JP2010002304A - Substrate treating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treating device capable of appropriately executing alignment processing by an alignment section. <P>SOLUTION: The alignment section 130 mainly has: a stationary base 133; a plurality of support pins 134; and an incidence and emission section 171. The stationary base 133 is a wafer stage and a substrate W2 for inspection is fixed on its upper surface. A plurality of support pins 134 are erected at the side of the incidence and emission section 171 from an upper surface of the stationary base 133. A processing substrate W1 and a substrate W3 for inspection are supported by the support pins 134. The incidence and emission section 171 irradiates the side of the stationary base 133 with light and receives light reflected by the processing substrate W1 and the substrates W2, W3 for reference. Then, the emission situation of a light source 171a is determined, based on each integral operation value computed from the reflection light spectrum of each reflection light for a plurality of pieces of reflection light reflected by the processing substrate W1 and the substrates W2, W3 for inspection on the stationary base 133. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus for performing processing on a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk, etc. (hereinafter simply referred to as “substrate”). The present invention relates to the determination of the light emission state of a light source that supplies light irradiated on the light source.

  2. Description of the Related Art Conventionally, a substrate processing apparatus that heats a substrate with flash light emitted from a xenon flash lamp is known (for example, Patent Document 1). In the apparatus of Patent Document 1, the flash emitted from the xenon flash lamp has extremely high energy. When this light is irradiated onto the substrate, only the substrate surface is heated in an extremely short time (several milliseconds or less), and only the substrate surface rapidly expands.

  As a result, when a defective substrate having scratches or process defects is subjected to heat treatment with a xenon flash lamp, the substrate is cracked due to this thermal expansion, and fragments of the substrate are scattered and scattered in the heat treatment chamber. Problems will arise.

  In order to solve such problems, conventionally, there is known a technique for determining whether a substrate is good or bad and performing heat treatment on a defective substrate before the heat treatment is performed. (For example, Patent Document 2). In the apparatus of Patent Document 2, the quality of the substrate is determined based on the reflected light spectrum of the reflected light reflected by the substrate.

JP 2004-186542 A JP 2007-292726 A

  Therefore, if the light emission state of the light source that supplies the light irradiated toward the substrate is not good, it is not possible to execute the good / bad judgment of the substrate.

  Therefore, an object of the present invention is to provide a substrate processing apparatus that can irradiate the substrate with light for determining whether the substrate is good or bad.

  In order to solve the above-mentioned problems, the invention of claim 1 is a substrate processing apparatus, a processing unit for processing a first substrate, and an upstream of the processing unit as viewed from the transport direction of the first substrate. An inspection unit that inspects the first substrate based on reflected light reflected by the first substrate, and the inspection unit transmits light supplied from a light source in the inspection unit. A spectral intensity corresponding to each wavelength is measured for the irradiation unit for irradiating the second substrate, the light receiving unit for receiving the reflected light reflected by the second substrate, and the reflected light received by the light receiving unit. Based on the spectroscope for acquiring the reflected light spectrum, the integral calculation unit for integrating the reflected light spectrum acquired by the spectrometer with respect to the wavelength, and the integral calculation value calculated by the integral calculation unit, Judging the light emission status of the light source A plurality of reflected light reflected by the same second substrate, and the determination unit of the light source based on each integral calculation value calculated from the reflected light spectrum of each reflected light. It is characterized by determining the light emission state.

  According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, the second substrate is transported from the upstream side of the inspection unit as viewed from the transport direction and is carried into the inspection unit. It is characterized by.

  According to a third aspect of the present invention, in the substrate processing apparatus according to the first aspect, the second substrate is fixed in the inspection section.

  According to a fourth aspect of the present invention, there is provided the substrate processing apparatus according to the third aspect, wherein the inspection unit is transported from the upstream side of the inspection unit as viewed from the transport direction and is carried into the inspection unit. A plurality of support pins that support one substrate are further provided, and the second substrate is fixed in an enclosed region surrounded by the plurality of support pins.

  According to a fifth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fourth aspects, the second substrate is a bare wafer.

  According to a sixth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fifth aspects, the determination unit performs each integral calculation of the plurality of reflected lights reflected by the second substrate. The light emission state of the light source is determined based on the deviation of each integral calculation value.

  Further, the invention of claim 7 is the substrate processing apparatus according to claim 6, wherein (i) an average of each integral calculation value is calculated as an integral average value for each integral calculation value calculated based on the plurality of reflected lights. (Ii) normalized integral value obtained by dividing each integral operation value by the integral average value, (iii) the maximum normalized value among each normalized integral value, and (iv) each normalized value. In the case where the minimum normalized integration value is defined as the normalized minimum value, the deviation is obtained by subtracting the normalized minimum value from the normalized maximum value.

  Further, the invention of claim 8 is the substrate processing apparatus according to claim 6, wherein (i) an average of each integral calculation value is calculated as an integral average value for each integral calculation value calculated based on the plurality of reflected lights. When defined, the deviation is obtained by multiplying the standard deviation of each integral calculation value by three and dividing by the integral average value.

  The invention according to claim 9 is the substrate processing apparatus according to any one of claims 1 to 5, wherein (i) each integral calculation value of the plurality of reflected lights reflected by the second substrate is The average of each integral calculation value is the integral average value, (ii) the largest integral value among the integral calculation values, and (iii) the smallest integral value is the minimum integral value. In the case of defining, the determination unit, when each of the maximum integral value divided by the integral average value and the minimum integral value divided by the integral average value are within an allowable range, It is determined that the light emission state of the light source is good.

  The invention according to claim 10 is the substrate processing apparatus according to any one of claims 1 to 5, wherein (i) each integral calculation value of the plurality of reflected lights reflected by the second substrate is When each integral calculation value is defined as the maximum integral value and (ii) the minimum integral calculation value is defined as an integral minimum value, the determination unit is configured to determine the integral maximum value with respect to the integral maximum value. When the ratio of the integral minimum value is within an allowable range, it is determined that the light emission state of the light source is good.

  The invention according to claim 11 is the substrate processing apparatus according to any one of claims 1 to 10, wherein the integral calculation unit is based on a spectrum in a partial wavelength range of the reflected light spectrum. And calculating an integral calculation value.

  In the invention according to any one of claims 1 to 11, the determination unit is a light source based on each integral calculation value of the reflected light spectrum corresponding to each reflected light with respect to the plurality of reflected lights reflected by the same second substrate. Can be determined. Thereby, the replacement time of the light source can be easily grasped. Therefore, during the period from the replacement of the light source to the next replacement, the inspection of the first substrate based on the reflected light can be performed satisfactorily, and the inspection accuracy of the first substrate can be maintained well.

  In the inventions according to claims 1 to 11, the reflected light reflected by the substrate is used for the determination of the light emission state of the light source, as in the case of the inspection of the first substrate. That is, it is not necessary to separately add hardware for determining the light emission state of the light source. Therefore, the light emission state of the light source can be determined without increasing the size and manufacturing cost of the substrate processing apparatus.

