JP2009545878A - 電子デバイスが形成されたフレキシブル基板 - Google Patents
電子デバイスが形成されたフレキシブル基板 Download PDFInfo
- Publication number
- JP2009545878A JP2009545878A JP2009522771A JP2009522771A JP2009545878A JP 2009545878 A JP2009545878 A JP 2009545878A JP 2009522771 A JP2009522771 A JP 2009522771A JP 2009522771 A JP2009522771 A JP 2009522771A JP 2009545878 A JP2009545878 A JP 2009545878A
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- substrate
- electronic device
- particulate material
- plastic material
- thin film
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0212—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or coating of substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Thin Film Transistor (AREA)
- Laminated Bodies (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/461,080 US7678701B2 (en) | 2006-07-31 | 2006-07-31 | Flexible substrate with electronic devices formed thereon |
| PCT/US2007/016085 WO2008016479A1 (en) | 2006-07-31 | 2007-07-16 | Flexible substrate with electronic devices formed thereon |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009545878A true JP2009545878A (ja) | 2009-12-24 |
| JP2009545878A5 JP2009545878A5 (OSRAM) | 2011-09-08 |
Family
ID=38669806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009522771A Pending JP2009545878A (ja) | 2006-07-31 | 2007-07-16 | 電子デバイスが形成されたフレキシブル基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US7678701B2 (OSRAM) |
| EP (1) | EP2047513A1 (OSRAM) |
| JP (1) | JP2009545878A (OSRAM) |
| TW (1) | TW200814333A (OSRAM) |
| WO (1) | WO2008016479A1 (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010506400A (ja) * | 2006-10-03 | 2010-02-25 | イーストマン コダック カンパニー | 電子デバイス及びトレースを有するフレキシブル基板 |
| JP2019121734A (ja) * | 2018-01-10 | 2019-07-22 | 株式会社Ｊｏｌｅｄ | 半導体装置および表示装置 |
| KR102084519B1 (ko) * | 2019-07-16 | 2020-03-04 | 주식회사 오플렉스 | 자외선(uv) 경화형 점착제층을 포함하는 백플레이트 필름 및 이를 이용한 유기 발광 표시 장치 제조 방법 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7913381B2 (en) * | 2006-10-26 | 2011-03-29 | Carestream Health, Inc. | Metal substrate having electronic devices formed thereon |
| KR101408510B1 (ko) * | 2007-05-18 | 2014-06-17 | 삼성전자주식회사 | 표시소자용 연성기판 및 이를 이용한 디스플레이 소자 |
| US8502259B2 (en) | 2008-01-11 | 2013-08-06 | Industrial Technology Research Institute | Light emitting device |
| US8800138B2 (en) * | 2008-02-08 | 2014-08-12 | Carestream Health, Inc. | Method for conditioning a substrate surface for forming an electronic device thereon and resultant device |
| US20090200543A1 (en) * | 2008-02-08 | 2009-08-13 | Roger Stanley Kerr | Method of forming an electronic device on a substrate supported by a carrier and resultant device |
| US20100032702A1 (en) * | 2008-08-11 | 2010-02-11 | E. I. Du Pont De Nemours And Company | Light-Emitting Diode Housing Comprising Fluoropolymer |
| TWI400673B (zh) * | 2009-02-18 | 2013-07-01 | Prime View Int Co Ltd | 可撓性顯示面板及其製作方法 |
| US8074349B2 (en) * | 2009-04-16 | 2011-12-13 | Carestream Health, Inc. | Magnetic hold-down for foil substrate processing |
| GB0909721D0 (en) * | 2009-06-05 | 2009-07-22 | Plastic Logic Ltd | Dielectric seed layer |
| TWI387138B (zh) * | 2009-07-10 | 2013-02-21 | Ind Tech Res Inst | 磁性發光元件、磁性發光裝置以及氮化物半導體模板 |
| EP2404650A1 (de) * | 2010-07-09 | 2012-01-11 | Bayer MaterialScience AG | Vorrichtung und Verfahren zur Fest-/Flüssig-Trennung von Fest-Flüssig-Suspensionen |
| WO2012043971A2 (ko) * | 2010-09-29 | 2012-04-05 | 포항공과대학교 산학협력단 | 롤 형상의 모기판을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판 |
| USRE49869E1 (en) * | 2015-02-10 | 2024-03-12 | iBeam Materials, Inc. | Group-III nitride devices and systems on IBAD-textured substrates |
| KR20160127892A (ko) * | 2015-04-27 | 2016-11-07 | 삼성디스플레이 주식회사 | 플렉서블 기판 및 이를 포함하는 표시 장치 |
| KR102346037B1 (ko) | 2017-04-04 | 2021-12-31 | 더블유.엘.고어 앤드 어소시에이츠 게엠베하 | 강화된 엘라스토머 및 통합된 전극을 갖는 유전체 복합재 |
| KR20210006963A (ko) | 2018-05-08 | 2021-01-19 | 더블유.엘. 고어 앤드 어소시에이트스, 인코포레이티드 | 신장성 및 비신장성 기재 상의 내구성 있는 연성 인쇄 회로 |
| WO2019216883A1 (en) | 2018-05-08 | 2019-11-14 | W.L. Gore & Associates, Inc. | Flexible printed circuits for dermal applications |
| AU2018422666B2 (en) | 2018-05-08 | 2022-03-10 | W. L. Gore & Associates, Inc. | Flexible and stretchable printed circuits on stretchable substrates |
| CN109285462B (zh) * | 2018-12-12 | 2021-04-20 | 武汉天马微电子有限公司 | 柔性显示面板及其制作方法、柔性显示装置 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002108250A (ja) * | 2000-09-29 | 2002-04-10 | Sharp Corp | アクティブマトリックス駆動型自発光表示装置及びその製造方法 |
| JP2004140267A (ja) * | 2002-10-18 | 2004-05-13 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP2004515081A (ja) * | 2000-11-30 | 2004-05-20 | インフィネオン テクノロジーズ アクチェンゲゼルシャフト | 半導体層を有する基板、電子素子、電子回路、印刷可能な組成物および製作する方法 |
| JP2004200365A (ja) * | 2002-12-18 | 2004-07-15 | Konica Minolta Holdings Inc | 有機薄膜トランジスタ素子 |
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| JP2010506400A (ja) * | 2006-10-03 | 2010-02-25 | イーストマン コダック カンパニー | 電子デバイス及びトレースを有するフレキシブル基板 |
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| KR102084519B1 (ko) * | 2019-07-16 | 2020-03-04 | 주식회사 오플렉스 | 자외선(uv) 경화형 점착제층을 포함하는 백플레이트 필름 및 이를 이용한 유기 발광 표시 장치 제조 방법 |
Also Published As
| Publication number | Publication date |
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| WO2008016479A1 (en) | 2008-02-07 |
| US20080026581A1 (en) | 2008-01-31 |
| TW200814333A (en) | 2008-03-16 |
| US20100136777A1 (en) | 2010-06-03 |
| US7964507B2 (en) | 2011-06-21 |
| US7678701B2 (en) | 2010-03-16 |
| EP2047513A1 (en) | 2009-04-15 |
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