JP2008277518A - Substrate cleaning device and substrate cleaning method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate cleaning device and a substrate cleaning method, which are capable of nicely removing foreign matter adhered firmly to the edge part of a substrate without polishing the substrate itself. <P>SOLUTION: The substrate cleaning device 1 removes the foreign matter adhered to the edge part E by abutting an abutting member 32, constituted of an elastic material having a compression elasticity not less than 0.3 MPa and not more than 2.7 MPa, against the edge part E of the substrate W. Accordingly, the foreign matter, such as metallic film, slurry or the like which is adhered firmly to the edge part E, can be removed nicely without polishing the edge part of the substrate W. On the other hand, silica is mixed into the elastic material for constituting the abutting member 32 as an abrasive grain whereby the foreign matter adhered firmly to the edge part E can be removed nicely while peeling the same. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method using a substrate cleaning brush. Substrates to be processed include, for example, semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disks, magnetic disks, etc. The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for removing foreign matter adhering to an edge portion of a disk-shaped substrate.

  Conventionally, in a process of manufacturing a substrate such as a semiconductor wafer, a substrate cleaning apparatus that removes foreign matter adhering to the edge portion of the substrate W has been used. FIG. 12 is a diagram showing an example of a conventional substrate cleaning apparatus. The substrate cleaning apparatus of FIG. 12 rotates the substrate W while holding it on the holding unit 110, and makes the polishing tape 120 abut against the edge E of the rotating substrate W, thereby removing foreign matter from the edge E of the substrate W. Remove. Since abrasive grains such as diamond are adhered to the surface of the polishing tape 120, the polishing tape 120 can remove foreign matters on the edge portion E while polishing the edge portion E of the substrate W. FIG. 13 is a view showing another example of a conventional substrate cleaning apparatus. The substrate cleaning apparatus of FIG. 13 rotates the substrate W while holding it on the holding unit 210, and brings the resin brush 220 into contact with the edge portion E of the rotating substrate W so that the edge W of the substrate W Remove foreign material.

  Such a conventional substrate cleaning apparatus is disclosed in Patent Document 1, for example.

JP 2004-241434 A

  However, the conventional substrate cleaning apparatus shown in FIG. 12 removes foreign matter on the edge portion E while polishing the edge portion E itself of the substrate W with the polishing tape 120. For this reason, it is necessary to perform secondary cleaning in order to remove polishing scraps generated by polishing, and there has been a problem that the number of cleaning processing steps increases.

  On the other hand, in the substrate cleaning apparatus shown in FIG. 13, the edge portion E of the substrate W is not polished, but since the resin brush is too soft, the edge portion E is firmly attached to the edge portion E like a metal film or slurry. The adhered foreign matter could not be removed. In recent years, in order to prevent cross-contamination at the time of transport, there is an increasing technical demand to favorably remove a metal film such as tungsten and a CMP process residue slurry adhering to the edge E of the substrate W.

  The present invention has been made in view of such circumstances, and a substrate cleaning apparatus and a substrate cleaning device that can satisfactorily remove foreign matters firmly adhered to an edge portion of a substrate without polishing the substrate itself. It aims to provide a method.

  In order to solve the above-mentioned problem, an invention according to claim 1 is a substrate cleaning apparatus for cleaning an edge portion of a substrate, comprising a contact means for contacting a contact member to the edge portion of the substrate, and a substrate. And a relative movement means for moving the contact member relative to the contact member, wherein the contact member is made of an elastic material having a compression elastic modulus of 0.3 MPa or more and 2.7 MPa or less.

  A second aspect of the present invention is the substrate cleaning apparatus according to the first aspect, wherein the contact member includes silica mixed in the elastic material.

  The invention according to claim 3 is the substrate cleaning apparatus according to claim 2, further comprising a rinse liquid supply means for supplying a rinse liquid to the main surface of the substrate, wherein the rinse liquid supply means is pure as a rinse liquid. It is characterized by supplying water.

  The invention according to claim 4 is the substrate cleaning apparatus according to any one of claims 1 to 3, further comprising a standby unit that waits in a state in which the contact member is immersed in the liquid at the time of non-cleaning. It is characterized by providing.

  A fifth aspect of the present invention is the substrate cleaning apparatus according to any one of the first to fourth aspects, wherein the abutting means is a plurality of the abutments that abut against different regions of the edge portion of the substrate. It has the member.

  The invention according to claim 6 is the substrate cleaning apparatus according to claim 5, wherein the plurality of contact members include a first contact member that contacts one inclined surface of the edge portion of the substrate, and a substrate It includes a second contact member that contacts the top of the edge portion and a third contact member that contacts the other inclined surface of the edge portion of the substrate.

  The invention according to claim 7 is the substrate cleaning apparatus according to any one of claims 1 to 6, wherein the substrate cleaning apparatus is acquired by an imaging unit that images the contact surface of the contact member, and the imaging unit. Detecting means for detecting dirt adhering to the contact member based on the image data.

  The invention according to claim 8 is the substrate cleaning apparatus according to claim 7, wherein the contact means is a contact position of the contact member with respect to an edge portion of the substrate based on a detection result of the detection means. It is characterized by changing.

  The invention according to claim 9 is the substrate cleaning apparatus according to any one of claims 1 to 8, wherein the substrate is a circular substrate, and the relative movement means rotates the substrate around a central axis. Thus, the edge portion of the substrate and the contact member are relatively moved.

