JP2021064701A - Substrate cleaning device and substrate cleaning method - Google Patents

Substrate cleaning device and substrate cleaning method Download PDF

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JP2021064701A
JP2021064701A JP2019188424A JP2019188424A JP2021064701A JP 2021064701 A JP2021064701 A JP 2021064701A JP 2019188424 A JP2019188424 A JP 2019188424A JP 2019188424 A JP2019188424 A JP 2019188424A JP 2021064701 A JP2021064701 A JP 2021064701A
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substrate
peripheral edge
peripheral
cleaning
cleaning member
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JP7348021B2 (en
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及川　文利
Fumitoshi Oikawa
文利 及川
友章 藤本
Tomoaki Fujimoto
友章 藤本
宮▲崎▼　充
Mitsuru Miyazaki
充 宮▲崎▼
孝一 深谷
Koichi Fukaya
孝一 深谷
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Ebara Corp
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Ebara Corp
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Priority to TW109132513A priority patent/TW202129736A/en
Priority to US17/068,114 priority patent/US20210111018A1/en
Priority to KR1020200130929A priority patent/KR20210044705A/en
Priority to SG10202010118SA priority patent/SG10202010118SA/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/02087—Cleaning of wafer edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Computer Hardware Design (AREA)
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Abstract

To provide a substrate cleaning device and a substrate cleaning method that can more reliably clean the peripheral edge of a substrate.SOLUTION: A substrate cleaning device includes: a substrate rotating unit 110 that rotates a substrate W; a peripheral edge cleaning member 10 that cleans the peripheral edge portion of the substrate W; a peripheral edge rotating unit 40 that rotates the peripheral edge cleaning member 10 around a peripheral edge rotating shaft 19 extending in a direction orthogonal to a substrate rotating shaft 130; moving units 31 and 36 that move the position of the peripheral edge cleaning member 10 with respect to the peripheral edge portion of the substrate W; and a control unit 50 that moves the position of the peripheral edge cleaning member 10 with respect to the peripheral edge portion of the substrate W by controlling the moving units 31 and 36, and cleans a one side peripheral edge region W1 including the one side surface of the peripheral edge portion of the substrate W, a side surface region W3 including the side surface, and another side peripheral edge region W2 including another side surface, by the peripheral cleaning member 10.SELECTED DRAWING: Figure 3

Description

本発明は、基板の周縁部を洗浄する基板洗浄装置及び基板洗浄方法に関する。 The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning the peripheral edge of a substrate.

従来から、基板の周縁部を有効に洗浄することができず、その結果、基板の周縁部に洗浄されずに残ったパーティクルが基板の表面に再付着することがあるといった問題があった。このような問題を解決するために、半導体ウェハ等からなる基板の周縁部を洗浄することが行われている。特許文献１では、基板の周縁部を把持して該基板を回転させる複数の基板回転用ローラと、基板の端面及びベベル面に接触して該端面及びベベル面をスクラブ洗浄する洗浄部材を有する回転自在な洗浄ローラと、基板回転用ローラの動力を洗浄ローラに伝達して洗浄ローラを回転させる動力伝達機構とを有する基板洗浄装置が提案されている。 Conventionally, there has been a problem that the peripheral edge of the substrate cannot be effectively cleaned, and as a result, particles remaining uncleaned on the peripheral edge of the substrate may reattach to the surface of the substrate. In order to solve such a problem, the peripheral edge of a substrate made of a semiconductor wafer or the like is cleaned. Patent Document 1 has a plurality of rollers for rotating a substrate that grip the peripheral edge of the substrate and rotate the substrate, and a rotation member having a cleaning member that contacts the end face and the bevel surface of the substrate and scrubs the end face and the bevel surface. A substrate cleaning device having a flexible cleaning roller and a power transmission mechanism that transmits the power of the substrate rotating roller to the cleaning roller to rotate the cleaning roller has been proposed.

特開２０００−２４１７９４号公報Japanese Unexamined Patent Publication No. 2000-241794

特許文献１に開示された態様では基板の周縁部を洗浄することはできるが、その洗浄効果としては十分なものではなかった。 In the embodiment disclosed in Patent Document 1, the peripheral edge of the substrate can be cleaned, but the cleaning effect is not sufficient.

本発明は、基板の周縁部をより確実に洗浄できる基板洗浄装置及び基板洗浄方法を提供する。 The present invention provides a substrate cleaning apparatus and a substrate cleaning method capable of more reliably cleaning the peripheral edge of a substrate.

本発明の第一態様による基板洗浄装置は、
基板を回転させる基板回転部と、
前記基板の周縁部を洗浄するための周縁洗浄部材と、
前記周縁洗浄部材を前記基板回転軸に直交する方向で延びた周縁回転軸の周りで回転させる周縁回転部と、
前記周縁洗浄部材の前記基板の周縁部に対する位置を移動させる移動部と、
前記移動部を制御することで前記周縁洗浄部材の前記基板の周縁部に対する位置を移動させ、前記基板の周縁部の一方側の面を含む一方側周縁領域、側面を含む側面領域及び他方側の面を含む他方側周縁領域を前記周縁洗浄部材によって洗浄させる制御部と、
を備えてもよい。 The substrate cleaning device according to the first aspect of the present invention is
The board rotating part that rotates the board and
A peripheral cleaning member for cleaning the peripheral edge of the substrate, and
A peripheral rotation portion that rotates the peripheral cleaning member around a peripheral rotation axis extending in a direction orthogonal to the substrate rotation axis, and a peripheral rotation portion.
A moving portion that moves the position of the peripheral cleaning member with respect to the peripheral edge of the substrate, and a moving portion.
By controlling the moving portion, the position of the peripheral edge cleaning member with respect to the peripheral edge portion of the substrate is moved, and the one-side peripheral edge region including one side surface of the peripheral edge portion of the substrate, the side surface region including the side surface, and the other side A control unit that cleans the other peripheral region including the surface with the peripheral cleaning member,
May be provided.

本発明の第一態様による基板洗浄装置において、
前記制御部は、前記周縁洗浄部材が所定の時間だけ前記一方側周縁領域を洗浄し、その後で前記周縁洗浄部材が所定の時間だけ前記側面領域を洗浄し、その後で前記周縁洗浄部材が所定の時間だけ前記他方側周縁領域を洗浄するように制御する、又は前記周縁洗浄部材が所定の時間だけ前記他方側周縁領域を洗浄し、その後で前記周縁洗浄部材が所定の時間だけ前記側面領域を洗浄し、その後で前記周縁洗浄部材が所定の時間だけ前記一方側周縁領域を洗浄するように制御してもよい。 In the substrate cleaning apparatus according to the first aspect of the present invention.
In the control unit, the peripheral edge cleaning member cleans the one-side peripheral area for a predetermined time, then the peripheral edge cleaning member cleans the side surface area for a predetermined time, and then the peripheral edge cleaning member determines. The other side peripheral area is controlled to be cleaned for a certain period of time, or the peripheral edge cleaning member cleans the other side peripheral area for a predetermined time, and then the peripheral edge cleaning member cleans the side surface area for a predetermined time. Then, the peripheral cleaning member may be controlled to clean the one-side peripheral region for a predetermined time.

本発明の第一態様による基板洗浄装置は、
前記周縁洗浄部材に加わる力を検出する検出部を備え、
前記制御部が、前記検出部による検出結果に基づいて前記移動部の制御を行い、前記一方側周縁領域又は前記他方側周縁領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力と、前記側面領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力が異なるように制御してもよい。 The substrate cleaning device according to the first aspect of the present invention is
A detection unit for detecting a force applied to the peripheral cleaning member is provided.
The control unit controls the moving unit based on the detection result by the detection unit, and a force applied to the peripheral cleaning member when the one-side peripheral region or the other-side peripheral region is cleaned by the peripheral cleaning member. And, when the side surface region is cleaned by the peripheral cleaning member, the force applied to the peripheral cleaning member may be controlled to be different.

本発明の第一態様による基板洗浄装置において、
前記制御部は、前記一方側周縁領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力と前記他方側周縁領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力とは略同一となるように制御してもよい。 In the substrate cleaning apparatus according to the first aspect of the present invention.
The control unit applies a force applied to the peripheral edge cleaning member when the one side peripheral area is cleaned by the peripheral edge cleaning member and a force applied to the peripheral edge cleaning member when the other peripheral peripheral area is cleaned by the peripheral edge cleaning member. It may be controlled so as to be substantially the same as.

本発明の第一態様による基板洗浄装置において、
前記制御部は、前記一方側周縁領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力及び前記他方側周縁領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力は、前記側面領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力よりも大きくなるように制御してもよい。 In the substrate cleaning apparatus according to the first aspect of the present invention.
The control unit applies a force applied to the peripheral edge cleaning member when the one side peripheral area is cleaned by the peripheral edge cleaning member and a force applied to the peripheral edge cleaning member when the other peripheral peripheral area is cleaned by the peripheral edge cleaning member. May be controlled to be greater than the force applied to the peripheral cleaning member when the side surface region is cleaned by the peripheral cleaning member.

本発明の第二態様による基板洗浄装置は、
基板を回転させる基板回転部と、
前記基板の周縁部を洗浄するための周縁洗浄部材と、
前記周縁洗浄部材を前記基板回転軸に直交する方向で延びた周縁回転軸の周りで回転させる周縁回転部と、
を備え、
前記周縁洗浄部材が、少なくとも前記基板の側面の一方側の一部及び周縁部の一方側の面に当接して洗浄する第一周縁洗浄部材と、少なくとも前記基板の側面の他方側の一部及び周縁部の他方側の面に当接して洗浄する第二周縁洗浄部材とを有する、又は少なくとも前記基板の側面に当接して洗浄する第三周縁洗浄部材と、少なくとも前記基板の周縁部の一方側の面に当接して洗浄する第四周縁洗浄部材と、少なくとも前記基板の周縁部の他方側の面に当接して洗浄する第五周縁洗浄部材とを有してもよい。 The substrate cleaning device according to the second aspect of the present invention is
The board rotating part that rotates the board and
A peripheral cleaning member for cleaning the peripheral edge of the substrate, and
A peripheral rotation portion that rotates the peripheral cleaning member around a peripheral rotation axis extending in a direction orthogonal to the substrate rotation axis, and a peripheral rotation portion.
With
The first peripheral cleaning member that the peripheral cleaning member abuts on at least one side of the side surface of the substrate and one side of the peripheral surface to clean, and at least a part of the other side of the substrate and A third peripheral edge cleaning member having a second peripheral edge cleaning member that contacts and cleans the other side surface of the peripheral edge, or at least a third peripheral edge cleaning member that contacts and cleans the side surface of the substrate, and at least one side of the peripheral edge portion of the substrate. There may be a fourth peripheral edge cleaning member that abuts on the surface of the substrate for cleaning, and at least a fifth peripheral edge cleaning member that abuts on the other surface of the peripheral edge of the substrate for cleaning.

本発明の第三態様による基板洗浄装置は、
基板を回転させる基板回転部と、
前記基板に洗浄液を供給する基板洗浄液供給部と、
前記基板の周縁部を洗浄するための周縁洗浄部材と、
前記周縁洗浄部材を前記基板回転軸に直交する方向で延びた周縁回転軸の周りで回転させる周縁回転部と、
前記周縁洗浄部材を前記基板の周縁部から離間させた後で、前記基板回転部による前記基板の回転を停止させるように制御する制御部と、
を備えてもよい。 The substrate cleaning device according to the third aspect of the present invention is
The board rotating part that rotates the board and
A substrate cleaning liquid supply unit that supplies a cleaning liquid to the substrate,
A peripheral cleaning member for cleaning the peripheral edge of the substrate, and
A peripheral rotation portion that rotates the peripheral cleaning member around a peripheral rotation axis extending in a direction orthogonal to the substrate rotation axis, and a peripheral rotation portion.
A control unit that controls the rotation of the substrate by the rotating portion of the substrate after the peripheral cleaning member is separated from the peripheral edge of the substrate.
May be provided.

本発明の第三態様による基板洗浄装置において、
前記制御部は、前記周縁洗浄部材を前記基板の周縁部から離間させた後であって前記基板回転部による前記基板の回転を停止させる前に、前記基板洗浄液供給部からの洗浄液の供給を停止させるように制御してもよい。 In the substrate cleaning apparatus according to the third aspect of the present invention.
The control unit stops the supply of the cleaning liquid from the substrate cleaning liquid supply unit after the peripheral cleaning member is separated from the peripheral edge of the substrate and before the rotation of the substrate by the substrate rotating unit is stopped. It may be controlled so as to cause.

本発明の第三態様による基板洗浄装置において、
前記制御部は、前記周縁洗浄部材を前記基板の周縁部から離間させる前に前記周縁回転部による前記周縁洗浄部材の回転を停止させるように制御してもよい。 In the substrate cleaning apparatus according to the third aspect of the present invention.
The control unit may control to stop the rotation of the peripheral edge cleaning member by the peripheral edge rotating portion before separating the peripheral edge cleaning member from the peripheral edge portion of the substrate.

本発明による基板洗浄装置において、
前記基板はウェハからなり、
前記洗浄部材は前記ウェハの形状に合わせて側面が湾曲してもよい。 In the substrate cleaning apparatus according to the present invention
The substrate consists of a wafer
The side surface of the cleaning member may be curved according to the shape of the wafer.

本発明による基板洗浄装置は、
前記基板の中心部から周縁部に向かって、前記周縁洗浄部材と前記基板との接触箇所に対して洗浄液を供給する周縁洗浄液供給部を備えてもよい。 The substrate cleaning device according to the present invention
A peripheral cleaning liquid supply unit that supplies the cleaning liquid to the contact point between the peripheral cleaning member and the substrate may be provided from the central portion of the substrate toward the peripheral edge portion.

本発明による基板洗浄装置において、
前記周縁洗浄部材の前記基板の中心部側に隔壁が設けられてもよい。 In the substrate cleaning apparatus according to the present invention
A partition wall may be provided on the central side of the substrate of the peripheral cleaning member.

本発明による基板洗浄装置は、
前記隔壁を有するカバー部材を備え、
前記カバー部材が前記周縁洗浄部材を覆ってもよい。 The substrate cleaning device according to the present invention
A cover member having the partition wall is provided.
The cover member may cover the peripheral cleaning member.

本発明による基板洗浄装置は、
前記基板の中心部から周縁部に向かって、前記周縁洗浄部材と前記基板との接触領域に対して洗浄液を供給する周縁洗浄液供給部を備え、
前記カバー部材に前記周縁洗浄液供給部を取り付けるための取付部が設けられてもよい。 The substrate cleaning device according to the present invention
A peripheral cleaning liquid supply unit for supplying cleaning liquid to a contact region between the peripheral cleaning member and the substrate is provided from the central portion of the substrate toward the peripheral edge portion.
A mounting portion for mounting the peripheral cleaning liquid supply portion may be provided on the cover member.

本発明による基板洗浄装置は、
前記基板の中心部から周縁部に向かって、前記周縁洗浄部材と前記基板との接触領域に対して洗浄液を供給する周縁洗浄液供給部を備え、
前記カバー部材に前記周縁洗浄液供給部から供給される洗浄液を排出する排出口が設けられてもよい。 The substrate cleaning device according to the present invention
A peripheral cleaning liquid supply unit for supplying cleaning liquid to a contact region between the peripheral cleaning member and the substrate is provided from the central portion of the substrate toward the peripheral edge portion.
The cover member may be provided with a discharge port for discharging the cleaning liquid supplied from the peripheral cleaning liquid supply unit.

本発明による基板洗浄装置は、
前記周縁洗浄部材を洗浄するための周縁洗浄機構を備えてもよい。 The substrate cleaning device according to the present invention
A peripheral cleaning mechanism for cleaning the peripheral cleaning member may be provided.

本発明による基板洗浄装置において、
前記周縁洗浄機構は、前記周縁洗浄部材に当接可能な接触部材、前記周縁洗浄部材に洗浄液を供給する洗浄液供給部材及び前記周縁洗浄部材を吸引する吸引部材のいずれか１つを有してもよい。 In the substrate cleaning apparatus according to the present invention
The peripheral cleaning mechanism may have any one of a contact member capable of contacting the peripheral cleaning member, a cleaning liquid supply member that supplies the cleaning liquid to the peripheral cleaning member, and a suction member that sucks the peripheral cleaning member. Good.

本発明による基板洗浄装置において、
前記制御部は、前記周縁洗浄部材が前記基板の周縁部を洗浄していない時間に前記周縁洗浄機構が前記周縁洗浄部材を洗浄するように制御してもよい。 In the substrate cleaning apparatus according to the present invention
The control unit may control the peripheral edge cleaning mechanism to clean the peripheral edge cleaning member while the peripheral edge cleaning member is not cleaning the peripheral edge portion of the substrate.

本発明による基板洗浄装置において、
前記制御部は、前記周縁洗浄部材が前記基板の周縁部を洗浄している時間と前記周縁洗浄機構が前記周縁洗浄部材を洗浄する時間とが少なくとも一部で重複するように制御してもよい。 In the substrate cleaning apparatus according to the present invention
The control unit may control so that the time when the peripheral edge cleaning member cleans the peripheral edge portion of the substrate and the time when the peripheral edge cleaning mechanism cleans the peripheral edge cleaning member overlap at least in a part. ..

本発明による基板洗浄装置は、
前記周縁回転部によって回転されるペンユニットを備え、
前記周縁洗浄部材はペンユニットの先端に設けられてもよい。 The substrate cleaning device according to the present invention
A pen unit rotated by the peripheral rotating portion is provided.
The peripheral cleaning member may be provided at the tip of the pen unit.

