JP2009521561A - 静電気発生の少ないポリエーテルイミドポリマーからなる高温熱耐接着テープ - Google Patents
静電気発生の少ないポリエーテルイミドポリマーからなる高温熱耐接着テープ Download PDFInfo
- Publication number
- JP2009521561A JP2009521561A JP2008547452A JP2008547452A JP2009521561A JP 2009521561 A JP2009521561 A JP 2009521561A JP 2008547452 A JP2008547452 A JP 2008547452A JP 2008547452 A JP2008547452 A JP 2008547452A JP 2009521561 A JP2009521561 A JP 2009521561A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- film
- tape
- polymer film
- tape according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004697 Polyetherimide Substances 0.000 title claims abstract description 47
- 229920001601 polyetherimide Polymers 0.000 title claims abstract description 47
- 230000003068 static effect Effects 0.000 title description 45
- 230000005611 electricity Effects 0.000 title description 23
- 239000002390 adhesive tape Substances 0.000 title description 21
- 229920000642 polymer Polymers 0.000 title description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 152
- 230000001070 adhesive effect Effects 0.000 claims abstract description 151
- 229920006254 polymer film Polymers 0.000 claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 239000006229 carbon black Substances 0.000 claims abstract description 13
- 230000000873 masking effect Effects 0.000 claims abstract description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 18
- -1 acrylic compound Chemical class 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000003522 acrylic cement Substances 0.000 claims description 7
- 238000003851 corona treatment Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 5
- 239000013464 silicone adhesive Substances 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004202 carbamide Substances 0.000 claims description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 claims description 2
- 239000002585 base Substances 0.000 claims 2
- 239000003513 alkali Substances 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 86
- 239000000047 product Substances 0.000 description 30
- 239000000463 material Substances 0.000 description 22
- 229920001721 polyimide Polymers 0.000 description 18
- 239000000203 mixture Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 12
- 239000002245 particle Substances 0.000 description 12
- 239000004020 conductor Substances 0.000 description 11
- 239000007787 solid Substances 0.000 description 11
- 239000004642 Polyimide Substances 0.000 description 9
- 238000009826 distribution Methods 0.000 description 8
- 229920000098 polyolefin Polymers 0.000 description 8
- 230000009467 reduction Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 239000002313 adhesive film Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 5
- 239000012467 final product Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000002572 peristaltic effect Effects 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 229920005573 silicon-containing polymer Polymers 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- ZOOODBUHSVUZEM-UHFFFAOYSA-N ethoxymethanedithioic acid Chemical compound CCOC(S)=S ZOOODBUHSVUZEM-UHFFFAOYSA-N 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000012991 xanthate Substances 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 150000003926 acrylamides Chemical class 0.000 description 2
