JP2009302394A - Processing device - Google Patents

Abstract

When a second cleaning mechanism is easily and quickly brought into contact with the back surface of the peripheral portion of the object to be processed and a cup surrounding the object to be processed held by a holding part is provided, Reduce the size of the cup.
A processing apparatus includes a holding unit 1 that holds a workpiece, a rotation driving unit 60 that rotates a workpiece W held by the holding unit 1, and one surface of a peripheral portion of the workpiece W. A first cleaning mechanism 30 that contacts and cleans, and a second cleaning mechanism 40 that is connected to the first cleaning mechanism 30 and contacts and cleans the other surface of the peripheral edge of the workpiece W. . The second cleaning mechanism 40 can swing about the swing shaft 45a, and comes into contact with the other surface of the peripheral edge of the workpiece W when it is swung to the first cleaning mechanism 30 side.
[Selection] Figure 1

Description

  The present invention relates to a processing apparatus for processing a peripheral portion of a target object made of a semiconductor wafer or the like.

Conventionally, a holding unit that holds a substrate (object to be processed), a sponge-like first substrate cleaning brush that cleans the surface (one surface) of the peripheral portion of the substrate, and a first substrate cleaning brush that is opposed to the first substrate cleaning brush A sponge-like second substrate cleaning brush that cleans the back surface (the other surface) of the peripheral edge of the substrate, and a brush contact / separation mechanism that causes the first substrate cleaning brush and the second substrate cleaning brush to approach and separate from each other; Is known (see Patent Document 1).
JP 2007-157936 A

  However, if the first substrate cleaning brush and the second substrate cleaning brush are made to approach and separate from each other as in the processing apparatus described in Patent Document 1, the second substrate cleaning brush is attached to the back side of the object to be processed ( It is necessary to sandwich the object to be processed by the first substrate cleaning brush and the second substrate cleaning brush after being moved in the horizontal direction toward the peripheral edge of the object to be processed. For this reason, it takes time to position the second substrate cleaning brush on the back surface of the object to be processed.

  Further, in the case where a cup surrounding the object to be processed held by the holding unit is provided, the second substrate cleaning brush is simply passed between the object to be processed held by the holding unit and the cup. It is necessary to provide a gap. For this reason, the size of the cup surrounding the wafer held by the holding unit increases.

  The present invention has been made in consideration of such points, and the second cleaning mechanism can be easily and quickly brought into contact with the back surface of the peripheral edge of the object to be processed and is held by the holding portion. When the cup surrounding the to-be-processed object is provided, it aims at providing the processing apparatus which can make the magnitude | size of the said cup small.

The processing apparatus according to the present invention comprises:
A holding unit for holding the object to be processed;
A rotation driving unit that rotates the object to be processed held by the holding unit;
A first cleaning mechanism for cleaning in contact with one surface of the peripheral edge of the workpiece;
A second cleaning mechanism that is connected to the first cleaning mechanism and that contacts and cleans the other surface of the peripheral portion of the object to be processed;
The second cleaning mechanism can swing about a swing shaft, and abuts against the other surface of the peripheral edge when swinged toward the first cleaning mechanism.

In the processing apparatus according to the present invention,
It is preferable that the apparatus further includes a moving mechanism that is connected to the first cleaning mechanism and moves the first cleaning mechanism and the second cleaning mechanism in a direction from one surface of the workpiece to the other surface.

In the processing apparatus according to the present invention,
It is preferable that the apparatus further includes a pressing member that contacts the second cleaning mechanism and swings the second cleaning mechanism toward the first cleaning mechanism about the swing shaft.

In the processing apparatus according to the present invention,
The pressing member preferably includes a contact portion that contacts the second cleaning mechanism, and an elastic member that is connected to the corresponding contact portion and applies an elastic force to the corresponding contact portion.

In the processing apparatus according to the present invention,
The second cleaning mechanism is swung toward the first cleaning mechanism around the swing shaft after the first cleaning mechanism abuts on the one surface of the peripheral edge, and the second cleaning mechanism It is preferable to contact the other surface.

