WO2019216314A1 - Substrate treatment system and substrate treatment method - Google Patents

Abstract

A substrate treatment system for processing a processed surface of a substrate, the substrate treatment system comprising: a holding step in which the processed surface is held by a conveying holding unit against the substrate, on which a non-processed surface is held by a processing holding unit; a subsequent liquid supply step in which a liquid is supplied from a liquid supply unit between the holding surface of the processing holding unit and the non-processed surface of the substrate; a subsequent raising step in which the substrate that is held by the conveying holding unit is raised by a movement mechanism to a height at which the liquid is not separated from the substrate; and a subsequent movement step in which the substrate held by the conveying unit is moved in a horizontal direction by the movement mechanism, in a state in which the liquid is contacting the substrate.

Description

Substrate processing system and substrate processing method

(Cross-reference of related applications)
This application claims priority based on Japanese Patent Application No. 2018-92361 for which it applied to Japan on May 11, 2018, and uses the content here.

The present disclosure relates to a substrate processing system and a substrate processing method.

Patent Document 1 discloses a conveying method for conveying a brittle workpiece after grinding. The conveying method includes an adhesion release step and an unloading step. In the close contact releasing step, fluid is ejected from the holding surface of the chuck table, and the brittle workpiece sucked and held by the conveying means is separated from the chuck table at a first speed. In the unloading step, following the execution of the close contact releasing step, the conveying means is separated from the chuck table at a second speed higher than the first speed, and the brittle workpiece is unloaded from the chuck table.

Japanese Unexamined Patent Publication No. 2013-145776

The technique according to the present disclosure appropriately transports a substrate in a substrate processing system that processes a processed surface of the substrate.

One aspect of the present disclosure is a substrate processing system that processes a processed surface of a substrate, and holds the non-processed surface opposite to the processed surface of the substrate when the processed surface of the substrate is processed. A liquid supply unit that supplies a liquid to the holding surface of the processing holding unit, a transfer holding unit that holds the processed surface of the substrate when the substrate is transferred, and the transfer holding unit A moving mechanism that moves in a direction and a vertical direction, and a processing control unit that controls the processing holding unit, the liquid supply unit, the transport holding unit, and the moving mechanism. A holding step of holding the processed surface by the holding unit for conveyance with respect to the substrate on which the non-processed surface is held by the holding unit, and then the holding surface of the processing holding unit from the liquid supply unit A liquid supply step of supplying a liquid between the processing surface, and then the liquid is The ascending step of ascending the substrate held by the transfer holding unit by the moving mechanism to a height that does not separate from the plate, and then the transfer holding by the moving mechanism in a state where the liquid is in contact with the substrate. And a moving step of moving the substrate held by the part in the horizontal direction.

According to one aspect of the present disclosure, a substrate can be appropriately transported in a substrate processing system that processes a processed surface of a substrate.

It is a top view showing typically the outline of the composition of the substrate processing system concerning this embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the process holding part. It is a side view which shows the outline of a structure of the holding part for conveyance. It is a top view which shows the outline of a structure of a 2nd washing | cleaning unit. It is a flowchart which shows the main processes of a board | substrate process. It is explanatory drawing which shows a mode that a conveyance unit receives a board | substrate from a delivery position. It is explanatory drawing which shows a mode that the non-processed surface of a board | substrate is wash | cleaned with a 2nd washing | cleaning unit. It is explanatory drawing which shows a mode that the height of a board | substrate is adjusted in other embodiment, and the non-processed surface of the said board | substrate is wash | cleaned. It is explanatory drawing which shows a mode that the non-processed surface of a board | substrate is wash | cleaned by the 2nd washing | cleaning unit in other embodiment. It is explanatory drawing which shows a mode that the height of a board | substrate is adjusted in other embodiment, and the non-processed surface of the said board | substrate is wash | cleaned.

In the manufacturing process of a semiconductor device, a back surface of the substrate is ground to a semiconductor substrate (hereinafter referred to as a substrate) on which a plurality of devices such as electronic circuits are formed on the surface, thereby thinning the substrate. ing.

Patent Document 1 described above discloses a method for conveying a brittle workpiece (substrate) after grinding. Specifically, first, the first surface of the brittle workpiece held on the chuck table is ground with a grinding wheel to thin the brittle workpiece to a predetermined thickness. Here, since the thin brittle workpiece is brittle, it may be damaged when it is unloaded from the chuck table. Therefore, in the method disclosed in Patent Document 1, the contact release step and the carry-out step described above are performed. That is, a fluid, a mixed fluid of pure water and air is ejected from the holding surface of the chuck table, and the brittle workpiece is separated from the chuck table at a two-stage speed. Thereby, it is aimed to suppress damage to the brittle workpiece during unloading.

However, in the method disclosed in Patent Document 1, since a mixed fluid of pure water and air is supplied to the holding surface of the chuck table, a pure water film is formed between the chuck table and the brittle workpiece. Then, since tension acts on the interface between the water film and the brittle workpiece, the brittle workpiece may still be damaged when it is unloaded from the chuck table. In addition, the brittle workpiece may be peeled off from the conveying means.

Therefore, the technology according to the present disclosure suppresses the substrate from being damaged and appropriately conveys the substrate. Hereinafter, a substrate processing system and a substrate processing method according to the present embodiment will be described with reference to the drawings. In the present specification and drawings, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

First, the configuration of the substrate processing system according to the present embodiment will be described. FIG. 1 is a plan view schematically showing the outline of the configuration of the substrate processing system 1.

In the substrate processing system 1 of the present embodiment, the substrate W is thinned. The substrate W is a semiconductor wafer such as a silicon wafer or a compound semiconductor wafer. A device (not shown) is formed on the surface of the substrate W (hereinafter referred to as a non-processed surface Wn), and a protective material for protecting the device, for example, a protective tape (not shown) is further provided on the surface. It is pasted. Then, a predetermined processing such as grinding is performed on the back surface of the substrate W (hereinafter referred to as a processing surface Wg), and the substrate is thinned.