- 230000000181 anti-adherent effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 150000001638 boron Chemical class 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000013008 thixotropic agent Substances 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000010076 replication Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 230000008733 trauma Effects 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 150000003681 vanadium Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74307605P | 2005-12-23 | 2005-12-23 | |
| PCT/US2006/048476 WO2007075716A1 (en) | 2005-12-23 | 2006-12-19 | High temperature heat resistant adhesive tape, with low electrostatic generation, made with a polyetherimide polymer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009521561A true JP2009521561A (ja) | 2009-06-04 |
| JP2009521561A5 JP2009521561A5 (https=) | 2010-02-04 |
Family
ID=38218317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008547452A Withdrawn JP2009521561A (ja) | 2005-12-23 | 2006-12-19 | 静電気発生の少ないポリエーテルイミドポリマーからなる高温熱耐接着テープ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20080268206A1 (https=) |
| EP (1) | EP1969081A4 (https=) |
| JP (1) | JP2009521561A (https=) |
| KR (1) | KR20080076965A (https=) |
| CN (1) | CN101341226B (https=) |
| MX (1) | MXPA06010596A (https=) |
| WO (1) | WO2007075716A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2019078290A1 (ja) * | 2017-10-19 | 2020-12-03 | デンカ株式会社 | 単層フィルム及びそれを用いた耐熱粘着テープ |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5517162B2 (ja) | 2010-09-22 | 2014-06-11 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 文書情報の機密ラベルを判定する方法、コンピュータ・プログラム、装置、及びシステム |
| US8673462B2 (en) | 2011-09-02 | 2014-03-18 | International Business Machines Corporation | Low viscosity electrostatic discharge (ESD) dissipating adhesive substantially free of agglomerates |
| EP2639278A1 (en) * | 2012-03-13 | 2013-09-18 | Nitto Denko Corporation | Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing seminconductor device using the tape |
| JP6106232B2 (ja) * | 2015-09-07 | 2017-03-29 | 日東電工株式会社 | グラファイトシート用粘着シート |
| US10501252B1 (en) * | 2017-07-27 | 2019-12-10 | Amazon Technologies, Inc. | Packaging material having patterns of microsphere adhesive members that allow for bending around objects |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3475196A (en) * | 1965-12-27 | 1969-10-28 | Borden Inc | Pressure-sensitive tape coated with a release agent |
| US3728150A (en) * | 1971-07-12 | 1973-04-17 | Du Pont | Bondable adhesive coated polyimide film |
| JPH0620087B2 (ja) * | 1989-07-10 | 1994-03-16 | 株式会社巴川製紙所 | リードフレーム用接着テープ |
| IE67319B1 (en) * | 1989-10-11 | 1996-03-20 | Waterford Res & Dev Ltd | Antistatic adhesive tape |
| US5273798A (en) * | 1991-08-01 | 1993-12-28 | Watson Label Products, Corp. | Heat and solvent resistant pressure-sensitive label |
| JP3368927B2 (ja) * | 1992-12-28 | 2003-01-20 | 大倉工業株式会社 | 導電性粘着テープ用基材フィルムの製造方法 |
| US5508107A (en) * | 1993-07-28 | 1996-04-16 | Minnesota Mining And Manufacturing Company | Pressure-sensitive adhesive tapes for electronics applications |
| US5478880A (en) * | 1994-02-01 | 1995-12-26 | Moore Business Forms, Inc. | Printable release |
| EP0758366B1 (en) * | 1994-05-06 | 1999-01-27 | Minnesota Mining And Manufacturing Company | High temperature resistant antistatic pressure-sensitive adhesive tape |
| US5589246A (en) * | 1994-10-17 | 1996-12-31 | Minnesota Mining And Manufacturing Company | Heat-activatable adhesive article |
| US5807507A (en) * | 1996-08-28 | 1998-09-15 | Fuji Polymer Industries Co., Ltd. | Self-fusing conductive silicone rubber composition |
