JP2009518187A - レーザ微細加工応用における光学部品の清浄管理および漂積物管理 - Google Patents
レーザ微細加工応用における光学部品の清浄管理および漂積物管理 Download PDFInfo
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
- B23K26/128—Laser beam path enclosures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
Abstract
【選択図】図1
Description
c 2006 Electro Scientific Industries社 本特許書類の開示の一部は、著作権保護を受ける要素を含んでいる。著作権所有者は、特許商標庁の特許ファイル又は記録に表示されている形で、何人かによって特許書類又は特許開示が複製されることに対しては異論を唱えないが、それ以外には全ての著作権の権利を留保する。37 CFR §1.71 (d)
P偏光:
S偏光:
ここで、θiは入射角度であり、θtはガラス内の透過角度である。角度は、スネルの法則、nisinθi =ntsinθt により分かる。ここで、niは空気の屈折率であり、ntはガラスの屈折率である。n=1.45についての1024ナノメートルでの石英ガラスの反射損失の計算の例が図4に与えられている。計画的な設計によるビーム減衰入力窓24は、従って、上記の式に従って定まる一定値の光損失を導く。
18 ビーム管組立体
20 シャッタ
24、24a レーザビーム減衰入力窓
26 バルクヘッド(支持部材)
24、34、38、44、50、54、60、72 光学部品
74 ガスパージポート
78 受光面
80 ガスディフューザ
122、132 ダンプ
140 マウント
142 ホルダ
144 肩部(支持面)
152 止め金具
154 ボルト(締め具)
156 穴
Claims (17)
- 光線経路を導く組立体の一部として含まれる光学部品のビーム受光面上への汚染物質の蓄積を防止するために設定されたガスディフューザを含む前記組立体であって、
光線が光線経路に沿って伝搬し得る内部領域を有する光学部品マウントと、
前記光線経路に交差すべく前記内部領域内に配置されるビーム受光面を有し、前記内部領域内を伝わる前記光線が前記受光面に入射する光学部品と、
前記ビーム受光面を横切って流れるガスの拡散した流れを前記内部領域に供給すべく前記光学部品マウントに流体を伝えるガスディフューザとを含み、該ディフューザは、前記ビーム受光面の汚染物質の蓄積を防止するに十分な流量で前記ガスの流れを供給するが、前記内部領域内での前記光線の伝搬の安定性を明確に感知できる程には妨げないように設定されている、組立体。 - 前記ガスディフューザは、前記光学部品マウント内に配置され、前記内部領域内に直接的に流体を伝える、請求項1の前記組立体。
- さらに、前記光学部品マウントに形成されるガス流路であって前記内部領域に開口するガス流路に流体を伝えるガス吸気口を含み、該ガス吸気口は、該ガス吸気口へガスの供給を提供する外部のガス配管の扱いに応じた前記ビーム受光面の変位を防止するために、前記光学部品から分離されている、請求項1の前記組立体。
- 前記光学部品は、前記ビーム受光面へ入射する前記光線の伝搬方向を変更するタイプである、請求項1の前記組立体。
- 前記光学部品はミラーを含む、請求項4の前記組立体。
- 前記光学部品はビーム減衰器を含む、請求項4の前記組立体。
- 光線が光線経路に沿って伝わりかつ加工品処理システムに配置された光学部品に交差する処理システムであって前記光学部品が実効中心を有する受光面を備え、また前記光線が前記光学部品の前記受光面と交差する光学面領域を規定する横断面を備える前記処理システムにおいて、
支持部材と、
前記支持部材に解除可能に結合され、前記光学部品を保持すべく設定されたホルダであって前記光学部品を保持している前記ホルダが前記受光面を回転させるときに前記実効中心の回りに異なる回転角毎で前記受光面の前記実効中心が前記光学面領域の外側にあるように、前記支持部材に関して配置されかつ選択的に回転可能であるホルダと、
前記支持部材に前記光学部品を効果的に固定する固定機構とを含む、前記システム。 - 前記支持部材は支持面を含み、前記ホルダは環状形状であり前記支持面上に載る寸法であり、前記環状ホルダは、該ホルダによって前記光学部品が保持されたときに該光学部品が載るフランジを含む、請求項7の前記システム。
- 前記光学部品は外縁を有し、前記環状ホルダは該ホルダの周囲に角度的に間隔を置く特徴部を有し、該特徴部に工具が前記支持面に沿って前記環状ホルダを回転させるために結合され、これにより、異なる光学面領域が前記光線経路に沿って伝搬する入射光線に提供される、請求項8の前記システム。
- 前記複数の特徴部のそれぞれは、前記工具が挿入可能の穴である、請求項9の前記システム。
- 前記光学部品は外縁を有し、前記固定機構は複数の留め金具と、前記光学部品の前記外縁に沿って間隔をおく複数の関連した細長い締め具とを含み、前記複数の止め金具のそれぞれは前記光学部品の外縁の近傍で該光学部品の一部に接触し、また前記複数の細長い締め具のそれぞれはそれに関連する前記止め金具を前記支持部材に結合する、請求項7の前記システム。
- 前記複数の細長い締め具はボルトを含む、請求項11の前記システム。
