JP2011091246A - Method of removing plate-like workpiece and processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To properly separate a surface of a plate-like workpiece held on a holding surface of a chuck table. <P>SOLUTION: A processing apparatus has a function to supply a liquid and a gas onto the holding surface 200 of the chuck table 2 that is formed of a porous member and holds the plate-like workpiece W by negative pressure, and also has a transfer mechanism 10 that holds the plate-like workpiece W held on the holding surface 200 from the side face side and carries it out. Using the processing apparatus, a liquid is supplied onto the holding surface 200 to levitate the plate-like workpiece W, and then a gas is supplied onto the holding surface 200 to ease the surface tension of the liquid, and under this state, the plate-like workpiece W is held and lifted to separate it from the holding surface 200. By this method, the plate-like workpiece W can be reliably carried out from the holding surface without being damaged. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method of holding a plate-like workpiece such as a semiconductor wafer held on a chuck table and releasing it from the chuck table, and a processing apparatus using the method.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a semiconductor wafer having a substantially disk shape, and devices such as ICs, LSIs, etc. are partitioned in these partitioned regions. Form. Then, by cutting the semiconductor wafer along the streets, the region where the device is formed is divided to manufacture individual semiconductor chips. In addition, optical device wafers with gallium nitride compound semiconductors laminated on the surface of a sapphire substrate are also divided into optical devices such as individual light-emitting diodes and laser diodes by cutting along the streets and widely used in electrical equipment. Has been. The wafer to be divided as described above is formed to a predetermined thickness by grinding or etching the back surface before cutting along the street. In recent years, it has been required to form a wafer with a thickness of 50 μm or less in order to reduce the weight and size of electrical equipment.

  However, when the thickness of the wafer is reduced to 50 μm or less by grinding or etching, there is a problem that the wafer is easily damaged and handling such as conveyance of the wafer becomes difficult. Therefore, in order to solve such a problem, the present applicant holds the front surface side of the wafer in the chuck table of the grinding apparatus, and grinds only the back side of the device region out of the back surface of the wafer to obtain the thickness of the device region portion. A wafer having a rigidity can be formed by forming an annular reinforcing portion while forming the thickness to a predetermined thickness and maintaining the original thickness without grinding the outer peripheral side thereof. (Patent Document 1) and a transport mechanism therefor have also been proposed (Patent Document 2).

JP 2007-019461 A JP 2007-258450 PR

  However, after the grinding of the back side of the device region is completed, the outer peripheral edge of the plate-like workpiece is disclosed in Patent Document 2 in order to transport the plate-like workpiece formed with the annular reinforcing portion to the next step. Need to hold. For this purpose, the plate-shaped workpiece needs to be separated from the holding surface of the chuck table, and thus the plate-shaped workpiece is separated from the holding surface by supplying gas to the holding surface. , The buoyancy does not work evenly over the entire surface to be held of the plate-like workpiece, and in some cases, the plate-like workpiece is damaged or the transport mechanism cannot properly hold the plate-like workpiece. was there. Such a problem may also occur in a processing apparatus other than the grinding apparatus.

  The present invention has been made in view of these facts, and its main technical problem is to appropriately hold the holding surface of the plate-like workpiece without damaging the plate-like workpiece. It is to be able to be separated from.

A first invention includes a chuck table that is formed of a porous member and has a holding surface that holds a plate-like workpiece by negative pressure, a processing mechanism that processes the plate-like workpiece held by the chuck table, and a plate-like workpiece for the chuck table. A transfer mechanism that carries in and out the liquid, a liquid source that supplies liquid to the holding surface, a gas source that supplies gas to the holding surface, a liquid communication path that connects the holding surface and the liquid source, and a liquid communication path A liquid valve, a gas communication path for communicating the holding surface and the gas source, and a gas valve disposed in the gas communication path; the transport mechanism holds the outer peripheral edge of the plate-like workpiece; At least three holding members, a support plate that supports the holding member so as to be movable in the horizontal direction with respect to the outer peripheral edge of the plate-like workpiece, and is provided on the support plate and protrudes downward from the holding member. horizontal direction A plate-like work held on the holding surface of the chuck table by a processing device having at least three horizontal direction movement restriction pins for restricting movement and a vertical driving unit for moving the support plate supporting the holding member in the vertical direction. The following steps are involved in a plate-like workpiece detachment method for detaching the substrate from the holding surface.
(1) a horizontal movement restriction pin positioning step for positioning at least three horizontal movement restriction pins around a plate-like workpiece held on a holding surface;
(2) A separation step of opening the liquid valve and supplying the liquid from the liquid source to the holding surface to lift the plate-like workpiece away from the holding surface with the liquid that exudes from the holding surface;
(3) a surface tension relaxation step of relaxing the surface tension of the liquid by opening the gas valve and supplying gas from the gas source to the holding surface;
(4) A holding step of holding the plate-like workpiece by moving the holding member toward the outer peripheral edge of the plate-like workpiece,
(5) A detaching step of moving the support plate supporting the holding unit holding the plate-like workpiece upward to release the plate-like workpiece from the holding surface.