In the processing apparatus according to the present invention,
The first cleaning mechanism is capable of abutting against one surface of the peripheral portion, the central portion of the cross section is a hard portion, and the outer peripheral portion surrounding the central portion is a soft portion that is softer than the hard portion It is preferable to have the 1st washing | cleaning part which consists of.

In the processing apparatus according to the present invention,
The second cleaning mechanism is capable of abutting against the other surface of the peripheral portion, the central portion of the cross section is a hard portion, and the outer peripheral portion surrounding the central portion is a soft portion that is softer than the hard portion It is preferable to have the 2nd washing | cleaning part which consists of.

  According to the present invention, the second cleaning mechanism can swing around the swing shaft, and when the second cleaning mechanism swings toward the first cleaning mechanism, the second cleaning mechanism comes into contact with the other surface of the peripheral portion, Clean the other side. For this reason, the second cleaning mechanism can be easily and quickly brought into contact with the back surface of the peripheral edge of the object to be processed. Moreover, when the cup surrounding the to-be-processed object hold | maintained by the holding | maintenance part is provided, the magnitude | size of the said cup can also be made small.

BEST MODE FOR CARRYING OUT THE INVENTION

First Embodiment Hereinafter, a first embodiment of a processing apparatus according to the present invention will be described with reference to the drawings. Here, FIG. 1 thru | or FIG. 4 (a)-(d) is a figure which shows the 1st Embodiment of this invention.

  As shown in FIG. 1, the processing apparatus includes a holding unit 1 that holds a semiconductor wafer W (hereinafter, also simply referred to as a wafer W) that is an object to be processed by vacuum suction, and a rotation that extends downward from the center of the holding unit 1. A shaft 5, a rotation driving unit 60 that rotates the rotating shaft 5 to rotate the wafer W held by the holding unit 1, a cup 70 that surrounds the wafer W held by the holding unit 1, and the wafer W A surface cleaning mechanism (first cleaning mechanism) 30 that contacts and cleans the surface (one surface) of the peripheral portion of the wafer W, and is connected to the surface cleaning mechanism 30 and contacts the back surface (the other surface) of the peripheral portion of the wafer W. And a back surface cleaning mechanism (second cleaning mechanism) 40 for cleaning in contact.

  Among these, as shown in FIG. 2, the surface cleaning mechanism 30 is provided at the first base end portion 31 and the lower end of the first base end portion 31 and can come into contact with the surface of the peripheral portion of the wafer W. And a sponge-like surface cleaning section (first cleaning section) 32. As shown in FIGS. 3 (a) and 3 (b), the surface cleaning section 32 is composed of a hard portion 32a having a hard central portion in the cross section, and an outer peripheral portion surrounding the center portion is softer than the hard portion 32a. It consists of a soft part 32b.

  Further, as shown in FIG. 2, a connecting portion 46 is provided at the upper end of the first base end portion 31, and the side surface of the connecting portion 46 extends in the vertical direction so that the front surface cleaning mechanism 30 and the back surface cleaning are performed. A connecting rod 45 that connects the mechanism 40 is provided. The back surface cleaning mechanism 40 can swing about the swing shaft 45a, and when it is swung to the front surface cleaning mechanism 30 side (upper side), the back surface cleaning mechanism 40 is placed on the back surface (the other surface) of the peripheral portion of the wafer W. It will abut.

  Further, as shown in FIG. 2, the back surface cleaning mechanism 40 is provided on the second base end portion 41 connected to the connecting rod 45 and the upper end of the second base end portion 41, and on the back surface of the peripheral portion of the wafer W. And a sponge-like back surface cleaning portion (second cleaning portion) 42 that can come into contact therewith. As shown in FIGS. 3 (a) and 3 (b), the back surface cleaning portion 42 is composed of a hard portion 42a having a hard central portion in the cross section, and an outer peripheral portion surrounding the central portion is softer than the hard portion 42a. It consists of part 42b.