  In particular, according to the second aspect of the present invention, the first substrate that is the target of substrate processing in the processing section can be used as the second substrate for determining the light emission state of the light source. That is, the light emission state of the light source can be determined together with the inspection of the substrate. Thereby, when it is determined that the light emission state of the light source is not good, it can be determined that the board inspection is not being performed well. Therefore, it is possible to prevent the substrate that should be originally determined as a defective substrate from being determined as a non-defective substrate and being processed by the processing unit.

  In particular, according to the third aspect of the present invention, even when the substrate to be processed is not loaded in the substrate processing apparatus, such as when the substrate processing apparatus is turned on, the light emission state of the light source is changed. Can be determined.

  In particular, according to the invention described in claim 4, the second substrate fixed in the inspection section is disposed in the surrounding region surrounded by the plurality of support pins. Therefore, the second substrate is easily arranged in the inspection section regardless of the mounting positions of the plurality of support pins.

  In particular, according to the invention described in claim 5, the second substrate is configured by a bare wafer in which no wiring pattern is formed on the substrate, and the reflection spectrum of the reflected light reflected by the same second substrate is Acquired with good repeatability. Therefore, the light emission state of the light source can be determined more satisfactorily.

  Particularly, according to the sixth aspect of the present invention, the light emission state of the light source can be determined from the deviation of each integral calculation value based on a plurality of reflected lights. Therefore, it is possible to better grasp the light source replacement time.

  In particular, according to the seventh and eighth aspects of the invention, the deviation normalized by the integral average value of each integral calculation value is used for determining the light emission state of the light source. Therefore, the light emission state of the light source can be determined satisfactorily regardless of the illuminance on the surface of the second substrate.

  In particular, according to the ninth aspect of the present invention, the integral maximum value and the integral minimum value normalized by the integral average value of each integral calculation value are used to determine the light emission state of the light source. Therefore, similarly to the inventions described in claims 7 and 8, the light emission state of the light source can be determined satisfactorily regardless of the illuminance on the surface of the second substrate.

  In particular, according to the eleventh aspect of the present invention, it is not necessary to perform integral calculation over the entire wavelength range of the reflected light spectrum, and the calculation cost of the integral calculation value can be reduced.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<1. First Embodiment>
<1.1. Configuration of substrate processing apparatus>
FIG. 1 is a plan view showing an example of the configuration of the substrate processing apparatus 100 in the present embodiment. 1 and the subsequent drawings have an XYZ orthogonal coordinate system in which the Z-axis direction is a vertical direction and the XY plane is a horizontal plane, as necessary, in order to clarify the directional relationship. .

  The substrate processing apparatus 100 is a so-called single-wafer type apparatus, which emits an extremely short light pulse from a xenon flash lamp and irradiates each processing substrate W1 with extremely strong light, thereby processing the processing substrates W1 one by one. Heat. As shown in FIG. 1, the substrate processing apparatus 100 mainly includes an indexer unit 110, a delivery robot 120, an alignment unit 130, a cooling unit 140, a transfer robot 150, and a heat processing unit 160. .

  Here, each processing substrate W1 carried into the indexer unit 110 is transported along a transport path (path along a broken line in FIG. 1) P by the delivery robot 120 and the transport robot 150. That is, each processing substrate W1 is delivered to the indexer unit 110, the alignment unit 130, the heat processing unit 160, the cooling unit 140, and the indexer unit 110 in this order.

  The indexer unit 110 carries the unprocessed processing substrate W1 into the substrate processing apparatus 100 and also carries out the processed processing substrate W1 out of the substrate processing apparatus 100. As shown in FIG. 1, a plurality (two in the present embodiment) of carriers 91 can be placed on the indexer unit 110. These carriers 91 can accommodate a plurality of processing substrates W1 and are transported from the outside of the apparatus 100 by an automatic guided vehicle (AGV: not shown) or the like.

  As shown in FIG. 1, the delivery robot 120 is provided on the downstream side of the indexer unit 110 when viewed from the transport direction AR1 of the processing substrate W1. The delivery robot 120 is slidable in the direction of the arrow 120S (substantially in the Y-axis direction) and is rotatable in the direction of the arrow 120R. In addition, the hand 121 that supports the processing substrate W1 can be advanced and retracted in the X-axis direction.

  As a result, the delivery robot 120 (1) puts and removes an arbitrary processing substrate W1 with the carrier 91, (2) delivers the processing substrate W1 taken out from the carrier 91 to the alignment unit 130, and (3) The processing substrate W1 for which the cooling process has been completed can be taken out from the cooling unit 140.

  As shown in FIG. 1, the alignment unit 130 is between the delivery robot 120 and the transfer chamber 170, and is viewed from the transfer direction AR1. It is provided on the upstream side. The alignment unit 130 performs alignment processing on the processing substrate W1 (first substrate) delivered from the delivery robot 120.

  Here, the alignment processing refers to adjusting the rotational position of the processing substrate W1 based on the reference position provided on the processing substrate W1. In addition, the rotation position of the processing substrate W1 refers to an angle formed by, for example, a straight line connecting the rotation center point of the processing substrate W1 and another point on the processing substrate W1 and the X axis.

  The alignment unit 130 also performs pass / fail determination of the processing substrate W1 based on the reflected light reflected by the processing substrate W1. Thus, the alignment unit 130 also has a function as an inspection unit that inspects the processing substrate W1. The quality determination of the processed substrate W1 is performed for the purpose of finding a defective substrate having a scratch or a process defect. Thereby, it is possible to prevent the defective substrate from being heat-treated in the heat treatment unit 160 and cracking in the heat treatment unit 160.

  FIG. 2 is a cross-sectional view of alignment unit 130 according to the present embodiment as viewed from the line V1-V1 in FIG. FIG. 3 is a plan view illustrating an example of the configuration of the alignment unit 130 of the present embodiment. As shown in FIGS. 2 and 3, the alignment unit 130 mainly includes an alignment head 132, a stationary base 133, a plurality of support pins 134, an incident / exit unit 171, a light source 171 a, and a spectrometer 176. Have. In FIG. 3, the alignment chamber 131 is not shown for convenience of illustration.

  As shown in FIG. 2, the alignment chamber 131 mainly includes a housing 131 a having an opening upward and a bottomed cylindrical lid portion 131 b. When the opening of the housing 131a is closed by the lid portion 131b, the alignment chamber 131 seals the processing substrate W1 that is the target of the alignment processing and pass / fail determination processing.

  The alignment head 132 includes a sensor (not shown) including a pair of light projecting units and light receiving units. A reference position such as a notch or an orientation flat of the processing substrate W1 is detected by this sensor.

