JP2009530832A5 - - Google Patents
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- Publication number
- JP2009530832A5 JP2009530832A5 JP2009500594A JP2009500594A JP2009530832A5 JP 2009530832 A5 JP2009530832 A5 JP 2009530832A5 JP 2009500594 A JP2009500594 A JP 2009500594A JP 2009500594 A JP2009500594 A JP 2009500594A JP 2009530832 A5 JP2009530832 A5 JP 2009530832A5
- Authority
- JP
- Japan
- Prior art keywords
- electrically conductive
- layer
- electrically
- insulating layer
- conductive layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002245 particle Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
Claims (4)
- 電気絶縁層によって分離される第1および第2の電気伝導層を含む基材、前記絶縁層は熱伝導性粒子が充填されたポリマー材料を含み、前記熱伝導性粒子の少なくとも一部は前記第1および第2の電気伝導層の両方に同時に接触する、並びに
前記第1の伝導層上に配置される複数の光源
を含む照明アセンブリ。 - ヒートシンクおよび
前記ヒートシンクと前記第2の伝導層との間に配置される熱界面材料層を組み合わせた、請求項1に記載のアセンブリ。 - 請求項1に記載のアセンブリを含む、ディスプレイ用バックライト。
- 電気絶縁層によって分離される第1および第2の電気伝導層を含む基材であって、前記絶縁層が前記第1および第2の電気伝導層の両方に同時に接触する熱伝導性粒子を含む基材を供給すること、
前記第1の電気伝導層をパターニングすること、および
前記パターニングされた第1の電気伝導層上に複数の光源を設けることを含む照明アセンブリを製造する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/276,901 US7710045B2 (en) | 2006-03-17 | 2006-03-17 | Illumination assembly with enhanced thermal conductivity |
PCT/US2007/063971 WO2007109474A2 (en) | 2006-03-17 | 2007-03-14 | Illumination assembly with enhanced thermal conductivity |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009530832A JP2009530832A (ja) | 2009-08-27 |
JP2009530832A5 true JP2009530832A5 (ja) | 2010-04-15 |
Family
ID=38517072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009500594A Withdrawn JP2009530832A (ja) | 2006-03-17 | 2007-03-14 | 熱伝導度が改善された照明アセンブリ |
Country Status (8)
Country | Link |
---|---|
US (1) | US7710045B2 (ja) |
EP (1) | EP1997359B1 (ja) |
JP (1) | JP2009530832A (ja) |
KR (1) | KR20080106242A (ja) |
CN (1) | CN101401490B (ja) |
AT (1) | ATE515932T1 (ja) |
TW (1) | TWI419348B (ja) |
WO (1) | WO2007109474A2 (ja) |
Cited By (1)
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---|---|---|---|---|
US8872330B2 (en) | 2006-08-04 | 2014-10-28 | Osram Opto Semiconductors Gmbh | Thin-film semiconductor component and component assembly |
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US9175843B2 (en) | 2011-11-17 | 2015-11-03 | Koninklijke Philips N.V. | Solid state lighting module with improved heat spreader |
WO2013102823A1 (en) | 2012-01-03 | 2013-07-11 | Koninklijke Philips Electronics N.V. | A lighting assembly, a light source and a luminaire |
JP2013149711A (ja) * | 2012-01-18 | 2013-08-01 | Citizen Holdings Co Ltd | 半導体発光装置 |
US8896010B2 (en) | 2012-01-24 | 2014-11-25 | Cooledge Lighting Inc. | Wafer-level flip chip device packages and related methods |
US20130187540A1 (en) | 2012-01-24 | 2013-07-25 | Michael A. Tischler | Discrete phosphor chips for light-emitting devices and related methods |
US8907362B2 (en) | 2012-01-24 | 2014-12-09 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
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CN103426993A (zh) * | 2012-05-16 | 2013-12-04 | 欧司朗股份有限公司 | 电子模块、照明装置和制造该电子模块的方法 |
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JP6099453B2 (ja) * | 2012-11-28 | 2017-03-22 | Dowaメタルテック株式会社 | 電子部品搭載基板およびその製造方法 |
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DE102013219335A1 (de) * | 2013-09-25 | 2015-03-26 | Osram Gmbh | Beleuchtungsvorrichtung mit Substratkörper |
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US9897292B1 (en) * | 2013-10-30 | 2018-02-20 | Automated Assembly Corporation | Solid-state lighting elements on adhesive transfer tape |
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CN106714507B (zh) * | 2015-11-16 | 2019-09-13 | 华为技术有限公司 | 中框件及其生产方法 |
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CN106784399B (zh) * | 2016-12-20 | 2018-10-30 | 武汉华星光电技术有限公司 | 制作oled时用于承载oled的承载基板及其制作方法 |
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-
2006
- 2006-03-17 US US11/276,901 patent/US7710045B2/en not_active Expired - Fee Related
-
2007
- 2007-03-14 JP JP2009500594A patent/JP2009530832A/ja not_active Withdrawn
- 2007-03-14 AT AT07758519T patent/ATE515932T1/de not_active IP Right Cessation
- 2007-03-14 KR KR1020087022177A patent/KR20080106242A/ko not_active Application Discontinuation
- 2007-03-14 EP EP07758519A patent/EP1997359B1/en not_active Not-in-force
- 2007-03-14 WO PCT/US2007/063971 patent/WO2007109474A2/en active Application Filing
- 2007-03-14 CN CN2007800087747A patent/CN101401490B/zh not_active Expired - Fee Related
- 2007-03-16 TW TW096109127A patent/TWI419348B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8872330B2 (en) | 2006-08-04 | 2014-10-28 | Osram Opto Semiconductors Gmbh | Thin-film semiconductor component and component assembly |
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