JP2009302508A5 - - Google Patents

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Publication number
JP2009302508A5
JP2009302508A5 JP2009038453A JP2009038453A JP2009302508A5 JP 2009302508 A5 JP2009302508 A5 JP 2009302508A5 JP 2009038453 A JP2009038453 A JP 2009038453A JP 2009038453 A JP2009038453 A JP 2009038453A JP 2009302508 A5 JP2009302508 A5 JP 2009302508A5
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JP
Japan
Prior art keywords
substrate holding
sheet portion
substrate
holding apparatus
heating mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009038453A
Other languages
English (en)
Japanese (ja)
Other versions
JP5324251B2 (ja
JP2009302508A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009038453A priority Critical patent/JP5324251B2/ja
Priority claimed from JP2009038453A external-priority patent/JP5324251B2/ja
Priority to US12/432,098 priority patent/US20090283976A1/en
Priority to CN2009101390600A priority patent/CN101582388B/zh
Priority to KR1020090042435A priority patent/KR101108411B1/ko
Publication of JP2009302508A publication Critical patent/JP2009302508A/ja
Publication of JP2009302508A5 publication Critical patent/JP2009302508A5/ja
Application granted granted Critical
Publication of JP5324251B2 publication Critical patent/JP5324251B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009038453A 2008-05-16 2009-02-20 基板保持装置 Active JP5324251B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009038453A JP5324251B2 (ja) 2008-05-16 2009-02-20 基板保持装置
US12/432,098 US20090283976A1 (en) 2008-05-16 2009-04-29 Substrate holding apparatus
CN2009101390600A CN101582388B (zh) 2008-05-16 2009-05-15 衬底保持设备
KR1020090042435A KR101108411B1 (ko) 2008-05-16 2009-05-15 기판 유지 장치

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008129118 2008-05-16
JP2008129118 2008-05-16
JP2009038453A JP5324251B2 (ja) 2008-05-16 2009-02-20 基板保持装置

Publications (3)

Publication Number Publication Date
JP2009302508A JP2009302508A (ja) 2009-12-24
JP2009302508A5 true JP2009302508A5 (https=) 2012-03-22
JP5324251B2 JP5324251B2 (ja) 2013-10-23

Family

ID=41315434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009038453A Active JP5324251B2 (ja) 2008-05-16 2009-02-20 基板保持装置

Country Status (4)

Country Link
US (1) US20090283976A1 (https=)
JP (1) JP5324251B2 (https=)
KR (1) KR101108411B1 (https=)
CN (1) CN101582388B (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
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JP4418032B2 (ja) * 2007-09-11 2010-02-17 キヤノンアネルバ株式会社 静電チャック
JP2009173975A (ja) * 2008-01-22 2009-08-06 Canon Anelva Corp 金属微粒子の生成方法、金属含有ペーストの製造方法及び金属薄膜配線の形成方法
JP2010021510A (ja) * 2008-06-13 2010-01-28 Canon Anelva Corp 基板保持装置およびプラズマ処理装置
JP5166531B2 (ja) * 2008-06-24 2013-03-21 キヤノンアネルバ株式会社 磁場発生装置及びプラズマ処理装置
WO2010013476A1 (ja) * 2008-07-31 2010-02-04 キヤノンアネルバ株式会社 プラズマ処理装置および電子デバイスの製造方法
JP5434636B2 (ja) * 2010-01-29 2014-03-05 住友電気工業株式会社 静電チャックを備えた基板保持体
CN103938186B (zh) * 2013-01-23 2016-12-07 北京北方微电子基地设备工艺研究中心有限责任公司 托盘、mocvd反应腔和mocvd设备
ITCO20130072A1 (it) * 2013-12-19 2015-06-20 Lpe Spa Suscettore con lavorazioni curve e concentriche nella superficie d'appoggio dei substrati
CN104752130A (zh) * 2013-12-30 2015-07-01 中微半导体设备(上海)有限公司 等离子体处理装置及其静电卡盘
JP2015222802A (ja) * 2014-05-23 2015-12-10 株式会社東芝 ウエハホルダおよび蒸着装置
CN105448796A (zh) * 2014-09-29 2016-03-30 盛美半导体设备（上海）有限公司 卡盘
US10340171B2 (en) 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
US11069553B2 (en) * 2016-07-07 2021-07-20 Lam Research Corporation Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
US10388558B2 (en) * 2016-12-05 2019-08-20 Tokyo Electron Limited Plasma processing apparatus
US10910195B2 (en) 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
JP7312031B2 (ja) * 2019-06-17 2023-07-20 日本特殊陶業株式会社 静電チャックおよびその運転方法
JP7394661B2 (ja) * 2020-03-09 2023-12-08 東京エレクトロン株式会社 基板処理装置

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JP2631485B2 (ja) * 1988-01-28 1997-07-16 キヤノン株式会社 位置決め装置
JP2766935B2 (ja) * 1989-10-20 1998-06-18 キヤノン株式会社 Ｘ線露光装置
JP3173928B2 (ja) * 1992-09-25 2001-06-04 キヤノン株式会社 基板保持装置、基板保持方法および露光装置
JPH07249586A (ja) * 1993-12-22 1995-09-26 Tokyo Electron Ltd 処理装置及びその製造方法並びに被処理体の処理方法
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JP3377165B2 (ja) * 1997-05-19 2003-02-17 キヤノン株式会社 半導体露光装置
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JP2001110883A (ja) * 1999-09-29 2001-04-20 Applied Materials Inc 基板支持装置及びその伝熱方法
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JP4141234B2 (ja) * 2002-11-13 2008-08-27 キヤノンアネルバ株式会社 プラズマ処理装置
JP2004273619A (ja) 2003-03-06 2004-09-30 Hitachi High-Technologies Corp 真空処理装置用の試料載置装置
US7846254B2 (en) * 2003-05-16 2010-12-07 Applied Materials, Inc. Heat transfer assembly
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JP2006013132A (ja) 2004-06-25 2006-01-12 Daikin Ind Ltd 温度制御装置
US7544251B2 (en) * 2004-10-07 2009-06-09 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
US7436645B2 (en) * 2004-10-07 2008-10-14 Applied Materials, Inc. Method and apparatus for controlling temperature of a substrate
US7648914B2 (en) * 2004-10-07 2010-01-19 Applied Materials, Inc. Method for etching having a controlled distribution of process results
US7387510B2 (en) * 2005-06-09 2008-06-17 Xin Wen Luo Lighter with pivot nozzle
JP4707593B2 (ja) * 2006-03-23 2011-06-22 大日本スクリーン製造株式会社 熱処理装置と基板吸着方法
US8524005B2 (en) * 2006-07-07 2013-09-03 Tokyo Electron Limited Heat-transfer structure and substrate processing apparatus
JP2010021510A (ja) * 2008-06-13 2010-01-28 Canon Anelva Corp 基板保持装置およびプラズマ処理装置

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