  In the present embodiment, for both the front surface cleaning unit 32 and the rear surface cleaning unit 42, the center portion of the cross section is made of hard hard portions 32a, 42a, and the outer peripheral portion surrounding the center portion is the hard portion 32a, A description will be given using an embodiment composed of soft portions 32b and 42b softer than 42a. However, the present invention is not limited to this, and only one of the front surface cleaning unit 32 and the rear surface cleaning unit 42 is composed of hard portions 32a and 42a having a central portion in the cross section, and an outer peripheral portion surrounding the central portion is provided. You may consist of the soft parts 32b and 42b softer than the hard parts 32a and 42a.

  Further, as shown in FIG. 2, a surface side adjustment mechanism 10 having a cylindrical cylinder 12 and a piston 15 movable in the vertical direction within the cylinder 12 is connected to the upper portion of the surface cleaning mechanism 30. ing. Among these, the cylinder 12 is provided with an upper inflow portion 11 for flowing air into the upper side of the piston 15 and a lower inflow portion 16 for flowing air into the lower side of the piston 15. . In addition, each of the upper side inflow part 11 and the lower side inflow part 16 is connected to the air supply part (not shown).

  Further, as shown in FIG. 2, a measured part 19 extending in the horizontal direction is connected to the upper end of the piston 15. Further, a measurement sensor 51 for measuring the pressing force applied from the measured part 19 is brought into contact with the lower end of the measured part 19. The measurement sensor 51 is connected to an output unit 52 that outputs a pressing force detected by the measurement sensor 51.

  Here, the air pressure applied to the piston 15 by the air flowing in from the upper inflow portion 11 and the air pressure applied to the piston 15 by the air flowing in from the lower inflow portion 16 are adjusted, thereby cleaning the surface. The pressing force applied from the portion 32 to the surface of the peripheral portion of the wafer W is adjusted.

  Further, as shown in FIGS. 1 and 4 (a)-(d), the back surface cleaning mechanism 40 is brought into contact with the back surface cleaning mechanism 40 below the back surface cleaning mechanism 40, and the back surface cleaning mechanism 40 is centered on the swing shaft 45a. A pressing member 26 that swings is placed on the surface cleaning mechanism 30 side (upper side). As shown in FIGS. 4A to 4D, the pressing member 26 is connected to the contact portion 27 that contacts the second base end portion 41 of the back surface cleaning mechanism 40, and the contact portion 27. And an elastic member 28 for applying an elastic force to the contact portion 27.

  As shown in FIG. 1, the front surface cleaning mechanism 30 and the back surface cleaning mechanism 40 are integrated with the front surface cleaning mechanism 30 via the front surface side adjustment mechanism 10 in the vertical direction (direction from the front surface to the back surface of the wafer W). A cleaning unit moving mechanism 55 is connected to move the cleaning unit.

  Further, as shown in FIG. 1, the rotation driving unit 60 includes a pulley 62 disposed on the outer periphery of the rotating shaft 5, a driving belt 63 wound around the pulley 62, and a driving force applied to the driving belt 63. And a motor 61 that rotates the rotary shaft 5 via the pulley 62. Further, a bearing 66 is disposed on the outer periphery of the rotating shaft 5. The rotating shaft 5 is connected to a holding unit moving mechanism 65 that moves the holding unit 1 in the vertical direction by moving the rotary shaft 5 in the vertical direction.

  In addition, as shown in FIG. 1, the processing apparatus includes a processing liquid supply unit 75 that supplies a processing liquid to the wafer W. On the front side of the wafer W, a front side supply nozzle 71 that is connected to the processing liquid supply unit 75 and supplies the processing liquid supplied from the processing liquid supply unit 75 to the surface of the wafer W is provided. Further, on the back surface side of the wafer W, a back surface side supply nozzle 72 that is connected to the processing liquid supply unit 75 and supplies the processing liquid supplied from the processing liquid supply unit 75 to the back surface of the wafer W is provided.

