JP2009302533A - 薄膜太陽電池モジュールをリサイクルする方法 - Google Patents
薄膜太陽電池モジュールをリサイクルする方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000010409 thin film Substances 0.000 title claims abstract description 21
- 238000004064 recycling Methods 0.000 title claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 98
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000002346 layers by function Substances 0.000 claims abstract description 19
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000003672 processing method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
- B09B3/40—Destroying solid waste or transforming solid waste into something useful or harmless involving thermal treatment, e.g. evaporation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/001—Dry processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
- B29B2017/0213—Specific separating techniques
- B29B2017/0255—Specific separating techniques using different melting or softening temperatures of the materials to be separated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
- C22B9/16—Remelting metals
- C22B9/22—Remelting metals with heating by wave energy or particle radiation
- C22B9/221—Remelting metals with heating by wave energy or particle radiation by electromagnetic waves, e.g. by gas discharge lamps
- C22B9/223—Remelting metals with heating by wave energy or particle radiation by electromagnetic waves, e.g. by gas discharge lamps by laser beams
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/20—Waste processing or separation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/919—Delaminating in preparation for post processing recycling step
- Y10S156/922—Specified electronic component delaminating in preparation for recycling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
- Y10T156/1917—Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49821—Disassembling by altering or destroying work part or connector
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Abstract
【解決手段】基板層は、作用レーザービームに対して透過であり、電極層の第一機能層は、この作用レーザービームを吸収することができる。基板層の自由表面が作用レーザービームで走査されるので、第一電極層は、作用レーザービームの吸収に起因して、少なくとも部分的に蒸発させられ、故に、機能層の積層構造が基板層から分離される。基板層は、プラスチック層とカバー層とに取り付けられる機能層から切り離されて、その後別の更なる処理のために使用可能である。
【選択図】なし
Description
Claims (9)
- 薄膜大陽電池モジュールをリサイクルするための方法であって、当該方法では、薄膜太陽電池モジュールは、第一電極層、半導体層及び第二電極層を備えて成る積層構造を備えた基板層と、前記した機能層を封入するためのプラスチック層であって、外周エッジ領域に沿って基板層に直接接合されるプラスチック層と、カバー層と、から成り、基板層は、作用レーザービームに対して透過であり、且つ、第一電極層は、この作用レーザービームを吸収することが可能である、薄膜大陽電池モジュールをリサイクルするための方法において、
基板層の自由表面が、作用レーザービームで走査され、第一電極層が、作用レーザービームを吸収することにより少なくとも部分的に蒸発させられ、機能層の積層構造が基板層から自身を分離するので、基板層が、プラスチック層とカバー層とに取付けられた機能層から切り離されて、別個の更なる処理のために利用可能となる、ことを特徴とする薄膜大陽電池モジュールをリサイクルするための方法。 - プラスチック層が、軟化温度に達するまでカバー層の方向から加熱されること、及び、カバー層がプラスチック層からはがされるので、カバー層がプラスチック層に取付けられた機能層から切り離されて、別個の更なる処理のために利用可能となること、を特徴とする請求項1に記載の薄膜大陽電池モジュールをリサイクルするための方法。
