JP2013207094A5 - - Google Patents

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Publication number
JP2013207094A5
JP2013207094A5 JP2012074651A JP2012074651A JP2013207094A5 JP 2013207094 A5 JP2013207094 A5 JP 2013207094A5 JP 2012074651 A JP2012074651 A JP 2012074651A JP 2012074651 A JP2012074651 A JP 2012074651A JP 2013207094 A5 JP2013207094 A5 JP 2013207094A5
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JP
Japan
Prior art keywords
substrate holder
stress
coupling
holder according
stress reduction
Prior art date
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Granted
Application number
JP2012074651A
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English (en)
Japanese (ja)
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JP5970909B2 (ja
JP2013207094A (ja
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Priority to JP2012074651A priority Critical patent/JP5970909B2/ja
Priority claimed from JP2012074651A external-priority patent/JP5970909B2/ja
Publication of JP2013207094A publication Critical patent/JP2013207094A/ja
Publication of JP2013207094A5 publication Critical patent/JP2013207094A5/ja
Application granted granted Critical
Publication of JP5970909B2 publication Critical patent/JP5970909B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012074651A 2012-03-28 2012-03-28 クランプ機構及び基板貼り合わせ装置 Active JP5970909B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012074651A JP5970909B2 (ja) 2012-03-28 2012-03-28 クランプ機構及び基板貼り合わせ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012074651A JP5970909B2 (ja) 2012-03-28 2012-03-28 クランプ機構及び基板貼り合わせ装置

Publications (3)

Publication Number Publication Date
JP2013207094A JP2013207094A (ja) 2013-10-07
JP2013207094A5 true JP2013207094A5 (https=) 2015-05-21
JP5970909B2 JP5970909B2 (ja) 2016-08-17

Family

ID=49525886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012074651A Active JP5970909B2 (ja) 2012-03-28 2012-03-28 クランプ機構及び基板貼り合わせ装置

Country Status (1)

Country Link
JP (1) JP5970909B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11260679B2 (en) * 2018-12-21 2022-03-01 Kateeva, Inc. Gripping for print substrates

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4852891B2 (ja) * 2005-05-31 2012-01-11 株式会社ニコン ウェハホルダ、ウェハ積層方法及び積層型半導体装置製造方法
JP5098165B2 (ja) * 2005-12-08 2012-12-12 株式会社ニコン ウェハの接合方法、接合装置及び積層型半導体装置の製造方法
JP5577585B2 (ja) * 2008-11-12 2014-08-27 株式会社ニコン 基板保持部材、接合装置および接合方法

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