JP2015233070A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device capable of preventing the collision of a restriction part for restricting a wafer position with the outer periphery of the wafer, when holding the wafer to carry into a chuck table.SOLUTION: Three restriction pins 64 are configured to be capable of advancing or retracting between an action position to the slightly lateral of the outer periphery of a wafer W, having a lower end held by a hold member 61, and a retraction position upward of and apart from the wafer W held by the hold member 61. At the carriage of the wafer W out of a temporary placing table, a bump part retracts the restriction pins 64 upward, to thereby enable preventing the restriction pin 64 from colliding with the wafer W before held by the hold member 61. At the carriage of the wafer W into the chuck table 20, the restriction pins 64 restrict the movement of the wafer W to the plane direction.

Description

  The present invention relates to a processing apparatus.

  In processing equipment that processes semiconductor wafers, such as grinding equipment, when the wafer is transported, if you do not want to touch the top surface of the wafer, or if the wafer is warped or uneven, the top surface of the wafer is vacuum fixed and transported If this is not possible, a mechanism called edge clamp conveyance that clamps the outer periphery of the wafer is used (Patent Document 1).

  When the outer periphery of the wafer is clamped by the clamping member and carried into the chuck table, the wafer is slightly released to the holding surface of the lower chuck table by separating the clamping member toward the outer periphery. At this time, since the wafer is in a free state, the wafer may move slightly in the surface direction before being held on the holding surface.

JP 2007-258450 A

  By the way, in order to prevent the wafer from slightly moving in the surface direction, it is conceivable to provide a restricting portion on the outer peripheral portion of the wafer. However, when the wafer is clamped by the transfer means, if the center of the wafer is at a different position before and after clamping, there is a risk that the regulating portion and the outer periphery of the wafer collide and the wafer is damaged.

  Therefore, the problem to be solved by the present invention is to provide a processing apparatus capable of preventing a regulating portion that regulates the position of the wafer from colliding with the outer periphery of the wafer when the wafer is sandwiched and carried into the chuck table. It is in.

  In order to solve the above-described problems, a processing apparatus according to the present invention includes a chuck table that holds a wafer, a processing unit that processes the wafer held on the chuck table, and a temporary placement having a holding surface that holds the wafer. A processing apparatus comprising: a table; and a transfer unit that has at least three holding members that hold and hold the outer periphery of the wafer, and transfers the wafer from the temporary placement table to the chuck table. Includes a moving means that moves in a direction parallel to and orthogonal to the holding surface of the temporary table, a support plate that is fixed to the moving means and supports the holding member so as to be movable in the radial direction, and a lower end that holds the holding An action position that extends slightly to the outer periphery of the wafer held by the member, and a retreat position that is spaced above the wafer held by the clamping member , Three restriction pins configured to be able to advance and retreat, and an engagement portion that protrudes from the restriction pin in the outer circumferential direction and is fixed to the three restriction pins, and the temporary placement table includes the holding surface An abutting portion that is disposed at a position facing the engagement portion of the transfer means on the outer periphery of the transfer means and has an upper end protruding above the holding surface, and when loading the wafer into the chuck table, The wafer that is released from the clamping member is restricted from moving in the surface direction by the restriction pin positioned in the direction, and when the wafer is unloaded from the temporary placement table, the transfer is lowered toward the temporary placement table. When the engaging portion of the means abuts against the abutting portion of the temporary table, the restriction pin is stopped at a position above the wafer held on the holding surface, and the clamping Characterized in that to prevent the said regulation pin contact before the wafer is clamped in wood.

  In the processing apparatus, it is preferable that the lower end of the regulation pin regulates the movement of the wafer in the surface direction while being spaced apart from the holding surface of the chuck table by a distance equal to or less than the thickness of the wafer.

  In the processing apparatus of the present invention, when the wafer is unloaded from the temporary placement table, the restriction pin is retracted upward by the abutting portion, so that the restriction pin collides with the wafer before being held by the holding member. When the wafer is loaded into the chuck table, since the movement of the wafer in the surface direction is restricted by the restriction pin, the wafer can be carried into a predetermined position.