  Further, the second invention is suitable for carrying out the above-described plate-like workpiece detachment method, and in order to reliably perform the method, the plate-like workpiece is made of a liquid that is leached from the holding surface by opening the liquid valve. The processing apparatus includes a control means having a control function of relaxing the surface tension of the liquid by floating and separating from the holding surface, and opening the gas valve to supply gas to the holding surface.

  In the plate-like workpiece detachment method according to the present invention, the entire plate-like workpiece can be lifted up with a substantially uniform force by the seepage of liquid from the holding surface by opening the liquid valve in the separation step. Then, the outer peripheral edge of the plate-like workpiece is held in that state, and the plate-like workpiece is lifted off from the holding surface in a state where the surface tension of the liquid is relaxed by supplying gas into the liquid by opening the gas valve. Therefore, it is possible to reliably carry out the holding surface without damaging the plate-like workpiece.

  Moreover, the processing apparatus according to the present invention can reliably perform the lifting of the plate-like workpiece and the relaxation of the surface tension of the liquid due to the liquid seepage.

It is a perspective view which shows an example of a processing apparatus. It is a perspective view which shows an example of the holding mechanism which comprises a conveyance mechanism. It is a disassembled perspective view which shows the holding mechanism. It is a top view which shows typically the support plate and rotation plate which comprise a holding mechanism, (a) shows the state before rotation of a rotation plate, (b) shows the state which the rotation plate rotated. Show. It is sectional drawing which shows an example of a plate-shaped workpiece. It is sectional drawing which shows schematically the state in which a holding mechanism is located above a plate-shaped workpiece. It is sectional drawing which shows schematically the state of a horizontal direction movement control pin positioning process and a separation process. It is sectional drawing which shows the state of a holding process roughly. It is sectional drawing which shows the state of a surface tension relaxation process schematically. It is sectional drawing which shows the state of a detachment | leave process schematically.

  A grinding apparatus 1 shown in FIG. 1 is an apparatus for grinding a plate-shaped workpiece held on a chuck table 2, and includes an attachment / detachment area where a plate-shaped workpiece is attached to and detached from the chuck table 2, and a chuck table 2. It is comprised from the grinding area | region which is an area | region which can grind the plate-shaped workpiece | work hold | maintained.

  The chuck table 2 includes a holding surface 200 that is formed of a porous member having innumerable pores and holds a plate-like workpiece with negative pressure, and a frame body 201 that supports the holding surface 200 from below and around. The holding surface 200 and the upper surface of the frame body 201 are flush with each other. The chuck table 2 is rotatably supported by a base 202, and a telescopic bellows 203 is coupled to the side of the base 202 in the front-rear direction. The chuck table 2 is configured to move horizontally between the attachment / detachment region and the grinding region as the bellows 203 expands and contracts.

  The holding surface 20 communicates with the liquid source 205 via the liquid communication path 204 and also communicates with the gas source 207 via the gas communication path 206. A liquid valve 208 is disposed in the liquid communication path 204, and the amount of liquid flow can be adjusted to allow the liquid to ooze out from the holding surface 200. In addition, a gas valve 209 is provided in the gas communication path 206, and the amount of gas flow can be adjusted and the gas can be blown out from the holding surface 200. The liquid valve 208 and the gas valve 209 are controlled by the control unit 210. The liquid source 205 stores, for example, pure water, and the gas source 207 stores, for example, air.

