JP2009533567A - 紙に金属を適用するための方法 - Google Patents
紙に金属を適用するための方法 Download PDFInfo
- Publication number
- JP2009533567A JP2009533567A JP2009504721A JP2009504721A JP2009533567A JP 2009533567 A JP2009533567 A JP 2009533567A JP 2009504721 A JP2009504721 A JP 2009504721A JP 2009504721 A JP2009504721 A JP 2009504721A JP 2009533567 A JP2009533567 A JP 2009533567A
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- Prior art keywords
- metal
- paper
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- polymer
- monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 78
- 239000002184 metal Substances 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 65
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 44
- 229920000642 polymer Polymers 0.000 claims abstract description 40
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 150000002500 ions Chemical class 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 238000000151 deposition Methods 0.000 claims abstract description 11
- 239000000178 monomer Substances 0.000 claims description 35
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- -1 polyphenylene Polymers 0.000 claims description 21
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 18
- 239000003999 initiator Substances 0.000 claims description 17
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 16
- 229910052763 palladium Inorganic materials 0.000 claims description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- 239000007848 Bronsted acid Substances 0.000 claims description 8
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 8
- 229910052741 iridium Inorganic materials 0.000 claims description 8
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052762 osmium Inorganic materials 0.000 claims description 8
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- 229910052703 rhodium Inorganic materials 0.000 claims description 8
- 239000010948 rhodium Substances 0.000 claims description 8
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052707 ruthenium Inorganic materials 0.000 claims description 8
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 6
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 claims description 6
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 claims description 6
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 claims description 6
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 5
- TZMFJUDUGYTVRY-UHFFFAOYSA-N pentane-2,3-dione Chemical compound CCC(=O)C(C)=O TZMFJUDUGYTVRY-UHFFFAOYSA-N 0.000 claims description 5
- 229920000098 polyolefin Polymers 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- KVFQMAZOBTXCAZ-UHFFFAOYSA-N 3,4-Hexanedione Chemical compound CCC(=O)C(=O)CC KVFQMAZOBTXCAZ-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920000306 polymethylpentene Polymers 0.000 claims description 4