  The stationary table 133 is a processing substrate W1 to be subjected to the cooling processing performed by the cooling unit 140 and the heating processing performed by the heating processing unit 160, and the inspection substrate used in the determination processing of the light emission state of the light source 171a. W2 (second substrate). As shown in FIG. 2, the inspection substrate W <b> 2 is placed on the upper surface of the stationary stand 133 in a horizontal posture substantially parallel to the XY plane.

  A plurality of (three in the present embodiment) support pins 134 are support portions provided on the stationary table 133, and are erected from the upper surface of the stationary table 133 toward the incident / exit portion 171. The processing substrate W1 is supported by these support pins 134 in a horizontal posture substantially parallel to the XY plane. Therefore, the lower surface of the processing substrate W1 is separated from the upper surface of the stationary table 133, and is easily supported above the inspection substrate W2.

  Further, as shown in FIG. 3, the inspection substrate W <b> 2 is placed in the surrounding area 134 a surrounded by the plurality of support pins 134. Therefore, the inspection substrate W <b> 2 is easily fixed on the stationary base 133 in the alignment unit 130 regardless of the standing position (attachment position) of each support pin 134.

  As shown in FIG. 2, the motor 135 is linked and connected to the stationary table 133 via a rotation shaft 135 a extending in the vertical direction (substantially Z-axis direction). Therefore, when the rotational force is transmitted from the motor 135, the stationary base 133 is rotated in the XY plane about the rotational axis 135b. As described above, the motor 135 has a function as a rotation drive unit that rotates the stationary table 133.

  As shown in FIG. 3, the incident / exit section 171 is separated from the alignment head 132 and is provided at a position where it does not interfere with the alignment head 132. The arm part 173b is a beam member extending in the horizontal direction as shown in FIG. One end portion of the arm portion 173b is attached with an incident / exit portion 171 and the other end portion is attached near the upper portion of the support member 173a extending in the vertical direction. Therefore, the entrance / exit part 171 is supported in a cantilever shape by the support member 173a and the arm part 173b above the stationary base 133.

  FIG. 4 is a side sectional view schematically showing the configuration of the incident / exit section 171 of the present embodiment. As shown in FIG. 4, the incident / exit section 171 mainly includes a spherical lens 171b and a half mirror 171c.

  Here, the light source 171a is constituted by, for example, a halogen lamp. As shown in FIG. 4, the light supplied from the light source 171a is introduced into the main body 171e of the incident / exit section 171 via the optical fiber 171d.

  As shown in FIG. 4, the light introduced into the main body 171e through the optical fiber 171d travels along the optical path LP11, passes through the half mirror 171c, and reaches the spherical lens 171b. Then, the light supplied to the spherical lens 171b is condensed by the spherical lens 171b, and is irradiated to the stationary table 133 side as substantially point-like light.

  Further, the light emitted from the spherical lens 171b proceeds along the optical path LP11 and the optical path LP12 when the processing substrate W1 is not supported by the plurality of support pins 134, and is reflected on the inspection substrate W2. Reflected in region RR1. On the other hand, (2) when the processing substrate W1 is supported by the plurality of support pins 134, it is reflected by the reflection region RR2 on the processing substrate W1.

  Further, the reflected light reflected by the reflection region RR1 on the inspection substrate W2 travels along the optical paths LP21 and LP22, and is received and collected by the spherical lens 171b. On the other hand, the reflected light reflected by the reflective region RR2 on the processing substrate W1 travels along the optical path LP22 and is received by the spherical lens 171b.

  The reflected light received by the spherical lens 171b travels along the optical path LP22 in the main body 171e of the incident / exit section 171 and is reflected by the half mirror 171c to be introduced into the optical fiber 175.

  In this way, the incident / exit section 171 functions as an irradiation section that irradiates the light supplied from the light source 171a toward the processing substrate W1 or the inspection substrate W2 on the stationary base 133 side, and is disposed on the stationary base 133 side. And a function as a light receiving unit that receives reflected light reflected by the processed substrate W1 and the inspection substrate W2. In other words, the incident / exit section 171 is configured by integrally forming an irradiation section and a light receiving section.

  As shown in FIGS. 2 and 4, the spectroscope 176 resolves the reflected light received and collected by the spherical lens 171 b and introduced into the optical fiber 175 into each wavelength by a dispersion system (for example, a prism). Measure the spectral intensity corresponding to the wavelength. Thereby, the spectrum intensity-wavelength curve (hereinafter also referred to as “reflected light spectrum”) of the reflected light reflected by the processing substrate W1 or the inspection substrate W2 is acquired.

  FIG. 5 is a graph showing an example of the reflected light spectrum. The vertical axis in FIG. 5 represents the intensity of the reflected light spectrum at each wavelength, and the horizontal axis represents the wavelength of the reflected light. A solid line RS in FIG. 5 represents a reflected light spectrum of the reflected light reflected by the inspection substrate W2.

  The transfer robot 150 is provided in the transfer chamber 170 as shown in FIG. Further, the transfer chamber 170 is disposed between the alignment unit 130 and the cooling unit 140, and the heat treatment unit 160. The alignment unit 130, the cooling unit 140, and the heat treatment unit 160 are arranged so as to be connected to the transfer chamber 170 so that the respective inner spaces can communicate with the inner space of the transfer chamber 170. Thereby, the transfer robot 150 can transfer the processing substrate W <b> 1 among the alignment unit 130, the cooling unit 140, and the heat processing unit 160.

  Here, as shown in FIG. 1, the transfer robot 150 is capable of turning in the direction of the arrow 150 </ b> R about an axis that faces the vertical direction (substantially parallel to the Z axis). The transfer robot 150 has two link mechanisms composed of a plurality of arm segments, and transfer arms 151a and 151b for holding the processing substrate W1 are provided at the ends of the two link mechanisms. These transfer arms 151a and 151b are vertically spaced apart from each other by a predetermined pitch, and are independently slidable linearly in the same horizontal direction by a link mechanism. Further, the transfer robot 150 can be moved up and down while maintaining the pitch between the transfer arms 151a and 151b.

  Therefore, when the transfer robot 150 transfers (in / out) the processing substrate W1 as a transfer partner of any of the alignment unit 130, the heat processing unit 160, and the cooling unit 140, first, the transfer arms 151a and 151b Turn to face the delivery partner. After that (or while turning), any one of the transfer arms is positioned at a height at which the processing substrate W1 is delivered to and from the delivery partner. Then, the transfer arm 151a (151b) is slid linearly in the horizontal direction to deliver the processing substrate W1.

  FIG. 6 is a front view illustrating an example of the configuration of the heat treatment unit 160. The heat treatment unit 160 performs heat treatment on the surface of the processing substrate W1 by irradiating the processing substrate W1 with extremely strong light. As shown in FIG. 1, the heat processing unit 160 is disposed on the opposite side of the alignment unit 130 and the cooling unit 140 with the transfer chamber 170 interposed therebetween. And a chamber 6 and a holding portion 7.

  Here, the processing substrate W1 to be subjected to the heat treatment by the heat treatment unit 160 is one to which impurities are added by, for example, an ion implantation method, and the added impurities are activated by this heat treatment.