- 機能層が外周エッジ領域によって囲まれる内側領域にわたって完全に走査されること、及び、その後、エッジ領域が加熱されること、を特徴とする請求項1に記載の薄膜大陽電池モジュールをリサイクルするための方法。
- 内側領域が互いに隣接するトラックに沿って走査され、第一電極層が基板層から自身を分離する閉鎖領域をもたらし、その結果、形成するガス体積を取り囲む閉じた内側空間が形成されることを特徴とする請求項3に記載の薄膜大陽電池モジュールをリサイクルするための方法。
- 内側領域が、互いから間隔を開けて配置されるトラックに沿って走査され、当該間隔はトラックの幅又はトラックの幅の倍数に等しく、熱負荷を減少することを特徴とする請求項1に記載の薄膜大陽電池モジュールをリサイクルするための方法。
- 走査処理の間、プラスチック層がカバー層の方向から冷却されることを特徴とする請求項1に記載の薄膜大陽電池モジュールをリサイクルするための方法。
- 内側領域が走査される前に、少なくともひとつの開口が外周エッジ領域に作り出されることを特徴とする請求項1に記載の薄膜大陽電池モジュールをリサイクルするための方法。
- 形成されるガスが、少なくともひとつ存在する作り出された開口を通じて内側空間から放出されることを特徴とする請求項7に記載の薄膜大陽電池モジュールをリサイクルするための方法。
- 外部のガスが、少なくともひとつ存在する作り出された開口を通じて内側空間に供給されることを特徴とする請求項7に記載の薄膜大陽電池モジュールをリサイクルするための方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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DE102008028425.4 | 2008-06-13 | ||
DE102008028425 | 2008-06-13 | ||
DE102008047675.7A DE102008047675B4 (de) | 2008-06-13 | 2008-09-15 | Recycling-Verfahren für Dünnschichtsolarzellenmodule |
DE102008047675.7 | 2008-09-15 |
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JP2009302533A true JP2009302533A (ja) | 2009-12-24 |
JP5409127B2 JP5409127B2 (ja) | 2014-02-05 |
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JP2009134986A Active JP5409127B2 (ja) | 2008-06-13 | 2009-06-04 | 薄膜太陽電池モジュールをリサイクルする方法 |
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US (1) | US7972473B2 (ja) |
EP (1) | EP2133923B1 (ja) |
JP (1) | JP5409127B2 (ja) |
KR (1) | KR101607706B1 (ja) |
DE (1) | DE102008047675B4 (ja) |
TW (1) | TWI493741B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020507197A (ja) * | 2017-01-26 | 2020-03-05 | グロース・レアンダー・キリアン | 複合部材の様々な材料層を分離するための方法及び装置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8288680B1 (en) * | 2010-02-24 | 2012-10-16 | Vinyl Technologies, Inc. | Thin film remediation and edge deletion process |
DE102011103589A1 (de) * | 2011-05-30 | 2012-12-06 | Boraident Gmbh | Verfahren zum Entfernen einer Schicht auf einem Trägersubstrat |
TWI449486B (zh) * | 2012-01-11 | 2014-08-11 | E Ink Holdings Inc | 基板剝離製程 |
DE102012010904B3 (de) * | 2012-06-01 | 2013-05-29 | Eugen Rold GmbH | Verfahren und Vorrichtung zum Recyclen der Bodenplatten von Photovoltaik-Anlagen |
DE112014004689A5 (de) * | 2013-10-10 | 2016-07-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum separierenden Trennen von Schichten eines aus mindestens zwei Schichten gebildeten Verbundbauteils |
US10688535B1 (en) | 2018-01-10 | 2020-06-23 | Owens-Brockway Glass Container Inc. | Obtaining cullet from thin film solar modules |
CN108807602A (zh) * | 2018-07-23 | 2018-11-13 | 北京铂阳顶荣光伏科技有限公司 | 一种薄膜太阳能基板电池材料的回收装置和回收方法 |
KR20200086390A (ko) | 2019-01-08 | 2020-07-17 | 주식회사 에스엠케미칼 | 폴리실리콘의 폐기물을 이용한 레진 제조방법 |
DE102021109591B4 (de) | 2021-04-16 | 2023-01-19 | Wolfram Palitzsch | Verfahren und Vorrichtung zum Trennen von Multischichtverbundmaterialien |