- 前記光学部品は外縁を有し、前記固定機構は前記光学部品の前記外縁に沿って間隔をおいて配置された複数の固定器具を含み、該固定器具のそれぞれは第1及び第2の端部を有し、前記第1の端部は前記光学部品にその外縁の一部で接触し、前記第2の端部は前記支持部材に接触する、請求項7の前記システム。
- 前記複数の固定器具のそれぞれは止め金具および締め具を含む、請求項13の前記システム。
- 前記ホルダの前記支持部材への解除可能な結合は、前記固定機構によって達成される、請求項13の前記システム。
- 前記光学部品は減衰窓を含む、請求項7の前記システム。
- 前記減衰窓の受光面は、実質的に平面であり、前記光線経路が斜角で前記受光面に交差するように、傾斜角に設定されており、該傾斜角は前記光線経路に沿った入射光線の伝搬に減衰量をもたらす、請求項16の前記システム。
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US74216205P | 2005-12-01 | 2005-12-01 | |
PCT/US2006/046113 WO2007064947A2 (en) | 2005-12-01 | 2006-11-30 | Optical component cleanliness and debris management in laser micromachining applications |
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JP2009518187A true JP2009518187A (ja) | 2009-05-07 |
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US (1) | US8320424B2 (ja) |
JP (1) | JP2009518187A (ja) |
KR (1) | KR101352895B1 (ja) |
CN (1) | CN101317311B (ja) |
DE (1) | DE112006003173T5 (ja) |
GB (1) | GB2446328B (ja) |
TW (1) | TWI377105B (ja) |
WO (1) | WO2007064947A2 (ja) |
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2006
- 2006-11-30 CN CN2006800444241A patent/CN101317311B/zh active Active
- 2006-11-30 JP JP2008543514A patent/JP2009518187A/ja active Pending
- 2006-11-30 US US11/565,356 patent/US8320424B2/en active Active
- 2006-11-30 DE DE112006003173T patent/DE112006003173T5/de not_active Withdrawn
- 2006-11-30 KR KR1020087013167A patent/KR101352895B1/ko active IP Right Grant
- 2006-11-30 GB GB0809120A patent/GB2446328B/en not_active Expired - Fee Related
- 2006-11-30 WO PCT/US2006/046113 patent/WO2007064947A2/en active Application Filing
- 2006-12-01 TW TW095144619A patent/TWI377105B/zh not_active IP Right Cessation
Patent Citations (1)
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JPH0426687U (ja) * | 1990-06-28 | 1992-03-03 |
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GB2446328A (en) | 2008-08-06 |
TWI377105B (en) | 2012-11-21 |
WO2007064947A2 (en) | 2007-06-07 |
GB2446328B (en) | 2011-04-13 |
DE112006003173T5 (de) | 2008-12-11 |
KR101352895B1 (ko) | 2014-02-19 |
TW200726564A (en) | 2007-07-16 |
CN101317311A (zh) | 2008-12-03 |
CN101317311B (zh) | 2011-12-07 |
GB0809120D0 (en) | 2008-06-25 |
KR20080070732A (ko) | 2008-07-30 |
US20070127122A1 (en) | 2007-06-07 |
WO2007064947A3 (en) | 2007-11-08 |
US8320424B2 (en) | 2012-11-27 |
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