  The grinding area is provided with a processing mechanism 3 for grinding a plate-like workpiece held on the chuck table 2. The processing mechanism 3 includes a spindle 30 having a vertical axis, a grinding wheel 32 fixed to the spindle 30 via a wheel mount 31, and a servo motor 33 that rotationally drives the spindle 30. A grinding wheel 34 is fixed to the lower part of the grinding wheel 32 in a circular arc shape, and the grinding wheel 34 is rotated as the spindle 30 is rotated by being driven by the servo motor 33.

  The processing mechanism 3 is driven by the feed mechanism 4 and moves up and down. The feed mechanism 4 includes a ball screw 40 having a vertical axis, a pair of guide rails 41 arranged in parallel to the ball screw 40, a pulse motor 42 that rotates the ball screw 40, and a ball screw 40. It has a nut (not shown) to be screwed therein and a sliding portion 43 whose side portion is in sliding contact with the guide rail 41, and is driven by the pulse motor 42 to rotate the ball screw 40. The sliding portion 43 is guided by the guide rail 41 and moves up and down. Since the support portion 44 fixed to the sliding portion 43 supports the processing mechanism 3, the processing mechanism 3 is also moved up and down as the sliding portion 43 moves up and down.

  In the attachment / detachment area, a first cassette 5a for accommodating a plate-shaped workpiece before grinding and a second cassette 5b for accommodating a plate-shaped workpiece after grinding are placed. In the vicinity of the first cassette 5a and the second cassette 5b, there is a function of taking out the plate-shaped workpiece before grinding from the first cassette 5a and a function of accommodating the plate-shaped workpiece after grinding in the second cassette 5b. A carry-in / out mechanism 6 is provided. The carry-in / out mechanism 6 includes a holding portion 60 that holds a plate-like workpiece, and an arm portion 61 that can be rotated and bent with the holding portion 60 connected to the tip.

  In the vicinity of the carry-in / out mechanism 6, a centering means 7 for aligning the center position of the plate-shaped workpiece before grinding and a cleaning means 8 for cleaning the plate-shaped workpiece after grinding are disposed. The centering means 7 includes a mounting table 70 on which a plate-shaped workpiece to be ground is mounted, and a plurality of protrusions 71 that are arranged in an arc shape in a state of protruding upward from the mounting table 70 and are movable in directions approaching each other. It has. On the other hand, the cleaning means 8 includes a holding table 80 that holds and rotates a plate-like workpiece, and a nozzle (not shown) that ejects cleaning liquid and air.

  In the vicinity of the centering means 7, a first transport mechanism 9 is provided for carrying out the centered plate-shaped workpiece before grinding from the centering means 7 and carrying it into the chuck table 2. The first transport mechanism 9 includes a suction plate 90 that sucks and holds a surface to be ground of a plate-like workpiece, and an arm portion 91 that is attached to the tip and can be rotated in the horizontal direction and can be moved up and down. Have.

  In the vicinity of the cleaning means 8, a second transport mechanism 10 is provided for carrying the ground plate-like workpiece out of the chuck table 2 and carrying it into the cleaning means 8. The second transport mechanism 10 includes an arm part 11 that can be raised and lowered and a holding mechanism 12 that is attached to the tip of the arm part 11.

  As shown in FIG. 2, the holding mechanism 12 includes at least three holding members 13 that engage with the outer peripheral edge of the plate-like workpiece to hold the plate-like workpiece, and the holding member 13 with respect to the outer peripheral edge of the plate-like workpiece. A support plate 14 that is movably supported in the horizontal direction, a rotation plate 15 that is disposed on the upper surface side of the support plate 14 so as to be rotatable within a predetermined range with respect to the support plate 14, and attachment of the tip of the arm portion 11. The mounting plate 16 is connected to the support plate 14 so as to be tiltable, and the vertical driving unit 17 moves the support plate 14 in the vertical direction.

  As shown in FIG. 3, the holding member 13 is formed of a synthetic resin having a low frictional resistance such as a fluororesin, and includes an engaging member 130 having an engaging recess 130 a, and is erected upward from the engaging member 130. A cylindrical threaded supported portion 131 is formed, and a female screw hole 131 a for screwing a bolt is formed on the inner peripheral surface of the supported portion 131.