本発明による基板洗浄装置は、
前記基板の一方側の面又は他方側の面に当接して洗浄する基板洗浄部材を備え、
前記制御部は、前記基板洗浄部材が前記基板の一方側の面又は他方側の面を洗浄する時間と前記周縁洗浄部材が前記基板の周縁部を洗浄する時間とが少なくとも一部で重複するように制御してもよい。 The substrate cleaning device according to the present invention
A substrate cleaning member provided with a substrate cleaning member that abuts on one surface or the other surface of the substrate to clean the substrate.
In the control unit, the time for the substrate cleaning member to clean one side surface or the other side surface of the substrate and the time for the peripheral edge cleaning member to clean the peripheral edge portion of the substrate overlap at least in part. It may be controlled to.

本発明の第一態様による基板洗浄方法は、
基板回転部によって基板を回転させる工程と、
周縁回転部によって周縁洗浄部材を前記基板回転軸に直交する方向で延びた周縁回転軸の周りで回転させ、前記周縁洗浄部材によって前記基板の周縁部を洗浄する工程と、
を備え、
前記基板の周縁部を洗浄する工程において、移動部によって前記周縁洗浄部材の前記基板の周縁部に対する位置を移動させ、前記基板の周縁部の一方側の面を含む一方側周縁領域、側面を含む側面領域及び他方側の面を含む他方側周縁領域を前記周縁洗浄部材によって洗浄してもよい。 The substrate cleaning method according to the first aspect of the present invention
The process of rotating the board by the board rotating part,
A step of rotating the peripheral edge cleaning member around a peripheral edge rotation axis extending in a direction orthogonal to the substrate rotation axis by the peripheral edge rotating portion, and cleaning the peripheral edge portion of the substrate by the peripheral edge cleaning member.
With
In the step of cleaning the peripheral edge portion of the substrate, the position of the peripheral edge cleaning member with respect to the peripheral edge portion of the substrate is moved by the moving portion, and the one-side peripheral edge region including one side surface of the peripheral edge portion of the substrate and the side surface are included. The other side peripheral area including the side surface area and the other side surface may be cleaned by the peripheral cleaning member.

本発明の第二態様による基板洗浄方法は、
基板回転部によって基板を回転させる工程と、
基板洗浄液供給部によって前記基板に洗浄液を供給する工程と、
周縁回転部によって周縁洗浄部材を前記基板回転軸に直交する方向で延びた周縁回転軸の周りで回転させ、前記周縁洗浄部材によって前記基板の周縁部を洗浄する工程と、
を備え、
前記周縁洗浄部材を前記基板の周縁部から離間させた後で、前記基板回転部による前記基板の回転を停止させてもよい。 The substrate cleaning method according to the second aspect of the present invention
The process of rotating the board by the board rotating part,
The process of supplying the cleaning liquid to the substrate by the substrate cleaning liquid supply unit,
A step of rotating the peripheral edge cleaning member around a peripheral edge rotation axis extending in a direction orthogonal to the substrate rotation axis by the peripheral edge rotating portion, and cleaning the peripheral edge portion of the substrate by the peripheral edge cleaning member.
With
After separating the peripheral edge cleaning member from the peripheral edge portion of the substrate, the rotation of the substrate by the substrate rotating portion may be stopped.

本発明によれば、基板の周縁部をより確実に洗浄できる基板洗浄装置及び基板洗浄方法を提供できる。 According to the present invention, it is possible to provide a substrate cleaning apparatus and a substrate cleaning method capable of more reliably cleaning the peripheral edge of a substrate.

図１は、本発明の第１の実施の形態による基板処理装置を含む処理装置の全体構成を示す概略平面図である。FIG. 1 is a schematic plan view showing an overall configuration of a processing apparatus including a substrate processing apparatus according to the first embodiment of the present invention. 図２（ａ）は、本発明の第１の実施の形態で用いられうる周縁洗浄部材等を示した平面図であり、図２（ｂ）は周縁洗浄部材を覆うカバー部材及び周縁洗浄部材を回転させる周縁回転部を示した側方図である。FIG. 2A is a plan view showing a peripheral edge cleaning member and the like that can be used in the first embodiment of the present invention, and FIG. 2B shows a cover member and a peripheral edge cleaning member that cover the peripheral edge cleaning member. It is a side view which showed the peripheral rotation part to rotate. 図３は、本発明の実施の形態で用いられうる周縁洗浄部材、第一移動部、第二移動部、周縁回転部等を示した側方図であり、基板の側面を周縁洗浄部材が洗浄している態様を示した側方図である。なお図３ではカバー部材は図視されていない。FIG. 3 is a side view showing a peripheral cleaning member, a first moving portion, a second moving portion, a peripheral rotating portion, and the like that can be used in the embodiment of the present invention, and the peripheral cleaning member cleans the side surface of the substrate. It is a side view which showed the aspect which is doing. Note that the cover member is not shown in FIG. 図４は、図３に対応した図面であり、基板の周縁部の一方側周縁領域を周縁洗浄部材が洗浄している態様を示した側方図である。FIG. 4 is a drawing corresponding to FIG. 3, and is a side view showing a mode in which a peripheral edge cleaning member is cleaning one peripheral peripheral area of a peripheral edge portion of a substrate. 図５は、図３に対応した図面であり、基板の周縁部の他方側周縁領域を周縁洗浄部材が洗浄している態様を示した側方図である。FIG. 5 is a drawing corresponding to FIG. 3, and is a side view showing a mode in which the peripheral edge cleaning member is cleaning the other peripheral peripheral region of the peripheral edge portion of the substrate. 図６は、本発明の第１の実施の形態で用いられうる周縁洗浄液供給部を示した平面図である。FIG. 6 is a plan view showing a peripheral cleaning liquid supply unit that can be used in the first embodiment of the present invention. 図７は、本発明の第１の実施の形態で用いられうる周縁洗浄液供給部、周縁洗浄機構等を示した側方図である。図７における矢印は周縁洗浄液供給部から供給される洗浄液を示している。FIG. 7 is a side view showing a peripheral cleaning liquid supply unit, a peripheral cleaning mechanism, and the like that can be used in the first embodiment of the present invention. The arrow in FIG. 7 indicates the cleaning liquid supplied from the peripheral cleaning liquid supply unit. 図８は、本発明の第１の実施の形態で用いられうる基板洗浄部材、基板洗浄液供給部等を示した斜視図である。FIG. 8 is a perspective view showing a substrate cleaning member, a substrate cleaning liquid supply unit, and the like that can be used in the first embodiment of the present invention. 図９は、本発明の第１の実施の形態で用いられうる基板洗浄装置で用いられ得る構成要素についてのブロック図である。FIG. 9 is a block diagram of components that can be used in the substrate cleaning apparatus that can be used in the first embodiment of the present invention. 図１０は、図３に対応した図面であり、隔壁の変形例を示した側方図である。FIG. 10 is a drawing corresponding to FIG. 3, and is a side view showing a modified example of the partition wall. 図１１（ａ）は突出部を有する周縁洗浄部材を示した側方図であり、図１１（ｂ）は溝部を有する周縁洗浄部材を示した側方図である。FIG. 11A is a side view showing a peripheral cleaning member having a protrusion, and FIG. 11B is a side view showing a peripheral cleaning member having a groove. 図１２は、周縁洗浄部材を首振り機構によって移動させる態様を示した側方図である。FIG. 12 is a side view showing a mode in which the peripheral cleaning member is moved by the swing mechanism. 図１３（ａ）は、本発明の第１の実施の形態の別の態様で用いられうる周縁洗浄部材、周縁回転部等を示した斜視図であり、図１３（ｂ）は図１３（ａ）に示した周縁回転部等を駆動カバー部材で覆った態様を示した斜視図である。13 (a) is a perspective view showing a peripheral cleaning member, a peripheral rotating portion, and the like that can be used in another aspect of the first embodiment of the present invention, and FIG. 13 (b) is a perspective view showing FIG. 13 (a). ) Is a perspective view showing a mode in which the peripheral rotating portion and the like shown in) are covered with a drive cover member. 図１４は、本発明の第２の実施の形態の一態様で用いられうる基板洗浄装置の平面図である。FIG. 14 is a plan view of a substrate cleaning device that can be used in one aspect of the second embodiment of the present invention. 図１５は、本発明の第２の実施の形態の一態様で用いられうる基板洗浄装置の側方図である。FIG. 15 is a side view of a substrate cleaning apparatus that can be used in one aspect of the second embodiment of the present invention. 図１６は、本発明の第２の実施の形態の別の態様で用いられうる基板洗浄装置の平面図である。FIG. 16 is a plan view of a substrate cleaning apparatus that can be used in another aspect of the second embodiment of the present invention. 図１７は、本発明の第２の実施の形態の別の態様で用いられうる基板洗浄装置の側方図である。FIG. 17 is a side view of a substrate cleaning apparatus that can be used in another aspect of the second embodiment of the present invention. 図１８は、本発明の変形例１の一態様で用いられうる周縁洗浄部材等を示した平面図である。FIG. 18 is a plan view showing a peripheral cleaning member or the like that can be used in one aspect of the first modification of the present invention. 図１９は、本発明の変形例１の別の態様で用いられうる周縁洗浄部材等を示した平面図である。FIG. 19 is a plan view showing a peripheral cleaning member or the like that can be used in another embodiment of the first modification of the present invention. 図２０（ａ）は本発明の変形例２で用いられうる周縁洗浄部材がペンユニットの先端に設けられる態様を示した斜視図であり、図２０（ｂ）は本発明の変形例２で用いられうる周縁洗浄部材がペンユニットの先端に設けられる態様を示した側方部分断面図である。FIG. 20 (a) is a perspective view showing a mode in which a peripheral cleaning member that can be used in the modified example 2 of the present invention is provided at the tip of the pen unit, and FIG. 20 (b) is used in the modified example 2 of the present invention. It is a side partial cross-sectional view which showed the aspect which possible peripheral cleaning member is provided at the tip of a pen unit. 図２１は、本発明の変形例２におけるペンユニットの駆動態様を示した側方図である。FIG. 21 is a side view showing a driving mode of the pen unit in the second modification of the present invention. 図２２（ａ）は本発明の変形例３で用いられうる周縁洗浄部材を示した平面図であり、図２２（ｂ）は変形例３で用いられうる別の態様からなる周縁洗浄部材を示した平面図である。FIG. 22 (a) is a plan view showing a peripheral cleaning member that can be used in the modified example 3 of the present invention, and FIG. 22 (b) shows a peripheral cleaning member having another aspect that can be used in the modified example 3. It is a plan view.

第１の実施の形態
《構成》
基板洗浄装置等を含む基板処理装置の実施の形態について説明する。本実施の形態の基板洗浄装置を用いた基板洗浄方法、基板洗浄装置を生成するためにインストールされるプログラムや、当該プログラムを記憶したＵＳＢ、ＤＶＤ等からなる記憶媒体も本実施の形態により提供される。 First Embodiment << Configuration >>
An embodiment of a substrate processing apparatus including a substrate cleaning apparatus and the like will be described. A substrate cleaning method using the substrate cleaning apparatus of the present embodiment, a program installed to generate the substrate cleaning apparatus, and a storage medium including a USB, a DVD, etc. that stores the program are also provided by the present embodiment. To.

図１に示すように、本実施の形態の基板処理装置は、略矩形状のハウジング３１０と、多数の基板Ｗをストックする基板カセットが載置されるロードポート３１２と、を有している。ロードポート３１２は、ハウジング３１０に隣接して配置されている。ロードポート３１２には、オープンカセット、ＳＭＩＦ（Standard Mechanical Interface）ポッド、又はＦＯＵＰ（Front Opening Unified Pod）を搭載することができる。ＳＭＩＦポッド、ＦＯＵＰは、内部に基板カセットを収納し、隔壁で覆うことにより、外部空間とは独立した環境を保つことができる密閉容器である。基板Ｗとしては、例えば半導体ウェハ等を挙げることができる。 As shown in FIG. 1, the substrate processing apparatus of the present embodiment has a substantially rectangular housing 310 and a load port 312 on which a substrate cassette for stocking a large number of substrates W is placed. The load port 312 is arranged adjacent to the housing 310. An open cassette, a SMIF (Standard Mechanical Interface) pod, or a FOUP (Front Opening Unified Pod) can be mounted on the load port 312. The SMIF pod and FOUP are closed containers that can maintain an environment independent of the external space by storing the substrate cassette inside and covering it with a partition wall. Examples of the substrate W include semiconductor wafers and the like.

ハウジング３１０の内部には、複数（図１に示す態様では４つ）の研磨ユニット３１４ａ〜３１４ｄと、研磨後の基板Ｗを洗浄する第１洗浄ユニット３１６及び第２洗浄ユニット３１８と、洗浄後の基板Ｗを乾燥させる乾燥ユニット３２０とが収容されている。研磨ユニット３１４ａ〜３１４ｄは、基板処理装置の長手方向に沿って配列され、洗浄ユニット３１６、３１８及び乾燥ユニット３２０も基板処理装置の長手方向に沿って配列されている。本実施の形態の基板処理装置によれば、直径３００ｍｍ又は４５０ｍｍの半導体ウェハ、フラットパネル、ＣＭＯＳ（Complementary Metal Oxide Semiconductor）やＣＣＤ（Charge Coupled Device）等のイメージセンサ、ＭＲＡＭ（Magnetoresistive Random Access Memory）における磁性膜の製造工程において、種々の基板Ｗを、研磨処理することができる。なお、別の実施の形態の基板処理装置としては、ハウジング３１０内に基板Ｗを研磨する研磨ユニットを設けず、基板Ｗの洗浄処理及び乾燥処理を行う装置としてもよい。 Inside the housing 310, a plurality of polishing units 314a to 314d (four in the embodiment shown in FIG. 1), a first cleaning unit 316 and a second cleaning unit 318 for cleaning the polished substrate W, and after cleaning A drying unit 320 for drying the substrate W is housed. The polishing units 314a to 314d are arranged along the longitudinal direction of the substrate processing apparatus, and the cleaning units 316 and 318 and the drying unit 320 are also arranged along the longitudinal direction of the substrate processing apparatus. According to the substrate processing apparatus of the present embodiment, in semiconductor wafers having a diameter of 300 mm or 450 mm, flat panels, image sensors such as CMOS (Complementary Metal Oxide Semiconductor) and CCD (Charge Coupled Device), and MRAM (Magnetoresistive Random Access Memory). In the process of manufacturing the magnetic film, various substrates W can be polished. As the substrate processing apparatus of another embodiment, an apparatus that does not provide a polishing unit for polishing the substrate W in the housing 310 and performs cleaning treatment and drying treatment of the substrate W may be used.

ロードポート３１２、ロードポート３１２側に位置する研磨ユニット３１４ａ及び乾燥ユニット３２０に囲まれた領域には、第１搬送ロボット３２２が配置されている。また、研磨ユニット３１４ａ〜３１４ｄ並びに洗浄ユニット３１６、３１８及び乾燥ユニット３２０と平行に、搬送ユニット３２４が配置されている。第１搬送ロボット３２２は、研磨前の基板Ｗをロードポート３１２から受け取って搬送ユニット３２４に受け渡したり、乾燥ユニット３２０から乾燥後の基板Ｗを受け取ってロードポート３１２に戻したりする。 The first transfer robot 322 is arranged in the area surrounded by the load port 312, the polishing unit 314a located on the load port 312 side, and the drying unit 320. Further, the transport unit 324 is arranged in parallel with the polishing units 314a to 314d, the cleaning unit 316, 318, and the drying unit 320. The first transfer robot 322 receives the substrate W before polishing from the load port 312 and delivers it to the transfer unit 324, or receives the substrate W after drying from the drying unit 320 and returns it to the load port 312.

第１洗浄ユニット３１６と第２洗浄ユニット３１８との間に、これら第１洗浄ユニット３１６と第２洗浄ユニット３１８の間で基板Ｗの受け渡しを行う第２搬送ロボット３２６が配置され、第２洗浄ユニット３１８と乾燥ユニット３２０との間に、これら第２洗浄ユニット３１８と乾燥ユニット３２０の間で基板Ｗの受け渡しを行う第３搬送ロボット３２８が配置されている。さらに、ハウジング３１０の内部には、基板処理装置の各機器の動きを制御する制御部に含まれる全体制御部３５０が配置されている。本実施の形態では、ハウジング３１０の内部に全体制御部３５０が配置されている態様を用いて説明するが、これに限られることはなく、ハウジング３１０の外部に全体制御部３５０が配置されてもよいし、全体制御部３５０は遠隔地に設けられてもよい。 Between the first cleaning unit 316 and the second cleaning unit 318, a second transfer robot 326 that transfers the substrate W between the first cleaning unit 316 and the second cleaning unit 318 is arranged, and the second cleaning unit is arranged. Between the 318 and the drying unit 320, a third transfer robot 328 that transfers the substrate W between the second cleaning unit 318 and the drying unit 320 is arranged. Further, inside the housing 310, an overall control unit 350 included in a control unit that controls the movement of each device of the substrate processing apparatus is arranged. In the present embodiment, the embodiment in which the overall control unit 350 is arranged inside the housing 310 will be described, but the present invention is not limited to this, and the overall control unit 350 may be arranged outside the housing 310. Alternatively, the overall control unit 350 may be provided at a remote location.