  In the present application, the treatment liquid means a chemical solution or pure water. And as a chemical | medical solution, dilute hydrofluoric acid etc. can be used, for example.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, the wafer W taken out from the carrier (not shown) by the transfer robot (not shown) is placed on the holding unit 1 positioned at the transfer position (upper position) by the holding unit moving mechanism 65. (Holding step).

  Next, the holding part moving mechanism 65 moves the holding part 1 downward and positions it at a lower position (see FIG. 1).

  Next, the cleaning unit moving mechanism 55 causes the front surface cleaning mechanism 30 and the back surface cleaning mechanism 40 to move together downward (see FIGS. 1 and 4A). At this time, the back surface cleaning unit 42 of the back surface cleaning mechanism 40 is swung to the opposite side (downward side) from the front surface cleaning mechanism 30 side and is positioned in the open position (see FIG. 4A).

  As described above, when the front surface cleaning mechanism 30 and the rear surface cleaning mechanism 40 are integrally moved downward, the rotation shaft 5 is rotationally driven by the rotation driving unit 60 to be held by the holding unit 11. The wafer W is rotated (rotation process) (see FIG. 1). At this time, a driving force is applied from the motor 61 to the pulley 62 via the driving belt 63, whereby the rotating shaft 5 is driven to rotate.

  Thereafter, the second base end portion 41 of the back surface cleaning mechanism 40 contacts the contact portion 27 of the pressing member 26 placed below the back surface cleaning mechanism 40, and the second base end portion 41 and the back surface cleaning portion 42 is swung to the surface cleaning mechanism 30 side (upper side) around the swing shaft 45a (see FIGS. 4B and 4C). Here, the contact portion 27 is given an elastic force by the elastic member 28.

  At this time, the processing liquid supplied from the processing liquid supply unit 75 starts to be supplied to the surface of the wafer W by the front side supply nozzle 71. Similarly, the processing liquid supplied from the processing liquid supply unit 75 starts to be supplied to the back surface of the wafer W by the back surface side supply nozzle 72 (processing liquid supply process) (see FIG. 1). The following steps are performed while the processing liquid is supplied to the peripheral edge of the wafer W from the front-side supply nozzle 71 and the back-side supply nozzle 72 as described above.

  When the front surface cleaning mechanism 30 and the rear surface cleaning mechanism 40 are completely positioned below, the lower surface of the second base end portion 41 and the upper surface of the contact portion 27 are flush with each other (FIG. 4D). )reference).

  Thus, according to the present embodiment, the back surface cleaning unit 42 of the back surface cleaning mechanism 40 can be positioned on the back surface side of the wafer W while the back surface cleaning unit 42 of the back surface cleaning mechanism 40 is positioned in the open position ( (Refer FIG.4 (b) (c)). Therefore, the size of the cup 70 surrounding the wafer W can be reduced, and the back surface cleaning unit 42 can be easily and quickly brought into contact with the back surface of the peripheral portion of the wafer W.

  That is, as in Patent Document 1, if the first substrate cleaning brush (front surface cleaning unit 32 ′) and the second substrate cleaning brush (back surface cleaning unit 42 ′) are made to approach and separate from each other, the holding unit 1 It is necessary to provide a gap between the held wafer W and the cup 70 so as to allow the first substrate cleaning brush (front surface cleaning unit 32 ′) and the second substrate cleaning brush (back surface cleaning unit 42 ′) to pass ( (See the dotted line 70 'in FIG. 1). For this reason, the size of the cup 70 surrounding the wafer W held by the holding unit 1 is increased.

  On the other hand, according to the present embodiment, the back surface cleaning unit of the back surface cleaning mechanism 40 can be simply moved downward while the back surface cleaning unit 42 of the back surface cleaning mechanism 40 is positioned at the open position. 42 can be moved to the back side of the wafer W (see solid line arrow in FIG. 1). For this reason, it is not necessary to provide a gap for allowing the back surface cleaning unit 42 to pass between the wafer W held by the holding unit 1 and the cup 70. As a result, the size of the cup 70 surrounding the wafer W can be reduced.