  As shown in FIG. 6, the light irradiation unit 5 is provided on the upper portion of the chamber 6, and mainly includes a plurality of (30 in the present embodiment) xenon flash lamps (hereinafter simply referred to as “flash lamps”). ) 69, the reflector 52, and the light diffusion plate 53.

  The plurality of flash lamps 69 are rod-shaped lamps each having a long cylindrical shape, and each of the flash lamps 69 is planar so that the longitudinal direction thereof is parallel to the main surface of the processing substrate W1 held by the holding unit 7. Is arranged.

  The reflector 52 is provided above the plurality of flash lamps 69 so as to cover all of them. In addition, the surface of the reflector 52 is roughened by blasting and has a satin pattern.

  The light diffusing plate 53 is formed of quartz glass whose surface is subjected to light diffusing processing. As shown in FIG. 6, a predetermined gap is provided between the translucent plate 61 disposed below the plurality of flash lamps 69 and the light diffusion plate 53. Thereby, the light emitted from the flash lamp 69 and incident on the light diffusion plate 53 is diffused by the light diffusion plate 53 and reaches the light transmission plate 61.

  The chamber 6 is a processing chamber having a substantially cylindrical shape, and the processing substrate W1 can be stored in the inner space (heat treatment space 65). A translucent plate 61 is provided in the opening 60 above the chamber 6.

  The translucent plate 61 is formed of, for example, quartz, and the translucent plate 61 functions as a chamber window that transmits light emitted from the light irradiation unit 5 and guides it to the heat treatment space 65. Then, flash light emitted from the flash lamp 69 passes through the light transmitting plate 61 and is irradiated onto the processing substrate W1, whereby the processing substrate W1 is subjected to heat treatment.

  As shown in FIG. 6, the holding unit 7 mainly includes a hot plate 71 for preheating (so-called assist heating) the processing substrate W1 and a susceptor 72, and holds the processing substrate W1 to be heated. To do.

  The susceptor 72 is disposed so as to cover the upper surface (surface on the processing substrate W1 side) of the hot plate 71, and is formed of quartz (or aluminum nitride (AIN) or the like). In addition, a pin 75 that prevents a displacement of the processing substrate W1 is provided near the upper periphery of the susceptor 72.

  As shown in FIG. 6, a shaft 41 is connected to the lower portion of the holding portion 7. The shaft 41 has a substantially cylindrical shape and can be moved up and down in the Z-axis direction by the holding unit lifting mechanism 4.

  As a result, when the shaft 41 is raised while the processing substrate W1 is supported by the plurality of support pins 70, the processing substrate W1 is lowered relative to the holding unit 7 and placed on the holding unit 7. Is done. On the other hand, when the shaft 41 is lowered while the processing substrate W1 is placed on the holding unit 7, the processing substrate W1 rises relative to the holding unit 7 and is separated from the holding unit 7.

  In addition, the heat processing by the heat processing part 160 of this Embodiment is performed with the following procedures. First, the holding unit 7 is lowered to the delivery position by the holding unit lifting mechanism 4. Next, room temperature nitrogen gas is introduced into the chamber 6, and the heat treatment space 65 is brought to a nitrogen gas atmosphere.

  Subsequently, when the gate valve 185 is opened, the processed substrate W <b> 1 for which the alignment processing has been completed is carried into the heat processing unit 160 from the transfer chamber 170 by the transfer robot 150 and supported by the support pins 70. When the transfer arm 151a of the transfer robot 150 moves backward from the chamber 6, the gate valve 185 is closed.

  Subsequently, when the processing substrate W <b> 1 is supported by the support pins 70, the holding unit 7 is raised to the processing position by the holding unit lifting mechanism 4. As a result, the processing substrate W1 supported by the support pins 70 is transferred to the susceptor 72 and placed and held thereon. The processing substrate W1 placed and held is preheated by the hot plate 71, and the temperature of the processing substrate W1 is a temperature at which impurities added to the processing substrate W1 are not likely to diffuse due to heat (preheating temperature). The temperature is raised to T1.

  Subsequently, when the holding unit 7 is raised to the processing position, flash light of a short light pulse is irradiated from the light irradiation unit 5 toward the processing substrate W1. By this light irradiation, flash heating of the processing substrate W1 is performed. As a result, the surface temperature of the processing substrate W1 instantaneously rises rapidly to the processing temperature T2 of about 1000 ° C. to 1100 ° C., the impurities added to the processing substrate W1 are activated, and then the surface temperature rapidly increases. Descend. Therefore, it is possible to activate the impurities while suppressing diffusion of the impurities added to the processing substrate W1 due to heat (this diffusion phenomenon is also referred to as a loss of the impurity profile in the processing substrate W1).

  When the flash heating is completed, the holding unit 7 is lowered again to the delivery position, and the processing substrate W1 is delivered to the support pins 70. Then, the gate valve 185 is opened, and the processing substrate W1 on the support pin 70 is unloaded by the transfer robot 150, whereby the heat processing in the heat processing unit 160 is completed.

  As shown in FIG. 1, the cooling unit 140 is provided between the delivery robot 120 and the transfer chamber 170 and on the downstream side of the transfer chamber 170 when viewed from the transfer direction AR1. The cooling unit 140 cools the processing substrate W <b> 1 whose temperature has been raised by the heat processing in the heat processing unit 160. The processing substrate W1 cooled by the cooling unit 140 is taken out of the cooling unit 140 by the delivery robot 120 and returned to the carrier 91 from the delivery robot 120 as a processed processing substrate W1.

  Here, as shown in FIG. 1, the transfer chamber 170 is connected to the alignment unit 130, the cooling unit 140, and the heat treatment unit 160 through gate valves 183, 184, and 185, respectively. The alignment unit 130 and the cooling unit 140 are connected to the delivery robot 120 via gate valves 181 and 182, respectively. Therefore, when the processing substrate W1 is transported, these gate valves are appropriately opened and closed. Further, the inner space of the alignment unit 130, the cooling unit 140, the heat processing unit 160, and the transfer chamber 170 becomes a sealed space by closing the corresponding gate valves 181 to 185.

  Further, high purity nitrogen gas from a nitrogen gas supply unit (not shown) is supplied into the alignment unit 130, the cooling unit 140, and the transfer chamber 170, respectively, and excess nitrogen gas is appropriately exhausted (not shown). Therefore, the alignment unit 130, the cooling unit 140, and the transfer chamber 170 are kept clean.

<1.2. Functional configuration of substrate processing apparatus>
FIG. 7 is a block diagram illustrating an example of a functional configuration of the substrate processing apparatus 100 (and a substrate processing apparatus 200 described later). Here, the functional configuration of the substrate processing apparatus 100 will be described mainly with reference to FIG.