第１洗浄ユニット３１６として、洗浄液の存在下で、基板Ｗの直径のほぼ全長にわたって直線状に延びるロール洗浄部材を接触させ、基板Ｗに平行な中心軸周りに自転させながら基板Ｗの表面をスクラブ洗浄するロール洗浄装置が使用されてもよい。例えば、水平又は垂直に基板Ｗを保持してこれを回転させながらロール洗浄部材を基板Ｗに接触させて洗浄処理してもよい。また、第２洗浄ユニット３１８として、洗浄液の存在下で、鉛直方向に延びる円柱状のペンシル洗浄部材の接触面を接触させ、ペンシル洗浄部材を自転させながら一方向に向けて移動させて、基板Ｗの表面をスクラブ洗浄するペンシル洗浄装置が使用されてもよい。また、乾燥ユニット３２０として、水平に保持しつつ回転する基板Ｗに向けて、移動する噴射ノズルからＩＰＡ蒸気を噴出して基板Ｗを乾燥させ、さらに基板Ｗを高速で回転させて遠心力によって基板Ｗを乾燥させるスピン乾燥ユニットが使用されてもよい。 As the first cleaning unit 316, in the presence of the cleaning liquid, a roll cleaning member extending linearly over almost the entire diameter of the substrate W is brought into contact with the surface, and the surface of the substrate W is scrubbed while rotating around a central axis parallel to the substrate W. A roll cleaning device for cleaning may be used. For example, the substrate W may be held horizontally or vertically and the roll cleaning member may be brought into contact with the substrate W for cleaning while rotating the substrate W. Further, as the second cleaning unit 318, in the presence of the cleaning liquid, the contact surfaces of the cylindrical pencil cleaning member extending in the vertical direction are brought into contact with each other, and the pencil cleaning member is rotated and moved in one direction to move the substrate W. A pencil cleaning device may be used to scrub the surface of the surface. Further, as the drying unit 320, IPA steam is ejected from a moving injection nozzle toward the rotating substrate W while being held horizontally to dry the substrate W, and the substrate W is further rotated at a high speed to be subjected to centrifugal force. A spin drying unit that dries W may be used.

なお、第１洗浄ユニット３１６としてロール洗浄装置ではなく、第２洗浄ユニット３１８と同様のペンシル洗浄装置を使用したり、二流体ジェットにより基板Ｗの表面を洗浄する二流体ジェット洗浄装置を使用したりしてもよい。また、第２洗浄ユニット３１８としてペンシル洗浄装置ではなく、第１洗浄ユニット３１６と同様のロール洗浄装置を使用したり、二流体ジェットにより基板Ｗの表面を洗浄する二流体ジェット洗浄装置を使用したりしてもよい。 As the first cleaning unit 316, a pencil cleaning device similar to the second cleaning unit 318 may be used instead of the roll cleaning device, or a two-fluid jet cleaning device that cleans the surface of the substrate W with a two-fluid jet may be used. You may. Further, as the second cleaning unit 318, a roll cleaning device similar to that of the first cleaning unit 316 may be used instead of the pencil cleaning device, or a two-fluid jet cleaning device for cleaning the surface of the substrate W with a two-fluid jet may be used. You may.

本実施の形態の洗浄液には、純水（ＤＩＷ）等のリンス液と、アンモニア過酸化水素（ＳＣ１）、塩酸過酸化水素（ＳＣ２）、硫酸過酸化水素（ＳＰＭ）、硫酸加水、フッ酸等の薬液が含まれている。本実施の形態で特に断りのない限り、洗浄液は、リンス液、薬液、又は、リンス液及び薬液の両方を意味している。 The cleaning solution of the present embodiment includes a rinse solution such as pure water (DIW), hydrogen peroxide (SC1), hydrogen peroxide (SC2), hydrogen peroxide (SPM), sulfuric acid, hydrofluoric acid, and the like. Contains chemicals. Unless otherwise specified in the present embodiment, the cleaning solution means a rinsing solution, a chemical solution, or both a rinsing solution and a chemical solution.

本実施の形態では、基板Ｗが水平方向に延在して設けられ、「一方側」として「上方」を用い、「他方側」として「下方」を用いて説明するがこれに限られることはない。基板Ｗは、鉛直方向に延在して設けられてもよいし、水平方向と鉛直方向の間の斜め方向に延在して設けられてもよい。 In the present embodiment, the substrate W is provided so as to extend in the horizontal direction, and "upper side" is used as "one side" and "lower side" is used as "the other side". Absent. The substrate W may be provided so as to extend in the vertical direction, or may be provided so as to extend in an oblique direction between the horizontal direction and the vertical direction.

図２に示すように、本実施の形態の基板洗浄装置は、基板Ｗを支持するとともに回転させるスピンドル等からなる基板回転部１１０と、基板Ｗの周縁部を洗浄するための周縁洗浄部材１０と、周縁洗浄部材１０を基板回転軸１３０に直交する方向（基板Ｗの面内方向に平行な方向）で延びた周縁回転軸１９の周りで回転させるモータ等を有する周縁回転部４０と、を有してもよい。図３に示すように、基板洗浄装置は、基板Ｗの周縁部に対する周縁洗浄部材１０の位置を移動させる移動部３１，３６を有してもよい。移動部３１，３６は、周縁洗浄部材１０を基板Ｗの法線方向（図３の上下方向）に沿って移動するための第一移動部３１と、周縁洗浄部材１０を基板Ｗの面内方向（図３の左右方向）に沿って移動させ、基板Ｗの周縁部に近接又は離隔させるための第二移動部３６と、を有してもよい。なお、基板Ｗを支持する支持部と、基板Ｗを回転させる回転部とは別体になっており、例えばチャック等の支持部によって基板Ｗが支持（保持）され、当該基板Ｗが回転部によって回転されるようにしてもよい。この場合には、支持部と回転部の両方によって基板回転部が構成されることになる。基板Ｗを支持する基板回転部１１０の支持部材の材料は硬さが固いものからなり、ウレタン等であってもよい。 As shown in FIG. 2, the substrate cleaning apparatus of the present embodiment includes a substrate rotating portion 110 including a spindle that supports and rotates the substrate W, and a peripheral edge cleaning member 10 for cleaning the peripheral edge portion of the substrate W. A peripheral edge rotating portion 40 having a motor or the like that rotates the peripheral edge cleaning member 10 around a peripheral edge rotating shaft 19 extending in a direction orthogonal to the substrate rotating shaft 130 (a direction parallel to the in-plane direction of the substrate W). You may. As shown in FIG. 3, the substrate cleaning apparatus may have moving portions 31 and 36 that move the position of the peripheral edge cleaning member 10 with respect to the peripheral edge portion of the substrate W. The moving portions 31 and 36 include a first moving portion 31 for moving the peripheral edge cleaning member 10 along the normal direction of the substrate W (vertical direction in FIG. 3) and the peripheral edge cleaning member 10 in the in-plane direction of the substrate W. It may have a second moving portion 36 for moving along (the left-right direction in FIG. 3) and approaching or separating from the peripheral edge portion of the substrate W. The support portion that supports the substrate W and the rotating portion that rotates the substrate W are separate bodies. For example, the substrate W is supported (held) by a supporting portion such as a chuck, and the substrate W is supported (held) by the rotating portion. It may be rotated. In this case, the substrate rotating portion is formed by both the supporting portion and the rotating portion. The material of the support member of the substrate rotating portion 110 that supports the substrate W is made of a material having a hard hardness, and may be urethane or the like.

第二移動部３６は、ベースプレート３７と、ベースプレート３７を基板Ｗの面内方向に沿って移動するための第二モータ３８とを有してもよい。第一移動部３１としては、ベースプレート３７に固定され、第一モータ３３を有する電動シリンダを採用してもよい。周縁洗浄部材１０としてはＰＶＡ（ポリビニルアルコール）等からなるスポンジを採用してもよく、この場合には、周縁洗浄部材１０はベベルスポンジから構成されることになる。周縁洗浄部材１０はロール洗浄部材と同じ材料からなってもよい。なお、本実施の形態の周縁洗浄部材１０は基板Ｗの周縁部（ベベル）を研磨するものではなく、基板Ｗの周縁部を洗浄するものである。 The second moving portion 36 may have a base plate 37 and a second motor 38 for moving the base plate 37 along the in-plane direction of the substrate W. As the first moving portion 31, an electric cylinder fixed to the base plate 37 and having the first motor 33 may be adopted. A sponge made of PVA (polyvinyl alcohol) or the like may be used as the peripheral cleaning member 10, and in this case, the peripheral cleaning member 10 is made of a bevel sponge. The peripheral edge cleaning member 10 may be made of the same material as the roll cleaning member. The peripheral edge cleaning member 10 of the present embodiment does not polish the peripheral edge portion (bevel) of the substrate W, but cleans the peripheral edge portion of the substrate W.

基板Ｗの周縁部とは、基板Ｗの端部から面内方向の長さにおける１／１０の範囲内にある領域を意味する。基板Ｗが円形状のウェハからなる場合であって、ウェハの直径がＲである場合には、ウェハの端部から１／１０×Ｒの範囲内にある領域がウェハの周縁部になる。本実施の形態では、基板Ｗの周縁部の全部ではなく一部を周縁洗浄部材１０が洗浄する態様となっている。ただし、このような態様に限られることはなく、周縁洗浄部材１０が基板Ｗの周縁部の全部を洗浄するようにしてもよい。 The peripheral edge portion of the substrate W means a region within a range of 1/10 of the length in the in-plane direction from the end portion of the substrate W. When the substrate W is made of a circular wafer and the diameter of the wafer is R, the region within the range of 1/10 × R from the edge of the wafer is the peripheral edge of the wafer. In the present embodiment, the peripheral edge cleaning member 10 cleans not all but a part of the peripheral edge of the substrate W. However, the present invention is not limited to this aspect, and the peripheral edge cleaning member 10 may clean the entire peripheral edge of the substrate W.

第一移動部３１及び第二移動部３６を制御することで周縁洗浄部材１０の基板Ｗの周縁部に対する位置を移動させ、基板Ｗの周縁部の一方側の面を含む一方側周縁領域Ｗ１、側面を含む側面領域Ｗ３及び他方側の面を含む他方側周縁領域Ｗ２を周縁洗浄部材１０によって洗浄させる装置制御部５０が設けられてもよい（図３乃至図５参照）。本実施の形態の基板洗浄装置は、第１洗浄ユニット３１６で用いられてもよいし、第２洗浄ユニット３１８で用いられてもよいし、第１洗浄ユニット３１６及び第２洗浄ユニット３１８とは異なるユニットで用いられてもよい。周縁洗浄部材１０は円柱形状となってもよい。 By controlling the first moving portion 31 and the second moving portion 36, the position of the peripheral cleaning member 10 with respect to the peripheral edge portion of the substrate W is moved, and the one-side peripheral edge region W1 including one side surface of the peripheral edge portion of the substrate W, A device control unit 50 for cleaning the side surface region W3 including the side surface and the other side peripheral edge region W2 including the other side surface by the peripheral cleaning member 10 may be provided (see FIGS. 3 to 5). The substrate cleaning device of the present embodiment may be used in the first cleaning unit 316 or the second cleaning unit 318, and is different from the first cleaning unit 316 and the second cleaning unit 318. It may be used in the unit. The peripheral edge cleaning member 10 may have a cylindrical shape.

周縁回転部４０による周縁洗浄部材１０の回転速度及び回転方向は装置制御部５０によって自在に制御できるようになってもよい。 The rotation speed and rotation direction of the peripheral edge cleaning member 10 by the peripheral edge rotating unit 40 may be freely controlled by the device control unit 50.

本実施の形態では装置制御部５０が基板洗浄装置の制御を行う態様を用いて説明するが、これに限られることはなく、全体制御部３５０が基板洗浄装置の制御を行うようにしてもよい。 In this embodiment, the device control unit 50 controls the substrate cleaning device, but the present embodiment is not limited to this, and the overall control unit 350 may control the substrate cleaning device. ..

装置制御部５０は、一方側周縁領域Ｗ１、側面領域Ｗ３及び他方側周縁領域Ｗ２を順次洗浄するようになってもよい。より具体的には、装置制御部５０は、周縁洗浄部材１０が所定の第一時間Ｔ１だけ一方側周縁領域Ｗ１を洗浄し、その後で周縁洗浄部材１０が所定の第三時間Ｔ３だけ側面領域Ｗ３を洗浄し、その後で周縁洗浄部材１０が所定の第二時間Ｔ２だけ他方側周縁領域Ｗ２を洗浄するように制御してもよい。また、装置制御部５０は、周縁洗浄部材１０が所定の第二時間Ｔ２だけ他方側周縁領域Ｗ２を洗浄し、その後で周縁洗浄部材１０が所定の第三時間Ｔ３だけ側面領域Ｗ３を洗浄し、その後で周縁洗浄部材１０が所定の第一時間Ｔ１だけ一方側周縁領域Ｗ１を洗浄するように制御してもよい。第一時間Ｔ１、第二時間Ｔ２及び第三時間Ｔ３の各々が同一又は略同一となってもよいし、これらが互いに異なる時間であってもよい。本実施の形態において「略同一」とは、両者の差分が大きい方の値の５％以下であることを意味している。したがって、第一時間Ｔ１、第二時間Ｔ２及び第三時間Ｔ３が略同一であるというのは、例えばＴ１がＴ２及びＴ３よりも大きい場合には、Ｔ１−Ｔ２≦Ｔ１×０．０５となり、かつＴ１−Ｔ３≦Ｔ１×０．０５となることを意味している。なお、第一時間Ｔ１、第二時間Ｔ２及び第三時間Ｔ３は例えば数秒であってもよいし数分であってもよいし、３０分以上の時間であってもよい。 The device control unit 50 may sequentially clean the one-side peripheral area W1, the side surface area W3, and the other side peripheral area W2. More specifically, in the device control unit 50, the peripheral cleaning member 10 cleans the one-side peripheral region W1 for a predetermined first time T1, and then the peripheral cleaning member 10 cleans the side peripheral region W3 for a predetermined third time T3. After that, the peripheral edge cleaning member 10 may be controlled to wash the other peripheral peripheral area W2 for a predetermined second time T2. Further, in the device control unit 50, the peripheral edge cleaning member 10 cleans the other side peripheral edge region W2 for a predetermined second time T2, and then the peripheral edge cleaning member 10 cleans the side surface region W3 for a predetermined third time T3. After that, the peripheral edge cleaning member 10 may be controlled to clean the one-side peripheral area W1 for a predetermined first time T1. The first time T1, the second time T2, and the third time T3 may be the same or substantially the same, or they may be different times from each other. In the present embodiment, "substantially the same" means that the difference between the two is 5% or less of the larger value. Therefore, the fact that the first time T1, the second time T2, and the third time T3 are substantially the same means that, for example, when T1 is larger than T2 and T3, T1-T2 ≦ T1 × 0.05, and It means that T1-T3 ≦ T1 × 0.05. The first time T1, the second time T2, and the third time T3 may be, for example, several seconds, several minutes, or 30 minutes or more.

周縁洗浄部材１０に加わる力を検出する検出部２１が設けられてもよい（図９参照）。検出部２１は周縁洗浄部材１０の周縁回転軸１９に設けられてもよいし、第二移動部３６又は第一移動部３１及び第二移動部３６に加わる力を検出することで周縁洗浄部材１０に加わる力を検出するように構成されてもよい。検出部２１は加わる力を直接検出してもよいし、周縁洗浄部材１０を基板Ｗに対して押し付けるモータに加わるトルクによって加わる力を検出してもよい。装置制御部５０は基板Ｗに対して加わる力が一定になるように検出部２１からの検出結果を用いてフィードバック制御を行うようにしてもよい。 A detection unit 21 for detecting a force applied to the peripheral edge cleaning member 10 may be provided (see FIG. 9). The detection unit 21 may be provided on the peripheral rotation shaft 19 of the peripheral edge cleaning member 10, or the peripheral edge cleaning member 10 may be provided by detecting a force applied to the second moving portion 36 or the first moving portion 31 and the second moving portion 36. It may be configured to detect the force applied to. The detection unit 21 may directly detect the applied force, or may detect the applied force by the torque applied to the motor that presses the peripheral cleaning member 10 against the substrate W. The device control unit 50 may perform feedback control using the detection result from the detection unit 21 so that the force applied to the substrate W becomes constant.

装置制御部５０は、検出部２１による検出結果に基づいて第二移動部３６又は第一移動部３１及び第二移動部３６の制御を行い、一方側周縁領域Ｗ１又は他方側周縁領域Ｗ２を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力と、側面領域Ｗ３を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力が異なるように制御してもよい。 The device control unit 50 controls the second moving unit 36 or the first moving unit 31 and the second moving unit 36 based on the detection result by the detecting unit 21, and surrounds the one-side peripheral area W1 or the other side peripheral area W2. The force applied to the peripheral edge cleaning member 10 when cleaning by the cleaning member 10 and the force applied to the peripheral edge cleaning member 10 when cleaning the side surface region W3 by the peripheral edge cleaning member 10 may be controlled to be different.