  According to a tenth aspect of the present invention, there is provided a substrate cleaning method for cleaning an edge portion of a substrate, a contact step of contacting a contact member with the edge portion of the substrate, and a substrate while continuing the contact step. A relative movement step of relatively moving the substrate and the contact member while holding the contact member, wherein the contact member is made of an elastic material having a compression elastic modulus of 0.3 MPa or more and 2.7 MPa or less. Features.

  According to an eleventh aspect of the present invention, in the substrate cleaning method according to the tenth aspect, the contact member includes silica mixed in the elastic material.

  A twelfth aspect of the present invention is the substrate cleaning method according to the eleventh aspect, wherein in the contact step, a rinse liquid is supplied to the main surface of the substrate, and pure water is supplied as a rinse liquid. It is characterized by doing.

  The invention according to claim 13 is the substrate cleaning method according to any one of claims 10 to 12, further comprising a standby step of waiting in a state where the contact member is immersed in a liquid. Features.

  The invention according to claim 14 is the substrate cleaning method according to any one of claims 10 to 13, wherein in the contact step, the plurality of contact members have different edge portions of the substrate, respectively. It abuts on the region.

  The invention according to claim 15 is the substrate cleaning method according to claim 14, wherein the plurality of contact members include a first contact member that contacts one inclined surface of the edge portion of the substrate, It includes a second contact member that contacts the top of the edge portion and a third contact member that contacts the other inclined surface of the edge portion of the substrate.

  The invention according to claim 16 is the substrate cleaning method according to any one of claims 10 to 15, wherein the method is acquired in an imaging step of imaging the contact surface of the contact member, and the imaging step. And a dirt detecting step of detecting dirt adhering to the contact member based on the image data.

  The invention according to claim 17 is the substrate cleaning method according to claim 16, wherein, in the contact step, the contact of the contact member against the edge portion of the substrate is based on a detection result of the dirt detection step. The contact position is changed.

  The invention according to claim 18 is the substrate cleaning method according to any one of claims 10 to 17, wherein the substrate is a circular substrate, and the substrate is rotated around a central axis in the relative movement step. Accordingly, the edge portion of the substrate and the abutting member are moved relative to each other.

  According to the invention described in claim 1 or claim 10, the contact member made of an elastic material having a compression elastic modulus of 0.3 MPa or more and 2.7 MPa or less is brought into contact with the edge portion of the substrate. Remove foreign matter adhering to the edge part. For this reason, it is possible to satisfactorily remove foreign matters such as a metal film and slurry firmly adhered to the edge portion without polishing the edge portion of the substrate.

  In particular, according to the invention described in claim 2 or claim 11, by bringing a contact member made of an elastic material mixed with silica into contact with the edge portion of the substrate, foreign matter adhering to the edge portion is removed. Remove. For this reason, the foreign material adhering to the edge part of a board | substrate can be removed more favorably.

  In particular, according to the invention described in claim 3 or claim 12, pure water is supplied as the rinse liquid. For this reason, it is not necessary to perform the secondary cleaning for removing the rinse liquid.

  In particular, according to the invention described in claim 4 or claim 13, the abutting member is kept in a state of being immersed in the liquid when not washed. For this reason, the contact member can maintain a predetermined compression elastic modulus.

  In particular, according to the invention described in claim 5 or claim 14, the plurality of contact members are brought into contact with different regions of the edge portion of the substrate, respectively. For this reason, each foreign substance adhering to a plurality of regions of the edge portion of the substrate can be efficiently removed.

  In particular, according to the invention described in claim 6 or claim 15, foreign substances adhering to one inclined surface, the top portion, and the other inclined surface of the edge portion of the substrate can be efficiently removed.

  In particular, according to the invention described in claim 7 or claim 16, the contact surface of the contact member is photographed, and the dirt attached to the contact member is detected based on the acquired image data. For this reason, the dirt on the contact member can be recognized as information.

  In particular, according to the invention described in claim 8 or claim 17, the contact position of the contact member with respect to the edge portion of the substrate is changed according to the degree of contamination of the contact member. For this reason, it is possible to prevent the reattachment of foreign matter from the contact member to the substrate without replacing the contact member.

  In particular, according to the invention described in claim 9 or claim 18, the edge portion of the substrate and the contact member are relatively moved by rotating the circular substrate around the central axis. For this reason, the edge part of a board | substrate and a contact member can be moved relatively easily.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

<1. First Embodiment>
FIG. 1 is a top view of a substrate cleaning apparatus 1 according to the first embodiment of the present invention. 2 is a longitudinal sectional view of the substrate cleaning apparatus 1 cut along the line II-II in FIG. The substrate cleaning apparatus 1 is an apparatus for removing foreign matters such as a metal film and slurry attached to the edge portion E by cleaning the edge portion (edge portion) E of the disk-shaped substrate W. As shown in FIGS. 1 and 2, the substrate cleaning apparatus 1 mainly includes a substrate holding / rotating unit 10, a pure water supply unit 20, an edge contact mechanism 30, and a control unit 40.