The substrate processing system 1 has a configuration in which a carry-in station 2, a carry-out station 3, a processing apparatus 4, a post-processing apparatus 5, and a transfer station 6 are connected. The carry-in station 2 stores the substrate W before processing in the cassette C, and carries a plurality of substrates W into the substrate processing system 1 from the outside in units of cassettes. The unloading station 3 stores the processed substrates W in the cassette C, and unloads a plurality of substrates W from the substrate processing system 1 to the outside in units of cassettes. The processing apparatus 4 thins the substrate W by processing it. The post-processing apparatus 5 performs post-processing of the substrate W after processing. The transfer station 6 transfers the substrate W among the carry-in station 2, the processing apparatus 4 and the post-processing apparatus 5. The carry-in station 2, the transfer station 6, and the processing device 4 are arranged in this order in the Y-axis direction on the X-axis negative direction side. The carry-out station 3 and the post-processing device 5 are arranged in this order in the Y-axis direction on the X-axis positive direction side.

The loading station 2 is provided with a cassette mounting table 10. In the illustrated example, a plurality of, for example, two cassettes C can be placed on the cassette mounting table 10 in a line in the X-axis direction.

The carry-out station 3 has the same configuration as the carry-in station 2. The unloading station 3 is provided with a cassette mounting table 20. For example, two cassettes C can be mounted in a row in the X-axis direction on the cassette mounting table 20. The carry-in station 2 and the carry-out station 3 may be integrated into one carry-in / out station. In such a case, a common cassette mounting table is provided in the carry-in / out station.

In the processing apparatus 4, processing such as grinding or cleaning is performed on the substrate W. The configuration of the processing device 4 will be described later.

In the post-processing apparatus 5, post-processing is performed on the substrate W processed by the processing apparatus 4. As the post-processing, for example, a mounting process for holding the substrate W on the dicing frame via a dicing tape, a peeling process for peeling the protective tape attached to the substrate W, and the like are performed. Then, the post-processing apparatus 5 transports the substrate W that has been post-processed and held on the dicing frame to the cassette C of the unloading station 3. A known apparatus is used for each of the mounting process and the peeling process performed by the post-processing apparatus 5.

The transfer station 6 is provided with a substrate transfer area 30. A substrate transfer device 32 is provided in the substrate transfer region 30 and is movable on a transfer path 31 extending in the X-axis direction. The substrate transfer device 32 includes a transfer fork 33 and a transfer pad 34 as a substrate holding unit that holds the substrate W. The transport fork 33 has its tip branched into two to hold the substrate W by suction. The transport fork 33 transports the substrate W before the grinding process. The transport pad 34 has a circular shape with a diameter longer than the diameter of the substrate W in plan view, and holds the substrate W by suction. The transport pad 34 transports the substrate W after the grinding process. The transport fork 33 and the transport pad 34 are configured to be movable in the horizontal direction, the vertical direction, the horizontal axis, and the vertical axis, respectively.

The substrate processing system 1 is provided with a control unit 40. The control unit 40 is a computer, for example, and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of the substrate W in the substrate processing system 1. The program storage unit also stores a program for controlling the operation of drive systems such as the above-described various processing apparatuses and transfer apparatuses to realize substrate processing described later in the substrate processing system 1. The program may be recorded on a computer-readable storage medium H and may be installed in the control unit 40 from the storage medium H.

Next, the configuration of the processing apparatus 4 described above will be described. The processing apparatus 4 includes a rotary table 100, a transport unit 110, an alignment unit 120, a first cleaning unit 130, a second cleaning unit 140, a rough grinding unit 150, a middle grinding unit 160, and a finish grinding unit 170. Yes.

The rotary table 100 is configured to be rotatable by a rotation mechanism (not shown). On the turntable 100, four processing holding portions 101 that hold the non-processed surface Wn of the substrate W by suction are provided. The processing holding portions 101 are arranged on the same circumference as the rotary table 100, that is, every 90 degrees. The four processing holders 101 are movable to the delivery position A0 and the processing positions A1 to A3 as the turntable 100 rotates.

In this embodiment, the delivery position A0 is a position on the X-axis positive direction side and the Y-axis negative direction side of the turntable 100, and the second cleaning unit 140, alignment is on the Y-axis negative direction side of the delivery position A0. The unit 120 and the first cleaning unit 130 are arranged side by side. The alignment unit 120 and the first cleaning unit 130 are stacked in this order from above. The first machining position A1 is a position on the X-axis positive direction side and the Y-axis positive direction side of the turntable 100, and the rough grinding unit 150 is disposed. The second machining position A2 is a position on the X-axis negative direction side and the Y-axis positive direction side of the turntable 100, and the intermediate grinding unit 160 is disposed. The third machining position A3 is a position on the X-axis negative direction side and the Y-axis negative direction side of the turntable 100, and the finish grinding unit 170 is disposed.

As shown in FIG. 2, the processing holding portion 101 is held on a holding portion base 102. The processing holder 101 and the holder base 102 are configured to be rotatable by a rotation mechanism 103. The rotation mechanism 103 is provided, for example, through a through hole 100a formed in the turntable 100.

The processing holding unit 101 is connected to a supply pipe 104 that supplies at least a liquid or a gas to the holding surface 101 a of the substrate W of the processing holding unit 101. The supply pipe 104 is connected to the processing holding unit 101 through the inside of the rotation mechanism 103. The supply pipe 104 is connected to each of the four processing holding portions 101. Each supply pipe 104 is provided with a valve 104 a that controls supply of liquid or gas to each processing holding unit 101. Further, the supply pipe 104 is branched into a liquid supply pipe 104b and a gas supply pipe 104c on the downstream side. A liquid supply unit 105 is connected to the liquid supply pipe 104b. The liquid supply unit 105 stores a liquid, for example, pure water, and supplies the liquid to the holding surface 101a. A gas supply unit 106 is connected to the gas supply pipe 104c. The gas supply unit 106 stores a gas, for example, air or an inert gas, and supplies the gas to the holding surface 101a.

