JP2010010600A5 - - Google Patents
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- Publication number
- JP2010010600A5 JP2010010600A5 JP2008171067A JP2008171067A JP2010010600A5 JP 2010010600 A5 JP2010010600 A5 JP 2010010600A5 JP 2008171067 A JP2008171067 A JP 2008171067A JP 2008171067 A JP2008171067 A JP 2008171067A JP 2010010600 A5 JP2010010600 A5 JP 2010010600A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- circuit board
- recess
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 9
- 230000037431 insertion Effects 0.000 claims 3
- 238000003780 insertion Methods 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008171067A JP5253016B2 (ja) | 2008-06-30 | 2008-06-30 | 回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008171067A JP5253016B2 (ja) | 2008-06-30 | 2008-06-30 | 回路基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010010600A JP2010010600A (ja) | 2010-01-14 |
| JP2010010600A5 true JP2010010600A5 (enExample) | 2011-08-25 |
| JP5253016B2 JP5253016B2 (ja) | 2013-07-31 |
Family
ID=41590695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008171067A Expired - Fee Related JP5253016B2 (ja) | 2008-06-30 | 2008-06-30 | 回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5253016B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101719699B1 (ko) * | 2010-10-05 | 2017-03-27 | 삼성전자주식회사 | 메모리 모듈 및 이의 제조 방법 |
| JP6254421B2 (ja) * | 2013-11-01 | 2017-12-27 | センサータ テクノロジーズ マサチューセッツ インコーポレーテッド | コネクター |
| CN108075276B (zh) * | 2016-11-11 | 2020-01-07 | 泰科电子(上海)有限公司 | 连接器和连接器组件 |
| JP6991782B2 (ja) | 2017-08-23 | 2022-01-13 | センサータ テクノロジーズ インコーポレーテッド | ソケット |
| KR102808379B1 (ko) | 2020-05-26 | 2025-05-16 | 주식회사 케이엠더블유 | Pcb 조립체 |
| JP2023069689A (ja) * | 2021-11-08 | 2023-05-18 | 日本端子株式会社 | カードエッジ型プリント配線基板 |
| JP7475010B2 (ja) * | 2022-01-21 | 2024-04-26 | 太陽インキ製造株式会社 | 立体組み立て回路部品、立体組み立て回路構造 |
| WO2025135928A1 (ko) * | 2023-12-22 | 2025-06-26 | 엘지이노텍 주식회사 | 인쇄회로기판 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07302975A (ja) * | 1994-03-09 | 1995-11-14 | Yazaki Corp | 回路板の端末処理方法 |
| JP3904321B2 (ja) * | 1998-03-13 | 2007-04-11 | タイコエレクトロニクスアンプ株式会社 | プリント基板 |
| JP2000113920A (ja) * | 1998-10-01 | 2000-04-21 | Mitsubishi Electric Corp | モジュール |
| JP2007266618A (ja) * | 2001-07-30 | 2007-10-11 | Seiko Epson Corp | 回路基板、及びこれを用いたインクカートリッジ、回路基板用接続装置およびこれを用いたインクジェット式記録装置 |
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2008
- 2008-06-30 JP JP2008171067A patent/JP5253016B2/ja not_active Expired - Fee Related