  In the support plate 14, corresponding to the number and position of the holding members 13, elongated holes 140 that are long in the radial direction and penetrate the front and back surfaces are formed. The long hole 140 supports the supported portion 131 of the holding member 13 movably in the longitudinal direction of the long hole 140, and the width of the long hole 140 is slightly larger than the diameter of the supported portion 131. .

  From the lower surface of the support plate 14, at least three horizontal movement restriction pins 18 that restrict horizontal movement of the plate-like workpiece to be held are formed to protrude downward, and the lower end thereof is held. It is located below the member 13. From the upper surface of the support plate 14, three support pillars 19 are erected. A female screw hole 19 a is formed at the upper end of the support column 19. A coil spring 190 is inserted into each support column 19. On the other hand, a stepped nut 20 having a large diameter portion 20a and a small diameter portion 20b is attached to the upper surface of the center portion of the support plate 14.

  The rotating plate 15 has a center hole 150 having an inner diameter that fits into the small diameter portion 20b of the stepped nut 20 and three long holes 151 that are long in the circumferential direction and penetrate the front and back surfaces, with a predetermined interval. And three arm portions 152 projecting in the outer circumferential direction. A link 154 is connected to the tip of each arm portion 152 so as to be rotatable with respect to the arm portion 152 by a pivot 153. The link 154 has a through hole 154a that penetrates the front and back surfaces. A connecting protrusion 155 protruding upward is formed at a position protruding in the circumferential direction from one of the three arm portions 152.

  An air cylinder 22 for projecting and retracting the piston rod 21 is disposed on the upper surface side of the support plate 14, and a distal end portion of the piston rod 21 is connected to a connection protrusion 155 formed in a ring shape on the rotating plate 15. A mating engagement portion 21a is formed.

  Further, as shown in FIG. 2, when the bolt 23 is inserted into the through hole 154a, the spacer 24 and the long hole 140 shown in FIG. 3 and screwed into the female screw hole 131a of the engaging member 13, the pivot 153 is centered. As the link 154 is rotated, the support plate 14 and the rotation plate 15 are connected in a state where the rotation plate 15 can rotate within a predetermined range with respect to the support plate 14. A bolt 26 is screwed into the stepped nut 20 to prevent the turning plate 15 from coming off. Further, when the connection protrusion 155 provided at a position protruding sideways from the arm portion 152 is engaged with the connection engagement portion 21a at the tip of the piston rod 21, the piston rod 21 is moved by the arrow A in FIG. By being driven in the direction, the rotation plate 15 can be rotated in the arrow B direction. When the rotation plate 15 rotates in the direction of arrow B, the link 154 moves in the direction of arrow C accordingly, so that the holding member 13 connected to the link 154 moves in the direction of arrow D, that is, the direction toward the center of the support plate 14. Move to. This movement will be described with reference to FIG. 4. In the initial state, as shown in FIG. 4A, the three arm portions 152 are in line with the link 154. Then, as shown in FIG. 4B, when the rotation plate 15 is driven by the air cylinder 22 and rotates in the arrow B direction, the arm portion 152 and the link 154 are not in a straight line, and are directed in the C direction. The changed link 154 pulls the holding member 13 in the direction toward the center of the support plate 14, whereby the holding member 13 moves along the long hole 140 in the direction in which the holding members 13 approach each other (D direction). Thus, the air cylinder 22, the piston rod 21, and the rotation plate 15 function as a driving unit that moves the three engaging members 13 in a direction in which they approach each other.

  Further, as shown in FIG. 3, in the mounting plate 16, three through holes 160 are disposed at positions corresponding to the three support pillars 19 erected from the upper surface of the support plate 14. The support plate 14 is fixed to the mounting plate 16 by screwing the bolt 25 inserted into the hole 160 into the female screw hole 19 a formed in the support column 19.

Next, the operation of the apparatus when grinding a plate-like workpiece using the grinding apparatus 1 shown in FIG. 1 will be described. The plate workpiece to be ground is not particularly limited. For example, silicon wafer, semiconductor wafer such as GaAs, ceramic, glass, sapphire (Al ₂ O ₃ ) based inorganic material substrate, plate metal or resin ductile material, The flatness (TTV: total thickness variation: the difference between the maximum value and the minimum value of the entire surface of the workpiece ground surface measured in the thickness direction with the workpiece ground surface as the reference surface) Various processing materials required are listed.