For example, a porous chuck is used for the processing holding portion 101. A suction tube 107 for sucking the substrate W is connected to the processing holding unit 101 in order to suck and hold the substrate W by the holding surface 101a. The suction tube 107 is connected to the processing holding portion 101 through the inside of the rotation mechanism 103. Further, the suction tube 107 is connected to each of the four processing holding portions 101. Each suction tube 107 is provided with a valve 107 a that controls suction in each processing holding portion 101. A suction device 108 for sucking the substrate W is connected to the suction tube 107. In order to prevent the porous chuck from being clogged, the liquid is supplied from the liquid supply unit 105 when the substrate W is not held by the processing holding unit 101.

In this embodiment, the supply pipe 104 common to the liquid supply unit 105 and the gas supply unit 106 is used. However, the liquid supply pipe 104b and the gas supply pipe 104c may be directly connected to the processing holding unit 101, respectively. Good. In such a case, a valve (not shown) is provided in each of the liquid supply pipe 104b and the gas supply pipe 104c. Further, in this embodiment, the common liquid supply unit 105 and the gas supply unit 106 are provided in the four processing holding units 101, but the liquid supply unit 105 and the gas supply unit 106 are individually provided for each processing holding unit 101. Each may be provided.

As shown in FIG. 1, the transport unit 110 is an articulated robot including a plurality of, for example, three arms 111-113. The three arms 111 to 113 are connected by joint portions (not shown). With these joint portions, of the three arms 111 to 113, the first arm 111 at the distal end and the second arm 112 in the middle are each configured to be pivotable about the proximal end portion. The third arm 113 at the base end is attached to a moving mechanism 114 that moves the arms 111 to 113 in the vertical direction. With this configuration, a transfer holding unit 115 that holds and holds a substrate W described later is movable in the horizontal direction and the vertical direction.

The first arm 111 is provided with a transport holding unit 115 that holds the substrate W by suction. For example, a porous chuck is used for the conveyance holding unit 115. As shown in FIG. 3, the transfer holder 115 has a circular shape having a diameter longer than the diameter of the substrate W in plan view. The transport holding unit 115 sucks and holds the entire processing surface Wg of the substrate W on the holding surface 115a. Further, the transport holding unit 115 is configured to be rotatable by a rotation mechanism 111 a provided on the first arm 111.

Between the first arm 111 and the conveyance holder 115, a tilting mechanism 116 and an elastic member 117 are provided via a support plate 118. The tilt mechanism 116 is provided between the first arm 111 and the support plate 118. The elastic member 117 is provided between the conveyance holding portion 115 and the support plate 118.

The tilt mechanism 116 makes the transport holding portion 115 tiltable in a side view. Although the configuration of the tilt mechanism 116 is arbitrary, for example, the tilt mechanism 116 includes a biasing member (not shown) that biases the support plate 118 (the transport holding portion 115) in the separation direction with respect to the first arm 111. With this tilting mechanism 116, for example, when the transport holding unit 115 receives the substrate W, the transport holding unit 115 can be tilted along the tilt even if the substrate W is not flat (horizontal). Further, for example, when the transport holding unit 115 delivers the substrate W, the transport holding unit 115 can be tilted along the tilt even if the delivery destination is not flat (horizontal). Thus, the substrate W can be appropriately received (delivered) by tilting the transport holding portion 115. Note that the tilting mechanism 116 may further include a mechanism for fixing the conveyance holding portion 115. In such a case, the transfer holding unit 115 can be fixed during transfer of the substrate W. As a result, the substrate W can be received (delivered) and transported appropriately.

A plurality of elastic members 117 are provided, for example, on the outer circumference of the conveyance holder 115 and on the concentric circles of the conveyance holder 115. The elastic member 117 is not particularly limited as long as it has elasticity. For example, a spring is used. The elastic member 117 can absorb the impact when the holding unit 115 for transport receives or transfers the substrate W, for example. As a result, it is possible to avoid a strong pressing force acting on the substrate W held by the transfer holding unit 115.

The transport unit 110 having the above configuration can transport the substrate W to the delivery position A0, the alignment unit 120, the first cleaning unit 130, and the second cleaning unit 140.

As shown in FIG. 1, the alignment unit 120 adjusts the horizontal direction of the substrate W before the grinding process. For example, the position of the notch portion of the substrate W is detected by a detection unit (not shown) while rotating the substrate W held by a spin chuck (not shown), thereby adjusting the position of the notch portion and the substrate. Adjust the horizontal direction of W.

In the first cleaning unit 130, the processed surface Wg of the substrate W after the grinding process is cleaned, more specifically, spin cleaning. For example, the cleaning liquid is supplied from the cleaning liquid nozzle (not shown) to the processing surface Wg of the substrate W while rotating the substrate W held on the spin chuck (not shown). Then, the supplied cleaning liquid diffuses on the processing surface Wg, and the processing surface Wg is cleaned.

The second cleaning unit 140 cleans the non-processed surface Wn of the substrate W that has been ground and is held by the transfer holding unit 115 of the transfer unit 110 and holds the holding surface of the transfer holding unit 115. 115a is washed. The non-processed surface Wn and the holding surface 115a are cleaning surfaces cleaned by the second cleaning unit 140. As shown in FIG. 4, the second cleaning unit 140 has a processing container 141. Inside the processing container 141, a sponge cleaning tool 142 having a cleaning liquid nozzle, an air nozzle 143, a stone cleaning tool 144 (grinding stone), and a brush cleaning tool 145 are provided. Each of the sponge cleaning tool 142, the air nozzle 143, the stone cleaning tool 144, and the brush cleaning tool 145 is configured to be movable in the vertical direction by an elevating mechanism (not shown).

The sponge cleaning tool 142 has, for example, a sponge extending longer than the diameter of the substrate W, and a cleaning liquid such as pure water can be supplied to the sponge to clean the non-processed surface Wn. The air nozzle 143 sprays air onto the non-processed surface Wn of the substrate W to dry the non-processed surface Wn. The cleaning of the non-processed surface Wn with the sponge and the cleaning liquid and the drying of the non-processed surface Wn with air are performed in a state where the substrate W is held by the transfer holding unit 115 and the transfer holding unit 115 (substrate W ) While rotating. Thereby, the entire non-processed surface Wn of the substrate W is cleaned.