  The substrate holding / rotating unit 10 is a mechanism for rotating the substrate W around an axis perpendicular to the main surface of the substrate W while holding the substrate W in a horizontal posture. As shown in FIG. 2, the substrate holding / rotating unit 10 includes a support unit 11 for supporting the substrate W from the lower surface side, and a rotation drive mechanism 12 for rotating the support unit 11. The support unit 11 holds the substrate W in a horizontal posture while adsorbing the lower surface of the substrate W with a predetermined suction pressure. The rotation drive mechanism 12 has a drive source such as a motor, and rotates the support portion 11 and the substrate W supported on the support portion 11 as a unit. Since the substrate W rotates around a vertical axis passing through the center thereof, the edge portion E of the rotating substrate W passes through substantially the same locus. Thus, in this embodiment, the support part 11 and the rotation drive mechanism 12 function as the “relative movement means” of the present invention.

  The pure water supply unit 20 is a mechanism for supplying pure water as a rinsing liquid to the upper surface (main surface) of the substrate W. As shown in FIGS. 1 and 2, the pure water supply unit 20 has a discharge nozzle 21 disposed above the support unit 11 of the substrate holding and rotating unit 10. As shown in FIG. 2, the discharge nozzle 21 is connected to a pure water supply source 23 via a pure water supply line 22, and an on-off valve 24 is interposed in the middle of the path of the pure water supply line 22. It is inserted. For this reason, when the on-off valve 24 is opened, pure water is supplied from the pure water supply source 23 through the pure water supply line 22 to the discharge nozzle 21, and pure water is discharged from the discharge nozzle 21 toward the upper surface of the substrate W. The The discharge nozzle 21 discharges pure water toward substantially the center of rotation of the substrate W. For this reason, when pure water is discharged while rotating the substrate W, the discharged pure water is supplied from the rotation center of the substrate W to the edge E of the substrate W while spreading over the entire upper surface of the substrate W.

  The edge contact mechanism 30 is a mechanism for causing the contact member 32 to contact the edge portion E of the substrate W. As shown in FIGS. 1 and 2, the edge contact mechanism 30 includes a swing arm 31, a contact member 32 attached to the tip of the swing arm 31, and a drive mechanism for swinging and lifting the swing arm 31. 33 and a standby part 34 for waiting the contact member 32. The swivel arm 31 is a substantially L-shaped rigid member whose distal end on the free end side is bent downward, and a contact member 32 is attached to the surface of the distal end bent downward on the substrate W side. A drive mechanism 33 is connected to the end of the turning arm 31 on the turning center side. The drive mechanism 33 is realized by various known mechanisms using a motor or the like. When the drive mechanism 33 is operated, the turning arm 31 turns around the vertical axis, and the contact member 32 attached to the tip of the turning arm 31 comes into contact with the edge E of the substrate W (FIG. 1). It moves forward and backward between a standby position (a virtual line position in FIG. 1) that is separated from the edge E of the substrate W. Here, the swing arm 31 is configured to hold the contact member 32 on a surface facing the edge portion E of the substrate W and sandwich the contact member 32 between the swing arm 31 and the edge portion E of the substrate W at the contact position. This makes the contact state of the contact member 32 favorable.

  The abutting member 32 mixes or impregnates a thermosetting resin such as phenol resin, melamine resin, epoxy resin, or urethane resin with silica described later in a resin such as polyvinyl acetal or polyurethane (PU) or a porous body thereof. Thus, a rectangular pad shape is formed of an elastic material whose compression elastic modulus is adjusted. Here, polyvinyl acetal is produced by reacting a water-soluble resin of polyvinyl alcohol (PVA) with an aldehyde. Specifically, an elastic material having a compression elastic modulus of 0.3 MPa or more and 2.7 MPa or less in a sufficiently absorbed state is used. There are various methods for measuring the compression elastic modulus, and any method may be used as long as it exhibits the above value by a test method defined in JIS K7181 (corresponding international standard: ISO604). Since the contact member 32 is made of an elastic material having such a compressive elastic modulus, the foreign matter firmly attached to the edge portion E can be satisfactorily removed without polishing the edge portion E of the substrate W. It has a function. The shape of the abutting member 32 is not limited to a rectangular shape as long as it is a plate-like pad shape, and may be a cylindrical shape.

  As can be seen from the results of the examples described later, if the compressive elastic modulus of the elastic material constituting the contact member 32 is too lower than 0.3 MPa, the ability of the contact member 32 to remove foreign matter is significantly reduced. If the compression modulus of the elastic material constituting the contact member 32 is too higher than 2.7 MPa, the contact member 32 is repelled by the edge portion E of the rotating substrate W and continues to the edge portion E. It becomes difficult to contact. For this reason, in order to satisfactorily remove the foreign matter on the edge portion E while continuously contacting the edge portion E of the substrate W, an appropriate compression elastic modulus is required. Specifically, the elastic modulus of the elastic material is desirably 0.3 MPa or more and 2.7 MPa or less as described above in a sufficiently absorbed state, and more desirably 1.3 MPa.

  Further, the elastic material constituting the contact member 32 preferably has a porosity of 25% by volume or more and 90% by volume or less, and 50% by volume or more and 85% by volume or less in order to obtain good water absorption. If so, it is more desirable. If the porosity is lower than 25% by volume, the water absorption is poor, and if the porosity exceeds 90% by volume, the strength of the elastic material is lowered and cannot be used. In addition, the elastic material constituting the contact member 32 desirably has a tensile fracture strain of 3% or more and 300% or less in order to obtain a good foreign matter removal capability against sliding contact with the substrate W. If the tensile fracture strain is lower than 3%, the mechanical strength of the elastic material is lowered and cannot be used, and if the tensile fracture strain exceeds 400%, an appropriate removal capability cannot be obtained.