  First, the holding portion 60 of the carry-in / out mechanism 6 shown in FIG. 1 enters the first cassette 5a, sucks the plate-like workpiece to be ground, carries it out from the first cassette 5a, and performs centering means 7 And the suction is released. And the center position of a plate-shaped workpiece | work is aligned to a fixed position by the protrusion part 71 moving to the direction which mutually approaches.

  Next, the suction plate 90 sucks the plate-like work centered by turning and lowering of the arm portion 91 constituting the first transport mechanism 9, and after the suction, the arm portion 91 rises and turns. The plate-like workpiece is moved above the chuck table 2 located in the attachment / detachment area. Then, the plate-like workpiece is held by the chuck table 2 by lowering the plate-like workpiece and releasing the suction by the suction plate 90. At this time, the surface to be ground which is the surface to be ground is exposed upward, and the surface to be held which is the back surface thereof is held by the chuck table 2.

  The plate-like workpiece held by the chuck table 2 moves in the horizontal direction and enters the grinding zone, and is positioned immediately below the processing mechanism 3. Then, the chuck table 2 rotates to rotate the plate-shaped workpiece, and is driven by the feed mechanism 4 in a state where the grinding wheel 32 is rotated. The processing mechanism 3 is lowered, and the rotating grinding wheel 34 rotates. Grinding is performed in contact with the surface to be ground of the workpiece, and a plate-like workpiece is formed to a desired thickness. At this time, as shown in FIG. 5, in the back surface W <b> 2 of the plate-like workpiece W, the region where the chip to be manufactured exists without grinding the surplus region that is the region where the chip to be manufactured at the peripheral portion does not exist. When only the device region is ground, the initial thickness of the surplus region is maintained and the reinforcing portion W3 is formed. The plate-like workpiece W on which the reinforcing portion W3 is formed becomes easier to handle, such as subsequent conveyance, as compared with a plate-like workpiece without the reinforcing portion W3. Although not shown in FIG. 5, a protective tape is attached to the surface W1 of the plate-like workpiece W during grinding.

  When the grinding is finished in this way, the chuck table 2 holding the ground plate-like workpiece W returns to the attachment / detachment area. Then, the plate-like workpiece W is unloaded from the chuck table 2 by the second transfer means 10 and is transferred to the cleaning means 8. Below, the process is demonstrated with reference to FIGS.

  As shown in FIG. 6, when the plate-like workpiece W after grinding is to be carried out from the chuck table 2 by the second conveying means 10, the liquid valve 208 is firstly controlled by the control by the control means 210 shown in FIG. And the gas valve 209 are both closed. Further, the holding mechanism 12 constituting the second conveying means 10 is positioned directly above the plate-like workpiece W. Although not shown in FIGS. 6 to 10, the holding surface 200 of the chuck table 2 communicates with a suction source through a valve. However, when the plate-shaped workpiece is carried out, the valve is closed. It is not in communication with the suction source. Further, the holding mechanism 12 may be inclined as a whole as shown in FIG. 6 due to component assembly errors or the like.

  Next, as shown in FIG. 7, by moving the holding mechanism 12 downward, the horizontal movement restriction pin 18 protruding downward from the support plate 14 is moved around the plate-like workpiece W, for example, the frame 201 of the chuck table 2. Contact the top surface. In FIG. 7, only one horizontal direction movement restricting pin 18 is shown, but actually three horizontal direction movement restricting pins 18 abut against the frame body 201. Since the horizontal direction movement restricting pins 18 are all equal in length, when the three horizontal direction movement restricting pins 18 come into contact with the frame body 201, the support plate 14 that is the base thereof is parallel to the upper surface of the chuck table 2. Thus, there is no hindrance to the subsequent holding of the plate-like workpiece W (horizontal movement restriction pin positioning step).

  Further, as shown in FIG. 7, the liquid valve 208 is opened under the control of the control unit 210, the liquid is circulated in the direction of arrow E, and the liquid is supplied from the liquid source 205 to the holding surface 200. The liquid layer 27 is formed by the liquid that oozes out, and the plate-like workpiece W is lifted from the holding surface 200 and separated. By using the liquid, the entire plate-like workpiece can be lifted with a substantially uniform force. Even when the plate-like workpiece W is lifted by the liquid layer 27, the position of the plate-like workpiece W is greatly increased by the surface tension of the liquid. There is no slippage (separation process). Even if it shifts, the movement is restricted within a certain range by the three horizontal movement restricting pins 18 and does not adversely affect the subsequent holding.