装置制御部５０は、一方側周縁領域Ｗ１を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力と他方側周縁領域Ｗ２を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力とは略同一となるように制御してもよい。本実施の形態において「略同一」の意味は前述したとおりである。したがって、一方側周縁領域Ｗ１を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力Ｆ１と他方側周縁領域Ｗ２を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力Ｆ２とが略同一であるというのは、Ｆ１≧Ｆ２の場合にはＦ１−Ｆ２≦Ｆ１×０．０５であることを意味し、Ｆ１＜Ｆ２の場合にはＦ２−Ｆ１≦Ｆ２×０．０５であることを意味している。 The device control unit 50 applies a force applied to the peripheral edge cleaning member 10 when cleaning the one-side peripheral edge region W1 by the peripheral edge cleaning member 10 and a force applied to the peripheral edge cleaning member 10 when cleaning the other side peripheral edge region W2 by the peripheral edge cleaning member 10. It may be controlled so as to be substantially the same as the force. In this embodiment, the meaning of "substantially the same" is as described above. Therefore, the force F1 applied to the peripheral edge cleaning member 10 when the one-side peripheral edge region W1 is cleaned by the peripheral edge cleaning member 10 and the force F2 applied to the peripheral edge cleaning member 10 when the other side peripheral edge region W2 is cleaned by the peripheral edge cleaning member 10. Is substantially the same, which means that F1-F2 ≦ F1 × 0.05 when F1 ≧ F2, and F2-F1 ≦ F2 × 0.05 when F1 <F2. It means that.

装置制御部５０は、一方側周縁領域Ｗ１を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力及び他方側周縁領域Ｗ２を前周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力は、側面領域Ｗ３を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力よりも大きくなるように制御してもよい。 The device control unit 50 applies a force applied to the peripheral edge cleaning member 10 when cleaning the one-side peripheral edge region W1 by the peripheral edge cleaning member 10 and the peripheral edge cleaning member 10 when cleaning the other side peripheral edge region W2 by the front peripheral edge cleaning member 10. The applied force may be controlled to be larger than the force applied to the peripheral edge cleaning member 10 when the side surface region W3 is cleaned by the peripheral edge cleaning member 10.

図６に示すように、基板Ｗの中心部から周縁部に向かって、周縁洗浄部材１０と基板Ｗとの接触箇所に対して洗浄液を供給する周縁洗浄液供給部６０が設けられてもよい。周縁洗浄液供給部６０は周縁洗浄液供給ノズルを有し、周縁洗浄液供給ノズルから周縁外方に向かって洗浄液が供給されるようにしてもよく、例えば周縁外方に向かって洗浄液が噴射される態様を採用してもよい。図６では周縁洗浄液供給部６０が基板Ｗの一方側（上方側）に設けられる態様となっているが、これに限られることはなく、図６では周縁洗浄液供給部６０が基板Ｗの他方側（下方側）に設けられてもよいし、周縁洗浄液供給部６０が基板Ｗの一方側（上方側）及び他方側（下方側）の両方に設けられてもよい。 As shown in FIG. 6, a peripheral cleaning liquid supply unit 60 that supplies the cleaning liquid to the contact point between the peripheral cleaning member 10 and the substrate W may be provided from the central portion of the substrate W toward the peripheral edge portion. The peripheral cleaning liquid supply unit 60 has a peripheral cleaning liquid supply nozzle, and the cleaning liquid may be supplied from the peripheral cleaning liquid supply nozzle toward the outer periphery of the peripheral edge. It may be adopted. In FIG. 6, the peripheral cleaning liquid supply unit 60 is provided on one side (upper side) of the substrate W, but the present invention is not limited to this, and in FIG. 6, the peripheral cleaning liquid supply unit 60 is provided on the other side of the substrate W. It may be provided on the (lower side), or the peripheral cleaning liquid supply unit 60 may be provided on both one side (upper side) and the other side (lower side) of the substrate W.

周縁洗浄部材１０の基板Ｗの中心部側に隔壁７１が設けられてもよい（図７参照）。また、周縁洗浄部材１０を覆うようにしてカバー部材７０が設けられ、カバー部材７０の一部が当該隔壁７１を有してもよい。このような態様に限られることはなく、また図１０に示すような板形状の隔壁７１ａを採用してもよい。 A partition wall 71 may be provided on the central portion side of the substrate W of the peripheral edge cleaning member 10 (see FIG. 7). Further, the cover member 70 may be provided so as to cover the peripheral edge cleaning member 10, and a part of the cover member 70 may have the partition wall 71. The mode is not limited to this, and a plate-shaped partition wall 71a as shown in FIG. 10 may be adopted.

周縁洗浄液供給部６０が設けられる態様では、カバー部材７０に周縁洗浄液供給部６０が取り付けられるにしてもよい。周縁洗浄液供給部６０を取付けるための取付部７５がカバー部材７０に設けられ、周縁洗浄液供給部６０が取付部７５に着脱自在に設けられてもよい。また、カバー部材７０に周縁洗浄部材１０が取り付けられる構成となり、周縁洗浄部材１０の設けられたカバー部材７０全体を基板洗浄装置の取付部（図示せず）に取り付けることで周縁洗浄部材１０を交換できるようにしてもよい。これらの態様によれば、周縁洗浄液供給部６０の交換時間を短くすることができ、ひいては基板洗浄装置の稼働率が下がることを防止できる。なお、カバー部材７０に周縁洗浄液供給部６０が取り付けられる態様を採用した場合には、周縁洗浄液供給部６０の周縁洗浄部材１０に対する取付位置を予め定まった位置とすることができ、交換を素早くできるだけではなく、洗浄液による洗浄効果を所望のものとすることができる。 In the embodiment in which the peripheral cleaning liquid supply unit 60 is provided, the peripheral cleaning liquid supply unit 60 may be attached to the cover member 70. A mounting portion 75 for mounting the peripheral cleaning liquid supply unit 60 may be provided on the cover member 70, and the peripheral cleaning liquid supply unit 60 may be detachably provided on the mounting portion 75. Further, the peripheral cleaning member 10 is attached to the cover member 70, and the peripheral cleaning member 10 is replaced by attaching the entire cover member 70 provided with the peripheral cleaning member 10 to the attachment portion (not shown) of the substrate cleaning device. You may be able to do it. According to these aspects, the replacement time of the peripheral cleaning liquid supply unit 60 can be shortened, and it is possible to prevent the operating rate of the substrate cleaning apparatus from decreasing. When the aspect in which the peripheral cleaning liquid supply unit 60 is attached to the cover member 70 is adopted, the attachment position of the peripheral cleaning liquid supply unit 60 with respect to the peripheral cleaning member 10 can be set to a predetermined position, and replacement can be performed as quickly as possible. Instead, the cleaning effect of the cleaning liquid can be desired.

周縁洗浄液供給部６０が設けられる態様では、カバー部材７０に周縁洗浄液供給部６０から供給される洗浄液を排出する排出口７９が設けられてもよい（図６参照）。排出口７９はカバー部材７０の他方側の面（下面）に設けられてもよい。排出口７９はカバー部材７０の周縁外方側（図６の一点鎖線よりも左側）に位置する下面に設けられてもよい。ここで周縁外方側というのはカバー部材７０を基板Ｗの中心から周縁に向かう直線に沿って見たときに、カバー部材７０の中心よりも周縁外方側に位置する領域であることを意味している。また排出口７９は基板Ｗの回転方向（図６中、基板Ｗ内の太い実線矢印）に沿った下流端部側（図６の二点鎖線よりも上側）に設けられてもよい。ここで基板Ｗの回転方向に沿った下流端部側というのは、カバー部材７０の中心よりも基板Ｗの回転方向の下流側のことを意味している。排出口７９をカバー部材７０の周縁外方側及び／又は基板Ｗの回転方向に沿った下流端部側に設けることで、基板Ｗの回転によりカバー部材７９内に流れ込む洗浄液を効率よく排出することができる。 In the embodiment in which the peripheral cleaning liquid supply unit 60 is provided, the cover member 70 may be provided with a discharge port 79 for discharging the cleaning liquid supplied from the peripheral cleaning liquid supply unit 60 (see FIG. 6). The discharge port 79 may be provided on the other side surface (lower surface) of the cover member 70. The discharge port 79 may be provided on the lower surface of the cover member 70 located on the outer side of the peripheral edge (on the left side of the alternate long and short dash line in FIG. 6). Here, the outer peripheral side means a region located on the outer peripheral side of the center of the cover member 70 when the cover member 70 is viewed along a straight line from the center of the substrate W to the peripheral edge. doing. Further, the discharge port 79 may be provided on the downstream end side (above the alternate long and short dash line in FIG. 6) along the rotation direction of the substrate W (thick solid arrow in the substrate W in FIG. 6). Here, the downstream end side along the rotation direction of the substrate W means the downstream side in the rotation direction of the substrate W from the center of the cover member 70. By providing the discharge port 79 on the outer peripheral side of the cover member 70 and / or on the downstream end side along the rotation direction of the substrate W, the cleaning liquid that flows into the cover member 79 due to the rotation of the substrate W can be efficiently discharged. Can be done.

周縁洗浄部材１０を洗浄するための周縁洗浄機構が設けられてもよい。周縁洗浄機構は周縁洗浄部材１０に当接可能な接触板等の接触部材８１であってもよい（図７参照）。接触部材８１は石英板等からなってもよい。接触部材８１を押し付ける押付部８１ａが設けられ、この押付部８１ａを装置制御部５０が制御することで、周縁洗浄部材１０の洗浄を行ったり洗浄を停止したり制御してもよい。つまり、押付部８１ａによって接触部材８１を周縁洗浄部材１０に当接することで周縁洗浄部材１０を洗浄し、押付部８１ａによって接触部材８１を周縁洗浄部材１０から離間することによって周縁洗浄部材１０を洗浄するようにしてもよい。周縁洗浄機構は周縁洗浄部材１０に洗浄液を供給する洗浄液供給部材８２であってもよい（図６及び図７参照）。周縁洗浄機構は周縁洗浄部材１０を吸引する吸引部材８３であってもよい（図６及び図７参照）。また、周縁洗浄機構は接触部材８１、洗浄液供給部材８２及び吸引部材８３のいずれか１つ以上を有してもよい。洗浄液供給部材８２は周縁洗浄部材１０に対して洗浄液を噴射する流体ノズルであってもよい。吸引部材８３は周縁洗浄部材１０に当接する又は近接して設けられる吸引ノズルであってもよい。洗浄液供給部材８２はメガソニック洗浄を行うメガソニック洗浄ノズルであってもよいし、二流体による洗浄を行う二流体ノズルであってもよい。また、洗浄液供給部材８２は基板Ｗの法線方向に沿った軸（例えば上下方向に延在する軸）を中心として揺動してもよいし、基板Ｗの面内方向に沿った軸（例えば水平方向に延在する軸）を中心として揺動してもよい。 A peripheral cleaning mechanism for cleaning the peripheral cleaning member 10 may be provided. The peripheral edge cleaning mechanism may be a contact member 81 such as a contact plate capable of contacting the peripheral edge cleaning member 10 (see FIG. 7). The contact member 81 may be made of a quartz plate or the like. A pressing portion 81a for pressing the contact member 81 is provided, and the apparatus control unit 50 may control the pressing portion 81a to perform cleaning of the peripheral cleaning member 10 or stop or control the cleaning. That is, the peripheral cleaning member 10 is cleaned by bringing the contact member 81 into contact with the peripheral cleaning member 10 by the pressing portion 81a, and the peripheral cleaning member 10 is cleaned by separating the contact member 81 from the peripheral cleaning member 10 by the pressing portion 81a. You may try to do it. The peripheral cleaning mechanism may be a cleaning liquid supply member 82 that supplies a cleaning liquid to the peripheral cleaning member 10 (see FIGS. 6 and 7). The peripheral edge cleaning mechanism may be a suction member 83 that sucks the peripheral edge cleaning member 10 (see FIGS. 6 and 7). Further, the peripheral cleaning mechanism may have any one or more of the contact member 81, the cleaning liquid supply member 82, and the suction member 83. The cleaning liquid supply member 82 may be a fluid nozzle that injects cleaning liquid onto the peripheral cleaning member 10. The suction member 83 may be a suction nozzle provided in contact with or close to the peripheral cleaning member 10. The cleaning liquid supply member 82 may be a megasonic cleaning nozzle that performs megasonic cleaning, or may be a bifluid nozzle that performs cleaning with two fluids. Further, the cleaning liquid supply member 82 may swing around an axis along the normal direction of the substrate W (for example, an axis extending in the vertical direction), or an axis along the in-plane direction of the substrate W (for example). It may swing around a shaft extending in the horizontal direction).

装置制御部５０は、周縁洗浄部材１０が基板Ｗの周縁部を洗浄していない時間に周縁洗浄機構が周縁洗浄部材１０を洗浄するように制御してもよい。ただし、これに限られることはなく、装置制御部５０は、周縁洗浄部材１０が基板Ｗの周縁部を洗浄している時間と周縁洗浄機構が周縁洗浄部材１０を洗浄する時間とが少なくとも一部で重複するように制御してもよいし、周縁洗浄部材１０が基板Ｗの周縁部を洗浄している時間と周縁洗浄機構が周縁洗浄部材１０を洗浄する時間とが完全に重複するように制御してもよい。周縁洗浄機構が接触部材８１を有する場合には周縁洗浄部材１０とともに接触部材８１が（例えば上下方向及び左右方向で）移動する構成を採用してもよい。周縁洗浄機構が洗浄液供給部材８２又は吸引部材８３を有する場合には、周縁洗浄部材１０とともに洗浄液供給部材８２又は吸引部材８３が（例えば上下方向及び左右方向で）移動する態様を採用してもよいし、周縁洗浄部材１０の移動位置に合わせて洗浄液供給部材８２又は吸引部材８３の角度が変わる態様を採用してもよい。 The device control unit 50 may control the peripheral edge cleaning mechanism to clean the peripheral edge cleaning member 10 while the peripheral edge cleaning member 10 is not cleaning the peripheral edge portion of the substrate W. However, the present invention is not limited to this, and the device control unit 50 has at least a part of the time when the peripheral edge cleaning member 10 cleans the peripheral edge portion of the substrate W and the time when the peripheral edge cleaning mechanism cleans the peripheral edge cleaning member 10. It may be controlled so that the peripheral cleaning member 10 cleans the peripheral edge portion of the substrate W and the peripheral cleaning mechanism cleans the peripheral edge cleaning member 10 completely. You may. When the peripheral edge cleaning mechanism has the contact member 81, a configuration may be adopted in which the contact member 81 moves together with the peripheral edge cleaning member 10 (for example, in the vertical direction and the horizontal direction). When the peripheral cleaning mechanism has the cleaning liquid supply member 82 or the suction member 83, an embodiment in which the cleaning liquid supply member 82 or the suction member 83 moves together with the peripheral cleaning member 10 (for example, in the vertical direction and the horizontal direction) may be adopted. Then, an embodiment in which the angle of the cleaning liquid supply member 82 or the suction member 83 changes according to the moving position of the peripheral cleaning member 10 may be adopted.

図８に示すように、基板Ｗの一方側の面（上面）及び／又は他方側の面（下面）に当接して洗浄する前述したロール洗浄部材やペンシル洗浄部材等からなる基板洗浄部材２１０が設けられてもよい（図８ではロール洗浄部材を示している。）。また、基板Ｗに洗浄液を供給する基板洗浄液供給部２２０が設けられてもよい。装置制御部５０は、基板洗浄部材２１０が基板Ｗの一方側の面又は他方側の面を洗浄する時間と周縁洗浄部材１０が基板Ｗの周縁部を洗浄する時間とが少なくとも一部で重複するように制御してもよい。制御部は、基板洗浄部材２１０が基板Ｗを洗浄する間の全時間で周縁洗浄部材１０が基板Ｗの周縁部を洗浄するように制御してもよいし、周縁洗浄部材１０が基板Ｗの周縁部を洗浄する間の全時間で基板洗浄部材２１０が基板Ｗを洗浄するように制御してもよい。 As shown in FIG. 8, the substrate cleaning member 210 composed of the roll cleaning member, the pencil cleaning member, and the like described above that abuts on one side surface (upper surface) and / or the other side surface (lower surface) of the substrate W to clean the substrate W. It may be provided (FIG. 8 shows a roll cleaning member). Further, a substrate cleaning liquid supply unit 220 that supplies the cleaning liquid to the substrate W may be provided. In the apparatus control unit 50, the time for the substrate cleaning member 210 to clean one side surface or the other side surface of the substrate W and the time for the peripheral edge cleaning member 10 to clean the peripheral edge portion of the substrate W overlap at least in part. It may be controlled as follows. The control unit may control the peripheral edge cleaning member 10 to clean the peripheral edge of the substrate W for the entire time while the substrate cleaning member 210 cleans the substrate W, or the peripheral edge cleaning member 10 may perform the peripheral edge cleaning member 10 to clean the peripheral edge of the substrate W. The substrate cleaning member 210 may be controlled to clean the substrate W during the entire time during cleaning of the portion.

《効果》
次に、上述した構成からなる本実施の形態による効果であって、未だ説明していないものを中心に説明する。「構成」で記載されていない場合であっても、「効果」で説明するあらゆる構成を本件発明において採用することができる。 "effect"
Next, the effects of the present embodiment having the above-described configuration, which have not been described yet, will be mainly described. Even if it is not described in "Structure", any configuration described in "Effect" can be adopted in the present invention.