  In the elastic material constituting the contact member 32, particles of silica (for example, fumed silica or colloidal silica) are mixed as abrasive grains. For this reason, the contact member 32 can peel off the foreign matter firmly attached to the edge portion E by sliding contact with the edge portion E of the substrate W. In the present embodiment, abrasive grains having an average particle diameter of 1 μm or more and 10 μm or less are used so that the edge portion E itself of the substrate W is not polished while exhibiting an appropriate peeling ability against foreign substances. Yes. Here, when the average particle diameter of silica is smaller than 1 μm, the ability to remove foreign substances is lowered, and when the average particle diameter is larger than 10 μm, the substrate itself is polished and scratched.

  Such an elastic material is, for example, an aqueous solution of polyvinyl alcohol mixed with starch as a pore-forming material, silica as an abrasive, and aldehydes as an acetalizing agent, and reacted by adding an acid. Then, it can be prepared as a polyvinyl acetal porous body by washing with water, drying, and heat treatment. Moreover, you may produce as a polyurethane porous body by mixing the polyol as a main ingredient, the isocyanate as a crosslinking agent, a foaming agent, and a curing catalyst, and making it react and harden | cure in a metal mold | die. Further, these porous bodies may be prepared by mixing a thermosetting resin before the reaction or impregnating the porous body after the reaction. However, the elastic material used in the present invention is not limited to those produced by such a manufacturing method.

  FIG. 3 is an enlarged vertical cross-sectional view showing a state where the turning arm 31 is turned to the substrate W side and the contact member 32 is brought into contact with the edge portion E of the substrate W. Since the contact member 32 is made of an elastic material, when the flat opposing surface (contact surface) of the contact member 32 contacts the edge E of the substrate W, the contact surface of the contact member 32 is It is pushed into the edge portion E to a certain depth and deforms along the surface of the edge portion E. Thereby, the contact member 32 will contact | abut not only the top part (apex part) of the edge part E but the inclined surface (bevel part) formed up and down. When the contact member 32 is brought into contact with the edge portion E of the substrate W while rotating the substrate W, the contact member 32 comes into sliding contact with the top portion and the inclined surface of the edge portion E and adheres to the top portion and the inclined surface of the edge portion E. Remove foreign matter.

  Returning to FIG. 1 and FIG. 2, the standby part 34 is a part for keeping the contact member 32 on standby when not being cleaned. The standby unit 34 has a storage tank 34a having an inner diameter that can accommodate the tip of the swivel arm 31, and pure water is stored inside the storage tank 34a. 4 is a longitudinal sectional view of the vicinity of the standby unit 34 taken along line IV-IV in FIG. When the swivel arm 31 is lowered by the drive mechanism 33 in a state where the swivel arm 31 is swung to the upper part of the storage tank 34a, as shown in FIG. The contact member 32 is immersed in pure water inside the storage tank 34a. When the abutting member 32 is not washed, the abutting member 32 stands by in such a state that it is immersed in pure water and sufficiently absorbs pure water, thereby maintaining the compression elastic modulus of the elastic material at a predetermined value.

  The control unit 40 is a computer device for controlling the operation of each unit in the substrate cleaning apparatus 1. As shown in FIGS. 1 and 2, the control unit 40 is electrically connected to the rotation drive mechanism 12, the on-off valve 24, and the drive mechanism 33 described above. The controller 40 advances the cleaning process of the substrate W by controlling the operations of the rotation drive mechanism 12, the on-off valve 24, the drive mechanism 33, and the like according to a predetermined computer program.

  Next, the flow of the cleaning process in the substrate cleaning apparatus 1 will be described with reference to the flowchart of FIG. When performing the cleaning process in the substrate cleaning apparatus 1, first, the substrate after the CMP process, the substrate after the plating wiring process, and the substrate immediately before the CVD for forming the protective film are transported by a transport robot (not shown), The substrate W is placed on the support portion 11 of the ten and the substrate W is sucked and held on the upper surface of the support portion 11. Then, by operating the rotation drive mechanism 12, the substrate W is rotated about the vertical axis (step S11). In order to satisfactorily remove foreign matter without flipping the contact member 32 in the subsequent step S13, the control unit 40 controls the rotation drive mechanism 12 so that the number of rotations of the substrate W is within a predetermined range. . For example, when the diameter of the substrate W to be processed is about 200 mm, it is desirable that the rotation speed of the substrate W be 50 rpm or more and 200 rpm or less.

  Next, the substrate cleaning apparatus 1 opens the on-off valve 24 and discharges pure water from the discharge nozzle 21 of the pure water supply unit 20 toward the upper surface of the substrate W (step S12). The pure water discharged onto the upper surface of the substrate W is supplied from the rotation center of the substrate W to the edge portion E of the substrate W while spreading over the entire upper surface of the substrate W, and a liquid flow is caused along the surface of the edge portion E of the substrate W. After forming, it falls below the edge portion E.