Each of the stone cleaning tool 144 and the brush cleaning tool 145 extends, for example, longer than the diameter of the holding surface 115a of the transfer holding unit 115 of the transfer unit 110, and abuts on the holding surface 115a for cleaning. The cleaning of the transport holding unit 115 by the stone cleaning tool 144 and the brush cleaning tool 145 is performed while rotating the transport holding unit 115 by the rotation mechanism 111a. As a result, the entire holding surface 115a of the transfer holding unit 115 is cleaned.

As shown in FIG. 1, in the rough grinding unit 150, the processed surface Wg of the substrate W is roughly ground. The rough grinding unit 150 includes a rough grinding portion 151 having a circular grinding wheel (not shown) that is rotatable in an annular shape. The rough grinding portion 151 is configured to be movable in the vertical direction and the horizontal direction along the support column 152. Then, the processing surface of the substrate W is rotated by rotating the processing holding portion 101 and the rough grinding wheel while the processing surface Wg of the substrate W held by the processing holding portion 101 is in contact with the rough grinding wheel. Roughly grind Wg.

In the middle grinding unit 160, the processing surface Wg of the substrate W is ground. The intermediate grinding unit 160 has an intermediate grinding part 161 provided with an annular grinding wheel (not shown) that is rotatable. Further, the intermediate grinding portion 161 is configured to be movable in the vertical direction and the horizontal direction along the support column 162. The grain size of the medium grinding wheel is smaller than the grain size of the coarse grinding wheel. Then, while the processing surface Wg of the substrate W held by the processing holding unit 101 is in contact with the intermediate grinding wheel, the processing holding unit 101 and the intermediate grinding wheel are rotated, so that the processing surface Wg is set to the middle. Grind.

The finish grinding unit 170 finish-grinds the processed surface Wg of the substrate W. The finish grinding unit 170 has a finish grinding portion 171 provided with a finish grinding wheel (not shown) that is annular and rotatable. Further, the finish grinding part 171 is configured to be movable in the vertical direction and the horizontal direction along the support column 172. The grain size of the finish grinding wheel is smaller than the grain size of the medium grinding wheel. Then, the processing surface Wg is finished by rotating the processing holding portion 101 and the finishing grinding wheel while the processing surface Wg of the substrate W held by the processing holding portion 101 is in contact with the finishing grinding wheel. Grind.

Next, substrate processing performed using the substrate processing system 1 configured as described above will be described.

First, a cassette C storing a plurality of substrates W is placed on the cassette placement table 10 of the carry-in station 2. In the cassette C, in order to suppress the deformation of the protective tape, the substrate W is stored so that the non-processed surface Wn of the substrate W to which the protective tape is attached faces upward.

Next, the substrate W in the cassette C is taken out by the transfer fork 33 of the substrate transfer device 32 and transferred to the processing device 4. At this time, the front and back surfaces are reversed so that the processing surface Wg of the substrate W faces upward by the transport fork 33.

The substrate W transferred to the processing apparatus 4 is transferred to the alignment unit 120. In the alignment unit 120, the horizontal direction of the substrate W is adjusted (step S1 in FIG. 5).

Next, the substrate W is transported from the alignment unit 120 to the delivery position A0 by the transport unit 110, and is delivered to the processing holding unit 101 at the delivery position A0. In the processing holder 101, the non-processed surface Wn of the substrate W is held. Further, when the transport holder 115 receives the substrate W from the alignment unit 120 and when the substrate W is transferred to the processing holder 101, the tilt mechanism 116 makes the transport holder 115 tiltable. Further, when the substrate W is received and delivered, the elastic member 117 absorbs the impact. Thereby, the reception and delivery of the substrate W can be performed appropriately.

Next, the processing holder 101 is moved to the first processing position A1. Then, the processed surface Wg of the substrate W is roughly ground by the rough grinding unit 150 (step S2 in FIG. 5).

Next, the processing holding portion 101 is moved to the second processing position A2. Then, the processing surface Wg of the substrate W is subjected to intermediate grinding by the intermediate grinding unit 160 (step S3 in FIG. 5).

Next, the processing holding portion 101 is moved to the third processing position A3. Then, the processed surface Wg of the substrate W is finish-ground by the finish grinding unit 170 (step S4 in FIG. 5).

Next, the processing holder 101 is moved to the delivery position A0. Here, the processing surface Wg of the substrate W is roughly cleaned with the cleaning liquid using a cleaning liquid nozzle (not shown) (step S5 in FIG. 5). In step S5, cleaning is performed to remove dirt on the processed surface Wg to some extent.

Next, the substrate W is transported from the delivery position A0 to the second cleaning unit 140 by the transport unit 110 (step S6 in FIG. 5). Here, a method in which the transport unit 110 receives the substrate W from the delivery position A0 in step S6 will be described.

First, as shown in FIG. 6A, the transfer holding unit 115 of the transfer unit 110 is moved above the substrate W sucked and held by the processing holding unit 101 and arranged to face the substrate W.

Thereafter, as shown in FIG. 6B, the transport holding unit 115 is lowered, and the processing surface Wg of the substrate W is sucked and held by the transport holding unit 115. At this time, the holding mechanism 115 for conveyance is made tiltable by the tilt mechanism 116. Furthermore, the elastic member 117 absorbs the impact when the substrate W is sucked and held. Thereby, the adsorption | suction holding | maintenance of the board | substrate W can be performed appropriately. The process shown in FIG. 6B may be referred to as a holding process. Further, in this holding step, when the substrate W is sucked and held by the transfer holding unit 115, the processing holding unit 101 sucks and holds the substrate W at any timing before gas is supplied from the gas supply unit 106 described later. To release.