FIG. 1 is a perspective view illustrating a configuration example of a grinding apparatus according to an embodiment. FIG. 2 is a perspective view illustrating a configuration example of the conveying unit. FIG. 3 is a cross-sectional view schematically showing the configuration of the conveying means. FIG. 4 is a cross-sectional view schematically showing the wafer unloading operation (part 1) of the transfer means. FIG. 5 is a cross-sectional view schematically showing the wafer carrying-out operation (part 2) of the carrying means. FIG. 6 is a cross-sectional view schematically showing the wafer carrying-in operation (part 1) of the carrying means. FIG. 7 is a cross-sectional view schematically showing the wafer carrying-in operation (part 2) of the carrying means.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment
A grinding apparatus according to an embodiment will be described with reference to FIG. FIG. 1 is a perspective view illustrating a configuration example of a grinding apparatus according to an embodiment. The grinding apparatus 1 according to the present embodiment functions as a processing apparatus, and processes the chuck table 20 that holds the disk-shaped wafer W, the disk-shaped index table 21 on which the chuck table 20 is disposed, and the wafer W. And a grinding means 30 functioning as a processing means for performing the above.

  The disk-shaped index table 21 is formed larger than the diameter of the chuck table 20 and is rotatably attached to the upper surface of the apparatus main body 2 by a rotating means (not shown). The chuck table 20 is arranged in the grinding region of the grinding means 30 by the rotation of the index table 21. For example, two chuck tables 20 are arranged on the index table 21 with an interval of 180 degrees. The index table 21 is rotated in the direction of arrow P, and each chuck table 20 is disposed in the grinding area of the grinding means 30.

  The grinding means 30 includes a grinding wheel 31 that holds a grinding wheel 31a, a spindle 32 that rotates the grinding wheel 31, and a spindle motor 33 that rotationally drives the spindle 32. The grinding means 30 rotates the spindle 32 to grind the wafer W held on the chuck table 20 disposed in the grinding region by the grinding wheel 31a.

  The grinding means 30 is attached to the apparatus main body 2 so as to be movable up and down in the vertical direction (Z-axis direction) by the moving means 40. The moving means 40 is engaged with the Z-axis slider 41 movably attached to the apparatus body 2 in the Z-axis direction, a fixing member 42 that fixes the grinding means 30 to the Z-axis slider 41, and the Z-axis slider 41. A ball screw 43 that drives the Z-axis slider 41 in the Z-axis direction and a motor 44 that rotates the screw shaft of the ball screw 43 are provided. The moving means 40 rotates the ball screw 43 to move the grinding means 30 fixed to the Z-axis slider 41 up and down in the Z-axis direction. As a result, the grinding means 30 approaches and separates from the chuck table 20.

  The grinding apparatus 1 includes a temporary placement table 50 for temporarily placing the wafer W, and a transport unit 60 for transporting the wafer W temporarily placed on the temporary placement table 50 to the chuck table 20. The temporary placement table 50 is disposed in the vicinity of the index table 21, and includes a columnar placement table 51 on which the wafer W is placed, three butting portions 52 with which the transfer means 60 is engaged, a placement table 51, and And a base 53 for fixing the abutting portion 52. The columnar mounting table 51 has a holding surface 510 that holds the wafer W, and the diameter thereof is smaller than the diameter of the wafer W. This is because the transfer means 60 transfers the wafer W while holding the outer periphery of the wafer W held on the holding surface 510 of the mounting table 51.

  The abutting portions 52 are disposed at three positions at intervals of 120 degrees in the vicinity of the outer periphery of the mounting table 51, and engage with the conveying means 60. The base 53 is formed in a rectangular flat plate shape and is fixed to the apparatus main body 2.

  The transfer means 60 is disposed between the index table 21 and the temporary placement table 50 and has at least three holding members 61 for holding the outer periphery of the wafer W so as to hold the wafer W from the temporary placement table 50 to the chuck table 20. The wafer W is transferred.