WO2023147803A1 (de) * | 2022-02-07 | 2023-08-10 | FLAXTEC GmbH | Verfahren zur trennung von wertstoffen in einem verbundbauteil |
DE102022109249A1 (de) | 2022-04-14 | 2023-10-19 | Wolfram Palitzsch | Verfahren und Vorrichtung zum Trennen von Multischichtverbundmaterialien |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11165150A (ja) * | 1997-07-21 | 1999-06-22 | Angewandte Solarenergie Ase Gmbh | 合わせガラスの構成部材の分離方法 |
JP2000269535A (ja) * | 1999-01-14 | 2000-09-29 | Canon Inc | 太陽電池モジュール、発電装置、太陽電池モジュールの分離方法及び太陽電池モジュールの再生方法 |
JP2001111080A (ja) * | 1999-10-14 | 2001-04-20 | Sony Corp | 半導体素子の製造方法 |
JP2002540950A (ja) * | 1999-04-07 | 2002-12-03 | シーメンス ソーラー ゲゼルシャフト ミット ベシュレンクテル ハフツング | 担体材料上の薄層の剥離のための装置及び方法 |
JP2004186547A (ja) * | 2002-12-05 | 2004-07-02 | Showa Shell Sekiyu Kk | Cis系薄膜太陽電池モジュールの構成部材回収方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19703104A1 (de) * | 1997-01-29 | 1998-07-30 | Walter Schlutius | Verfahren und Vorrichtungen zum Recykeln von Datenträgerplatten |
US20030116185A1 (en) * | 2001-11-05 | 2003-06-26 | Oswald Robert S. | Sealed thin film photovoltaic modules |
JP2006179626A (ja) * | 2004-12-22 | 2006-07-06 | Showa Shell Sekiyu Kk | Cis系薄膜太陽電池モジュール、該太陽電池モジュールの製造方法及び分離方法 |
JP2008042017A (ja) | 2006-08-08 | 2008-02-21 | Tomozumi Kamimura | レジストを回収可能なレジスト剥離除去方法及びそれを用いる半導体製造装置 |
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- 2009-06-04 JP JP2009134986A patent/JP5409127B2/ja active Active
- 2009-06-08 US US12/480,482 patent/US7972473B2/en active Active
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11165150A (ja) * | 1997-07-21 | 1999-06-22 | Angewandte Solarenergie Ase Gmbh | 合わせガラスの構成部材の分離方法 |
JP2000269535A (ja) * | 1999-01-14 | 2000-09-29 | Canon Inc | 太陽電池モジュール、発電装置、太陽電池モジュールの分離方法及び太陽電池モジュールの再生方法 |
JP2002540950A (ja) * | 1999-04-07 | 2002-12-03 | シーメンス ソーラー ゲゼルシャフト ミット ベシュレンクテル ハフツング | 担体材料上の薄層の剥離のための装置及び方法 |
JP2001111080A (ja) * | 1999-10-14 | 2001-04-20 | Sony Corp | 半導体素子の製造方法 |
JP2004186547A (ja) * | 2002-12-05 | 2004-07-02 | Showa Shell Sekiyu Kk | Cis系薄膜太陽電池モジュールの構成部材回収方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020507197A (ja) * | 2017-01-26 | 2020-03-05 | グロース・レアンダー・キリアン | 複合部材の様々な材料層を分離するための方法及び装置 |
JP7442603B2 (ja) | 2017-01-26 | 2024-03-04 | グロース・レアンダー・キリアン | 複合部材の様々な材料層を分離するための方法及び装置 |
Also Published As
Publication number | Publication date |
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US7972473B2 (en) | 2011-07-05 |
EP2133923B1 (de) | 2017-04-19 |
EP2133923A3 (de) | 2012-12-19 |
JP5409127B2 (ja) | 2014-02-05 |
EP2133923A2 (de) | 2009-12-16 |
KR101607706B1 (ko) | 2016-03-30 |
KR20090129944A (ko) | 2009-12-17 |
TW201005982A (en) | 2010-02-01 |
DE102008047675B4 (de) | 2014-05-15 |
DE102008047675A1 (de) | 2009-12-24 |
TWI493741B (zh) | 2015-07-21 |
US20090308535A1 (en) | 2009-12-17 |
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