Then, as shown in FIG. 6C, gas is supplied from the gas supply unit 106 between the holding surface 101a of the processing holding unit 101 and the non-processed surface Wn of the substrate W. With this gas, the substrate W is peeled from the processing holder 101. Here, as described above, the liquid is supplied from the liquid supply unit 105 in a state where the substrate W is not held by the processing holding unit 101. Then, the liquid remains in the supply pipe 104, and the liquid is supplied together with the supply of gas. A film of the liquid L is formed between the holding surface 101 a of the processing holding unit 101 and the non-processed surface Wn of the substrate W. The process shown in FIG. 6C may be referred to as a liquid supply process. In the present embodiment, the liquid L is supplied between the holding surface 101a of the processing holding unit 101 and the non-processed surface Wn of the substrate W by supplying gas from the gas supply unit 106. The liquid may be supplied from 105.

Thereafter, as shown in FIG. 6C, the substrate W held by the transfer holding unit 115 is raised to a height at which the liquid L is not separated from the substrate W. Note that the process shown in FIG. 6C may be referred to as an ascending process.

Thereafter, as shown in FIG. 6D, the substrate W held by the transfer holding unit 115 is moved in the horizontal direction while the liquid L is in contact with the substrate W. If it does so, the contact area of the board | substrate W and the liquid L will become small. Further, there is a case where a minute air space is formed between the substrate W and the liquid L by the horizontal movement of the substrate W. Further, when the outer peripheral portion of the substrate W is positioned outside the processing holding unit 101 in plan view, the liquid L may be discharged from the outside of the processing holding unit 101. Due to these various factors, the tension generated at the interface between the substrate W and the liquid L can be reduced. The process shown in FIG. 6D may be referred to as a movement process.

Thereafter, as shown in FIG. 6E, when the outer peripheral portion of the substrate W is positioned outside the processing holding portion 101 in plan view, the substrate W held by the transfer holding portion 115 is raised. Then, the substrate W is separated from the liquid L. At this time, since the interface tension is small as described above, it is possible to suppress the substrate W from being damaged as in the prior art. Further, it is possible to prevent the substrate W from being peeled off from the transfer holding portion 115 as in the past.

Note that the timing of raising the substrate W is not limited to this embodiment. For example, the substrate W may be raised when the substrate W moves in the horizontal direction and the entire substrate W is positioned outside the processing holder 101 in plan view.

In the present embodiment, the substrate W is moved up in the horizontal direction and then raised, but the substrate W may be moved obliquely upward. That is, the moving process shown in FIG. 6 (d) and the ascending process shown in FIG. 6 (e) may be performed simultaneously.

Further, for example, when there is sufficient space in the horizontal direction, the substrate W may be separated from the liquid L only by moving in the horizontal direction without raising the substrate W.

As described above, in step S6, the transport unit 110 receives the substrate W from the delivery position A0, and the substrate is transported from the delivery position A0 to the second cleaning unit 140.

Then, in the second cleaning unit 140, the non-processed surface Wn of the substrate W is cleaned by the sponge cleaning tool 142 in a state where the substrate W is rotated and held by the transport holding unit 115 by the rotation mechanism 111a as shown in FIG. (Step S7 in FIG. 5). After that, in a state where the substrate W is rotated and held by the transfer holder 115, air is jetted from the air nozzle 143 to the non-processed surface Wn, and the non-processed surface Wn is dried.

Before the substrate W is held by the transfer holding unit 115 in these steps S6 and S7, the transfer holding unit 115 is cleaned using the stone cleaning tool 144 and the brush cleaning tool 145 of the second cleaning unit 140. . (Step T1 in FIG. 5). The conveyance holder 115 is cleaned by the stone cleaner 144 and the brush cleaner 145 while rotating the conveyance holder 115 by the rotation mechanism 111a. The conveyance holding unit 115 may be cleaned by either one of the stone cleaning tool 144 and the brush cleaning tool 145 or by both. In addition, the transport holding unit 115 is cleaned at an arbitrary timing up to step S6.

Next, the substrate W is transported from the second cleaning unit 140 to the first cleaning unit 130 by the transport unit 110. When the substrate W is transferred from the transport holding unit 115 to the spin chuck (not shown) of the first cleaning unit 130, the tilting mechanism 116 makes the transport holding unit 115 tiltable. Further, the elastic member 117 absorbs an impact when the substrate W is delivered. Thereby, the delivery of the board | substrate W can be performed appropriately. In the first cleaning unit 130, the processed surface Wg of the substrate W is finished and cleaned with the cleaning liquid using a cleaning liquid nozzle (not shown) (step S8 in FIG. 5). In step S8, the processed surface Wg is washed to a desired cleanliness and dried.

Thereafter, the substrate W is transported from the first cleaning unit 130 to the post-processing device 5 by the substrate transport device 32. Then, the post-processing apparatus 5 performs post-processing such as mounting processing for holding the substrate W on the dicing frame and peeling processing for peeling the protective tape attached to the substrate W (step S9 in FIG. 5).

Thereafter, the substrate W that has been subjected to all the processes is transferred to the cassette C of the cassette mounting table 20 of the unloading station 3. Thus, a series of substrate processing in the substrate processing system 1 is completed.

As described above, according to the present embodiment, the substrate processing system 1 that processes the substrate W holds the non-processed surface Wn opposite to the processed surface Wg of the substrate W when processing the processed surface Wg of the substrate W. The processing holding unit 101, the liquid supply unit 105 that supplies a liquid to the holding surface 101a of the processing holding unit 101, and the transfer holding unit 115 that holds the processing surface Wg of the substrate W when the substrate W is transferred. And a moving mechanism 114 (111 to 113) for moving the transport holding unit 115 in the horizontal and vertical directions, a processing holding unit 101, a liquid supply unit 105, a transport holding unit 115, and a moving mechanism 114 (111 to 113). And a control unit 40 for controlling). Further, the substrate processing method in the substrate processing system 1 includes a holding step of holding the processed surface Wg by the transfer holding unit 115 with respect to the substrate W on which the non-processed surface Wn is held by the processing holding unit 101 (FIG. 6 ( b)), and thereafter, a liquid supply step of supplying the liquid L between the holding surface 101a of the processing holding unit 101 and the non-processed surface Wn of the substrate W from the liquid supply unit 105 (FIG. 6C), and thereafter An ascending step of raising the substrate W held by the transfer holder 115 by the moving mechanism 114 to a height at which the liquid L is not separated from the substrate W (FIG. 6C), and then the liquid L contacts the substrate W. In this state, there is a moving step (FIG. 6D) of moving the substrate W held by the transfer holding unit 115 in the horizontal direction by the moving mechanism. Thereby, the tension generated at the interface between the substrate W and the liquid L can be reduced, and the substrate W can be prevented from being damaged. In addition, in the present embodiment, it is not necessary to provide a special structure or mechanism, and the above-described effects can be enjoyed only by changing the operation path.