| JP3347026B2 (ja) * | 1997-07-23 | 2002-11-20 | 株式会社巴川製紙所 | 電子部品用接着テープ |
| US5958537A (en) * | 1997-09-25 | 1999-09-28 | Brady Usa, Inc. | Static dissipative label |
| JP5105655B2 (ja) * | 1999-03-11 | 2012-12-26 | 日東電工株式会社 | 粘着テープ又はシート用プライマー組成物、及び粘着テープ又はシート |
| US20030039822A1 (en) * | 2001-08-17 | 2003-02-27 | 3M Innovative Properties Company | Contaminant removal tape assembly, a roll of contaminant removal tape, and methods of removing contaminants from a surface |
| TWI341859B (en) * | 2003-05-09 | 2011-05-11 | Mitsubishi Gas Chemical Co | Adhesive and adhesive film |
| JP2005150630A (ja) * | 2003-11-19 | 2005-06-09 | Nitto Denko Corp | 半導体装置製造用接着フィルム |
| US8252407B2 (en) * | 2005-01-12 | 2012-08-28 | Avery Dennison Corporation | Adhesive article having improved application properties |
| US20060194070A1 (en) * | 2005-02-25 | 2006-08-31 | Joshua Croll | Polyetherimide film and multilayer structure |
-
2006
- 2006-09-15 MX MXPA06010596A patent/MXPA06010596A/es unknown
- 2006-12-19 WO PCT/US2006/048476 patent/WO2007075716A1/en not_active Ceased
- 2006-12-19 JP JP2008547452A patent/JP2009521561A/ja not_active Withdrawn
- 2006-12-19 EP EP06839436A patent/EP1969081A4/en not_active Withdrawn
- 2006-12-19 KR KR1020087014917A patent/KR20080076965A/ko not_active Ceased
- 2006-12-19 US US12/096,249 patent/US20080268206A1/en not_active Abandoned
- 2006-12-19 CN CN2006800482686A patent/CN101341226B/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2019078290A1 (ja) * | 2017-10-19 | 2020-12-03 | デンカ株式会社 | 単層フィルム及びそれを用いた耐熱粘着テープ |
| JP7204658B2 (ja) | 2017-10-19 | 2023-01-16 | デンカ株式会社 | 単層フィルム及びそれを用いた耐熱粘着テープ |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101341226A (zh) | 2009-01-07 |
| EP1969081A4 (en) | 2012-08-08 |
| CN101341226B (zh) | 2013-03-20 |
| EP1969081A1 (en) | 2008-09-17 |
| MXPA06010596A (es) | 2007-06-22 |
| WO2007075716A1 (en) | 2007-07-05 |
| US20080268206A1 (en) | 2008-10-30 |
| KR20080076965A (ko) | 2008-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1040450C (zh) | 聚硅氧烷防粘涂料和涂层以及涂有该涂料的底材及其制法 | |
| US9187678B2 (en) | Release films via solventless extrusion processes | |
| CN104962209B (zh) | 粘结膜用剥离膜、以及使用该粘结膜用剥离膜的粘结膜 | |
| JP4892129B2 (ja) | 剥離性硬化皮膜形成用シリコーン組成物 | |
| JP6594637B2 (ja) | 粘着シート、及び、光学部材 | |
| CN105950041B (zh) | 剥离性优异的离型膜 | |
| JP5183485B2 (ja) | 剥離力を調節することができるシリコーン離型組成物及びこれをコーティングしたシリコーン離型フィルム | |
| WO2014007353A1 (ja) | 粘着性シート | |
| CN106232755A (zh) | 粘着片和光学部件 | |
| US20180134925A1 (en) | High temperature resistant pressure sensitive adhesive with low thermal impedance | |
| CN103374305A (zh) | 粘合片及粘合剂组合物 | |
| JP2007217553A (ja) | 両面粘着テープ又はシート | |
| JP2013095807A (ja) | 自己貼着性積層体フィルム | |
| JP5671923B2 (ja) | 離型剤組成物、離型フィルム及びこれを用いた接着フィルム | |
| CN111918942A (zh) | 表面保护薄膜、光学构件、及显示装置 | |
| KR102024963B1 (ko) | 박리 시트 | |
| JP2009521561A (ja) | 静電気発生の少ないポリエーテルイミドポリマーからなる高温熱耐接着テープ | |
| JP2016117839A (ja) | 両面粘着フィルム及びそれを用いた情報表示画面用の保護部材 | |
| TWI700350B (zh) | 黏著片、及光學構件 | |
| JP6566247B2 (ja) | 両面粘着フィルム及びそれを用いた情報表示画面用の保護部材 | |
| JP2015140375A (ja) | 吸着フィルム | |
| KR100901526B1 (ko) | 수평 열전도 시트 및 그 제조 방법 | |
| JP2003261855A (ja) | 剥離性硬化皮膜形成用シリコーン組成物 | |
| JP6383968B2 (ja) | 両面粘着フィルム及びそれを用いた情報表示画面用の保護部材 | |
| JP2005047176A (ja) | 離形フィルム |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091208 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091208 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20110622 |