第一移動部３１及び第二移動部３６を制御することで周縁洗浄部材１０の基板Ｗの周縁部に対する位置を移動させ、一方側周縁領域Ｗ１、側面領域Ｗ３及び他方側周縁領域Ｗ２を周縁洗浄部材１０によって洗浄させる態様を採用した場合には、基板Ｗの周縁部の側面だけではなく、一方側の面及び他方側の面をより確実に洗浄することができる。基板Ｗの側面は平坦であることは少なく、基板Ｗの先端が細くなっていることが多い。このため、周縁洗浄部材１０の基板Ｗの周縁部に対する位置を移動させることで、一方側周縁領域Ｗ１及び他方側周縁領域Ｗ２をより確実に洗浄できる。また、基板Ｗの側面の先が細くなっていることから、周縁洗浄部材１０が固定されている場合には先が細くなった基板Ｗのエッジで周縁洗浄部材１０が削られてしまうことになるが、本態様のように周縁洗浄部材１０が移動する場合には基板Ｗのエッジと周縁洗浄部材１０との接触位置を変更することができ、周縁洗浄部材１０の定まった位置で摩耗が発生することを防止できる。このため、周縁洗浄部材１０による洗浄効果を長期間に及ぼすことができ、洗浄効果の下がった周縁洗浄部材１０によって基板Ｗの周縁部（ベベル）が洗浄できないという事態が発生することを防止できる。なお、基板Ｗがウェハからなる場合には様々な膜が設けられていることから、基板Ｗの周縁部（ベベル）はより汚れやすくなっている。 By controlling the first moving portion 31 and the second moving portion 36, the position of the peripheral edge cleaning member 10 with respect to the peripheral edge portion of the substrate W is moved, and the one side peripheral edge region W1, the side surface region W3 and the other side peripheral edge region W2 are peripherally cleaned. When the mode of cleaning by the member 10 is adopted, not only the side surface of the peripheral edge portion of the substrate W but also one side surface and the other side surface can be cleaned more reliably. The side surface of the substrate W is rarely flat, and the tip of the substrate W is often thin. Therefore, by moving the position of the peripheral edge cleaning member 10 with respect to the peripheral edge portion of the substrate W, the one side peripheral edge region W1 and the other side peripheral edge region W2 can be more reliably cleaned. Further, since the side surface of the substrate W has a tapered edge, when the peripheral edge cleaning member 10 is fixed, the peripheral edge cleaning member 10 is scraped at the edge of the tapered substrate W. However, when the peripheral edge cleaning member 10 moves as in this embodiment, the contact position between the edge of the substrate W and the peripheral edge cleaning member 10 can be changed, and wear occurs at a fixed position of the peripheral edge cleaning member 10. Can be prevented. Therefore, the cleaning effect of the peripheral edge cleaning member 10 can be exerted for a long period of time, and it is possible to prevent a situation in which the peripheral edge portion (bevel) of the substrate W cannot be cleaned by the peripheral edge cleaning member 10 having a reduced cleaning effect. When the substrate W is made of a wafer, various films are provided, so that the peripheral edge portion (bevel) of the substrate W is more easily soiled.

なお、第一移動部３１及び第二移動部３６を制御する態様ではなく、周縁洗浄部材１０を一方側周縁領域Ｗ１、側面領域Ｗ３及び他方側周縁領域Ｗ２を跨ぐように首振りさせる首振り機構１８を設けてもよい（図１２参照）。 It should be noted that the swing mechanism for swinging the peripheral edge cleaning member 10 so as to straddle the one-side peripheral area W1, the side surface area W3, and the other side peripheral area W2, instead of controlling the first moving unit 31 and the second moving unit 36. 18 may be provided (see FIG. 12).

周縁洗浄部材１０を基板回転軸１３０と平行な軸（例えば上下方向で延在する軸）で回転させた場合には、周縁洗浄部材１０から飛び散る洗浄液が基板Ｗに届きやすくなるが、周縁洗浄部材１０を基板回転軸１３０に直交する方向（例えば左右方向で延在する軸）で延びた周縁回転軸１９の周りで回転させる態様を採用した場合には、周縁洗浄部材１０が回転することで飛び散る洗浄液が基板Ｗに届き難くすることができる。周縁洗浄部材１０の単位時間あたりの回転数は基板Ｗの単位時間あたりの回転数よりもかなり大きくなることから、周縁洗浄部材１０から基板Ｗへ洗浄液が飛び散りやすい傾向にある。このため、周縁洗浄部材１０を基板回転軸１３０に直交する方向で延びた周縁回転軸１９の周りで回転させる態様を採用することは有益である。なお、基板Ｗがウェハからなる場合には、一例として、周縁洗浄部材１０の回転数は基板Ｗの回転数の１０倍の回転数となり、例えば周縁洗浄部材１０の回転数が１００回転だとすると、周縁洗浄部材１０の回転数は１０００回転となる。 When the peripheral edge cleaning member 10 is rotated on an axis parallel to the substrate rotating shaft 130 (for example, an axis extending in the vertical direction), the cleaning liquid scattered from the peripheral edge cleaning member 10 easily reaches the substrate W, but the peripheral edge cleaning member When the mode of rotating 10 around the peripheral edge rotating shaft 19 extending in a direction orthogonal to the substrate rotating shaft 130 (for example, an axis extending in the left-right direction) is adopted, the peripheral edge cleaning member 10 scatters due to rotation. It is possible to make it difficult for the cleaning liquid to reach the substrate W. Since the rotation speed of the peripheral edge cleaning member 10 per unit time is considerably larger than the rotation speed of the substrate W per unit time, the cleaning liquid tends to scatter from the peripheral edge cleaning member 10 to the substrate W. Therefore, it is beneficial to adopt an embodiment in which the peripheral edge cleaning member 10 is rotated around the peripheral edge rotating shaft 19 extending in a direction orthogonal to the substrate rotating shaft 130. When the substrate W is made of a wafer, as an example, the rotation speed of the peripheral edge cleaning member 10 is 10 times the rotation speed of the substrate W. For example, if the rotation speed of the peripheral edge cleaning member 10 is 100 rotations, the peripheral edge cleaning member 10 is rotated. The rotation speed of the cleaning member 10 is 1000 rotations.

装置制御部５０が、周縁洗浄部材１０が所定の第一時間Ｔ１だけ一方側周縁領域Ｗ１を洗浄し、その後で周縁洗浄部材１０が所定の第三時間Ｔ３だけ側面領域Ｗ３を洗浄し、その後で周縁洗浄部材１０が所定の第二時間Ｔ２だけ他方側周縁領域Ｗ２を洗浄するように制御する態様を採用する場合には、基板Ｗの周縁部に付着した汚れを一方側の面から他方側の面へと順次移動させることができ、取り除いた汚れが基板Ｗの別の箇所に付着することを防止できる。この態様は、一方側の面が上方側に位置し、他方側の面が下方側に位置する場合に特に有益である。この場合には、周縁洗浄部材１０が所定の第一時間Ｔ１だけ一方側周縁領域Ｗ１を洗浄した後で、第二移動部３６が周縁洗浄部材１０を基板Ｗの周縁部から離間するように移動させた後で、第一移動部３１が周縁洗浄部材１０を基板Ｗの法線方向に沿って移動させ（例えば下方に移動させ）、第二移動部３６が周縁洗浄部材１０を基板Ｗの側面領域Ｗ３に近接させ、当接するまで又は所定の力が周縁洗浄部材１０に加わるまで移動させる。所定の第三時間Ｔ３だけ側面領域Ｗ３を周縁洗浄部材１０が洗浄した後で、第二移動部３６が周縁洗浄部材１０を基板Ｗの周縁部から離間するように移動させた後で、第一移動部３１が周縁洗浄部材１０を基板Ｗの法線方向に沿って移動させ（例えば下方に移動させ）、第二移動部３６が周縁洗浄部材１０を基板Ｗの他方側周縁領域Ｗ２に近接させ、当接するまで又は所定の力が周縁洗浄部材１０に加わるまで移動させる。その後、所定の第二時間Ｔ２だけ他方側周縁領域Ｗ２を周縁洗浄部材１０が洗浄する。 The device control unit 50 cleans the one-side peripheral region W1 by the peripheral cleaning member 10 for a predetermined first time T1, and then the peripheral cleaning member 10 cleans the side peripheral region W3 for a predetermined third time T3. When the peripheral cleaning member 10 is controlled to clean the other peripheral region W2 for a predetermined second time T2, the dirt adhering to the peripheral edge of the substrate W is removed from one side to the other. It can be sequentially moved to the surface, and the removed dirt can be prevented from adhering to another part of the substrate W. This aspect is particularly useful when one side is located on the upper side and the other side is located on the lower side. In this case, after the peripheral edge cleaning member 10 cleans the one-side peripheral edge region W1 for a predetermined first time T1, the second moving portion 36 moves so as to separate the peripheral edge cleaning member 10 from the peripheral edge portion of the substrate W. After that, the first moving portion 31 moves the peripheral edge cleaning member 10 along the normal direction of the substrate W (for example, moves it downward), and the second moving portion 36 moves the peripheral edge cleaning member 10 to the side surface of the substrate W. It is brought close to the region W3 and moved until it abuts or a predetermined force is applied to the peripheral cleaning member 10. After the peripheral edge cleaning member 10 has cleaned the side surface region W3 for a predetermined third time T3, the second moving portion 36 has moved the peripheral edge cleaning member 10 so as to be separated from the peripheral edge portion of the substrate W, and then the first The moving portion 31 moves the peripheral edge cleaning member 10 along the normal direction of the substrate W (for example, moves it downward), and the second moving portion 36 brings the peripheral edge cleaning member 10 close to the other peripheral peripheral region W2 of the substrate W. , Move until they come into contact with each other or until a predetermined force is applied to the peripheral cleaning member 10. After that, the peripheral edge cleaning member 10 cleans the other peripheral peripheral region W2 for a predetermined second time T2.

一方側周縁領域Ｗ１又は他方側周縁領域Ｗ２を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力と、側面領域Ｗ３を前記周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力が異なるように装置制御部５０が制御する態様を採用する場合には、周縁洗浄部材１０が基板Ｗの側面を洗浄する場合と、周縁洗浄部材１０が基板Ｗの周縁部のうちの一方側の面又は他方側の面を洗浄する場合とで、異なる力で基板Ｗの周縁部を洗浄することができる。 A force applied to the peripheral edge cleaning member 10 when the one side peripheral area W1 or the other side peripheral edge area W2 is cleaned by the peripheral edge cleaning member 10, and a force applied to the peripheral edge cleaning member 10 when the side surface area W3 is cleaned by the peripheral edge cleaning member 10. When the device control unit 50 controls so that the forces are different, the peripheral cleaning member 10 cleans the side surface of the substrate W and the peripheral cleaning member 10 is one side of the peripheral edge of the substrate W. The peripheral edge of the substrate W can be cleaned with a different force than in the case of cleaning the surface of the substrate W or the surface on the other side.

一方側周縁領域Ｗ１を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力と他方側周縁領域Ｗ２を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力とは略同一となるように装置制御部５０が制御する態様を採用する場合には、周縁洗浄部材１０が基板Ｗの周縁部のうちの一方側の面を洗浄する場合と他方側の面を洗浄する場合とで同程度の力で基板Ｗの周縁部を洗浄することができる。 The force applied to the peripheral edge cleaning member 10 when the one side peripheral edge region W1 is cleaned by the peripheral edge cleaning member 10 and the force applied to the peripheral edge cleaning member 10 when the other side peripheral edge region W2 is cleaned by the peripheral edge cleaning member 10 are substantially the same. When the aspect in which the device control unit 50 controls is adopted, the peripheral cleaning member 10 cleans one surface of the peripheral edge of the substrate W and the other surface. The peripheral edge of the substrate W can be cleaned with the same force.

一方側周縁領域Ｗ１を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力及び他方側周縁領域Ｗ２を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力が、側面領域Ｗ３を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力よりも大きくなるように装置制御部５０が制御する態様を採用する場合には、斜め方向から力が加わることから力が加わりにくい一方側周縁領域Ｗ１及び他方側周縁領域Ｗ２であってもより確実に洗浄することができる。この際、力の加わり方をベクトルで分解した計算結果を根拠として、一方側周縁領域Ｗ１及び他方側周縁領域Ｗ２に加わる力と側面領域Ｗ３に加わる力とが略同一になるように装置制御部５０が制御してもよい。 The force applied to the peripheral edge cleaning member 10 when the one side peripheral edge region W1 is cleaned by the peripheral edge cleaning member 10 and the force applied to the peripheral edge cleaning member 10 when the other side peripheral edge region W2 is cleaned by the peripheral edge cleaning member 10 are the side surface region W3. When the device control unit 50 controls the device so as to be larger than the force applied to the peripheral edge cleaning member 10 when cleaning the peripheral edge cleaning member 10, the force is difficult to be applied because the force is applied from an oblique direction. Even the one-side peripheral area W1 and the other side peripheral area W2 can be cleaned more reliably. At this time, based on the calculation result obtained by decomposing how the force is applied by a vector, the device control unit so that the force applied to the one-side peripheral region W1 and the other side peripheral region W2 and the force applied to the side peripheral region W3 are substantially the same. 50 may be controlled.

また基板Ｗの一方側の面及び他方側の面のいずれかをより確実に洗浄したい場合には、確実に洗浄したい面の周縁部を洗浄する際に、周縁洗浄部材１０に加わる力が大きくなるように装置制御部５０が制御してもよい。一例として、一方側周縁領域Ｗ１を他方側周縁領域Ｗ２よりもより確実に洗浄したい場合には、一方側周縁領域Ｗ１を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力が、他方側周縁領域Ｗ２を周縁洗浄部材１０によって洗浄する際に周縁洗浄部材１０に加わる力よりも大きくなるように装置制御部５０が制御してもよい。またこの場合には、一方側周縁領域Ｗ１を周縁洗浄部材１０によって洗浄する第一時間Ｔ１が、他方側周縁領域Ｗ２を周縁洗浄部材１０によって洗浄する第二時間Ｔ２よりも長くなるように装置制御部５０が制御してもよい。他方側周縁領域Ｗ２を一方側周縁領域Ｗよりもより確実に洗浄したい場合には、装置制御部５０が逆の制御を行ってもよい。 Further, when it is desired to more reliably clean either one side surface or the other side surface of the substrate W, the force applied to the peripheral edge cleaning member 10 becomes large when cleaning the peripheral edge portion of the surface to be reliably cleaned. The device control unit 50 may control the device as described above. As an example, when it is desired to clean the one-side peripheral region W1 more reliably than the other peripheral region W2, the force applied to the peripheral cleaning member 10 when cleaning the one-side peripheral region W1 by the peripheral cleaning member 10 is applied to the other. The device control unit 50 may control the side peripheral region W2 so as to be larger than the force applied to the peripheral cleaning member 10 when the peripheral peripheral region W2 is cleaned by the peripheral cleaning member 10. Further, in this case, the device is controlled so that the first time T1 for cleaning the one-side peripheral region W1 by the peripheral cleaning member 10 is longer than the second time T2 for cleaning the other peripheral peripheral region W2 by the peripheral cleaning member 10. The unit 50 may control. When it is desired to clean the other side peripheral area W2 more reliably than the one side peripheral area W, the device control unit 50 may perform the reverse control.

基板Ｗの中心部から周縁部に向かって、周縁洗浄部材１０と基板Ｗとの接触箇所に対して洗浄液を供給する周縁洗浄液供給部６０が設けられている場合には、基板Ｗの周縁部を洗浄液によって洗浄できるだけではなく、基板Ｗの周縁部から基板Ｗの中心部に向かって洗浄液が流れ（逆流し）、基板Ｗの中心領域が汚れてしまうことを防止できる。 When the peripheral cleaning liquid supply unit 60 for supplying the cleaning liquid to the contact point between the peripheral cleaning member 10 and the substrate W is provided from the central portion of the substrate W toward the peripheral edge portion, the peripheral edge portion of the substrate W is provided. Not only can the cleaning liquid be used for cleaning, but it is also possible to prevent the cleaning liquid from flowing (backflowing) from the peripheral edge portion of the substrate W toward the central portion of the substrate W and contaminating the central region of the substrate W.

周縁洗浄部材１０の基板Ｗの中心部側に隔壁７１，７１ａが設けられる態様を採用した場合には（図７及び図１０参照）、周縁洗浄液供給部６０から供給される洗浄液が跳ねて、基板Ｗの中心側が汚れてしまうことを防止できる。この観点からすると、隔壁７１を有するカバー部材７０によって周縁洗浄部材１０を覆う構成となっていることが有益である。 When the partition walls 71 and 71a are provided on the central portion side of the substrate W of the peripheral cleaning member 10 (see FIGS. 7 and 10), the cleaning liquid supplied from the peripheral cleaning liquid supply unit 60 bounces off the substrate. It is possible to prevent the central side of W from becoming dirty. From this point of view, it is beneficial that the peripheral cleaning member 10 is covered with the cover member 70 having the partition wall 71.

図７に示すようにカバー部材７０に周縁洗浄液供給部６０が取り付けられる態様を採用した場合には、予め定まった位置に周縁洗浄液供給部６０を配置でき、ひいては、基板Ｗの周縁部の定まった位置に洗浄液を供給できるようになる。このため、均一な洗浄効果を得やすくなる。 When the aspect in which the peripheral cleaning liquid supply unit 60 is attached to the cover member 70 as shown in FIG. 7 is adopted, the peripheral cleaning liquid supply unit 60 can be arranged at a predetermined position, and by extension, the peripheral edge portion of the substrate W is determined. The cleaning liquid can be supplied to the position. Therefore, it becomes easy to obtain a uniform cleaning effect.

図６及び図７に示すようにカバー部材７０に周縁洗浄液供給部６０から供給される洗浄液を排出する排出口７９が設けられる態様を採用した場合には、供給された洗浄液を効率よく排出することができる。 When the cover member 70 is provided with a discharge port 79 for discharging the cleaning liquid supplied from the peripheral cleaning liquid supply unit 60 as shown in FIGS. 6 and 7, the supplied cleaning liquid is efficiently discharged. Can be done.