Further, according to the present embodiment, when the outer peripheral portion of the substrate W is positioned outside the processing holding portion 101 in a plan view in the moving step shown in FIG. In this way, the substrate W held by the transfer holding unit 115 is raised by the moving mechanism 114. Alternatively, in the movement step shown in FIG. 6D, when the entire substrate W is positioned outside the processing holding portion 101 in a plan view, it is transferred by the movement mechanism 114 as shown in FIG. The substrate W held by the holding unit 115 is raised. In either case, the tension generated at the interface between the substrate W and the liquid L can be reduced.

Further, according to the present embodiment, when the outer peripheral portion of the substrate W is positioned outside the processing holding portion 101 in plan view in the moving step shown in FIG. It is discharged from the outside. Thereby, the tension generated at the interface between the substrate W and the liquid L can be further reduced.

Further, according to the present embodiment, the substrate processing system 1 includes the gas supply unit 106 that supplies gas to the holding surface 101 a of the processing holding unit 101. 6C, a gas is supplied from the gas supply unit 106 between the holding surface 101a of the processing holding unit 101 and the non-processed surface Wn of the substrate W. Thereby, the board | substrate W can be appropriately peeled from the holding part 101 for a process.

Further, according to the present embodiment, the substrate processing system 1 includes the tilt mechanism 116 that allows the transport holding unit 115 to tilt in a side view, and the elastic member 117 provided on the transport holding unit 115. The tilting mechanism 116 can tilt the transport holding unit 115 when the transport holding unit 115 receives or transfers the substrate W. Further, the elastic member 117 can absorb the impact when the transport holding unit 115 receives or transfers the substrate W. As a result, the substrate W can be appropriately received (delivered).

In the moving step shown in FIG. 6D in step S6 of the present embodiment, the processing holding unit 101 is rotated by a rotating mechanism (not shown), and the conveying holding unit 115 is moved by the rotating mechanism 111a. The substrate W held by the transfer holding unit 115 may be moved in the horizontal direction by the moving mechanism while being rotated. By rotating the processing holding unit 101 and the conveyance holding unit 115 in this manner, the tension generated at the interface between the substrate W and the liquid L can be further reduced. Any one of the processing holding unit 101 and the conveyance holding unit 115 may be rotated, that is, the processing holding unit 101 and the conveyance holding unit 115 may be relatively rotated.

In the second cleaning unit 140 of the above embodiment, the transport holder 115 is reciprocated in the horizontal direction by the moving mechanism in a state where the sponge cleaning tool 142 is in contact with the non-processed surface Wn of the substrate W in step S7. The non-processed surface Wn may be cleaned by moving. Similarly, in step T1, in a state where the stone cleaning tool 144 or the brush cleaning tool 145 is in contact with the holding surface 115a, the transfer holding unit 115 is reciprocated in the horizontal direction by the moving mechanism, thereby holding the holding surface 115a. May be washed.

Here, for example, Japanese Patent Application Laid-Open No. 2003-45841 discloses a cleaning device that cleans the suction surface of a suction pad for sucking and conveying a workpiece. The cleaning device includes a grinding plate having a grinding surface for grinding the suction surface, and swing drive means for swinging the grinding plate in a direction in which the grinding surface extends. Then, the suction surface is cleaned by moving the suction surface in a direction substantially orthogonal to the extending direction of the grinding plate while bringing the suction surface into contact with the grinding surface of the grinding plate rocked by the rocking drive means.

However, in the cleaning apparatus disclosed in Japanese Patent Application Laid-Open No. 2003-45841, when the grinding plate is rocked, if the rocking is not constant, the pressure applied to the suction pad by the grinding plate may be uneven in the suction surface. is there. In particular, the suction pad may be provided with an elastic member in order to absorb an impact when sucking the workpiece. Depending on the arrangement of the elastic member, the pressure applied to the suction pad becomes more uneven.

Therefore, in this embodiment, in step S7 or step T1, the pressure applied to the non-processed surface Wn or the holding surface 115a is determined when the transport holding unit 115 is reciprocated to clean the non-processed surface Wn or the holding surface 115a. Keep it constant.

In step S7, in the second cleaning unit 140, with the sponge cleaning tool 142 in contact with the non-processed surface Wn of the substrate W as shown in FIG. The non-processed surface Wn is cleaned by reciprocating. In FIG. 8, (a) shows a state where the sponge cleaning tool 142 contacts the central portion of the substrate W. The position of the center portion of the substrate W at this time is referred to as a center position A. (B) and (c) show how the sponge cleaning tool 142 abuts on the outer periphery of the substrate W, respectively. The position of the central portion of the substrate W at this time is referred to as center positions B and C. In (d), the movement of the central part of the non-processed surface Wn of the substrate W is schematically shown together with its height position.

When the elastic member 117 is provided on the outer peripheral portion of the transport holding portion 115 as in the present embodiment, the pressure applied to the substrate W when the sponge cleaning tool 142 contacts the outer peripheral portion of the substrate W is the central portion of the substrate W. It becomes larger than the pressure applied to. Therefore, as shown in FIG. 8, the height position of the non-processed surface Wn of the substrate W at the center positions B and C is set higher than the height position of the non-processed surface Wn of the substrate W at the center position A. The adjustment of the height position is performed, for example, by moving the conveyance holder 115 in the vertical direction by the moving mechanism 114.