  Further, in the case of the conventional one described in Patent Document 1, when the second substrate cleaning brush (back surface cleaning unit 42 ′) is brought into contact with the peripheral edge of the back surface of the wafer W, the second substrate cleaning brush is used. After the (back surface cleaning unit 42 ′) is positioned on the back surface side (lower side) of the wafer W, the first substrate cleaning brush (front surface cleaning unit 41 ′) and the second substrate cleaning brush (back surface cleaning unit 42 ′) are mounted on the wafer W. The wafer W needs to be moved in the horizontal direction toward the peripheral edge of the wafer, and then the wafer W must be sandwiched between the first substrate cleaning brush (front surface cleaning portion 41 ′) and the second substrate cleaning brush (back surface cleaning portion 42 ′). According to the present embodiment, after moving the back surface cleaning mechanism 40 downward, it is only necessary to sandwich the wafer W between the front surface cleaning unit 41 and the back surface cleaning unit 42 (see FIG. 1). (See solid line arrow 1). Therefore, it is possible to reduce the number of steps until the back surface cleaning unit 42 is brought into contact with the peripheral edge of the back surface of the wafer W (the first substrate cleaning brush (front surface cleaning unit 41 ′) and the second substrate cleaning brush (back surface). The cleaning unit 42 ′) can be reduced in the horizontal movement step), and the back surface cleaning unit 42 can be easily and quickly brought into contact with the back surface of the peripheral portion of the wafer W.

  As described above, when the front surface of the peripheral portion of the wafer W is in contact with the front surface cleaning unit 32 and the back surface of the peripheral portion of the wafer W is in contact with the back surface cleaning unit 42, the wafer W flows from the upper inflow portion 11. By adjusting the air pressure generated by the air to be applied and the air pressure generated by the air flowing in from the lower inflow portion 16, the pressing force applied from the surface cleaning unit 32 to the surface of the peripheral portion of the wafer W can be adjusted. (See FIG. 2). At this time, the pressing force applied to the surface of the peripheral edge of the wafer W is detected by the measurement sensor 51 and output by the output unit 52.

  Further, the front surface cleaning unit 32 and the back surface cleaning unit 42 are composed of hard portions 32a and 42a whose center portions in the cross section are hard, and the outer peripheral portions surrounding the center portions are soft portions 32b and softer than the hard portions 32a and 42a. 42b (see FIGS. 3A and 3B). For this reason, as shown in FIG. 3B, the side end surface (APEX portion) of the peripheral portion of the wafer W is brought into contact with the hard portions 32a and 42a, and the surface of the peripheral portion of the wafer W is formed by the soft portions 32b and 42b. And a back surface (bevel part) can be pinched | interposed.

  As a result, the side end face (APEX part) of the peripheral part of the wafer W that is not subjected to patterning can be cleaned with a stronger force (than the front and back surfaces (bevel part) of the peripheral part of the wafer W).

  In the present embodiment, the processing liquid supplied from the front-side supply nozzle 71 to the front surface of the wafer W and the processing liquid supplied from the back-side supply nozzle 72 to the back surface of the wafer W can be appropriately changed. (See FIG. 1). For example, the chemical liquid may be supplied first from the front surface side supply nozzle 71 and the back surface side supply nozzle 72, then the rinse liquid may be supplied, and finally the dry liquid may be supplied. Here, the type of processing liquid supplied from the front surface side supply nozzle 71 to the front surface of the wafer W and the type of processing liquid supplied from the back surface side supply nozzle 72 to the back surface of the wafer W can be changed independently. .