  On the other hand, the contact member 32 is on standby in a state where it is immersed in pure water stored in the storage tank 34a (standby step). When pure water reaches the edge portion E of the substrate W, the substrate cleaning apparatus 1 raises the turning arm 31 by operating the drive mechanism 33 to move the contact member 32 from the pure water stored in the storage tank 34a. By pulling up, the standby process is shifted to the contact process. Then, the substrate cleaning apparatus 1 performs a contact process in which the contact member 32 is brought into contact with the edge portion E of the substrate W by turning the turning arm 31 (step S13). The contact member 32 is pressed to a certain depth (for example, about 0.5 mm) and deformed by contacting the edge E of the rotating substrate W. And the contact member 32 peels the foreign material adhering to the edge part E by slidably contacting with the top part of the edge part E, and an inclination part. That is, the sliding contact with the edge portion E of the contact member 32 corresponds to the relative movement process of the present invention. The foreign matter peeled off from the edge portion E is flowed together with pure water flowing on the surface of the edge portion E, and is immediately removed from the edge portion E. For this reason, the foreign matter once peeled off does not reattach to the substrate W.

  When the contact process for a predetermined time is completed, the substrate cleaning apparatus 1 operates the drive mechanism 33 to rotate the turning arm 31 toward the standby unit 34 and pulls the contact member 32 away from the edge E of the substrate W ( Step S14). Then, by lowering the swivel arm 31 at the standby position, the process proceeds to a standby process in which the contact member 32 is immersed in the pure water stored in the storage tank 34a. The contact member 32 stands by in preparation for the next cleaning process while recovering its elastic modulus by absorbing pure water inside the storage tank 34a.

  Thereafter, the substrate cleaning apparatus 1 closes the on-off valve 24 and stops the supply of pure water from the discharge nozzle 21 to the substrate W (step S15). Then, the substrate cleaning apparatus 1 rotates the substrate W at a high speed by increasing the number of rotations of the rotation drive mechanism 12, and shakes off and removes pure water remaining on the surface of the substrate W. That is, spin drying is performed on the substrate W (step S16). When the spin drying for a predetermined time is completed, the substrate cleaning apparatus 1 stops the rotation of the substrate W by stopping the rotation drive mechanism 12 (step S17), and the substrate cleaning process for ending the cleaning process for one substrate W. Is completed. Here, the timing of stopping the discharge of pure water from the discharge nozzle 21 is performed without taking a long time after the contact member 32 reaches the standby position, but simultaneously with the separation of the contact member 32 from the edge portion E. You may stop.

  As described above, the substrate cleaning apparatus 1 according to the present embodiment applies the contact member 32 made of an elastic material having a compression elastic modulus of 0.3 MPa or more and 2.7 MPa or less to the edge E of the substrate W. By bringing them into contact, the foreign matter adhering to the edge portion E is removed. For this reason, it is possible to satisfactorily remove foreign matters such as a metal film and slurry firmly adhered to the edge portion E without polishing the edge portion of the substrate W. Moreover, since the silica as an abrasive grain is mixed in the elastic material which comprises the contact member 32, the foreign material firmly adhered to the edge part E can be peeled off favorably.

  Since the substrate cleaning apparatus 1 of the present embodiment does not polish the edge portion E of the substrate W, there is no possibility that new particles such as polishing dust are generated during cleaning. In this embodiment, pure water is used as the rinse liquid. Therefore, it is not necessary to perform secondary cleaning for removing polishing waste and rinsing liquid, and the substrate cleaning process can be shortened.

<2. Example>
FIG. 6 is a diagram showing the results of examining the foreign substance removal ability at each compression elastic modulus by changing the compression elastic modulus of the elastic material constituting the contact member 32 in the substrate cleaning apparatus 1 described above. However, only when the compression elastic modulus is 0.01 MPa, the result of the cleaning process by the conventional substrate cleaning apparatus shown in FIG. 13 is shown. The main component of the elastic material having a compression modulus of 0.3 to 130 MPa is polyurethane (polyurethane porous body), and the main component of the resin having a compression modulus of 0.01 MPa (the constituent material of the brush 220 in FIG. 13) is polyvinyl alcohol. It was. For the investigation, a substrate W having a diameter of 200 mm was used, and a tungsten film formed on the edge E of the substrate W by CVD (chemical vapor deposition) was used as a foreign object to be removed. Moreover, the rotation speed of the board | substrate W was 100 rpm.

  In this investigation, as shown in FIG. 6, when an elastic material having a compressive elastic modulus of 0.3 to 2.7 MPa is used in a sufficiently absorbed state, a good removal effect of the tungsten film is confirmed. I was able to. Therefore, at a compression elastic modulus of at least 0.3 to 2.7 MPa, an effect that cannot be obtained in the past can be obtained by removing the tungsten film from the edge portion E without polishing the edge portion E of the substrate W. I understood that. It was also found that the removal capability with respect to the tungsten film was most improved in the vicinity of 1.3 MPa.

<3. Second Embodiment>
FIG. 7 is a top view of the substrate cleaning apparatus 2 according to the second embodiment of the present invention. FIG. 8 is a longitudinal sectional view of the substrate cleaning apparatus 2 taken along line VIII-VIII in FIG. The substrate cleaning apparatus 2 according to the present embodiment is different from the edge contact mechanism 30 except that a first contact mechanism 51, a second contact mechanism 52, and a third contact mechanism 53 are provided. The configuration is the same as that of the substrate cleaning apparatus 1 according to one embodiment. Therefore, in the following, the configuration of the first contact mechanism 51, the second contact mechanism 52, and the third contact mechanism 53 will be mainly described, and the other parts will be described with reference to FIGS. The same reference numerals as those in FIG.