- 239000011116 polymethylpentene Substances 0.000 claims description 4
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical group C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 4
- LOXQVPXHWIYIDX-UHFFFAOYSA-N (4-benzylphenyl)-phenylmethanone Chemical compound C=1C=C(CC=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LOXQVPXHWIYIDX-UHFFFAOYSA-N 0.000 claims description 3
- VTESCYNPUGSWKG-UHFFFAOYSA-N (4-tert-butylphenyl)hydrazine;hydrochloride Chemical compound [Cl-].CC(C)(C)C1=CC=C(N[NH3+])C=C1 VTESCYNPUGSWKG-UHFFFAOYSA-N 0.000 claims description 3
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 claims description 3
- SHJXSYJQBXYBGA-UHFFFAOYSA-N 2-cyclohexyl-2-hydroxy-1-phenylethanone Chemical compound C=1C=CC=CC=1C(=O)C(O)C1CCCCC1 SHJXSYJQBXYBGA-UHFFFAOYSA-N 0.000 claims description 3
- OKISUZLXOYGIFP-UHFFFAOYSA-N 4,4'-dichlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=C(Cl)C=C1 OKISUZLXOYGIFP-UHFFFAOYSA-N 0.000 claims description 3
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 claims description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 3
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 claims description 3
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 3
- 150000004056 anthraquinones Chemical class 0.000 claims description 3
- 229930006711 bornane-2,3-dione Natural products 0.000 claims description 3
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 claims description 3
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims description 3
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 3
- CXAYOCVHDCXPAI-UHFFFAOYSA-N naphthalen-1-yl(phenyl)methanone Chemical compound C=1C=CC2=CC=CC=C2C=1C(=O)C1=CC=CC=C1 CXAYOCVHDCXPAI-UHFFFAOYSA-N 0.000 claims description 3
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 claims description 3
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 3
- BVQVLAIMHVDZEL-UHFFFAOYSA-N 1-phenyl-1,2-propanedione Chemical compound CC(=O)C(=O)C1=CC=CC=C1 BVQVLAIMHVDZEL-UHFFFAOYSA-N 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- LVXXMCDSLDUFCY-UHFFFAOYSA-N diphenylmethanone;methanol Chemical compound OC.C=1C=CC=CC=1C(=O)C1=CC=CC=C1 LVXXMCDSLDUFCY-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- DCUFMVPCXCSVNP-UHFFFAOYSA-N methacrylic anhydride Chemical compound CC(=C)C(=O)OC(=O)C(C)=C DCUFMVPCXCSVNP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- ARJOQCYCJMAIFR-UHFFFAOYSA-N prop-2-enoyl prop-2-enoate Chemical compound C=CC(=O)OC(=O)C=C ARJOQCYCJMAIFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 abstract description 17
- 239000011248 coating agent Substances 0.000 abstract description 16
- 239000000463 material Substances 0.000 abstract description 9
- 239000002699 waste material Substances 0.000 abstract description 2