  The transfer process control unit 31 controls the operations of the delivery robot 120 and the transfer robot 150 to execute the transfer process of the processing substrate W1 at a predetermined timing. The alignment process control unit 32 causes the alignment process to be executed at a predetermined timing for the processing substrate W1 carried into the alignment unit 130 from the indexer unit 110. In addition, the heat treatment control unit 33 causes the heat treatment (flash heating) to be performed at a predetermined timing on the processing substrate W <b> 1 carried into the heat treatment unit 160 after the alignment processing is completed. In addition, the cooling process control unit 34 causes the cooling process to be performed at a predetermined timing on the processing substrate W <b> 1 that has been subjected to the heating process and is carried into the cooling unit 140.

  The light reception processing control unit 35 controls the light emission operation of the light emitted from the light source 171a (see FIGS. 2 and 4) of the incident / exit unit 171 to thereby reflect the reflected light reflected by the processing substrate W1 or the inspection substrate W2. Is received by the incident / exit section 171. Details of the light receiving process realized by the light receiving process control unit 35 will be described later.

  The integration calculation unit 36 executes calculation processing for integrating the reflected light spectrum acquired by the spectroscope 176 for each wavelength. For example, the integral calculation unit 36 obtains an integral calculation value for the entire wavelength range of the reflected light spectrum. In addition, when the wavelength range necessary for the determination process executed by the determination unit 37 is a partial wavelength range in the total wavelength range of the reflected light spectrum, the integration calculation unit 36 integrates the partial wavelength range. A calculated value may be calculated. In this case, the calculation cost of the integral calculation value can be reduced, and the processing load on the control unit 3 can be reduced.

  The determination unit 37 determines the light emission state of the light source 171a based on the integration calculation value calculated by the integration calculation unit 36. For example, the determination unit 37 determines the light emission state of the light source 171a based on each integral calculation value calculated from the reflected light spectrum of each reflected light with respect to the plurality of reflected lights reflected by the inspection substrate W2 on the stationary table 133. judge. Further, the determination unit 37 receives the light source 171a from each integration calculation of the plurality of reflected lights reflected by the same processing substrate W1 for the same processing substrate W1 delivered from the delivery robot 120 and carried into the alignment unit 130. The light emission state may be determined.

  In addition, the determination unit 37 indicates that the light source 171a needs to be replaced when it is determined that the light emission state of the light source 171a is not good and the replacement time is approaching or the replacement time has come. An informing process for informing the user is executed.

  Here, in the present embodiment, the inspection substrate W2 is constituted by a bare wafer (a silicon wafer on which no wiring pattern is formed on the substrate). That is, the surface of the inspection substrate W2 is flat with almost no surface unevenness as compared with the substrate on which the wiring pattern is formed. In the determination of the light emission state of the light source 171a using the inspection substrate W2, the same inspection substrate W2 placed on the stationary base 133 is used.

  Thereby, the measurement accuracy (repetitive reproducibility) of the reflected light spectrum of the reflected light reflected by the inspection substrate W2 is improved as compared with the reflected light spectrum based on the processing substrate W1. Therefore, when the processing substrate W1 is used, the determination unit 37 can more appropriately determine the light emission state of the light source 171a.

  In the present embodiment, the substrate processing apparatus 100 acquires the reflected light spectrum of each reflected light by using the same inspection substrate W3 (second substrate) formed of a bare wafer instead of the processing substrate W1. The light emission state of the light source 171a may be determined. In this case, the inspection substrate W3 is transferred to the alignment unit 130 by the delivery robot 120, and is transferred to the transfer chamber 170 side by the transfer robot 150 after the light receiving process is completed.

  That is, the inspection substrate W3 is carried into the alignment unit 130 from the indexer unit 110 side that is disposed on the upstream side of the alignment unit 130 when viewed from the transport direction AR1, similarly to the processing substrate W1. Similarly to the processing substrate W1, the inspection substrate W3 is carried out to the heating processing unit 160 and the cooling unit 140 side (processing unit side) arranged on the downstream side of the alignment unit 130 when viewed from the transport direction AR1. .

  In this way, the inspection substrate W3 is transported by the same procedure as the processing substrate W1. Therefore, it is not necessary to construct a special transport procedure for the determination process of the light emission state using the inspection substrate W3, and the man-hours required for the construction and management of the transport procedure can be reduced.

  Further, the inspection substrate W3 is constituted by a bare wafer, and the measurement accuracy of the reflected light spectrum based on the inspection substrate W3 is improved as compared with the processing substrate W1. Therefore, when the inspection substrate W3 is used, the determination unit 37 can determine the light emission state of the light source 171a even better.

  Furthermore, the determination part 37 performs quality determination of the process board | substrate W1 processed by the heat processing part 160 and the cooling part 140 side based on the reflection spectrum of reflected light. Here, the quality determination (determination process) of the processing substrate W1 executed in the present embodiment compares, for example, the reflected light spectrum of the processing substrate W1 to be determined with the reflected light spectrum of the non-defective substrate, This is executed by determining the surface condition of the processing substrate W1.

  As a result of the pass / fail determination, if the determination target processing substrate W1 is determined to be a defective substrate, the determination unit 37 notifies the user to that effect.

  Note that the notification executed based on the determination result of the light emission state and the pass / fail determination result of the processing substrate W1 may be, for example, a warning sound or lighting of a warning lamp, or displayed on a display unit (not shown). May be a warning screen.

<1.3. Reflected light reception processing>
Here, the light receiving process of the reflected light realized by the light receiving process control unit 35 will be described for each of the case where the processing substrate W1 and the inspection substrate W3 are used and the case where the inspection substrate W2 is used. The light receiving process using the inspection substrate W3 is executed by the same procedure as that when the processing substrate W1 is used. Therefore, only the light receiving process when the processing substrate W1 and the inspection substrate W2 are used will be described below.

  First, the light receiving process of the reflected light reflected by the processing substrate W1 and the inspection substrate W3 will be described. After the processing substrate W1 is carried into the alignment unit 130 and supported by the plurality of support pins 134, when the alignment processing of the processing substrate W1 is completed, the light reception processing control unit 35 causes the light source 171a to emit light.

  Thereby, the incident / exit part 171 receives the reflected light reflected by the reflection region RR2 of the processing substrate W1 while the light source 171a is lit. The received reflected light is converted into one reflected light spectrum by the spectroscope 176.

  Here, as shown in FIGS. 2 and 3, the processing substrate W1 (and the inspection substrate W3) is set such that its diameter D1 is equal to or larger than the diameter D2 of the inspection substrate W2, and the inspection substrate W2 is used. It can be arranged so as to cover the upper side of. Thereby, the reflected light received in a state where the processing substrate W1 is supported by the support pins 134 does not include the reflected light reflected by the inspection substrate W2. That is, most of the received reflected light is reflected light reflected by the processing substrate W1. Therefore, the determination part 37 can determine the light emission state of the light source 171a satisfactorily even when the processing substrate W1 is used.