  The first contact mechanism 51 has a first contact member 51a made of an elastic material equivalent to the contact member 32 of the first embodiment. The first contact member 51a is attached to the tip of the first arm 51b, and the first drive mechanism 51c is connected to the other end of the first arm 51b. For this reason, when the first drive mechanism 51c is operated, the first arm 51b moves forward and backward, and the first contact member 51a attached to the tip of the first arm 51b contacts the edge E of the substrate W. Touch and separate. As shown in FIGS. 7 and 8, the first contact member 51a has an angle at which the contact surface with the substrate W faces slightly below the horizontal direction, specifically in this embodiment, the main contact member 51a. The angle between the surface and the surface is 45 degrees. For this reason, the first contact member 51a mainly contacts the upper inclined surface (upper bevel surface) of the edge portion E of the substrate W.

  The second contact mechanism 52 has a second contact member 52a made of an elastic material equivalent to the contact member 32 of the first embodiment. The second contact member 52a is attached to the tip of the second arm 52b, and the second drive mechanism 52c is connected to the other end of the second arm 52b. For this reason, when the second drive mechanism 52c is operated, the second arm 52b moves forward and backward, and the second contact member 52a attached to the tip of the second arm 52b contacts the edge E of the substrate W. Touch and separate. As shown in FIG. 7, the second contact member 52a is arranged upright so that the contact surface with the substrate W faces the horizontal direction. For this reason, the second contact member 52a mainly contacts the top (apex portion) of the edge portion E of the substrate W.

  The third contact mechanism 53 has a third contact member 53a made of an elastic material equivalent to the contact member 32 of the first embodiment. The third contact member 53a is attached to the tip of the third arm 53b, and the third drive mechanism 53c is connected to the other end of the third arm 53b. For this reason, when the third drive mechanism 53c is operated, the third arm 53b moves forward and backward, and the third contact member 53a attached to the tip of the third arm 53b contacts the edge E of the substrate W. Touch and separate. As shown in FIGS. 7 and 8, the third contact member 53a has an angle such that the contact surface with the substrate W is slightly above the horizontal direction, specifically in this embodiment, the back surface of the substrate W. The angle between the two is 45 degrees. For this reason, the third contact member 53a mainly contacts the lower inclined surface (lower bevel surface) of the edge portion E of the substrate W.

  FIG. 9 is a flowchart showing the flow of the cleaning process in such a substrate cleaning apparatus 2. When performing the cleaning process in the substrate cleaning apparatus 2, first, as in the first embodiment, the substrate W is placed on the support unit 11 and rotated (step S 21), and the pure water supply unit 20 discharges. Pure water is discharged from the nozzle 21 toward the upper surface of the substrate W (step S22). When pure water reaches the edge portion E of the substrate W, the substrate cleaning apparatus 2 first advances the first arm 51b to bring the first contact member 51a into contact with the edge portion E of the substrate W (step S23). . As a result, the foreign matter adhering mainly to the upper inclined surface of the edge portion E of the substrate W is peeled and removed. Then, when the contact processing for a predetermined time is completed, the substrate cleaning apparatus 2 retracts the first arm 51b and separates the first contact member 51a from the edge portion E of the substrate W (step S24).

  Subsequently, the substrate cleaning apparatus 2 moves the second arm 52b forward to bring the second contact member 52a into contact with the edge E of the substrate W (step S25). Thereby, in the edge part E of the board | substrate W, the foreign material adhering mainly to the top part is peeled and removed. Then, when the contact processing for a predetermined time is completed, the substrate cleaning apparatus 2 retracts the second arm 52b and separates the second contact member 52a from the edge portion E of the substrate W (step S26). Further, the substrate cleaning apparatus 2 moves the third arm 53b forward so that the third contact member 53a contacts the edge E of the substrate W (step S27). As a result, the foreign matter adhering mainly to the lower inclined surface of the edge portion E of the substrate W is peeled and removed. Then, when the contact processing for a predetermined time is completed, the substrate cleaning apparatus 2 retracts the third arm 53b and separates the third contact member 53a from the edge portion E of the substrate W (step S28).

  After that, the substrate cleaning apparatus 2 stops the discharge of pure water from the discharge nozzle 21 (step S29), spin-drys (step S30), and then the substrate W, as in the first embodiment. The rotation is stopped (step S31), and the cleaning process for one substrate W is completed.

  Similarly to the substrate cleaning apparatus 1 of the first embodiment, the substrate cleaning apparatus 2 of the present embodiment also has contact members 51a made of an elastic material having a compressive modulus of 0.3 MPa or more and 2.7 MPa or less. By bringing 52a and 53a into contact with the edge portion E of the substrate W, foreign matters attached to the edge portion E are removed. For this reason, it is possible to satisfactorily remove foreign matters such as a metal film and slurry firmly adhered to the edge portion E without polishing the edge portion of the substrate W. Further, since the elastic material constituting the contact members 51a, 52a, 53a is mixed with silica as abrasive grains, the foreign matter firmly attached to the edge portion E is removed while being peeled off well. Can do.

  In particular, the substrate cleaning apparatus 2 according to the present embodiment causes the three contact members 51a, 52a, and 53a to contact with different regions, and the foreign matters attached to the regions are peeled and removed by the contact members 51a, 52a, and 53a. To do. For this reason, the foreign substances adhering to the plurality of regions can be removed efficiently. Further, the substrate cleaning apparatus 2 of the present embodiment sequentially contacts the three contact members 51a, 52a, and 53a one by one. For this reason, the pressing force from two directions is not applied to the substrate W, and damage to the substrate W can be prevented.

