JP2009503838A5 - - Google Patents

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Publication number
JP2009503838A5
JP2009503838A5 JP2008523511A JP2008523511A JP2009503838A5 JP 2009503838 A5 JP2009503838 A5 JP 2009503838A5 JP 2008523511 A JP2008523511 A JP 2008523511A JP 2008523511 A JP2008523511 A JP 2008523511A JP 2009503838 A5 JP2009503838 A5 JP 2009503838A5
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JP
Japan
Prior art keywords
electrode
self
group
contact layer
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008523511A
Other languages
English (en)
Japanese (ja)
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JP2009503838A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2006/052510 external-priority patent/WO2007013015A1/en
Publication of JP2009503838A publication Critical patent/JP2009503838A/ja
Publication of JP2009503838A5 publication Critical patent/JP2009503838A5/ja
Pending legal-status Critical Current

Links

JP2008523511A 2005-07-27 2006-07-21 電気素子を製造する方法 Pending JP2009503838A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05106926 2005-07-27
PCT/IB2006/052510 WO2007013015A1 (en) 2005-07-27 2006-07-21 Method of manufacturing an electrical element

Publications (2)

Publication Number Publication Date
JP2009503838A JP2009503838A (ja) 2009-01-29
JP2009503838A5 true JP2009503838A5 (https=) 2009-09-03

Family

ID=37450775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008523511A Pending JP2009503838A (ja) 2005-07-27 2006-07-21 電気素子を製造する方法

Country Status (7)

Country Link
US (1) US20080203384A1 (https=)
EP (1) EP1911109A1 (https=)
JP (1) JP2009503838A (https=)
KR (1) KR20080032119A (https=)
CN (1) CN101228646A (https=)
TW (1) TW200742140A (https=)
WO (1) WO2007013015A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101046720B1 (ko) * 2008-06-30 2011-07-05 주식회사 하이닉스반도체 분자 전자 소자 및 그 제조 방법
EP2144310A1 (en) * 2008-07-10 2010-01-13 Koninklijke Philips Electronics N.V. Light emitting device
KR20110023164A (ko) * 2009-08-28 2011-03-08 삼성전자주식회사 광전자 소자
CN102802346B (zh) * 2011-05-27 2015-08-05 中国科学院理化技术研究所 一种液态金属印刷电路板及其制备方法
US9380979B2 (en) * 2012-11-02 2016-07-05 Nokia Technologies Oy Apparatus and method of assembling an apparatus for sensing pressure
EP2948968B1 (en) 2013-01-28 2018-03-28 Massachusetts Institute of Technology Electromechanical device
US9412806B2 (en) * 2014-06-13 2016-08-09 Invensas Corporation Making multilayer 3D capacitors using arrays of upstanding rods or ridges
US9742466B2 (en) * 2015-05-04 2017-08-22 Thin Film Electronics Asa MOSCAP-based circuitry for wireless communication devices, and methods of making and using the same
KR102227004B1 (ko) * 2018-07-18 2021-03-12 고려대학교 산학협력단 터널링 전류의 디콘볼루션 특성을 갖는 혼성 자기조립 단층 및 이를 포함하는 분자전자소자

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0130485D0 (en) * 2001-12-21 2002-02-06 Plastic Logic Ltd Self-aligned printing
JP4974263B2 (ja) * 2002-05-20 2012-07-11 富士通株式会社 半導体装置の製造方法
GB0309355D0 (en) * 2003-04-24 2003-06-04 Univ Cambridge Tech Organic electronic devices incorporating semiconducting polymer
JP4208668B2 (ja) * 2003-08-22 2009-01-14 富士通株式会社 半導体装置およびその製造方法
GB0315477D0 (en) * 2003-07-02 2003-08-06 Plastic Logic Ltd Rectifying diodes

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