- 238000010924 continuous production Methods 0.000 abstract 1
- 238000011031 large-scale manufacturing process Methods 0.000 abstract 1
- 239000000123 paper Substances 0.000 description 93
- 239000000243 solution Substances 0.000 description 20
- 239000002131 composite material Substances 0.000 description 13
- 238000006116 polymerization reaction Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 238000013459 approach Methods 0.000 description 10
- 238000009832 plasma treatment Methods 0.000 description 9
- 239000000835 fiber Substances 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- VRBFTYUMFJWSJY-UHFFFAOYSA-N 28804-46-8 Chemical compound ClC1CC(C=C2)=CC=C2C(Cl)CC2=CC=C1C=C2 VRBFTYUMFJWSJY-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920002678 cellulose Polymers 0.000 description 3
- 239000001913 cellulose Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000010985 leather Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- GUHKMHMGKKRFDT-UHFFFAOYSA-N 1785-64-4 Chemical compound C1CC(=C(F)C=2F)C(F)=C(F)C=2CCC2=C(F)C(F)=C1C(F)=C2F GUHKMHMGKKRFDT-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- AIJULSRZWUXGPQ-UHFFFAOYSA-N Methylglyoxal Chemical compound CC(=O)C=O AIJULSRZWUXGPQ-UHFFFAOYSA-N 0.000 description 1
- 101150003085 Pdcl gene Proteins 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- 229910001864 baryta Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003636 chemical group Chemical group 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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Abstract
Description
紙上に金属コーティングを生成するための方法を詳細に開示および説明する前に、本発明が、本明細書に開示される特定の構成、プロセス工程、および材料に限定されるわけではなく、そのような構成、プロセス工程、および材料が或る程度さまざまであってよいことを、理解すべきである。また、本明細書において使用される用語が、あくまで特定の実施の形態を説明するという目的のためだけに使用されていて、本発明を限定しようとするものではなく、本発明の技術的範囲が、添付の特許請求の範囲およびその均等物によってのみ限定されることを、理解すべきである。
第1の態様において、本発明は、第1の金属を紙上に適用するための方法であって、a)カルボキシル基を含み、かつ少なくとも1つの第2の金属のイオンを7を超えるpHで吸着させて含んでいるポリマーを、前記紙の表面に生成する工程、b)前記イオンを前記第2の金属に還元する工程、および
c)前記還元した前記第2の金属のイオンに前記第1の金属を堆積させる工程、を含んでいる方法に関する。
b)少なくとも1つの開始剤に接触させ、その後に該表面を、ルテニウム、ロジウム、パラジウム、オスミウム、イリジウム、白金、および銅から成る群から選択される少なくとも1つの第2の金属のイオンを含んでいるpHが7を超える溶液に接触させることによって、該表面に生成される。
次に、本発明の方法によるこれらの工程を、さらに詳しく説明する。
ストーラエンソ(StoraEnso)社から得られた1枚の紙「PET140+40」を基材として用いた。これは片面がPET(ポリエチレンテレフタレート)で被覆された紙である。この紙片を接着テープでポリマー基材に取り付け、接着テープで端部を封止して紙の未被覆表面を液体から保護した。プラズマ反応器において、この紙に、1分間にわたって大気圧の空気中でプラズマ処理を加えた。プラズマ処理の後に、この紙を、アクリル酸1重量%及びチオキサントン0.01重量%を含む溶液と接触させた。この紙に10秒間にわたってUV光を照射し、4分間にわたって重合反応を進行させた。紙を、30秒にわたって流水で洗浄した。重合反応によって紙に対して共有結合した、すなわち紙に対してグラフトしたポリマーが生成した。次いで、この紙を、PdCl20.48重量%及び濃縮NH3水溶液5.2重量%を含有する水溶液と接触させた。その結果、この溶液はアンモニウムイオン(NH4 +)を含有する。NH3水溶液を用いて、この溶液のpHを11.5に調節した。次いで、紙を、30秒にわたって流水で洗浄した。次いで、新たに作成したNaBH4の1重量%の水溶液に紙を接触させることによって、ポリマーに吸着しているパラジウムイオンを還元した。その後に、紙を、流水で30秒にわたって洗浄した。この工程の後で、紙を、銅を堆積させるべく自己触媒槽に接触させた。この槽は、CuSO4、EDTA(エチレンジアミン四酢酸)、HCHO、およびNaOHを含んでいる銅の堆積のための水性標準槽である。pH値は11.7であり、温度は35℃であった。銅を堆積させた後に、紙を流水中で30秒間にわたって洗浄し、乾燥させた。これにより、銅の厚さ2μmのコーティングを有するエポキシ樹脂が得られた。実施例2と同様の方法を用いた。これにより、銅の厚さ2μmのコーティングを有する紙が得られた。粘着テープを紙に貼り付け、素早く引き剥がすことによって付着を検査した。銅が剥がれることはなく、したがって付着は良好であると判断された。