  When the predetermined processing of the peripheral portion of the wafer W with the processing liquid as described above is completed, the supply of the processing liquid from the front surface side supply nozzle 71 and the back surface side supply nozzle 72 is stopped. Next, the front surface cleaning mechanism 30 and the back surface cleaning mechanism 40 are moved upward together. Here, as the second base end portion 41 is separated from the contact portion 27 of the pressing member 26, the second base end portion 41 and the back surface cleaning portion 42 are swung downward about the swing shaft 45a, and finally Is positioned in the open position.

  Therefore, according to the present embodiment, the back surface cleaning unit 42 is moved from the back surface side to the front surface side of the wafer W only by moving the back surface cleaning mechanism 40 upward (without moving it outward in the peripheral direction of the wafer W). Therefore, the back surface cleaning unit 42 can be easily and quickly moved.

  Next, the wafer W is rotated at a high speed by the rotation driving unit 60, and the peripheral portion of the wafer W is dried. Thereafter, the motor 61 of the rotation drive mechanism 60 is stopped, and the rotation of the wafer W held by the holding unit 1 is also stopped.

  Next, the holding part moving mechanism 65 moves the holding part 1 upward and positions it at the delivery position (upper position).

  Next, the wafer W is removed from the holding unit 1 by a transfer robot (not shown).

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. 5 and 6A to 6C. In the first embodiment shown in FIGS. 1 to 4 (a) to 4 (d), the second surface cleaning mechanism 40 is placed on the contact portion 27 of the pressing member 26 mounted below the back surface cleaning mechanism 40. The back surface cleaning mechanism 40 was swung to the surface cleaning mechanism 30 side (upper side) about the rocking shaft 45a when the base end portion 41 abuts. On the other hand, in the second embodiment shown in FIG. 5 and FIGS. 6A to 6C, a housing 24 having an electromagnet 21 disposed therein is connected to the upper end of the surface cleaning mechanism 30. The permanent magnet 25 is connected to the lower end of the back surface cleaning mechanism 40, and the current is passed through the electromagnet 21, thereby swinging the back surface cleaning mechanism 40 to the surface cleaning mechanism 30 side (upper side) about the swing shaft 45a. It is. Other configurations are substantially the same as those of the first embodiment shown in FIGS.

  In the second embodiment shown in FIGS. 5 and 6 (a)-(c), the same parts as those in the first embodiment shown in FIGS. 1 to 4 (a)-(d) are denoted by the same reference numerals. Detailed description will be omitted.

  Also in the present embodiment, the back surface cleaning unit 42 of the back surface cleaning mechanism 40 is moved to the back side of the wafer W only by moving the back surface cleaning mechanism 40 downward while the back surface cleaning unit 42 of the back surface cleaning mechanism 40 is positioned at the open position. (See FIGS. 6A to 6C). Therefore, it is not necessary to provide a gap for allowing the back surface cleaning unit 42 to pass between the wafer W held by the holding unit 1 and the cup 70, and the size of the cup 70 surrounding the wafer W is reduced. (See FIG. 1).

  Further, when the back surface cleaning unit 42 is brought into contact with the peripheral edge of the back surface of the wafer W, the back surface cleaning mechanism 40 may be moved downward without moving in the horizontal direction (FIGS. 6A to 6C). )reference). For this reason, the number of steps until the back surface cleaning unit 42 is brought into contact with the peripheral edge of the back surface of the wafer W can be reduced, and the back surface cleaning unit 42 is easily and quickly brought into contact with the back surface of the peripheral portion of the wafer W. be able to.

  Furthermore, in the present embodiment, by adjusting the magnitude of the current flowing through the electromagnet 21 (the magnitude of the voltage applied to the electromagnet 21), the pressing force applied from the back surface cleaning unit 42 to the back surface of the peripheral portion of the wafer W. The pressure can be adjusted (see FIG. 6C).

  For this reason, according to the present embodiment, the pressing force applied from the front surface cleaning mechanism 30 to the peripheral surface of the wafer W can be adjusted, and the back surface cleaning mechanism 40 applies the rear surface of the peripheral portion of the wafer W. The pressing force can be adjusted. As a result, the peripheral edge of the wafer W can be reliably cleaned, and the particles can be reliably removed from the peripheral edge of the wafer W.