<4. Third Embodiment>
FIG. 10 is a top view of the substrate cleaning apparatus 3 according to the third embodiment of the present invention. The substrate cleaning apparatus 3 of the present embodiment is the same as that of the first embodiment except that a camera 60 is added and the swivel arm 31 of the edge contact mechanism 30 can be raised and lowered in multiple stages. It has the same configuration as the device 1. For this reason, below, it demonstrates centering around the structure of the edge contact mechanism 30 and the camera 60, about the other part, the code | symbol same as FIG. 1 is attached | subjected in FIG. 10, and duplication description is abbreviate | omitted.

  The camera 60 of the substrate cleaning apparatus 3 is disposed at substantially the same height as the substrate W, and the imaging direction thereof is directed above the storage tank 34a. For this reason, the camera 60 can photograph the contact surface of the contact member 32 disposed above the storage tank 34a when the turning arm 31 turns to the standby unit 34 side. The camera 60 is electrically connected to the control unit 40 and can transmit image data acquired by photographing to the control unit 40. On the other hand, the drive mechanism 33 of the edge contact mechanism 30 can raise and lower the turning arm 31 in multiple stages. For this reason, the turning arm 31 can adjust the height position of the contact member 32 with respect to the edge portion E of the substrate W.

  The substrate cleaning apparatus 3 performs the cleaning process according to the flowchart of FIG. 5 in the same manner as the substrate cleaning apparatus 1 of the first embodiment. However, when the cleaning process is repeated, as shown in FIG. Dirt 32a due to foreign matter adheres to the contact surface. Therefore, the substrate cleaning device 3 captures the contact surface of the contact member 32 with the camera 60 during the non-cleaning process, and analyzes the image data captured in this capturing process in the control unit 40 to detect contamination. When the density of the portion of the dirt 32a in the image data exceeds a predetermined threshold value, the height of the swivel arm 31 is changed during the next cleaning process as a detection result of the dirt detection step, and the edge portion E of the substrate W is changed. The contact position of the contact member 32 is changed.

  Similarly to the substrate cleaning apparatus 1 of the first embodiment, the substrate cleaning apparatus 3 of the present embodiment also includes a contact member 32 made of an elastic material having a compression elastic modulus of 0.3 MPa or more and 2.7 MPa or less. The foreign matter adhering to the edge portion E is removed by bringing it into contact with the edge portion E of the substrate W. For this reason, it is possible to satisfactorily remove foreign matters such as a metal film and slurry firmly adhered to the edge portion E without polishing the edge portion of the substrate W. Moreover, since the silica as an abrasive grain is mixed in the elastic material which comprises the contact member 32, the foreign material firmly adhered to the edge part E can be removed, peeling off favorably.

  In particular, the substrate cleaning apparatus 3 of the present embodiment images the contact member 32 with the camera 60 and detects the dirt 32a on the contact member 32 based on image data acquired by the image capturing. For this reason, the dirt on the contact member 32 can be recognized as information. Further, the substrate cleaning apparatus 3 changes the contact position of the contact member 32 with respect to the edge portion E of the substrate W when the degree of the detected dirt 32a becomes severe. For this reason, it is possible to prevent reattachment of foreign matters from the contact member 32 to the substrate W without replacing the contact member 32.

<5. Modification>
As mentioned above, although main embodiment of this invention was described, this invention is not limited to said embodiment. For example, in each of the first to third embodiments, the substrate W is rotated only in one direction. However, even if the rotation driving mechanism 12 is controlled to repeat normal rotation and reverse rotation for a predetermined time. Good. In this way, since the peeling force can be applied to the foreign matter attached to the edge portion E from two directions, the foreign matter that is difficult to peel off only by rotation in one direction can be removed. Moreover, in said 1st Embodiment-3rd Embodiment, although the pure water was used as a rinse liquid, you may use carbonated water and another washing | cleaning liquid as a rinse liquid.

  In the above-described embodiment, the contact member 32 is brought into contact with the edge portion E of the substrate W by rotating the substrate W around the vertical axis passing through the center thereof. The relative movement process may be performed by moving the contact member 32. Moreover, in the said embodiment, although silica was mixed as an abrasive grain in the elastic material which comprises the contact member 32, you may use the elastic material which is not mixed with silica.

  Moreover, you may combine the structure of said 2nd Embodiment and 3rd Embodiment. That is, each of the plurality of contact members 51a, 52a, 53a is photographed with a camera, the dirt of each contact member 51a, 52a, 53a is detected based on the image data acquired by photographing, and the edge of the substrate W is detected. You may enable it to change the contact position of each contact member 51a, 52a, 53a with respect to the part E. FIG.