コピー機用に調製された一片の普通紙を基材として用いた。この紙はポリマー被覆されていない。この紙を直接処理に用いた。実施例1と同様の方法を用いた。得られた紙は銅2μmの柔軟性被覆を有していた。これにより、銅の厚さ2μmのコーティングを有する紙が得られた。粘着テープを表面に貼り付け、素早く引き剥がすことによって付着を検査した。銅が剥がれることはなく、したがって付着は良好であると判断された。
Claims (24)
- 第1の金属を紙上に適用するための方法であって、
a)カルボキシル基を含み、かつ少なくとも1つの第2の金属のイオンを7を超えるpHで吸着させて含んでいるポリマーを、前記紙の表面に生成する工程、
b)前記イオンを前記第2の金属に還元する工程、および
c)前記還元した前記第2の金属のイオンに前記第1の金属を堆積させる工程
を含んでいる方法。 - 前記表面が、前記ポリマーの生成に先立って、プラズマを使用して処理される請求項1に記載の方法。
- 工程a)に先立って少なくとも1つのプライマーが前記紙に塗布され、
該プライマーは、ポリフェニレン、脂環式ポリオレフィン、およびポリ(4‐メチル‐1‐ペンテン)から成る群から選択される請求項1または2に記載の方法。 - 前記プライマーが、パリレンである請求項3に記載の方法。
- 前記プライマーが、パリレンNである請求項3に記載の方法。
- 前記ポリマーが、前記表面を
・カルボキシル基を含んでいるモノマーを少なくとも1つ含む少なくとも1種類のモノマー、
・ルテニウム、ロジウム、パラジウム、オスミウム、イリジウム、白金、および銅から成る群から選択される少なくとも1つの第2の金属のイオン、ならびに
・少なくとも1つの開始剤
に接触させることによって該表面に生成され、
前記pHが7を超える請求項1〜5のいずれか一項に記載の方法。 - 前記ポリマーが、前記表面を
・カルボキシル基を含んでいるモノマーを少なくとも1つ含む少なくとも1種類のモノマー、および
・少なくとも1つの開始剤
に接触させ、その後に該表面を、ルテニウム、ロジウム、パラジウム、オスミウム、イリジウム、白金、および銅から成る群から選択される少なくとも1つの第2の金属のイオンを含んでいるpHが7を超える溶液に接触させることによって該表面に生成される請求項1〜5のいずれか一項に記載の方法。 - 前記少なくとも1種類のモノマーが、アクリル酸およびメタクリル酸から成る群から選択される請求項6または7に記載の方法。
- 前記ポリマーが、前記表面を
・潜在的カルボキシル基を含んでいるモノマーを少なくとも1つ含む少なくとも1種類のモノマー、および
・少なくとも1つの開始剤
に接触させ、
その後に該表面を、前記潜在的カルボキシル基をカルボキシル基に変換するために適した条件に曝し、
その後に該表面を、ルテニウム、ロジウム、パラジウム、オスミウム、イリジウム、白金、および銅から成る群から選択される少なくとも1つの第2の金属のイオンを含んでいるpHが7を超える溶液に接触させることによって該表面に生成される請求項1〜5のいずれか一項に記載の方法。 - 前記潜在的カルボキシル基を含んでいるモノマーが、アクリル酸t‐ブチル、無水マレイン酸、無水メタクリル酸、および無水アクリル酸から成る群から選択される少なくとも1つの物質である請求項9に記載の方法。
- 前記潜在的カルボキシル基をカルボキシル基に変換するために適した条件が、前記表面を光誘起性ブレンステッド酸に接触させることによって達成される請求項9または10に記載の方法。
- 前記ブレンステッド酸が、スルホニウム塩およびヨードニウム塩から成る群から選択される請求項11に記載の方法。
- 前記開始剤が、チオキサントン、カンファーキノン、ベンゾフェノン、4‐クロロベンゾフェノン、4,4’‐ジクロロベンゾフェノン、4‐ベンジルベンゾフェノン、ベンゾイルナフタレン、キサントン、アントラキノン、9‐フルオレノン、アセトフェノン、ベンゾイルジメチルケタール、ヒドロキシ‐シクロ‐ヘキシル‐アセトフェノン、ビ‐アセチル、3,4‐ヘキサン‐ジ‐オン、2,3‐ペンタン‐ジ‐オン、1‐フェニル‐1,2‐プロパン‐ジ‐オン、ベンゼン、ベンゾイルギ酸、ホルムアルデヒド、アセトアルデヒド、アセトン、2‐ペンタノン、3‐ペンタノン、シクロヘキサノン、ベンゾフェノンのメタノールスルホン酸エステル、およびこれらの混合物から成る群から選択される請求項6〜12のいずれか一項に記載の方法。
- 前記少なくとも1つの第2の金属のイオンが、パラジウムイオンであり、当該方法が、アンモニウムイオンをさらに含んでいる請求項1〜13のいずれか一項に記載の方法。
- 前記イオンが、10を超えるpHにおいて吸着されている請求項1〜14のいずれか一項に記載の方法。
- 前記第1の金属が、銅、銀、金、ニッケル、チタニウム、およびクロミウムから成る群から選択される請求項1〜15のいずれか一項に記載の方法。
- 前記表面に、
d)第3の金属を該表面に特徴的なパターンにて選択的に堆積させる工程、および
e)前記第1および第2の金属を、前記第3の金属によって覆われていない部位について該表面から取り除く工程
がさらに加えられる請求項1〜16のいずれか一項に記載の方法。 - 前記金属が、前記紙上に特徴的なパターンにて適用される請求項1〜16のいずれか一項に記載の方法。
- 前記金属が、紙の全体に適用される請求項1〜16のいずれか一項に記載の方法。
- 前記第3の金属が、銅である請求項17に記載の方法。
- 請求項1〜20のいずれか一項に従って製造された紙を含んでいる物体。
- 前記第1の金属の層の厚さが、約2μm〜約5μmである請求項21に記載の物体。
- 前記物体が、回路を含んでいる請求項21または22に記載の物体。
- 互いに電気的に絶縁された2つ以上の導体層を含んでいる請求項21〜23のいずれか一項に記載の物体。
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