  Instead of causing the liquid to ooze out from the holding surface 200, the gas valve 209 is opened and gas is supplied from the gas source 207 to the holding surface 200, so that the plate-like workpiece W is discharged by the gas ejected from the holding surface 200. Although it is possible to float and separate from the holding surface 200, the plate-like workpiece W may be damaged by the gas pressure. In addition, when a two-fluid gas and liquid are blown up from the holding surface 200 to release the plate-shaped workpiece, the plate-shaped workpiece may be damaged by an impact. Therefore, only liquid is used to avoid such inconvenience.

  Next, as shown in FIG. 8, with the liquid valve 208 opened and the liquid flowing in the direction of arrow E, the holding member 13 is directed toward the outer peripheral edge of the plate-like workpiece W, in other words, the plate-like workpiece. By moving in a direction approaching the center of W, the engagement concave portion 130 a on the side of the engagement member 130 is brought into contact with the side surface of the plate-like workpiece W. Although only one holding member 13 is illustrated in FIG. 8, in actuality, the engagement recesses 130 a of the three holding members 13 are in contact with the side surfaces of the plate-like workpiece W, and the plate is formed by the three engagement members 130. The workpiece W is sandwiched and held (holding process). Since the engaging member 130 holds the outer peripheral edge of the plate-like workpiece W, it does not come into contact with the device. Therefore, not only the plate-like workpiece W of the type in which the reinforcing portion W3 is formed but also holding the plate-like workpiece of the type that needs to avoid contact with the grinding surface in order to form some device on the grinding surface after grinding. Also suitable for.

  After the plate-like workpiece W on the liquid layer 27 is sandwiched and held by the three engaging members 130, if the holding mechanism 12 is lifted as it is and the plate-like workpiece W is lifted, The plate-like workpiece W may not be peeled off from the liquid layer 27 due to surface tension. Therefore, with the liquid valve 208 still open, the gas valve 207 is further opened under the control of the control means 210 as shown in FIG. By supplying gas to the holding surface 210, bubbles are generated in the liquid layer 27 and the surface tension is relaxed (surface tension relaxation step).

  Next, as shown in FIG. 10, the holding mechanism 12 including the support plate 14 is moved upward while the gas valve 207 and the liquid valve 208 are opened and the liquid and the gas are circulated in the arrow E direction and the F direction. . Then, the plate-like workpiece W is detached from the holding surface 200 and the liquid layer 27, and the plate-like workpiece W is raised (detachment process). In this way, the liquid layer 27 is formed by oozing out of the liquid to float the plate-like workpiece W, and further, the gas is supplied to the liquid layer 27 to contain the gas, thereby weakening the surface tension of the liquid layer 27. In this state, the plate-like workpiece is lifted, so that the plate-like workpiece W can be reliably unloaded from the chuck table 2 without being damaged.

  In the example based on FIGS. 6 to 10 described above, the order is the separation process → the holding process → the surface tension relaxation process → the separation process. However, the order of the holding process and the surface tension relaxation process may be reversed. Moreover, you may perform a holding process and a surface tension relaxation process simultaneously.

  When the plate-like workpiece W is unloaded from the chuck table 2 as described above, it is transported to the cleaning means 8 by the turning of the arm portion 11 shown in FIG. Then, the holding state is released by moving the holding members 13 away from each other. Thereafter, cleaning and drying are performed, and the plate-like workpiece W is carried into the second cassette 5 b by the carry-in / out mechanism 6.

  In the above description, the grinding device has been described as an example of the processing device. However, for example, a similar configuration and method are also used in a cutting device that performs cutting by applying a rotating cutting blade to a plate-like workpiece held on a chuck table. Possible.