図７に示すように周縁洗浄部材１０を洗浄するための周縁洗浄機構が設けられる態様を採用した場合には、周縁洗浄部材１０が汚れてしまうことを防止でき、ひいては、基板Ｗの周縁部の洗浄効果を高めることができる。 When a mode in which a peripheral edge cleaning mechanism for cleaning the peripheral edge cleaning member 10 is provided as shown in FIG. 7, it is possible to prevent the peripheral edge cleaning member 10 from becoming dirty, and by extension, the peripheral edge portion of the substrate W. The cleaning effect can be enhanced.

周縁洗浄機構として周縁洗浄部材１０に当接可能な接触部材８１を用いた場合には、物理的な接触で周縁洗浄部材１０に付着した汚れを除去することができる。周縁洗浄機構として周縁洗浄部材１０に洗浄液を供給する洗浄液供給部材８２を用いた場合には、洗浄液によって周縁洗浄部材１０に付着した汚れを除去することができる。周縁洗浄機構として周縁洗浄部材１０を吸引する吸引部材８３を用いた場合には、周縁洗浄部材１０に付着した汚れを吸引することで除去することができる。 When a contact member 81 capable of contacting the peripheral edge cleaning member 10 is used as the peripheral edge cleaning mechanism, dirt adhering to the peripheral edge cleaning member 10 can be removed by physical contact. When the cleaning liquid supply member 82 that supplies the cleaning liquid to the peripheral cleaning member 10 is used as the peripheral cleaning mechanism, the dirt adhering to the peripheral cleaning member 10 can be removed by the cleaning liquid. When the suction member 83 that sucks the peripheral edge cleaning member 10 is used as the peripheral edge cleaning mechanism, it can be removed by sucking the dirt adhering to the peripheral edge cleaning member 10.

周縁洗浄部材１０が基板Ｗの周縁部を洗浄していない時間に周縁洗浄機構が周縁洗浄部材１０を洗浄する態様を採用した場合には、周縁洗浄部材１０を洗浄したことによる汚れが基板Ｗに付着することを防止できる。特にこの態様は、周縁洗浄機構として接触部材８１又は洗浄液供給部材８２を採用した場合に有益である。 When the peripheral cleaning mechanism adopts the mode in which the peripheral cleaning member cleans the peripheral edge cleaning member 10 while the peripheral edge cleaning member 10 is not cleaning the peripheral edge portion of the substrate W, dirt due to cleaning the peripheral edge cleaning member 10 is found on the substrate W. It can be prevented from adhering. In particular, this aspect is useful when the contact member 81 or the cleaning liquid supply member 82 is adopted as the peripheral cleaning mechanism.

周縁洗浄部材１０が基板Ｗの周縁部を洗浄している時間と周縁洗浄機構が周縁洗浄部材１０を洗浄する時間とが少なくとも一部で重複するように装置制御部５０が制御する場合には、周縁洗浄部材１０を洗浄する時間の間に基板Ｗの周縁部の洗浄を停止する時間を短くすることができ、スループットを挙げることができる。特にこの態様は、周縁洗浄機構として吸引部材８３を採用した場合に有益である。 When the apparatus control unit 50 controls so that the time when the peripheral edge cleaning member 10 cleans the peripheral edge portion of the substrate W and the time when the peripheral edge cleaning mechanism cleans the peripheral edge cleaning member 10 overlap at least in part. During the time for cleaning the peripheral edge cleaning member 10, the time for stopping the cleaning of the peripheral edge portion of the substrate W can be shortened, and the throughput can be increased. In particular, this aspect is useful when the suction member 83 is adopted as the peripheral cleaning mechanism.

基板洗浄部材２１０が基板Ｗの一方側の面又は他方側の面を洗浄する時間と周縁洗浄部材１０が基板Ｗの周縁部を洗浄する時間とが少なくとも一部で重複するように装置制御部５０が制御する場合には、基板Ｗの中心部を含む周縁部以外と基板Ｗの周縁部とを同時に洗浄することができ、基板Ｗの周縁部だけを洗浄する時間を短く又は無くすことができる。この結果、一枚あたりの基板Ｗの洗浄時間を短くすることができ、基板洗浄装置の稼働率を高めることができる。 The apparatus control unit 50 so that the time for the substrate cleaning member 210 to clean one side surface or the other side surface of the substrate W and the time for the peripheral edge cleaning member 10 to clean the peripheral edge portion of the substrate W overlap at least in part. In the case of controlling, the peripheral portion other than the peripheral portion including the central portion of the substrate W and the peripheral portion of the substrate W can be cleaned at the same time, and the time for cleaning only the peripheral portion of the substrate W can be shortened or eliminated. As a result, the cleaning time of the substrate W per sheet can be shortened, and the operating rate of the substrate cleaning apparatus can be increased.

図１１（ａ）に示すように、周縁洗浄部材１０は、図８に示す上方側のロール洗浄部材と同様、複数の突出部１０ｐを有してもよい。このような態様を採用した場合には、突出部１０ｐが基板Ｗの周縁部に当たることで洗浄でき、より高い洗浄効果を発揮できる。また、周縁洗浄部材１０は図１１（ｂ）に示すような溝部１０ｖを有してもよい。この場合にも、溝部１０ｖの間の領域が突出部１０ｐと同様の機能を果たし、洗浄効果を高めることとなる。溝部１０ｖは周縁洗浄部材１０の長手方向に連続的に設けられてもよいし、断続的に設けられてもよい。 As shown in FIG. 11A, the peripheral edge cleaning member 10 may have a plurality of protrusions 10p, similarly to the roll cleaning member on the upper side shown in FIG. When such an aspect is adopted, the projecting portion 10p can be cleaned by hitting the peripheral edge portion of the substrate W, and a higher cleaning effect can be exhibited. Further, the peripheral cleaning member 10 may have a groove portion 10v as shown in FIG. 11B. Also in this case, the region between the groove portions 10v functions in the same manner as the protrusion portion 10p, and the cleaning effect is enhanced. The groove portion 10v may be provided continuously in the longitudinal direction of the peripheral edge cleaning member 10, or may be provided intermittently.

また、図１３（ａ）（ｂ）で示すような態様を採用してもよい。図１３（ａ）（ｂ）に示す態様では、周縁回転部４０の一方側（一例として上方側）に周縁洗浄部材１０が設けられ、周縁回転部４０と周縁回転軸１９とが歯車部材１４１−１４４を介して連結される態様となっている。本態様では、周縁回転軸１９及び歯車部材１４１−１４４を覆うが、周縁洗浄部材１０を覆わない駆動カバー部材１４５が設けられている。周縁洗浄部材１０は周縁回転軸１９に交換可能に取り付けられている。周縁回転軸１９は駆動カバー部材１４５に軸受け（符号省略）を介して回転可能に支持されている。歯車部材１４２と歯車部材１４３に連結される回転軸（符号省略）は軸受け（符号省略）を介して台座（符号省略）に回転可能に支持されている。また周縁回転部４０（駆動モーター）は台座（符号省略）を支持している。本態様では、駆動カバー部材１４５及び周縁洗浄部材１０が一体となって（全体として）、第一移動部３１及び第二移動部３６によって移動されるようにしてもよい。 Further, the embodiment as shown in FIGS. 13 (a) and 13 (b) may be adopted. In the embodiment shown in FIGS. 13 (a) and 13 (b), the peripheral edge cleaning member 10 is provided on one side (upper side as an example) of the peripheral edge rotating portion 40, and the peripheral edge rotating portion 40 and the peripheral edge rotating shaft 19 are connected to the gear member 141-. It is in a mode of being connected via 144. In this embodiment, a drive cover member 145 that covers the peripheral rotation shaft 19 and the gear member 141-144 but does not cover the peripheral cleaning member 10 is provided. The peripheral edge cleaning member 10 is replaceably attached to the peripheral edge rotating shaft 19. The peripheral rotation shaft 19 is rotatably supported by the drive cover member 145 via a bearing (reference numeral omitted). The rotating shaft (reference numeral omitted) connected to the gear member 142 and the gear member 143 is rotatably supported by a pedestal (reference numeral omitted) via a bearing (reference numeral omitted). Further, the peripheral rotating portion 40 (drive motor) supports a pedestal (reference numeral omitted). In this embodiment, the drive cover member 145 and the peripheral edge cleaning member 10 may be integrally (as a whole) moved by the first moving portion 31 and the second moving portion 36.

第２の実施の形態
次に第２の実施の形態について説明する。 Second Embodiment Next, the second embodiment will be described.

第１の実施の形態では１つの周縁洗浄部材１０が設けられる態様であったが、本実施の形態では、図１４乃至図１７に示すように基板Ｗの周縁部を洗浄する２つ以上の部材が設けられる態様となっている。その他については、第１の実施の形態と同様であり、第１の実施の形態で採用したあらゆる構成を第２の実施の形態でも採用することができる。第１の実施の形態で説明した部材に対しては同じ符号を付して説明する。 In the first embodiment, one peripheral cleaning member 10 is provided, but in the present embodiment, as shown in FIGS. 14 to 17, two or more members for cleaning the peripheral edge of the substrate W. Is provided. Others are the same as those in the first embodiment, and any configuration adopted in the first embodiment can be adopted in the second embodiment. The members described in the first embodiment will be described with the same reference numerals.

図１４及び図１５に示すように、周縁洗浄部材１０は、少なくとも基板Ｗの側面の一方側の一部及び周縁部の一方側の面に当接して洗浄する第一周縁洗浄部材１１と、少なくとも基板Ｗの側面の他方側の一部及び周縁部の他方側の面に当接して洗浄する第二周縁洗浄部材１２とを有してもよい。 As shown in FIGS. 14 and 15, the peripheral cleaning member 10 includes at least a part of the side surface of the substrate W and the first peripheral cleaning member 11 that abuts and cleans the peripheral surface on one side. It may have a second peripheral edge cleaning member 12 that abuts and cleans a part of the other side of the side surface of the substrate W and the other side surface of the peripheral edge portion.

このような態様を用いた場合には、第一周縁洗浄部材１１によって基板Ｗの側面の一方側の一部及び周縁部の一方側の面を洗浄し、第二周縁洗浄部材１２によって基板Ｗの側面の他方側の一部及び周縁部の他方側の面を洗浄することができ、基板Ｗの周縁部全体を二つの周縁洗浄部材１１，１２によって洗浄することができる。 When such an aspect is used, a part of one side of the side surface of the substrate W and one surface of the peripheral edge portion are cleaned by the first peripheral edge cleaning member 11, and the substrate W is cleaned by the second peripheral edge cleaning member 12. A part of the other side of the side surface and the other side surface of the peripheral edge portion can be cleaned, and the entire peripheral edge portion of the substrate W can be cleaned by the two peripheral edge cleaning members 11 and 12.

第二周縁洗浄部材１２が第一周縁洗浄部材１１よりも下方側に位置する場合には、第一周縁洗浄部材１１は基板Ｗの回転方向の上流側（図１４の下方側）に位置し、第二周縁洗浄部材１２は基板Ｗの回転方向の下流側（図１４の上方側）に位置することが有益である（図１５も参照）。この態様によれば、基板Ｗの一方側（上方側）を洗浄した洗浄液が他方側（下方側）に回り込んだ場合でも、第二周縁洗浄部材１２によって洗い流すことができるためである。 When the second peripheral edge cleaning member 12 is located below the first peripheral edge cleaning member 11, the first peripheral edge cleaning member 11 is located on the upstream side (lower side in FIG. 14) of the substrate W in the rotational direction. It is beneficial that the second peripheral edge cleaning member 12 is located on the downstream side (upper side in FIG. 14) of the substrate W in the rotational direction (see also FIG. 15). According to this aspect, even when the cleaning liquid that has washed one side (upper side) of the substrate W wraps around to the other side (lower side), it can be washed away by the second peripheral edge cleaning member 12.

また、図１６及び図１７に示すように、周縁洗浄部材１０は、少なくとも基板Ｗの側面に当接して洗浄する第三周縁洗浄部材１３と、少なくとも基板Ｗの周縁部の一方側の面に当接して洗浄する第四周縁洗浄部材１４と、少なくとも基板Ｗの周縁部の他方側の面に当接して洗浄する第五周縁洗浄部材１５とを有してもよい。 Further, as shown in FIGS. 16 and 17, the peripheral edge cleaning member 10 hits at least one surface of the peripheral edge portion of the substrate W with the third peripheral edge cleaning member 13 that abuts and cleans the side surface of the substrate W. It may have a fourth peripheral edge cleaning member 14 for contacting and cleaning, and a fifth peripheral edge cleaning member 15 for contacting and cleaning at least the other side surface of the peripheral edge portion of the substrate W.

このような態様を用いた場合には、第三周縁洗浄部材１３によって基板Ｗの側面を洗浄し、第四周縁洗浄部材１４によって基板Ｗの周縁部の一方側の面を洗浄することができ、第五周縁洗浄部材１５によって基板Ｗの周縁部の他方側の面を洗浄することができる。 When such an aspect is used, the side surface of the substrate W can be cleaned by the third peripheral edge cleaning member 13, and one surface of the peripheral edge portion of the substrate W can be cleaned by the fourth peripheral edge cleaning member 14. The fifth peripheral edge cleaning member 15 can clean the other surface of the peripheral edge portion of the substrate W.

第一周縁洗浄部材１１及び第二周縁洗浄部材１２に関して述べた理由と同様の理由から、第四周縁洗浄部材１４、第三周縁洗浄部材１３及び第五周縁洗浄部材１５の順で上方から下方に向かって配置されている場合には、第四周縁洗浄部材１４が第三周縁洗浄部材１３に対して基板Ｗの回転方向の上流側（図１６の下方側）に位置し、第三周縁洗浄部材１３が第五周縁洗浄部材１５に対して基板Ｗの回転方向の上流側（図１６の下方側）に位置することが有益である（図１７も参照）。 For the same reason as described for the first peripheral edge cleaning member 11 and the second peripheral edge cleaning member 12, the fourth peripheral edge cleaning member 14, the third peripheral edge cleaning member 13, and the fifth peripheral edge cleaning member 15 are arranged in this order from top to bottom. When the fourth peripheral edge cleaning member 14 is arranged toward the third peripheral edge cleaning member 13, the fourth peripheral edge cleaning member 14 is located on the upstream side (lower side in FIG. 16) of the substrate W in the rotational direction with respect to the third peripheral edge cleaning member 13. It is beneficial that 13 is located on the upstream side (lower side of FIG. 16) of the substrate W in the rotational direction with respect to the fifth peripheral edge cleaning member 15 (see also FIG. 17).

このように複数の周縁洗浄部材１１−１５を設ける場合には、必ずしも周縁洗浄部材１１−１５を移動させる必要が無くなるが、他方で、周縁洗浄部材１１−１５の収納スペースを確保する等、装置が大型化してしまう。このため、小型の装置を採用したい場合には、第１の実施の形態で説明した態様を採用することが有益ではある。 When a plurality of peripheral cleaning members 11-15 are provided in this way, it is not always necessary to move the peripheral cleaning members 11-15, but on the other hand, an apparatus such as securing a storage space for the peripheral cleaning members 11-15 is secured. Will become large. Therefore, when it is desired to adopt a small device, it is beneficial to adopt the embodiment described in the first embodiment.

第一周縁洗浄部材１１及び第二周縁洗浄部材１２の各々の回転速度及び回転方向は独立して装置制御部５０が制御できるようになってもよい。同様に、第三周縁洗浄部材１３、第四周縁洗浄部材１４及び第五周縁洗浄部材１５の各々の回転速度及び回転方向は独立して装置制御部５０が制御できるようになってもよい。 The device control unit 50 may be able to independently control the rotation speed and rotation direction of each of the first peripheral edge cleaning member 11 and the second peripheral edge cleaning member 12. Similarly, the device control unit 50 may be able to independently control the rotation speed and rotation direction of each of the third peripheral edge cleaning member 13, the fourth peripheral edge cleaning member 14, and the fifth peripheral edge cleaning member 15.

上記で第１の実施の形態で採用したあらゆる構成を第２の実施の形態でも採用することができると説明したとおり、本実施の形態でも第１の実施の形態と同様の態様を採用することができる。例えば、本実施の形態でも、第１の実施の形態と同様、第一周縁洗浄部材１１及び第二周縁洗浄部材１２のいずれかもしくは両方、又は第三周縁洗浄部材１３、第四周縁洗浄部材１４及び第五周縁洗浄部材１５のいずれか一つ以上もしくは全部が基板Ｗの一方側周縁領域Ｗ１、側面領域Ｗ３及び他方側周縁領域Ｗ２を移動する態様を採用してもよい。 As explained above that any configuration adopted in the first embodiment can be adopted in the second embodiment, the same embodiment as in the first embodiment is adopted in this embodiment as well. Can be done. For example, also in the present embodiment, as in the first embodiment, either or both of the first peripheral edge cleaning member 11 and the second peripheral edge cleaning member 12, or the third peripheral edge cleaning member 13 and the fourth peripheral edge cleaning member 14 And one or more or all of the fifth peripheral edge cleaning member 15 may adopt a mode in which one side peripheral area W1, the side surface area W3, and the other side peripheral area W2 of the substrate W move.

第３の実施の形態
次に、本発明の第３の実施の形態について説明する。 Third Embodiment Next, a third embodiment of the present invention will be described.

