JP2010027726A5 - - Google Patents

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Publication number
JP2010027726A5
JP2010027726A5 JP2008184892A JP2008184892A JP2010027726A5 JP 2010027726 A5 JP2010027726 A5 JP 2010027726A5 JP 2008184892 A JP2008184892 A JP 2008184892A JP 2008184892 A JP2008184892 A JP 2008184892A JP 2010027726 A5 JP2010027726 A5 JP 2010027726A5
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JP
Japan
Prior art keywords
substrate
upper stage
stage
bonding apparatus
board
Prior art date
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Application number
JP2008184892A
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English (en)
Japanese (ja)
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JP2010027726A (ja
JP5458520B2 (ja
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Priority to JP2008184892A priority Critical patent/JP5458520B2/ja
Priority claimed from JP2008184892A external-priority patent/JP5458520B2/ja
Publication of JP2010027726A publication Critical patent/JP2010027726A/ja
Publication of JP2010027726A5 publication Critical patent/JP2010027726A5/ja
Application granted granted Critical
Publication of JP5458520B2 publication Critical patent/JP5458520B2/ja
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JP2008184892A 2008-07-16 2008-07-16 基板接合装置 Active JP5458520B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008184892A JP5458520B2 (ja) 2008-07-16 2008-07-16 基板接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008184892A JP5458520B2 (ja) 2008-07-16 2008-07-16 基板接合装置

Publications (3)

Publication Number Publication Date
JP2010027726A JP2010027726A (ja) 2010-02-04
JP2010027726A5 true JP2010027726A5 (https=) 2012-03-01
JP5458520B2 JP5458520B2 (ja) 2014-04-02

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ID=41733292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008184892A Active JP5458520B2 (ja) 2008-07-16 2008-07-16 基板接合装置

Country Status (1)

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JP (1) JP5458520B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2978297A1 (fr) * 2011-07-23 2013-01-25 Soitec Silicon On Insulator Reduction d'interferences mecaniques dans un systeme de collage de substrats a basse pression
TWI578409B (zh) * 2011-12-08 2017-04-11 尼康股份有限公司 A pressing device, a substrate bonding device and a superimposing substrate
JP6148532B2 (ja) * 2013-05-08 2017-06-14 東京応化工業株式会社 貼付装置及び貼付方法
WO2016157422A1 (ja) * 2015-03-31 2016-10-06 株式会社メイコー 基板吸着装置及び基板吸着方法
JP6628681B2 (ja) * 2016-04-28 2020-01-15 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
TWI861734B (zh) * 2018-12-05 2024-11-11 美商凱特伊夫公司 基板固持器總成以及具有基板高度位置控制的噴墨印表機
KR102284055B1 (ko) * 2019-10-22 2021-07-30 (주)에스티아이 디스플레이 라미네이션 장치 및 이를 이용한 지지 척 레벨링 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3369877B2 (ja) * 1996-10-31 2003-01-20 三洋電機株式会社 ボンディングユニット
JP2003249425A (ja) * 2002-02-22 2003-09-05 Toray Eng Co Ltd 実装方法および装置
JP4245138B2 (ja) * 2003-03-11 2009-03-25 富士通株式会社 基板貼合せ装置及び基板貼合せ方法
JP5061515B2 (ja) * 2006-06-29 2012-10-31 株式会社ニコン ウェハ接合装置及びウェハ接合方法

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