1: Grinding device 2: Chuck table 200: Holding surface 201: Frame body 202: Base 203: Bellows 204: Liquid communication path 205: Liquid source 206: Communication path 207: Gas source 208: Liquid valve 209: Gas valve 210: Control means 3: Processing mechanism 30: Spindle 31: Wheel mount 32: Grinding wheel 33: Servo motor 34: Grinding wheel 4: Feed mechanism 40: Ball screw 41: Guide rail 42: Pulse motor 43: Sliding part 44: Support part 5a: first cassette 5b: second cassette 6: carry-in / out mechanism 60: holding part 61: arm part 7: centering means 70: mounting table 71: protrusion 8: cleaning means 80: holding table 9: first Transport mechanism 90: suction plate 91: arm unit 10: second transport mechanism 11: arm unit 12: holding mechanism 13: holding member
130: engagement member 131: held portion 131a: female screw hole 14: support plate 140: long hole
15: Rotating plate 150: Center hole 151: Long hole 152: Arm part 153: Pivot 154: Link 154a: Through hole 155: Connection protrusion 16: Mounting plate 160: Through hole 17: Vertical drive part 18: Horizontal movement Restriction pin 19: Support pillar 19a: Female screw hole 190: Coil spring 20: Stepped nut 20a: Large diameter portion 20b: Small diameter portion 21: Piston rod 21a: Connection engagement portion 22: Air cylinder 23: Bolt 24: Spacer 25: Bolt 26: Bolt 27: Liquid layer

Claims (2)

A chuck table formed of a porous member and having a holding surface for holding the plate-like workpiece by negative pressure, a processing mechanism for processing the plate-like workpiece held on the chuck table, and loading and unloading of the plate-like workpiece to and from the chuck table A transport mechanism for performing the above operation, a liquid source for supplying a liquid to the holding surface, a gas source for supplying a gas to the holding surface, a liquid communication path for communicating the holding surface and the liquid source, and the liquid communication path A liquid valve disposed in the gas passage, a gas communication path for communicating the holding surface and the gas source, and a gas valve disposed in the gas communication path,
The transport mechanism includes at least three holding members that hold the outer peripheral edge of the plate-shaped workpiece, a support plate that supports the holding member so as to be movable in a horizontal direction with respect to the outer peripheral edge of the plate-shaped workpiece, and the support At least three horizontal movement restriction pins provided on the plate and projecting downward from the holding member to restrict the horizontal movement of the plate-like workpiece, and a vertical for moving the support plate supporting the holding member in the vertical direction A plate-like workpiece detachment method for detaching the plate-like workpiece held on the holding surface of the chuck table from the holding surface by a processing device having a direction driving unit,
A horizontal movement restriction pin positioning step for positioning at least three of the horizontal movement restriction pins around the plate-like workpiece held on the holding surface;
A separation step of opening the liquid valve and supplying the liquid from the liquid source to the holding surface to lift and separate the plate-like workpiece from the holding surface with the liquid that exudes from the holding surface;
A surface tension relaxation step of relaxing the surface tension of the liquid by opening the gas valve and supplying gas from the gas source to the holding surface;
Holding the plate-like workpiece by moving the holding member toward the outer peripheral edge of the plate-like workpiece; and
A detaching step of moving the support plate supporting the holding part holding the plate-like workpiece upward to release the plate-like workpiece from the holding surface;
A plate-like workpiece disengagement method including: A chuck table that is formed of a porous member and has a holding surface that holds the plate-like workpiece by negative pressure, a processing mechanism that processes the plate-like workpiece held by the chuck table, and a plate-like workpiece that is carried into and out of the chuck table. A transfer mechanism; a liquid source for supplying a liquid to the holding surface; a gas source for supplying a gas to the holding surface; a liquid communication path for communicating the holding surface with the liquid source; and a liquid communication path. A liquid valve provided; a gas communication path for communicating the holding surface and the gas source; a gas valve disposed in the gas communication path; a control means for controlling the liquid valve and the gas valve; Have
The transport mechanism includes at least three holding members that hold the outer peripheral edge of the plate-shaped workpiece, a support plate that supports the holding member so as to be movable in a horizontal direction with respect to the outer peripheral edge of the plate-shaped workpiece, and the support At least three horizontal movement restriction pins provided on the plate and projecting downward from the holding member to restrict the horizontal movement of the plate-like workpiece, and a vertical for moving the support plate supporting the holding member in the vertical direction A direction drive unit,
The control means opens the liquid valve, floats the plate-like workpiece with the liquid that oozes from the holding surface and separates it from the holding surface, and opens the gas valve to supply gas to the holding surface. A processing apparatus having a control function for relaxing the surface tension of the liquid.

Images