本実施の形態では、装置制御部５０が、周縁洗浄部材１０を基板Ｗの周縁部から離間させた後で、基板回転部１１０による基板Ｗの回転を停止させるように制御する態様となっている。本実施の形態でも、上記各実施の形態で採用したあらゆる構成を採用することができる。上記各実施の形態で説明した部材に対しては同じ符号を付して説明する。 In the present embodiment, the device control unit 50 controls the peripheral cleaning member 10 so as to stop the rotation of the substrate W by the substrate rotating unit 110 after separating the peripheral cleaning member 10 from the peripheral edge of the substrate W. .. Also in this embodiment, any configuration adopted in each of the above embodiments can be adopted. The members described in each of the above embodiments will be described with the same reference numerals.

周縁洗浄部材１０を基板Ｗの周縁部から離間させる前に基板Ｗの回転を停止させると、周縁洗浄部材１０に付着又は吸収されていた洗浄液が基板Ｗに逆流し、基板Ｗが汚れてしまう可能性がある。本実施の形態のように、周縁洗浄部材１０を基板Ｗの周縁部から離間させた後で、基板回転部１１０による基板Ｗの回転を停止させる態様を採用した場合には、このような基板Ｗの汚染を防止できる。 If the rotation of the substrate W is stopped before the peripheral edge cleaning member 10 is separated from the peripheral edge portion of the substrate W, the cleaning liquid adhering to or absorbed by the peripheral edge cleaning member 10 may flow back to the substrate W and the substrate W may become dirty. There is sex. When the aspect of stopping the rotation of the substrate W by the substrate rotating portion 110 after separating the peripheral edge cleaning member 10 from the peripheral edge portion of the substrate W as in the present embodiment is adopted, such a substrate W is adopted. Can prevent contamination.

装置制御部５０は、周縁洗浄部材１０を基板Ｗの周縁部から離間させた後であって基板回転部１１０による基板Ｗの回転を停止させる前に、基板洗浄液供給部２２０からの洗浄液の供給を停止させるように制御してもよい。この態様を採用した場合には、基板洗浄液供給部２２０からの洗浄液の供給を停止させた後で基板Ｗの回転を停止させることから、基板Ｗに洗浄液が残ることを防止できる。ただし、このような態様に限られることはなく、装置制御部５０は、基板回転部１１０による基板Ｗの回転を停止させた後に、基板洗浄液供給部２２０からの洗浄液の供給を停止させるように制御してもよい。 The apparatus control unit 50 supplies the cleaning liquid from the substrate cleaning liquid supply unit 220 after the peripheral edge cleaning member 10 is separated from the peripheral edge portion of the substrate W and before the rotation of the substrate W by the substrate rotating unit 110 is stopped. It may be controlled to stop. When this aspect is adopted, since the rotation of the substrate W is stopped after the supply of the cleaning liquid from the substrate cleaning liquid supply unit 220 is stopped, it is possible to prevent the cleaning liquid from remaining on the substrate W. However, the present invention is not limited to this, and the device control unit 50 controls so as to stop the supply of the cleaning liquid from the substrate cleaning liquid supply unit 220 after stopping the rotation of the substrate W by the substrate rotating unit 110. You may.

装置制御部５０は基板洗浄液供給部２２０のみならず周縁洗浄液供給部６０からの供給及び停止も制御することとしてもよい。第１の実施の形態でも述べたように、基板洗浄部材２１０が基板Ｗの一方側の面又は他方側の面を洗浄する時間と周縁洗浄部材１０が基板Ｗの周縁部を洗浄する時間とが少なくとも一部で重複するように制御してもよい。 The device control unit 50 may control not only the substrate cleaning liquid supply unit 220 but also the supply and stop from the peripheral cleaning liquid supply unit 60. As described in the first embodiment, the time required for the substrate cleaning member 210 to clean one side surface or the other side surface of the substrate W and the time required for the peripheral edge cleaning member 10 to clean the peripheral edge portion of the substrate W are It may be controlled so as to overlap at least a part.

装置制御部５０は、周縁洗浄部材１０を基板Ｗの周縁部から離間させる前に周縁回転部４０による周縁洗浄部材１０の回転を停止させるように制御してもよい。この態様を採用した場合には、基板Ｗから離間した状態で回転する周縁回転部４０から洗浄液が基板Ｗに対して飛び散ることを防止できる。また、装置制御部５０は、周縁洗浄部材１０を基板Ｗの周縁部から離間させる前に周縁洗浄部材１０の回転速度を閾値以下まで落として所定時間だけ基板Ｗの周縁部を洗浄し、その後で周縁洗浄部材１０を基板Ｗの周縁部から離間させ、その後で周縁回転部４０による周縁洗浄部材１０の回転を停止させるように制御してもよい。 The device control unit 50 may control the peripheral edge cleaning member 10 to stop the rotation of the peripheral edge cleaning member 10 by the peripheral edge rotating portion 40 before separating the peripheral edge cleaning member 10 from the peripheral edge portion of the substrate W. When this aspect is adopted, it is possible to prevent the cleaning liquid from splashing with respect to the substrate W from the peripheral rotation portion 40 that rotates in a state of being separated from the substrate W. Further, the device control unit 50 reduces the rotation speed of the peripheral edge cleaning member 10 to a threshold value or less before separating the peripheral edge cleaning member 10 from the peripheral edge portion of the substrate W, and cleans the peripheral edge portion of the substrate W for a predetermined time. The peripheral edge cleaning member 10 may be controlled to be separated from the peripheral edge portion of the substrate W, and then the rotation of the peripheral edge cleaning member 10 by the peripheral edge rotating portion 40 may be stopped.

＜変形例＞
上記各実施の形態において、以下のような変形例を採用することもできる。 <Modification example>
In each of the above embodiments, the following modifications can be adopted.

変形例１
前述したように、周縁洗浄部材１０は円柱形状となってもよいが、図１８及び図１９に示すように、周縁洗浄部材１０はウェハの形状に合わせて側面が湾曲している形状となってもよい。「ウェハの形状に合わせて側面が湾曲している形状となる」というのは、ウェハの一方側（例えば上方側）から見たときに（法線方向に沿って見たときに）、ウェハの曲率半径に対応する曲率半径を洗浄部材の側面が有していることを意味している。ここで曲率半径が対応するというのは、両者の曲率半径の差が大きい方の５％以内であることを意味している。つまりウェハの曲率半径Ｒ１に洗浄部材の側面の曲率半径Ｒ２が対応しているというのは、Ｒ１≧Ｒ２の場合にはＲ１−Ｒ２≦Ｒ１×０．０５であることを意味し、Ｒ１＜Ｒ２の場合にはＲ２−Ｒ１≦Ｒ２×０．０５であることを意味している。 Modification 1
As described above, the peripheral edge cleaning member 10 may have a cylindrical shape, but as shown in FIGS. 18 and 19, the peripheral edge cleaning member 10 has a shape in which the side surface is curved according to the shape of the wafer. May be good. "The side surface is curved to match the shape of the wafer" means that when viewed from one side (for example, the upper side) of the wafer (when viewed along the normal direction), the wafer It means that the side surface of the cleaning member has a radius of curvature corresponding to the radius of curvature. Here, the corresponding radius of curvature means that the difference between the two radii of curvature is within 5% of the larger one. That is, the fact that the radius of curvature R2 of the side surface of the cleaning member corresponds to the radius of curvature R1 of the wafer means that in the case of R1 ≧ R2, R1-R2 ≦ R1 × 0.05, and R1 <R2. In the case of, it means that R2-R1 ≦ R2 × 0.05.

複数の周縁洗浄部材１０が設けられる場合には、各周縁洗浄部材１０においてウェハの形状に合わせて側面が湾曲している形状となってもよい（図１９参照）。 When a plurality of peripheral edge cleaning members 10 are provided, the side surfaces of each peripheral edge cleaning member 10 may be curved according to the shape of the wafer (see FIG. 19).

本変形例の態様を採用した場合には、基板Ｗの側面又は周縁部に面接触させた周縁洗浄部材１０によって基板Ｗの側面又は周縁部を洗浄することができる。すなわち、周縁洗浄部材１０との接触面積を大きくした状態で基板Ｗの側面又は周縁部を洗浄できる。このため、より効果的に基板Ｗの側面、又は基板Ｗの側面及び周縁部を洗浄することができる。 When the aspect of this modification is adopted, the side surface or the peripheral edge of the substrate W can be cleaned by the peripheral edge cleaning member 10 which is in surface contact with the side surface or the peripheral edge of the substrate W. That is, the side surface or the peripheral edge of the substrate W can be cleaned with the contact area with the peripheral edge cleaning member 10 increased. Therefore, the side surface of the substrate W, or the side surface and the peripheral edge of the substrate W can be cleaned more effectively.

前述したとおり、本変形例のような周縁洗浄部材１０を上記各実施の形態で採用したあらゆる構成で採用することができる。 As described above, the peripheral cleaning member 10 as in the present modification can be adopted in any configuration adopted in each of the above embodiments.

変形例２
図２０及び図２１に示すように、周縁回転部４０によって回転されるペンユニット１６０が設けられ、周縁洗浄部材１０ａがペンユニット１６０の先端に設けられる態様を採用してもよい。図２１に示すように、ペンユニット１６０が移動することで周縁洗浄部材１０の基板Ｗの周縁部に対する位置が移動してもよい（第１の実施の形態も参照）。 Modification 2
As shown in FIGS. 20 and 21, a mode may be adopted in which the pen unit 160 rotated by the peripheral edge rotating portion 40 is provided and the peripheral edge cleaning member 10a is provided at the tip of the pen unit 160. As shown in FIG. 21, the position of the peripheral cleaning member 10 with respect to the peripheral edge of the substrate W may be moved by moving the pen unit 160 (see also the first embodiment).

本変形例のようなペンユニット１６０を採用した場合には装置を小型化することができる。また、ペンユニット１６０の根元を締結部材で締結するような態様を採用し、ペンユニット１６０そのものを交換するようにしてもよい。このような態様を採用した場合には、交換作業を容易なものにすることができ、ひいては基板洗浄装置の稼働率が下がることを防止できる。なお、このような態様に限られることはなく、ペンユニット１６０の先端に位置する周縁洗浄部材１０ａを取り換えることができるようにしてもよい。 When the pen unit 160 as in this modification is adopted, the device can be miniaturized. Further, the pen unit 160 itself may be replaced by adopting a mode in which the base of the pen unit 160 is fastened with a fastening member. When such an aspect is adopted, the replacement work can be facilitated, and it is possible to prevent the operation rate of the substrate cleaning device from being lowered. The aspect is not limited to this, and the peripheral cleaning member 10a located at the tip of the pen unit 160 may be replaced.

図２０に示す態様では、周縁回転部４０と周縁回転軸１９とが歯車部材１４６−１４９を介して連結される態様となっている。周縁回転軸１９及び歯車部材１４７と歯車部材１４８に連結される回転軸は各々の軸受け（符号省略）を介して台座１４５ｂに回転可能に支持されている。また周縁回転部４０（駆動モーター）は台座１４５ｂを支持している。周縁回転軸１９及び歯車部材１４６−１４９を覆うが、周縁回転軸１９及び周縁洗浄部材１０ａを覆わない駆動カバー部材１４５ａ（図２０（ｂ）の1点鎖線部を参照）が設けられてもよい。この場合には、周縁回転軸１９（図中、右部分）及び周縁洗浄部材１０ａが駆動カバー部材の外方に設けられ、周縁回転軸１９（図中、左部分）及び歯車部材１４６−１４９は駆動カバー部材１４５ａ内に収容されて、外部から視認できない状態となる。 In the embodiment shown in FIG. 20, the peripheral rotation portion 40 and the peripheral rotation shaft 19 are connected via a gear member 146-149. The peripheral rotating shaft 19, the gear member 147, and the rotating shaft connected to the gear member 148 are rotatably supported by the pedestal 145b via their respective bearings (reference numerals omitted). The peripheral rotating portion 40 (drive motor) supports the pedestal 145b. A drive cover member 145a (see the alternate long and short dash line portion in FIG. 20B) that covers the peripheral rotation shaft 19 and the gear member 146-149 but does not cover the peripheral rotation shaft 19 and the peripheral cleaning member 10a may be provided. .. In this case, the peripheral rotation shaft 19 (right part in the figure) and the peripheral cleaning member 10a are provided on the outer side of the drive cover member, and the peripheral rotation shaft 19 (left part in the figure) and the gear member 146-149 are provided. It is housed in the drive cover member 145a and cannot be visually recognized from the outside.

図２０に示すように、周縁洗浄部材１０ａは先端が細くなるテーパー形状となってもよい。この場合には、周縁洗浄部材１０ａのテーパー形状部分に沿って基板Ｗが当接するように位置付けられてもよい（図２０参照）。このように周縁洗浄部材がテーパー形状となる態様は、上記の各実施の形態及び変形例でも採用することができる。この場合にも、周縁洗浄部材１０のテーパー形状部分に沿って基板Ｗが当接するように位置付けられてもよい。 As shown in FIG. 20, the peripheral cleaning member 10a may have a tapered shape having a tapered tip. In this case, the substrate W may be positioned so as to abut along the tapered portion of the peripheral edge cleaning member 10a (see FIG. 20). Such an embodiment in which the peripheral cleaning member has a tapered shape can also be adopted in each of the above-described embodiments and modifications. In this case as well, the substrate W may be positioned so as to abut along the tapered portion of the peripheral edge cleaning member 10.

また図２０に示す態様では、ペンユニット１６０の根本だけを保持する片持ち構成となっているが、上記の各実施の形態及び変形例でもこのような片持ち構成を採用してもよい。 Further, in the aspect shown in FIG. 20, the cantilever configuration is used to hold only the root of the pen unit 160, but such a cantilever configuration may be adopted in each of the above-described embodiments and modifications.

前述したとおり、本変形例のようなペンユニット１６０を上記各実施の形態で採用したあらゆる構成で採用することができる。 As described above, the pen unit 160 as in this modification can be adopted in any configuration adopted in each of the above embodiments.

変形例３
図２２（ａ）に示すように、周縁洗浄部材１０を基板Ｗの法線方向に沿って見た場合（例えば上方から見た場合）、基板Ｗの回転方向上流側の部分が回転方向下流側の部分と比較して凹みが大きい態様となってもよい。図２２で示す態様で説明すると、周縁洗浄部材１０を基板Ｗの法線方向に沿って見た場合、基板Ｗの図２２の下方側に位置する回転方向上流側の部分が図２２の上方側に位置する回転方向下流側の部分と比較して凹みが大きい態様となっている。 Modification 3
As shown in FIG. 22A, when the peripheral cleaning member 10 is viewed along the normal direction of the substrate W (for example, when viewed from above), the portion of the substrate W on the upstream side in the rotation direction is on the downstream side in the rotation direction. The dent may be larger than that of the portion of. Explaining in the embodiment shown in FIG. 22, when the peripheral cleaning member 10 is viewed along the normal direction of the substrate W, the portion of the substrate W located on the lower side of FIG. 22 on the upstream side in the rotation direction is on the upper side of FIG. 22. The dent is larger than that of the portion located on the downstream side in the rotation direction.

基板Ｗがウェハからなる場合には、基板ＷにノッチＷｎが設けられることある。本態様を採用した場合には、周縁洗浄部材１０による洗浄面積を一定程度確保しつつ、ノッチＷｎに周縁洗浄部材１０が引っかかってしまう可能性を低減できる。また、図２２（ｂ）に示すように樽型形状からなる周縁洗浄部材１０を採用してもよい。この場合にも、ノッチＷｎに周縁洗浄部材１０が引っかかってしまう可能性を低減できる。 When the substrate W is made of a wafer, the substrate W may be provided with a notch Wn. When this aspect is adopted, it is possible to reduce the possibility that the peripheral edge cleaning member 10 is caught in the notch Wn while securing a certain degree of cleaning area by the peripheral edge cleaning member 10. Further, as shown in FIG. 22B, a barrel-shaped peripheral cleaning member 10 may be adopted. Also in this case, the possibility that the peripheral cleaning member 10 is caught in the notch Wn can be reduced.

上述した各実施の形態の記載、各変形例及び図面の開示は、特許請求の範囲に記載された発明を説明するための一例に過ぎず、上述した実施の形態の記載又は図面の開示によって特許請求の範囲に記載された発明が限定されることはない。また、出願当初の請求項の記載はあくまでも一例であり、明細書、図面等の記載に基づき、請求項の記載を適宜変更することもできる。 The description of each embodiment and the disclosure of the modifications and drawings described above are merely examples for explaining the invention described in the claims, and the description of the above-described embodiments or the disclosure of drawings patents the invention. The invention described in the claims is not limited. Further, the description of the claims at the time of filing is only an example, and the description of the claims may be changed as appropriate based on the description of the description, drawings and the like.