In this case, the pressure applied to the non-processed surface Wn of the substrate W when the sponge cleaning tool 142 contacts the outer peripheral portion of the substrate W can be reduced. As a result, the pressure applied to the non-processed surface Wn can be made constant within the surface, and damage to the substrate W due to pressure nonuniformity can be suppressed. Further, by reducing the pressure applied to the outer peripheral portion of the substrate W in this way, it is possible to further suppress the outer peripheral portion of the substrate W from being damaged. In addition, in the present embodiment, it is not necessary to provide a special structure or mechanism, and the above-described effects can be enjoyed only by changing the operation path.

The same applies when the second cleaning unit 140 cleans the holding surface 115a of the transport holding unit 115 in step T1. In step T1, with the stone cleaning tool 144 or the brush cleaning tool 145 in contact with the holding surface 115a, the transfer holding unit 115 is reciprocated in the horizontal direction by the moving mechanism to clean the holding surface 115a. Then, as shown in FIG. 8, the height position of the holding surface 115a at the center positions B and C is set higher than the height position of the holding surface 115a at the center position A. If it does so, the pressure concerning the holding surface 115a can be made constant within a surface, and the said holding surface 115a can be wash | cleaned appropriately.

In the above embodiment, the elastic member 117 is provided on the outer peripheral portion of the conveyance holding portion 115, but the arrangement of the elastic member 117 is arbitrary. For example, as shown in FIG. 9, the elastic member 117 may be provided at the center of the transport holding portion 115. Then, in step S7, with the sponge cleaning tool 142 in contact with the non-processed surface Wn of the substrate W as shown in FIG. The surface Wn may be cleaned. In FIG. 10, (a) shows a state where the sponge cleaning tool 142 is in contact with the center of the substrate W. The position of the center portion of the substrate W at this time is referred to as a center position A. (B) and (c) show how the sponge cleaning tool 142 abuts on the outer periphery of the substrate W, respectively. The position of the central portion of the substrate W at this time is referred to as center positions B and C. In (d), the movement of the central part of the non-processed surface Wn of the substrate W is schematically shown together with its height position.

When the elastic member 117 is provided in the central portion of the transport holding portion 115 as in the present embodiment, the pressure applied to the substrate W when the sponge cleaning tool 142 contacts the outer peripheral portion of the substrate W is the central portion of the substrate W. It becomes smaller than the pressure applied to. Therefore, as shown in FIG. 10, the height position of the non-processed surface Wn of the substrate W at the center position A is set higher than the height position of the non-processed surface Wn of the substrate W at the center positions B and C.

In this case, the pressure applied to the non-processed surface Wn of the substrate W when the sponge cleaning tool 142 contacts the outer peripheral portion of the substrate W can be increased. As a result, the pressure applied to the non-processed surface Wn can be made constant within the surface, and damage to the substrate W due to pressure nonuniformity can be suppressed. Further, by increasing the pressure applied to the outer peripheral portion of the substrate W in this way, it is possible to shorten the time required for cleaning as compared with the case where the height of the substrate W is not adjusted.

The same applies when the second cleaning unit 140 cleans the holding surface 115a of the transport holding unit 115 in step T1. In step T1, with the stone cleaning tool 144 or the brush cleaning tool 145 in contact with the holding surface 115a, the transfer holding unit 115 is reciprocated in the horizontal direction by the moving mechanism to clean the holding surface 115a. Then, as shown in FIG. 10, the height position of the holding surface 115a at the center position A is set higher than the height position of the holding surface 115a at the center positions B and C. If it does so, the pressure concerning the holding surface 115a can be made constant in a surface, and also cleaning time can also be shortened.

In the above embodiment, the protective tape is attached to the non-processed surface Wn of the substrate W in order to protect the device, but the protective material of the device is not limited to this. For example, a support substrate such as a support wafer or a glass substrate may be bonded to the non-processed surface Wn of the substrate W. Even in such a case, the present embodiment can be applied.

The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The above-described embodiments may be omitted, replaced, and modified in various forms without departing from the scope and spirit of the appended claims.

DESCRIPTION OF SYMBOLS 1 Substrate processing system 40 Control part 101 Processing holding part 101a Holding surface 105 Liquid supply part 114 Moving mechanism 115 Transfer holding part W Substrate Wg Processing surface Wn Non-processing surface

Claims (18)