  Next, the light receiving process of the reflected light reflected by the inspection substrate W2 will be described. In a state where the processing substrate W1 is not carried into the alignment unit 130, the light reception processing control unit 35 causes the light source 171a to emit light.

  Thus, the incident / exit section 171 receives the reflected light reflected by the reflection region RR1 on the inspection substrate W2 while the light source 171a is lit. The received reflected light is converted into one reflected light spectrum by the spectroscope 176, as in the case of the processing substrate W1.

  The inspection substrate W2 is disposed in the alignment unit 130 as described above. Therefore, even when the processing substrate W1 and the inspection substrate W3 to be processed are not input into the substrate processing apparatus, such as when the substrate processing apparatus 100 is turned on, the reflected light from the inspection substrate W2 is reflected. Are received, and the light emission state of the light source 171a can be determined based on the reflected light.

<1.4. Judgment process of light emission status>
As described above, the determination unit 37 determines the light emission state of the light source 171a based on the reflected light spectrum of the reflected light reflected by the processing substrate W1, the inspection substrate W2, or the inspection substrate W3. Hereinafter, the principle of determining the light emission state based on the reflected light spectrum will be described, and the method for determining the light emission state realized by the determination unit 37 will be described.

  8 and 9 are graphs for explaining the principle of determination of the light emission state of the light source 171a in the present embodiment. The vertical axis in FIG. 8 and FIG. 9 represents the normalized integral value. Here, the normalized integral value is an average value (integral average value) of each integral calculation value for each integral calculation value calculated based on a plurality of reflected lights reflected by the same inspection substrate W2, W3. , By dividing each integral calculation value.

  In addition, “◇” (open diamond), “◆” (black diamond), “△” (open triangle), “×”, “□” (open square), “ Each of “+”, “◯” (white circle), and “●” (black circle) is supplied from the light source 171a and reflected by the same inspection substrates W2 and W3 (in this embodiment, 6), the normalized integral values corresponding to each reflected light are plotted.

  In addition, the plot points in the areas AL01 to AL04 surrounded by the one-dot chain line in FIG. 8 correspond to the normalized integral values of different inspection substrates W2. In other words, four inspection substrates W2 of the same type made up of bare wafers are placed one by one on the mounting table 133, and a normalized integral value is calculated for each inspection substrate W2.

  On the other hand, the plot points in the regions WF01 to WF04 surrounded by the alternate long and short dash line in FIG. 9 correspond to the normalized integrated values of different inspection substrates W3. That is, four inspection substrates W3 of the same type constituted by bare wafers are carried into the alignment unit 130 one by one, and a normalized integral value is calculated for each inspection substrate W3.

  Of the plot columns included in the same areas AL01 to AL04 and WF01 to WF04, the left plot columns (the “◇” column, the “△” column, the “□” column, and the “◯” column in FIGS. 8 and 9) are used. Corresponds to the normalized integrated value of the light source 171a used for a certain period. On the other hand, the plot columns on the right side (corresponding to the “♦” column, “×” column, “+” column, and “●” column in FIGS. 8 and 9) normalize the (new) light source 171a immediately after replacement. Corresponds to the integral value.

  For example, each “Δ” in the one-dot chain line area AL02 of FIG. 8 corresponds to each of six reflected lights emitted from the light source 171a used for a certain period and reflected by substantially the same part on the same inspection substrate W2. This is a plot of normalized integral values.

  8 and FIG. 9 and the plot points other than “◯” in FIG. 9 include those in which the normalized integral values of adjacent plot points are substantially the same, and adjacent plot points substantially overlap. It is. Therefore, in FIG. 8 and FIG. 9, although there are actually 6 points plotted, apparently 5 or less plotted points (for example, 3 points in the case of “◆” in FIG. 8) are displayed. Has been.

  FIGS. 10 and 11 are diagrams for explaining deviations of the normalized integral values of the test substrates W2 and W3, respectively. “Wafer NO” in FIGS. 10 and 11 is information for identifying each of the inspection substrates W2 and W3.

  Here, the normalized integral values of the inspection substrate W2 corresponding to “wafer NO” = “101”, “102”, “103”, “104” (see FIG. 10) are the area AL01 and the area of FIG. Plotted in AL02, region AL03, and region AL04. Further, the normalized integral values of the inspection substrate W2 corresponding to “wafer NO” = “201”, “202”, “203”, “204” (see FIG. 11) are the regions WF01 and WF02 in FIG. 9, respectively. , Region WF03, and region WF04.

  Further, the deviation ΔD1 in FIGS. 10 and 11 is the maximum of each normalized integral value (normalized maximum value) for each normalized integral value calculated from the reflected light spectrum of the light source 171a used for a certain period. ) Is obtained by subtracting the smallest normalized normalized value (normalized minimum value). On the other hand, the deviation ΔD2 in FIGS. 10 and 11 is obtained by subtracting the normalized minimum value from the normalized maximum value for each normalized integral value calculated from the reflected light spectrum of the light source 171a immediately after replacement.

  As shown in FIGS. 10 and 11, the ratio of the deviation ΔD2 (immediately after the replacement) to the deviation ΔD1 (before the replacement) is transported and supported on the support pins 134 by the inspection substrate W2 fixed on the stationary table 133. All of the inspection substrates W3 were 0.2 or less.

  From this result, the following knowledge is obtained. That is, the light emission state of the light source 171a is the best immediately after replacement, and the variation in light emitted from the light source 171a (for example, the variation in spectral intensity at each wavelength) increases according to use, and the light emission state of the light source 171a changes. To do. As a result, regardless of the difference between the inspection substrate W2 and the inspection substrate W3, it is considered that the deviation ΔD2 immediately after the replacement of the light source 171a becomes the minimum value, and the deviation deviation ΔD2 increases as the light source 171a is used.

  Therefore, in the present embodiment, the determination unit 37 determines the light emission state of the light source 171a based on the deviation of the normalized integral value obtained from the same inspection substrate W2, W3 or the same processing substrate W1. Yes. Thereby, the light emission state of a light source can be determined satisfactorily regardless of the illuminance on the surfaces of the processing substrate W1 and the inspection substrates W2 and W3.

  For example, when the deviation of the normalized integral value is within the allowable range (for example, when the deviation is equal to or less than a predetermined threshold), the determination unit 37 can determine that the light emission state of the light source 171a is good. On the other hand, when the deviation of the normalized integral value is outside the allowable range (for example, when the deviation is larger than a predetermined threshold), the determination unit 37 cannot say that the light emission state of the light source 171a is good, and the light source 171a is replaced. Can be determined to be necessary. Note that the allowable range (threshold value) of the deviation of the normalized integral value may be obtained in advance by experiments or the like.