１０・・・周縁洗浄部材、１１・・・第一周縁洗浄部材、１２・・・第二周縁洗浄部材、１３・・・第三周縁洗浄部材、１４・・・第四周縁洗浄部材、１５・・・第五周縁洗浄部材、１９・・・周縁回転軸、２１・・・検出部、３１・・・第一移動部、３６・・・第二移動部、４０・・・周縁回転部、５０・・・装置制御部（制御部）、６０・・・周縁洗浄液供給部、７０・・・カバー部材、７１・・・隔壁、７５・・・取付部、７９・・・排出口、８１・・・接触部材、８２・・・洗浄液供給部材、８３・・・吸引部材、１１０・・・基板回転部、１３０・・・基板回転軸、１６０・・・ペンユニット、２１０・・・基板洗浄部材、Ｗ・・・基板、Ｗ１・・・一方側周縁領域、Ｗ２・・・他方側周縁領域、Ｗ３・・・側面領域 10 ... peripheral cleaning member, 11 ... first peripheral cleaning member, 12 ... second peripheral cleaning member, 13 ... third peripheral cleaning member, 14 ... fourth peripheral cleaning member, 15. .. Fifth peripheral cleaning member, 19 ... peripheral rotating shaft, 21 ... detection unit, 31 ... first moving unit, 36 ... second moving unit, 40 ... peripheral rotating unit, 50 ... device control unit (control unit), 60 ... peripheral cleaning liquid supply unit, 70 ... cover member, 71 ... partition wall, 75 ... mounting unit, 79 ... discharge port, 81 ... -Contact member, 82: Cleaning liquid supply member, 83: Suction member, 110: Board rotating part, 130: Board rotating shaft, 160: Pen unit, 210: Board cleaning member, W ... substrate, W1 ... one side peripheral area, W2 ... other side peripheral area, W3 ... side surface area

Claims (23)

基板を回転させる基板回転部と、
前記基板の周縁部を洗浄するための周縁洗浄部材と、
前記周縁洗浄部材を前記基板回転軸に直交する方向で延びた周縁回転軸の周りで回転させる周縁回転部と、
前記周縁洗浄部材の前記基板の周縁部に対する位置を移動させる移動部と、
前記移動部を制御することで前記周縁洗浄部材の前記基板の周縁部に対する位置を移動させ、前記基板の周縁部の一方側の面を含む一方側周縁領域、側面を含む側面領域及び他方側の面を含む他方側周縁領域を前記周縁洗浄部材によって洗浄させる制御部と、
を備える基板洗浄装置。 The board rotating part that rotates the board and
A peripheral cleaning member for cleaning the peripheral edge of the substrate, and
A peripheral rotation portion that rotates the peripheral cleaning member around a peripheral rotation axis extending in a direction orthogonal to the substrate rotation axis, and a peripheral rotation portion.
A moving portion that moves the position of the peripheral cleaning member with respect to the peripheral edge of the substrate, and a moving portion.
By controlling the moving portion, the position of the peripheral edge cleaning member with respect to the peripheral edge portion of the substrate is moved, and the one-side peripheral edge region including one side surface of the peripheral edge portion of the substrate, the side surface region including the side surface, and the other side A control unit that cleans the other peripheral region including the surface with the peripheral cleaning member,
Substrate cleaning device. 前記制御部は、前記周縁洗浄部材が所定の時間だけ前記一方側周縁領域を洗浄し、その後で前記周縁洗浄部材が所定の時間だけ前記側面領域を洗浄し、その後で前記周縁洗浄部材が所定の時間だけ前記他方側周縁領域を洗浄するように制御する、又は前記周縁洗浄部材が所定の時間だけ前記他方側周縁領域を洗浄し、その後で前記周縁洗浄部材が所定の時間だけ前記側面領域を洗浄し、その後で前記周縁洗浄部材が所定の時間だけ前記一方側周縁領域を洗浄するように制御する請求項１に記載の基板洗浄装置。 In the control unit, the peripheral edge cleaning member cleans the one-side peripheral area for a predetermined time, then the peripheral edge cleaning member cleans the side surface area for a predetermined time, and then the peripheral edge cleaning member determines. The other side peripheral area is controlled to be cleaned for a certain period of time, or the peripheral edge cleaning member cleans the other side peripheral area for a predetermined time, and then the peripheral edge cleaning member cleans the side surface area for a predetermined time. The substrate cleaning apparatus according to claim 1, wherein the peripheral cleaning member is then controlled to clean the one-side peripheral region for a predetermined time. 前記周縁洗浄部材に加わる力を検出する検出部を備え、
前記制御部は、前記検出部による検出結果に基づいて前記移動部の制御を行い、前記一方側周縁領域又は前記他方側周縁領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力と、前記側面領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力が異なるように制御する、請求項１又は２に記載の基板洗浄装置。 A detection unit for detecting a force applied to the peripheral cleaning member is provided.
The control unit controls the moving unit based on the detection result of the detection unit, and a force applied to the peripheral cleaning member when the one-side peripheral region or the other-side peripheral region is cleaned by the peripheral cleaning member. The substrate cleaning apparatus according to claim 1 or 2, wherein the force applied to the peripheral edge cleaning member is controlled to be different when the side surface region is cleaned by the peripheral edge cleaning member. 前記制御部は、前記一方側周縁領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力と前記他方側周縁領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力とは略同一となるように制御する、請求項３に記載の基板洗浄装置。 The control unit applies a force applied to the peripheral edge cleaning member when the one side peripheral area is cleaned by the peripheral edge cleaning member and a force applied to the peripheral edge cleaning member when the other peripheral peripheral area is cleaned by the peripheral edge cleaning member. The substrate cleaning apparatus according to claim 3, wherein the substrate cleaning apparatus is controlled so as to be substantially the same as the above. 前記制御部は、前記一方側周縁領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力及び前記他方側周縁領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力は、前記側面領域を前記周縁洗浄部材によって洗浄する際に前記周縁洗浄部材に加わる力よりも大きくなるように制御する、請求項３又は４に記載の基板洗浄装置。 The control unit applies a force applied to the peripheral edge cleaning member when the one side peripheral area is cleaned by the peripheral edge cleaning member and a force applied to the peripheral edge cleaning member when the other peripheral peripheral area is cleaned by the peripheral edge cleaning member. The substrate cleaning apparatus according to claim 3 or 4, wherein is controlled so as to be larger than a force applied to the peripheral edge cleaning member when the side surface region is cleaned by the peripheral edge cleaning member. 基板を回転させる基板回転部と、
前記基板の周縁部を洗浄するための周縁洗浄部材と、
前記周縁洗浄部材を前記基板回転軸に直交する方向で延びた周縁回転軸の周りで回転させる周縁回転部と、
を備え、
前記周縁洗浄部材は、少なくとも前記基板の側面の一方側の一部及び周縁部の一方側の面に当接して洗浄する第一周縁洗浄部材と、少なくとも前記基板の側面の他方側の一部及び周縁部の他方側の面に当接して洗浄する第二周縁洗浄部材とを有する、又は少なくとも前記基板の側面に当接して洗浄する第三周縁洗浄部材と、少なくとも前記基板の周縁部の一方側の面に当接して洗浄する第四周縁洗浄部材と、少なくとも前記基板の周縁部の他方側の面に当接して洗浄する第五周縁洗浄部材とを有する基板洗浄装置。 The board rotating part that rotates the board and
A peripheral cleaning member for cleaning the peripheral edge of the substrate, and
A peripheral rotation portion that rotates the peripheral cleaning member around a peripheral rotation axis extending in a direction orthogonal to the substrate rotation axis, and a peripheral rotation portion.
With
The peripheral cleaning member includes at least a part of one side surface of the substrate and a first peripheral cleaning member that abuts and cleans one side surface of the peripheral edge portion, and at least a part of the other side surface of the substrate. A third peripheral edge cleaning member having a second peripheral edge cleaning member that contacts and cleans the other side surface of the peripheral edge, or at least a third peripheral edge cleaning member that contacts and cleans the side surface of the substrate, and at least one side of the peripheral edge portion of the substrate. A substrate cleaning device having a fourth peripheral edge cleaning member that abuts on the surface of the substrate for cleaning, and a fifth peripheral edge cleaning member that abuts and cleans at least the other surface of the peripheral edge portion of the substrate. 基板を回転させる基板回転部と、
前記基板に洗浄液を供給する基板洗浄液供給部と、
前記基板の周縁部を洗浄するための周縁洗浄部材と、
前記周縁洗浄部材を前記基板回転軸に直交する方向で延びた周縁回転軸の周りで回転させる周縁回転部と、
前記周縁洗浄部材を前記基板の周縁部から離間させた後で、前記基板回転部による前記基板の回転を停止させるように制御する制御部と、
を備える基板洗浄装置。 The board rotating part that rotates the board and
A substrate cleaning liquid supply unit that supplies a cleaning liquid to the substrate,
A peripheral cleaning member for cleaning the peripheral edge of the substrate, and
A peripheral rotation portion that rotates the peripheral cleaning member around a peripheral rotation axis extending in a direction orthogonal to the substrate rotation axis, and a peripheral rotation portion.
A control unit that controls the rotation of the substrate by the rotating portion of the substrate after the peripheral cleaning member is separated from the peripheral portion of the substrate.
Substrate cleaning device. 前記制御部は、前記周縁洗浄部材を前記基板の周縁部から離間させた後であって前記基板回転部による前記基板の回転を停止させる前に、前記基板洗浄液供給部からの洗浄液の供給を停止させるように制御する請求項７に記載の基板洗浄装置。 The control unit stops the supply of the cleaning liquid from the substrate cleaning liquid supply unit after the peripheral cleaning member is separated from the peripheral edge of the substrate and before the rotation of the substrate by the substrate rotating unit is stopped. The substrate cleaning apparatus according to claim 7, wherein the substrate cleaning apparatus is controlled so as to be caused. 前記制御部は、前記周縁洗浄部材を前記基板の周縁部から離間させる前に前記周縁回転部による前記周縁洗浄部材の回転を停止させるように制御する請求項７又は８のいずれかに記載の基板洗浄装置。 The substrate according to claim 7 or 8, wherein the control unit controls to stop the rotation of the peripheral edge cleaning member by the peripheral edge rotating portion before separating the peripheral edge cleaning member from the peripheral edge portion of the substrate. Cleaning equipment. 前記基板はウェハからなり、
前記洗浄部材は前記ウェハの形状に合わせて側面が湾曲している請求項１乃至９のいずれか１項に記載の基板洗浄装置。 The substrate consists of a wafer
The substrate cleaning apparatus according to any one of claims 1 to 9, wherein the cleaning member has a curved side surface according to the shape of the wafer. 前記基板の中心部から周縁部に向かって、前記周縁洗浄部材と前記基板との接触箇所に対して洗浄液を供給する周縁洗浄液供給部を備える請求項１乃至１０のいずれか１項に記載の基板洗浄装置。 The substrate according to any one of claims 1 to 10, further comprising a peripheral cleaning liquid supply unit that supplies a cleaning liquid to a contact portion between the peripheral cleaning member and the substrate from the central portion to the peripheral edge portion of the substrate. Cleaning equipment. 前記周縁洗浄部材の前記基板の中心部側に隔壁が設けられる、請求項１乃至１１のいずれか１項に記載の基板洗浄装置。 The substrate cleaning apparatus according to any one of claims 1 to 11, wherein a partition wall is provided on the central portion side of the substrate of the peripheral edge cleaning member. 前記隔壁を有するカバー部材を備え、
前記カバー部材が前記周縁洗浄部材を覆う請求項１２に記載の基板洗浄装置。 A cover member having the partition wall is provided.
The substrate cleaning apparatus according to claim 12, wherein the cover member covers the peripheral edge cleaning member. 前記基板の中心部から周縁部に向かって、前記周縁洗浄部材と前記基板との接触領域に対して洗浄液を供給する周縁洗浄液供給部を備え、
前記カバー部材に前記周縁洗浄液供給部を取り付けるための取付部が設けられている請求項１３に記載の基板洗浄装置。 A peripheral cleaning liquid supply unit for supplying cleaning liquid to a contact region between the peripheral cleaning member and the substrate is provided from the central portion of the substrate toward the peripheral edge portion.
The substrate cleaning apparatus according to claim 13, wherein an attachment portion for attaching the peripheral cleaning liquid supply portion is provided on the cover member. 前記基板の中心部から周縁部に向かって、前記周縁洗浄部材と前記基板との接触領域に対して洗浄液を供給する周縁洗浄液供給部を備え、
前記カバー部材に前記周縁洗浄液供給部から供給される洗浄液を排出する排出口が設けられる請求項１３又は１４に記載の基板洗浄装置。 A peripheral cleaning liquid supply unit for supplying cleaning liquid to a contact region between the peripheral cleaning member and the substrate is provided from the central portion of the substrate toward the peripheral edge portion.
The substrate cleaning device according to claim 13 or 14, wherein the cover member is provided with a discharge port for discharging the cleaning liquid supplied from the peripheral cleaning liquid supply unit. 前記周縁洗浄部材を洗浄するための周縁洗浄機構を備える請求項１乃至１５のいずれか１項に記載の基板洗浄装置。 The substrate cleaning apparatus according to any one of claims 1 to 15, further comprising a peripheral cleaning mechanism for cleaning the peripheral cleaning member. 前記周縁洗浄機構は、前記周縁洗浄部材に当接可能な接触部材、前記周縁洗浄部材に洗浄液を供給する洗浄液供給部材及び前記周縁洗浄部材を吸引する吸引部材のいずれか１つを有する請求項１６に記載の基板洗浄装置。 16. The peripheral cleaning mechanism includes any one of a contact member capable of contacting the peripheral edge cleaning member, a cleaning liquid supply member that supplies a cleaning liquid to the peripheral edge cleaning member, and a suction member that sucks the peripheral edge cleaning member. The substrate cleaning apparatus according to. 前記制御部は、前記周縁洗浄部材が前記基板の周縁部を洗浄していない時間に前記周縁洗浄機構が前記周縁洗浄部材を洗浄するように制御する請求項１６又は１７に記載の基板洗浄装置。 The substrate cleaning device according to claim 16 or 17, wherein the control unit controls the peripheral cleaning mechanism to clean the peripheral edge cleaning member while the peripheral edge cleaning member is not cleaning the peripheral edge portion of the substrate. 前記制御部は、前記周縁洗浄部材が前記基板の周縁部を洗浄している時間と前記周縁洗浄機構が前記周縁洗浄部材を洗浄する時間とが少なくとも一部で重複するように制御する請求項１６又は１７に記載の基板洗浄装置。 16. The control unit controls so that the time when the peripheral edge cleaning member cleans the peripheral edge portion of the substrate and the time when the peripheral edge cleaning mechanism cleans the peripheral edge cleaning member overlap at least in a part. Or the substrate cleaning apparatus according to 17. 前記周縁回転部によって回転されるペンユニットを備え、
前記周縁洗浄部材はペンユニットの先端に設けられる請求項１乃至１９のいずれか１項に記載の基板洗浄装置。 A pen unit rotated by the peripheral rotating portion is provided.
The substrate cleaning device according to any one of claims 1 to 19, wherein the peripheral cleaning member is provided at the tip of a pen unit. 前記基板の一方側の面又は他方側の面に当接して洗浄する基板洗浄部材を備え、
前記制御部は、前記基板洗浄部材が前記基板の一方側の面又は他方側の面を洗浄する時間と前記周縁洗浄部材が前記基板の周縁部を洗浄する時間とが少なくとも一部で重複するように制御する請求項１乃至２０のいずれか１項に記載の基板洗浄装置。 A substrate cleaning member provided with a substrate cleaning member that abuts on one surface or the other surface of the substrate to clean the substrate.
In the control unit, the time for the substrate cleaning member to clean one side surface or the other side surface of the substrate and the time for the peripheral edge cleaning member to clean the peripheral edge portion of the substrate overlap at least in part. The substrate cleaning apparatus according to any one of claims 1 to 20. 基板回転部によって基板を回転させる工程と、
周縁回転部によって周縁洗浄部材を前記基板回転軸に直交する方向で延びた周縁回転軸の周りで回転させ、前記周縁洗浄部材によって前記基板の周縁部を洗浄する工程と、
を備え、
前記基板の周縁部を洗浄する工程において、移動部によって前記周縁洗浄部材の前記基板の周縁部に対する位置を移動させ、前記基板の周縁部の一方側の面を含む一方側周縁領域、側面を含む側面領域及び他方側の面を含む他方側周縁領域を前記周縁洗浄部材によって洗浄する基板洗浄方法。 The process of rotating the board by the board rotating part,
A step of rotating the peripheral edge cleaning member around a peripheral edge rotation axis extending in a direction orthogonal to the substrate rotation axis by the peripheral edge rotating portion, and cleaning the peripheral edge portion of the substrate by the peripheral edge cleaning member.
With
In the step of cleaning the peripheral edge portion of the substrate, the position of the peripheral edge cleaning member with respect to the peripheral edge portion of the substrate is moved by the moving portion, and the one-side peripheral edge region including one side surface of the peripheral edge portion of the substrate and the side surface are included. A substrate cleaning method for cleaning a side surface region and the other side peripheral region including the other side surface with the peripheral cleaning member. 基板回転部によって基板を回転させる工程と、
基板洗浄液供給部によって前記基板に洗浄液を供給する工程と、
周縁回転部によって周縁洗浄部材を前記基板回転軸に直交する方向で延びた周縁回転軸の周りで回転させ、前記周縁洗浄部材によって前記基板の周縁部を洗浄する工程と、
を備え、
前記周縁洗浄部材を前記基板の周縁部から離間させた後で、前記基板回転部による前記基板の回転を停止させる基板洗浄方法。 The process of rotating the board by the board rotating part,
The process of supplying the cleaning liquid to the substrate by the substrate cleaning liquid supply unit,
A step of rotating the peripheral edge cleaning member around a peripheral edge rotation axis extending in a direction orthogonal to the substrate rotation axis by the peripheral edge rotating portion, and cleaning the peripheral edge portion of the substrate by the peripheral edge cleaning member.
With
A substrate cleaning method in which the rotation of the substrate by the rotating portion of the substrate is stopped after the peripheral cleaning member is separated from the peripheral edge of the substrate.
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