JP2009545157A5 - - Google Patents

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Publication number
JP2009545157A5
JP2009545157A5 JP2009521714A JP2009521714A JP2009545157A5 JP 2009545157 A5 JP2009545157 A5 JP 2009545157A5 JP 2009521714 A JP2009521714 A JP 2009521714A JP 2009521714 A JP2009521714 A JP 2009521714A JP 2009545157 A5 JP2009545157 A5 JP 2009545157A5
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JP
Japan
Prior art keywords
target
contact surface
heat
following characteristics
phase transition
Prior art date
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Application number
JP2009521714A
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English (en)
Japanese (ja)
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JP5384339B2 (ja
JP2009545157A (ja
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Publication date
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Priority claimed from PCT/NL2007/000181 external-priority patent/WO2008013443A2/en
Publication of JP2009545157A publication Critical patent/JP2009545157A/ja
Publication of JP2009545157A5 publication Critical patent/JP2009545157A5/ja
Application granted granted Critical
Publication of JP5384339B2 publication Critical patent/JP5384339B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009521714A 2006-07-28 2007-07-13 リソグラフィ・システム、熱放散の方法、及びフレーム Active JP5384339B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US83386506P 2006-07-28 2006-07-28
NL1032251 2006-07-28
US60/833,865 2006-07-28
NL1032251 2006-07-28
PCT/NL2007/000181 WO2008013443A2 (en) 2006-07-28 2007-07-13 Lithography system, method of heat dissipation and frame

Publications (3)

Publication Number Publication Date
JP2009545157A JP2009545157A (ja) 2009-12-17
JP2009545157A5 true JP2009545157A5 (enExample) 2010-09-02
JP5384339B2 JP5384339B2 (ja) 2014-01-08

Family

ID=38582337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009521714A Active JP5384339B2 (ja) 2006-07-28 2007-07-13 リソグラフィ・システム、熱放散の方法、及びフレーム

Country Status (6)

Country Link
EP (1) EP2054771B1 (enExample)
JP (1) JP5384339B2 (enExample)
KR (1) KR101486407B1 (enExample)
CN (1) CN101495922B (enExample)
TW (2) TW200813656A (enExample)
WO (1) WO2008013443A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8325321B2 (en) * 2006-07-28 2012-12-04 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
JP5529865B2 (ja) * 2008-08-08 2014-06-25 エーエスエムエル ネザーランズ ビー．ブイ． 温度安定化システム、リソグラフィ投影装置、および温度制御方法
JP5670351B2 (ja) 2009-02-22 2015-02-18 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィ機械装置のための準備ユニット
KR101568652B1 (ko) 2009-02-22 2015-11-12 마퍼 리쏘그라피 아이피 비.브이. 기판 지지 구조, 클램프 제조 유닛, 및 리소그래피 시스템
WO2011101450A1 (en) 2010-02-19 2011-08-25 Mapper Lithography Ip B.V. Substrate support structure, clamp preparation unit, and lithography system
JP6058538B2 (ja) 2010-08-30 2017-01-11 フィリップス ライティング ホールディング ビー ヴィ Ｐｏｗｅｒ−ｏｖｅｒ−Ｅｔｈｅｒｎｅｔ装置の管理
TWI757314B (zh) * 2016-07-28 2022-03-11 荷蘭商Ａｓｍｌ荷蘭公司 基板夾持裝置、用於製造此裝置之方法及用於處理或將樣本成像之儀器及方法
CN110879511B (zh) * 2019-11-28 2021-05-28 昆山龙腾光电股份有限公司 薄膜的定点去除装置、显示基板及其制作方法
NL2024445B1 (en) * 2019-12-12 2021-09-01 Delmic Ip B V Method and manipulation device for handling samples

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0076079A3 (en) * 1981-09-25 1983-08-10 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Improvements in or relating to heat pipes
JPS59117128A (ja) * 1982-12-24 1984-07-06 Hitachi Ltd 温度制御装置を備えたウエハ搭載台
US4911232A (en) * 1988-07-21 1990-03-27 Triangle Research And Development Corporation Method of using a PCM slurry to enhance heat transfer in liquids
JP2731950B2 (ja) * 1989-07-13 1998-03-25 キヤノン株式会社 露光方法
JP2975089B2 (ja) * 1990-11-01 1999-11-10 キヤノン株式会社 露光装置
US5220171A (en) * 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
JP3398456B2 (ja) * 1994-02-14 2003-04-21 大日本スクリーン製造株式会社 基板冷却装置
JPH1092738A (ja) * 1996-09-18 1998-04-10 Canon Inc 基板保持装置およびこれを用いた露光装置
JP2000252352A (ja) * 1999-03-03 2000-09-14 Nikon Corp 基板保持装置及びそれを有する荷電粒子線露光装置
KR100351049B1 (ko) * 1999-07-26 2002-09-09 삼성전자 주식회사 웨이퍼 가열 방법 및 이를 적용한 장치
JP2001189374A (ja) * 1999-12-28 2001-07-10 Nikon Corp 基板処理装置及び荷電粒子線露光装置
JP2001189258A (ja) * 1999-12-28 2001-07-10 Nikon Corp 露光装置
US6686598B1 (en) * 2000-09-01 2004-02-03 Varian Semiconductor Equipment Associates, Inc. Wafer clamping apparatus and method
JP2003068600A (ja) 2001-08-22 2003-03-07 Canon Inc 露光装置、および基板チャックの冷却方法
JP4366098B2 (ja) * 2003-03-04 2009-11-18 キヤノン株式会社 投影露光装置および方法ならびにデバイス製造方法
EP1530088B1 (en) * 2003-11-05 2007-08-08 ASML Netherlands B.V. Lithographic apparatus
US7106416B2 (en) * 2003-12-10 2006-09-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050128449A1 (en) * 2003-12-12 2005-06-16 Nikon Corporation, A Japanese Corporation Utilities transfer system in a lithography system
US20070210090A1 (en) * 2004-01-08 2007-09-13 Bernhard Sixt Transport Container For Keeping Frozen Material Chilled
US8749762B2 (en) * 2004-05-11 2014-06-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006138558A (ja) * 2004-11-12 2006-06-01 Saito Research Institute Inc 調理器
JP4835976B2 (ja) * 2006-01-31 2011-12-14 株式会社ニコン 保持装置及び露光装置
JP5529865B2 (ja) * 2008-08-08 2014-06-25 エーエスエムエル ネザーランズ ビー．ブイ． 温度安定化システム、リソグラフィ投影装置、および温度制御方法

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