<1.5. Advantages of the substrate processing apparatus of the first embodiment>
As described above, the substrate processing apparatus 100 according to the present embodiment includes the inspection substrate W2 on the stationary table 133 or the processing substrate W1 and the inspection substrate W3 that are transferred to the alignment unit 130 and supported by the support pins 134. The light emission state of the light source can be determined based on the integral calculation value. Thereby, the replacement time of the light source 171a can be easily grasped. Therefore, during the period from the replacement of the light source 171a to the next replacement, the processing substrate W1 can be satisfactorily inspected based on the reflected light, and the inspection accuracy of the processing substrate W1 can be maintained satisfactorily.

  In the substrate processing apparatus 100 of the present embodiment, the light emission state of the light source 171a is reflected by the processing substrate W1, the inspection substrate W2, or the inspection substrate W3 as in the case of the inspection of the processing substrate W1. Reflected light is used. That is, it is not necessary to separately add hardware for determining the light emission state of the light source 171a. Therefore, the light emission state of the light source 171a can be determined without increasing the size and manufacturing cost of the substrate processing apparatus 100.

<2. Second Embodiment>
Next, a second embodiment of the present invention will be described. 12 is a cross-sectional view of the alignment unit 230 according to the present embodiment as viewed from the line V1-V1 in FIG. FIG. 13 is a plan view showing an example of the configuration of alignment unit 230 in the present embodiment.

  The substrate processing apparatus 200 according to the second embodiment is different from the substrate processing apparatus 100 according to the first embodiment except that the hardware configuration of the input / output unit 271 is different. It is the same as the form. Therefore, in the following, this difference will be mainly described.

  In the following description, the same reference numerals are given to the same components as those in the substrate processing apparatus 100 according to the first embodiment. Since the components with the same reference numerals have already been described in the first embodiment, description thereof will be omitted in the present embodiment.

  As shown in FIGS. 12 and 13, the alignment unit 230 mainly includes an alignment head 132, a stationary base 133, a plurality of support pins 134, a light source 171a, a spectrometer 176, and an incident / exiting unit 271. Have. In FIG. 13, the alignment chamber 131 is not shown for convenience of illustration.

  Similar to the input / output unit 171, the input / output unit 271 functions as an irradiating unit that irradiates the light supplied from the light source 171 a to the stationary table 133 side, the processing substrate W 1 disposed on the stationary table 133 side, and the inspection Each having a function as a light receiving portion that receives reflected light reflected by the substrates W2 and W3. That is, the incident / exit section 271 is configured by integrally forming an irradiation section and a light receiving section.

  As shown in FIG. 13, the incident / exit section 271 is separated from the alignment head 132 and is provided at a position where it does not interfere with the alignment head 132. As shown in FIGS. 12 and 13, both ends of the incident / exit portion 271 viewed from the longitudinal direction (substantially Y-axis direction in FIG. 12) are attached near the upper portions of the support members 273a and 273b, respectively. The incident / exit section 271 is disposed above the stationary table 133.

  The light supplied from the light source 171a and supplied to the incident / exit section 271 via the optical fiber 171d is condensed by a cylindrical lens (cylindrical lens) 271b extending in the longitudinal direction (substantially Y-axis direction) of the incident / exit section 271 and is approximately. Irradiated to the stationary table 133 side as linear light.

  Further, when the processing substrate W1 (or the inspection substrate W3) is supported by the plurality of support pins 134, the light emitted from the cylindrical lens 271b is reflected by the processing substrate W1 (or the inspection substrate W3). The On the other hand, when the processing substrate W1 (or the inspection substrate W3) is not supported, it is reflected by the inspection substrate W2 on the stationary base 133. Then, the reflected light reflected by the processing substrate W 1 and the inspection substrates W 2 and W 3 is received by the cylindrical lens 271 b and introduced into the spectroscope 176 via the optical fiber 175.

  As described above, the substrate processing apparatus 200 according to the second embodiment (more specifically, the incident / exit section 271 of the alignment section 230) has the above-described configuration, so that it can be used for inspection on the stationary table 133. The reflected light reflected by the substrate W2 and the reflected light reflected by the processing substrate W1 and the inspection substrate W3 on the stationary table 133 can be received.

  As a result, the substrate processing apparatus 200 of the present embodiment, for each of the plurality of reflected lights reflected by the processing substrate W1 and the inspection substrates W2 and W3, is similar to the substrate processing apparatus 100 of the first embodiment. The light emission state of the light source 171a can be determined based on each integral calculation value calculated from the reflected light spectrum of the reflected light.

  Therefore, the substrate processing apparatus 200 according to the present embodiment can easily grasp the replacement time of the light source 171a as in the case of the first embodiment, and from the replacement of the light source 171a to the next replacement. Meanwhile, the inspection of the processing substrate W1 based on the reflected light can be favorably executed. Further, the light emission state of the light source 171a can be determined without increasing the size and manufacturing cost of the substrate processing apparatus 200.

<3. Modification>
Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications can be made.

  (1) In the first and second embodiments, the light reception processing control unit 35 controls the light emission operation of the light emitted from the light source 171a of the incident / exit unit 171 to thereby process the substrate W1 or the inspection substrate W2. In the above description, the reflected light reflected by W3 is received by the incident / exit section 171. However, the light receiving process of the reflected light is not limited to this. For example, the light reception processing control unit 35 synchronizes the rotation operation of the stationary table 133 by the motor 135 and the light emission operation of the light emitted from the light source 171a, thereby rotating the stationary table 133 while processing the substrate W1, The reflected light reflected by the inspection substrates W2 and W3 may be received by the incident / exit section 171.

  In this case, the incident / exit section 171 can receive the reflected light reflected in a wide area on the processing substrate W1 and the inspection substrates W2 and W3. Thereby, the spectroscope 176 can acquire a reflected light spectrum with high reproducibility without being affected locally on the processing substrate W1 and the inspection substrates W2 and W3. Therefore, the determination part 37 can determine the light emission state of the light source 171a still better.

  (2) In the first and second embodiments, the determination unit 37 uses a value obtained by subtracting the minimum value from the maximum value of the normalized integral value as the deviation of the normalized integral value. It is not limited to this. For example, the standard deviation (quotient) obtained by multiplying the standard deviation of each integral calculation value calculated by the integral calculation unit 36 by the integral average value may be used as the deviation of the normalized integral value. Also in this case, it is possible to easily grasp the replacement time of the light source 171a.

  (3) In the first and second embodiments, the determination unit 37 is described as determining the light emission state of the light source 171a using the deviation of the normalized integral value. However, the present invention is not limited to this. Not a thing.

  Here, with respect to each integral calculation value calculated by the integral calculation unit 36, the maximum integral value among the integral calculation values, the minimum integral value among the integral calculation values, the minimum integral value, The average value of the integral calculation value is calculated as the integral average value, the integral maximum value divided by the integral average value, the normalized maximum value, and the integral minimum value divided by the integral average value as the normalized minimum value, respectively. .

