JP2010004085A5 - - Google Patents
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- Publication number
- JP2010004085A5 JP2010004085A5 JP2009233128A JP2009233128A JP2010004085A5 JP 2010004085 A5 JP2010004085 A5 JP 2010004085A5 JP 2009233128 A JP2009233128 A JP 2009233128A JP 2009233128 A JP2009233128 A JP 2009233128A JP 2010004085 A5 JP2010004085 A5 JP 2010004085A5
- Authority
- JP
- Japan
- Prior art keywords
- dummy
- interlayer insulating
- insulating film
- seal ring
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011229 interlayer Substances 0.000 claims 11
- 239000004065 semiconductor Substances 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 6
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009233128A JP5214571B2 (ja) | 2009-10-07 | 2009-10-07 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009233128A JP5214571B2 (ja) | 2009-10-07 | 2009-10-07 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004182366A Division JP4401874B2 (ja) | 2004-06-21 | 2004-06-21 | 半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013007194A Division JP5801329B2 (ja) | 2013-01-18 | 2013-01-18 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010004085A JP2010004085A (ja) | 2010-01-07 |
| JP2010004085A5 true JP2010004085A5 (enExample) | 2010-02-18 |
| JP5214571B2 JP5214571B2 (ja) | 2013-06-19 |
Family
ID=41585474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009233128A Expired - Lifetime JP5214571B2 (ja) | 2009-10-07 | 2009-10-07 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5214571B2 (enExample) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4257013B2 (ja) * | 2000-03-28 | 2009-04-22 | エルピーダメモリ株式会社 | 半導体集積回路装置 |
| JP2004153015A (ja) * | 2002-10-30 | 2004-05-27 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| JP4401874B2 (ja) * | 2004-06-21 | 2010-01-20 | 株式会社ルネサステクノロジ | 半導体装置 |
-
2009
- 2009-10-07 JP JP2009233128A patent/JP5214571B2/ja not_active Expired - Lifetime
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