It is a top view of the substrate cleaning apparatus according to the first embodiment. It is the longitudinal cross-sectional view which cut | disconnected the board | substrate cleaning apparatus which concerns on 1st Embodiment by the II-II line of FIG. It is the enlarged longitudinal cross-sectional view which showed the state when a contact member is made to contact | abut to the edge part of a board | substrate. It is the longitudinal cross-sectional view which cut | disconnected the standby part vicinity by the IV-IV line of FIG. It is the flowchart which showed the flow of the cleaning process of 1st Embodiment. It is the figure which showed the result of having changed the compression elastic modulus of the elastic material which comprises a contact member, and having investigated the removal capability of the foreign material in each compression elastic modulus. It is a top view of the substrate cleaning apparatus according to the second embodiment. It is the longitudinal cross-sectional view which cut | disconnected the board | substrate cleaning apparatus which concerns on 2nd Embodiment by the VIII-VIII line of FIG. It is the flowchart which showed the flow of the washing process of 2nd Embodiment. It is a top view of the substrate cleaning apparatus according to the third embodiment. It is the figure which showed the mode of the contact member to which dirt adhered. It is the figure which showed an example of the conventional board | substrate cleaning apparatus. It is the figure which showed another example of the conventional board | substrate cleaning apparatus.

Explanation of symbols

1, 2 and 3 Substrate cleaning device 10 Substrate holding rotation unit 20 Pure water supply unit 30 Edge contact mechanism 31 Turning arm 32 Contact member 33 Drive mechanism 34 Standby unit 34a Storage tank 40 Control unit 51 First contact mechanism 52 First 2 contact mechanism 53 3rd contact mechanism 51a, 52a, 53a contact member 51b, 52b, 53b arm 51c, 52c, 53c drive mechanism 60 camera W substrate E edge part

Claims (18)

A substrate cleaning apparatus for cleaning an edge portion of a substrate,
Contact means for contacting the contact member to the edge portion of the substrate;
Relative movement means for moving relative to the contact member while holding the substrate;
With
The substrate cleaning apparatus, wherein the contact member is made of an elastic material having a compression elastic modulus of 0.3 MPa or more and 2.7 MPa or less. The substrate cleaning apparatus according to claim 1,
The substrate cleaning apparatus, wherein the contact member is made by mixing silica into the elastic material. The substrate cleaning apparatus according to claim 2,
A rinsing liquid supply means for supplying a rinsing liquid to the main surface of the substrate;
The rinsing liquid supply means supplies pure water as a rinsing liquid. A substrate cleaning apparatus according to any one of claims 1 to 3, wherein
A substrate cleaning apparatus, further comprising a standby unit that waits in a state in which the contact member is immersed in a liquid during non-cleaning. A substrate cleaning apparatus according to any one of claims 1 to 4, wherein
The substrate cleaning apparatus, wherein the contact means includes a plurality of the contact members that contact different regions of the edge portion of the substrate. The substrate cleaning apparatus according to claim 5,
The plurality of contact members are:
A first contact member that contacts one inclined surface of the edge portion of the substrate;
A second contact member that contacts the top of the edge portion of the substrate;
A third contact member that contacts the other inclined surface of the edge portion of the substrate;
A substrate cleaning apparatus comprising: A substrate cleaning apparatus according to any one of claims 1 to 6,
Photographing means for photographing a contact surface of the contact member;
Detecting means for detecting dirt adhering to the contact member based on image data acquired by the photographing means;
A substrate cleaning apparatus, further comprising: The substrate cleaning apparatus according to claim 7,
The substrate cleaning apparatus, wherein the contact means changes a contact position of the contact member with respect to an edge portion of the substrate based on a detection result of the detection means. A substrate cleaning apparatus according to any one of claims 1 to 8,
The substrate is a circular substrate,
The substrate cleaning apparatus, wherein the relative movement means relatively moves the edge portion of the substrate and the contact member by rotating the substrate around a central axis. A substrate cleaning method for cleaning an edge portion of a substrate,
A contact step of contacting the contact member to the edge portion of the substrate;
A relative movement step of relatively moving the substrate and the contact member while holding the substrate while continuing the contact step;
With
The substrate cleaning method, wherein the contact member is made of an elastic material having a compression elastic modulus of 0.3 MPa or more and 2.7 MPa or less. The substrate cleaning method according to claim 10, comprising:
The substrate cleaning method, wherein the contact member is made by mixing silica into the elastic material. The substrate cleaning method according to claim 11,
In the contact step, a rinse liquid is supplied to the main surface of the substrate, and pure water is supplied as a rinse liquid. A substrate cleaning method according to any one of claims 10 to 12,
A substrate cleaning method, further comprising a standby step of waiting in a state where the contact member is immersed in a liquid. A substrate cleaning method according to any one of claims 10 to 13, comprising:
In the abutting step, the plurality of abutting members abut on different regions of the edge portion of the substrate, respectively. The substrate cleaning method according to claim 14, comprising:
The plurality of contact members are:
A first contact member that contacts one inclined surface of the edge portion of the substrate;
A second contact member that contacts the top of the edge portion of the substrate;
A third contact member that contacts the other inclined surface of the edge portion of the substrate;
A substrate cleaning method comprising: A substrate cleaning method according to any one of claims 10 to 15,
A photographing step of photographing a contact surface of the contact member;
A dirt detecting step for detecting dirt attached to the contact member based on the image data acquired in the photographing step;
A substrate cleaning method, further comprising: The substrate cleaning method according to claim 16, comprising:
In the contact step, the contact position of the contact member with respect to the edge portion of the substrate is changed based on the detection result of the dirt detection step. A substrate cleaning method according to any one of claims 10 to 17,
The substrate is a circular substrate,
In the relative movement step, a substrate cleaning method, wherein the edge portion of the substrate and the contact member are relatively moved by rotating the substrate around a central axis.

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