  And the determination part 37 may determine with the light emission condition of the light source 171a being favorable, when each of a normalization maximum value and a normalization minimum value becomes a tolerance | permissible_range. The determination unit 37 may determine that the light emission state of the light source 171a is good when the ratio of the integral minimum value to the integral maximum value is within the allowable range. In any case, it is possible to easily grasp the replacement time of the light source 171a. Note that the allowable range of the normalized maximum value and the normalized minimum value, and the allowable range of the ratio of the integrated minimum value to the integrated maximum value may be obtained in advance by experiments or the like.

  (4) In the first and second embodiments, the determination of the light emission state of the light source 171a based on the processing substrate W1 has been described as being performed using the same processing substrate W1. It is not limited to. For example, a processing substrate W1 of the same type (not the same body but the same in nature, shape, etc.) may be used for determining the light emission state.

  In this case, the determination of the light emission state and the quality determination of the substrate can be executed simultaneously. When it is determined that the light emission state of the light source 171a is not good, it can be determined that the inspection (good / bad determination) of the processing substrate W1 has not been performed well. Therefore, it is possible to prevent the processing substrate W1 that should originally be determined as a defective substrate from being determined as a non-defective substrate and processed by the heat processing unit 160 or the cooling unit 140.

  (5) Furthermore, in the first and second embodiments, the determination unit 37 is described as executing the determination process of the light emission state using all the measured wavelength ranges for the reflected light spectrum. However, the wavelength range to be subjected to the determination process is not limited to this. For example, the light emission state may be determined based on a spectrum in a partial wavelength range (for example, 500 nm to 700 nm). Thereby, the calculation cost required for the determination process can be reduced.

It is a top view which shows an example of the whole structure of the substrate processing apparatus in the 1st and 2nd embodiment of this invention. It is sectional drawing which looked at the alignment part of 1st Embodiment from the V1-V1 line | wire of FIG. It is a top view which shows an example of a structure of the alignment part in 1st Embodiment. It is a sectional side view which shows typically the structure of the incident / exit part of 1st Embodiment. It is a graph which shows an example of a reflected light spectrum. It is a front view which shows an example of the heat processing part in 1st and 2nd embodiment. It is a block diagram which shows an example of a function structure in the substrate processing apparatus of 1st and 2nd embodiment. It is a figure for demonstrating the determination principle of the light emission condition of the light source in 1st and 2nd embodiment. It is a figure for demonstrating the determination principle of the light emission condition of the light source in 1st and 2nd embodiment. It is a figure for demonstrating the deviation of the normalized integral calculation value. It is a figure for demonstrating the deviation of the normalized integral calculation value. It is sectional drawing which looked at the alignment part of 2nd Embodiment from the V1-V1 line | wire of FIG. It is a top view which shows an example of a structure of the alignment part in 2nd Embodiment.

Explanation of symbols

3 Control Unit 36 Integration Calculation Unit 37 Determination Unit 100, 200 Substrate Processing Device 110 Indexer Unit 120 Delivery Robot 130, 230 Alignment Unit (Inspection Unit)
133 Standing table 134 Support pin 134a Surrounding area 140 Cooling unit 160 Heat processing unit 171 271 Input / output unit 171a Light source 176 Spectrometer RS Reflected light spectrum W1 Processing substrate (first substrate)
W2, W3 Inspection board (second board)
ΔD1, ΔD2 deviation

Claims (11)

A substrate processing apparatus,
(a) a processing unit that performs processing on the first substrate;
(b) an inspection unit that is provided on the upstream side of the processing unit as viewed from the transport direction of the first substrate, and inspects the first substrate based on reflected light reflected by the first substrate;
With
The inspection unit
(b-1) an irradiation unit that irradiates the light supplied from the light source toward the second substrate in the inspection unit;
(b-2) a light receiving unit that receives reflected light reflected by the second substrate;
(b-3) For the reflected light received by the light receiving unit, a spectroscope that obtains a reflected light spectrum by measuring the spectrum intensity corresponding to each wavelength; and
(b-4) an integral calculation unit that integrates the reflected light spectrum acquired by the spectrometer with respect to wavelength;
(b-5) a determination unit that determines the light emission status of the light source based on the integration calculation value calculated by the integration calculation unit;
Have
The determination unit determines the light emission status of the light source based on each integral calculation value calculated from the reflected light spectrum of each reflected light for a plurality of reflected lights reflected by the same second substrate. A substrate processing apparatus. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the second substrate is transported from an upstream side of the inspection unit as viewed from the transport direction and is carried into the inspection unit. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the second substrate is fixed in the inspection section. The substrate processing apparatus according to claim 3,
The inspection unit is transported from the upstream side of the inspection unit as viewed from the transport direction, and a plurality of support pins for supporting the first substrate carried into the inspection unit,
Further comprising
The substrate processing apparatus, wherein the second substrate is fixed in an enclosed region surrounded by the plurality of support pins. The substrate processing apparatus according to claim 1, wherein:
The substrate processing apparatus, wherein the second substrate is a bare wafer. The substrate processing apparatus according to claim 1, wherein:
The determination unit determines a light emission state of the light source based on a deviation of each integral calculation value for each integral calculation of the plurality of reflected lights reflected by the second substrate. The substrate processing apparatus according to claim 6,
For each integral calculation value calculated based on the plurality of reflected light,
(i) The average of each integral calculation value is the integral average value,
(ii) Normalized integral value obtained by dividing each integral calculation value by the integral average value,
(iii) The largest normalized integration value is the normalized maximum value,
(iv) The minimum of each normalized integral value is the normalized minimum value,
When defining each,
The deviation is obtained by subtracting the normalized minimum value from the normalized maximum value. The substrate processing apparatus according to claim 6,
For each integral calculation value calculated based on the plurality of reflected light,
(i) The average of each integral calculation value is the integral average value,
If you define
The substrate processing apparatus according to claim 1, wherein the deviation is obtained by multiplying a standard deviation of each integral calculation value by three and dividing by the integral average value. The substrate processing apparatus according to claim 1, wherein:
For each integral calculation value of the plurality of reflected lights reflected by the second substrate,
(i) The average of each integral calculation value is the integral average value,
(ii) The largest integral value among the integral calculation values is the integral maximum value,
(iii) The minimum integral value is the minimum integral value,
When defining each,
The determination unit, when each of the maximum integral value divided by the integral average value and the minimum integral value divided by the integral average value are within an allowable range, the light emission state of the light source Is determined to be good. A substrate processing apparatus, wherein: The substrate processing apparatus according to claim 1, wherein:
For each integral calculation value of the plurality of reflected lights reflected by the second substrate,
(i) The maximum integral value among the integral calculation values is the integral maximum value,
(ii) The minimum integral value is the minimum integral value,
When defining each,
The substrate processing apparatus, wherein the determination unit determines that the light emission state of the light source is good when a ratio of the integral minimum value to the integral maximum value is within an allowable range. In the substrate processing apparatus in any one of Claims 1 thru | or 10,
The substrate processing apparatus, wherein the integral calculation unit calculates an integral calculation value based on a spectrum in a partial wavelength range of the reflected light spectrum.

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