1. A substrate processing system for processing a processed surface of a substrate,
   When processing the processed surface of the substrate, a processing holding portion for holding a non-processed surface opposite to the processed surface of the substrate,
   A liquid supply unit for supplying liquid to the holding surface of the processing holding unit;
   A carrier holding unit for holding a processed surface of the substrate when the substrate is conveyed;
   A moving mechanism for moving the holding unit in the horizontal direction and the vertical direction;
   A control unit that controls the processing holding unit, the liquid supply unit, the transfer holding unit, and the moving mechanism;
   The controller is
   A holding step of holding the processed surface by the holding unit for conveyance with respect to the substrate on which the non-processed surface is held by the processing holding unit;
   Then, a liquid supply step of supplying a liquid between the holding surface of the processing holding unit and the non-processed surface of the substrate from the liquid supply unit,
   Thereafter, the ascending step of ascending the substrate held by the transfer holder by the moving mechanism until the liquid does not leave the substrate;
   Thereafter, a moving step of moving the substrate held by the transfer holding unit in the horizontal direction by the moving mechanism while the liquid is in contact with the substrate is performed.
2. The substrate processing system according to claim 1,
   In the moving step, the control unit raises the substrate held by the transfer holding unit by the moving mechanism when the outer peripheral portion of the substrate is positioned outside the processing holding unit in a plan view, The substrate is separated from the liquid.
3. The substrate processing system according to claim 1,
   In the moving step, the control unit raises the substrate held by the transfer holding unit by the moving mechanism when the entire substrate is positioned outside the processing holding unit in a plan view. Is removed from the liquid.
4. The substrate processing system according to claim 1,
   In the moving step, the control unit discharges the liquid from the outside of the processing holding unit when the outer peripheral portion of the substrate is positioned outside the processing holding unit in a plan view.
5. The substrate processing system according to claim 1,
   A gas supply unit for supplying gas to the holding surface of the processing holding unit;
   In the liquid supply step, the control unit supplies gas from the gas supply unit between a holding surface of the processing holding unit and a non-processed surface of the substrate.
6. The substrate processing system according to claim 1,
   A rotation mechanism that relatively rotates the processing holding unit and the conveyance holding unit;
   In the moving step, the control unit horizontally rotates the substrate held on the transfer holding unit by the moving mechanism while relatively rotating the processing holding unit and the transfer holding unit by the rotating mechanism. Move in the direction.
7. The substrate processing system according to claim 1,
   A tilting mechanism for tilting the holding unit for conveyance in a side view;
   And an elastic member provided in the holding unit for conveyance.
8. The substrate processing system according to claim 7, wherein
   A cleaning tool for cleaning the cleaning surface;
   The cleaning surface is a non-processed surface of the substrate or a holding surface of the holding unit for conveyance,
   The elastic member is provided on an outer peripheral portion of the conveyance holding portion,
   The controller is configured to perform a cleaning step of cleaning the cleaning surface by reciprocating the transport holding unit in a horizontal direction by the moving mechanism in a state where the cleaning tool is in contact with the cleaning surface. In the cleaning step, the height position of the cleaning surface when the cleaning tool contacts the outer peripheral portion of the cleaning surface, and the height of the cleaning surface when the cleaning tool contacts the central portion of the cleaning surface Make it higher than the position.
9. The substrate processing system according to claim 7, wherein
   A cleaning tool for cleaning the cleaning surface;
   The cleaning surface is a non-processed surface of the substrate or a holding surface of the holding unit for conveyance,
   The elastic member is provided in a central portion of the holding unit for conveyance,
   The controller is configured to perform a cleaning step of cleaning the cleaning surface by reciprocating the transport holding unit in a horizontal direction by the moving mechanism in a state where the cleaning tool is in contact with the cleaning surface. In the cleaning step, the height position of the cleaning surface when the cleaning tool contacts the center of the cleaning surface, and the height of the cleaning surface when the cleaning tool contacts the outer periphery of the cleaning surface Make it higher than the position.
10. A substrate processing method for processing a processed surface of a substrate using a substrate processing system,
    The substrate processing system includes:
    When processing the processed surface of the substrate, a processing holding portion for holding a non-processed surface opposite to the processed surface of the substrate,
    A liquid supply unit for supplying liquid to the holding surface of the processing holding unit;
    A carrier holding unit for holding a processed surface of the substrate when the substrate is conveyed;
    A moving mechanism for moving the holding unit for conveyance in a horizontal direction and a vertical direction,
    The substrate processing method includes:
    A holding step of holding the processed surface by the holding unit for conveyance with respect to the substrate on which the non-processed surface is held by the processing holding unit;
    Then, a liquid supply step of supplying a liquid between the holding surface of the processing holding unit and the non-processed surface of the substrate from the liquid supply unit,
    Thereafter, the ascending step of ascending the substrate held by the transfer holder by the moving mechanism until the liquid does not leave the substrate;
    And a moving step of moving the substrate held by the transfer holding unit in the horizontal direction by the moving mechanism in a state where the liquid is in contact with the substrate.
11. The substrate processing method according to claim 10,
    In the moving step, when the outer peripheral portion of the substrate is positioned outside the processing holding portion in a plan view, the substrate held by the transfer holding portion is raised by the moving mechanism, and the substrate is moved to the liquid Move away from.
12. The substrate processing method according to claim 10,
    In the moving step, when the entire substrate is positioned outside the processing holding unit in a plan view, the moving mechanism lifts the substrate held by the transfer holding unit and separates the substrate from the liquid. .
13. The substrate processing method according to claim 10,
    In the moving step, when the outer peripheral portion of the substrate is positioned outside the processing holding portion in plan view, the liquid is discharged from the outside of the processing holding portion.
14. The substrate processing method according to claim 10,
    In the liquid supply step, gas is supplied from a gas supply unit between a holding surface of the processing holding unit and a non-processed surface of the substrate.
15. The substrate processing method according to claim 10,
    In the moving step, the substrate held by the transfer holding unit is moved in the horizontal direction by the moving mechanism while the processing holding unit and the transfer holding unit are relatively rotated by a rotation mechanism.
16. The substrate processing method according to claim 10,
    In the holding step, when the processing surface is held by the transfer holding unit, the transfer holding unit is tiltable in a side view by a tilting mechanism, and the elastic member provided in the transfer holding unit absorbs an impact. To do.
17. The substrate processing method according to claim 16, wherein
    In a state where the cleaning tool is in contact with the cleaning surface, the transport mechanism is reciprocated horizontally by the moving mechanism to clean the cleaning surface,
    The cleaning surface is a non-processed surface of the substrate or a holding surface of the holding unit for conveyance,
    The elastic member is provided on an outer peripheral portion of the conveyance holding portion,
    In the cleaning step, the height position of the cleaning surface when the cleaning tool contacts the outer peripheral portion of the cleaning surface, and the height of the cleaning surface when the cleaning tool contacts the central portion of the cleaning surface Make it higher than the position.
18. The substrate processing method according to claim 16, wherein
    In a state where the cleaning tool is in contact with the cleaning surface, the transport mechanism is reciprocated horizontally by the moving mechanism to clean the cleaning surface,
    The cleaning surface is a non-processed surface of the substrate or a holding surface of the holding unit for conveyance,
    The elastic member is provided in a central portion of the holding unit for conveyance,
    In the cleaning step, the height position of the cleaning surface when the cleaning tool contacts the central portion of the cleaning surface, and the height of the cleaning surface when the cleaning tool contacts the outer peripheral portion of the cleaning surface. Make it higher than the position.

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