  In this embodiment, when cleaning the peripheral portion of the wafer W, the back surface side adjustment mechanism (the electromagnet 21 and the permanent magnet 25) is moved from the surface cleaning unit 32 of the surface cleaning mechanism 30 by the front surface side adjustment mechanism 10. A pressing force larger than the pressing force applied to the surface of the peripheral edge of the wafer W is applied from the back surface cleaning mechanism 40 to the back surface of the peripheral edge of the wafer W.

  For this reason, the back surface of the peripheral portion of the wafer W that is not subjected to patterning can be cleaned with a stronger force (than the surface of the peripheral portion of the wafer W that is subject to patterning). The back surface of the peripheral edge can be more reliably cleaned.

The side sectional view showing the composition of the processing device by a 1st embodiment of the present invention. The side sectional view showing the composition of the 1st adjustment mechanism and the 2nd adjustment mechanism of the processing unit by a 1st embodiment of the present invention. The upper sectional view showing the composition of the 1st washing part of the processing device by a 1st embodiment of the present invention, and the 2nd washing part. Schematic which shows the movement aspect of the 2nd washing | cleaning mechanism of the processing apparatus by the 1st Embodiment of this invention. Side sectional drawing which shows the structure of the 1st adjustment mechanism of the processing apparatus by the 2nd Embodiment of this invention, and a 2nd adjustment mechanism. Schematic which shows the movement aspect of the 2nd washing | cleaning mechanism of the processing apparatus by the 2nd Embodiment of this invention.

Explanation of symbols

1 holding part 10 surface side adjustment mechanism (first adjustment mechanism)
21 Electromagnet 25 Permanent magnet 30 Surface cleaning mechanism (first cleaning mechanism)
32 Surface cleaning section (first cleaning section)
32a Hard part 32b Soft part 40 Back surface cleaning mechanism (second cleaning mechanism)
42 Back surface cleaning section (second cleaning section)
42a Hard part 42b Soft part 45 Connecting rod 45a Oscillating shaft 55 Cleaning part moving mechanism (moving mechanism)
60 Rotation Drive Unit 65 Holding Unit Movement Mechanism 70 Cup W Wafer (Subject)

Claims (6)

A holding unit for holding the object to be processed;
A rotation driving unit that rotates the object to be processed held by the holding unit;
A first cleaning mechanism for cleaning in contact with one surface of the peripheral edge of the workpiece;
A second cleaning mechanism that is connected to the first cleaning mechanism and that contacts and cleans the other surface of the peripheral portion of the object to be processed;
The processing apparatus, wherein the second cleaning mechanism is swingable about a swing shaft, and abuts against the other surface of the peripheral edge when swinged toward the first cleaning mechanism.   And a moving mechanism that is connected to the first cleaning mechanism and moves the first cleaning mechanism and the second cleaning mechanism in a direction from one surface of the object to be processed to the other surface. The processing apparatus according to claim 1.   3. The pressing member according to claim 1, further comprising a pressing member that contacts the second cleaning mechanism and swings the second cleaning mechanism toward the first cleaning mechanism about the swing shaft. The processing apparatus of any one.   The said pressing member has a contact part contact | abutted to said 2nd washing | cleaning mechanism, and an elastic member connected with the applicable contact part, and giving an elastic force to the applicable contact part. Processing equipment.   The first cleaning mechanism is capable of abutting against one surface of the peripheral portion, the central portion of the cross section is a hard portion, and the outer peripheral portion surrounding the central portion is a soft portion that is softer than the hard portion The processing apparatus according to claim 1, further comprising a first cleaning unit made of   The second cleaning mechanism is capable of abutting against the other surface of the peripheral portion, the central portion of the cross section is a hard portion, and the outer peripheral portion surrounding the central portion is a soft portion that is softer than the hard portion The processing apparatus according to claim 1, further comprising a second cleaning unit made of

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