  A spinner cleaning means 70 is disposed in the vicinity of the transport means 60. The transport unit 60 transports the ground wafer W held on the chuck table 20 to the spinner cleaning unit 70. The spinner cleaning means 70 cleans and removes grinding debris adhering to the grinding surface and side surfaces of the wafer W and spin-drys the wafer W.

  Arranging means 80 is disposed in the vicinity of the spinner cleaning means 70. In the vicinity of the arrangement means 80, a supply-side cassette 90 that accommodates the wafer W before grinding and a collection-side cassette 91 that accommodates the wafer W after grinding are disposed. The placement means 80 takes out the wafer W before grinding from the supply-side cassette 90 and places it on the placement table 51 of the temporary placement table 50. The arrangement unit 80 takes out the cleaned wafer W from the spinner cleaning unit 70 and stores it in the recovery-side cassette 91.

  Next, the structure of the conveyance means 60 is demonstrated based on FIG.2 and FIG.3. FIG. 2 is a perspective view illustrating a configuration example of the conveying unit. FIG. 3 is a cross-sectional view schematically showing the configuration of the conveying means. The transfer means 60 includes a moving means 62 that moves the wafer W held by the holding member 61, a support plate 63 that is fixed to the moving means 62 and supports the holding member 61 so as to be movable in the radial direction, and is supported by the support plate 63. The driving mechanism 68 that drives the sandwiched member 61 and three restriction pins 64 that restrict the wafer W from moving in the surface direction are provided. The clamping member 61 has a concave portion 610, and the outer periphery of the wafer W is sandwiched and held by the concave portion 610.

  The moving means 62 moves in a direction parallel to and orthogonal to the holding surface 510 of the mounting table 51 in the temporary placement table 50. For example, the moving means 62 is attached to the apparatus main body 2 so that the base end portion of the L-shaped arm 620 is rotatable, and is movably attached in the vertical direction (Z-axis direction). Accordingly, the moving unit 62 can move the wafer W placed on the placing table 51 of the temporary placing table 50 to the chuck table 20.

  The support plate 63 fixed to the moving means 62 is formed in a disc shape, and three elongated holes 632 opened in the radial direction are formed at intervals of 120 degrees in the circumferential direction. The elongate holes 632 are slidably fitted with holding members 61 arranged at intervals of 120 degrees, and the holding members 61 are driven by the drive mechanism 68 to move along the elongate holes 632. The drive mechanism 68 includes an air cylinder 680, a piston rod 681 connected to the air cylinder 680, a rotating plate 682 connected to the piston rod 681, an arm 683, and a link 684 having one end connected to the arm 683. Is provided. A clamping member 61 is fixed to the other end of the link 684.

  The drive mechanism 68 operates the air cylinder 680 to extend or contract the piston rod 681 connected to the air cylinder 680 and rotate the rotating plate 682 connected to the piston rod 681. By the rotation of the rotation plate 682, the holding member 61 is moved along the long hole 632 via the link 684 connected to the arm 683 of the rotation plate 682. For example, when the wafer W is sandwiched, the drive mechanism 68 extends the piston rod 681 connected to the air cylinder 680, and the sandwiching member 61 is moved into the long hole via the link 684 connected to the arm 683 of the rotating plate 682. It is moved toward the center of the support plate 63 along 632. Further, when releasing the wafer W, the driving mechanism 68 contracts the piston rod 681 connected to the air cylinder 680, and the clamping member 61 is moved into the long hole via the link 684 connected to the arm 683 of the rotating plate 682. It moves along the 632 in the radial direction toward the outer periphery of the support plate 63.

  The three regulating pins 64 of the conveying means 60 are disposed at intervals of 120 degrees, and are inserted through the support plate 63 so as to be movable up and down in the Z-axis direction. For example, the three regulating pins 64 are fixed to the disk-shaped pin fixing plate 65 at intervals of 120 degrees in the circumferential direction. In this example, the restriction pin 64 is fixed to the pin fixing plate 65 by a fixing member 640 at the center upper position in the longitudinal direction of the restriction pin 64 so as to be perpendicular to the pin fixing plate 65.

  Three support columns 630 are erected on the support plate 63, and the support columns 630 are inserted into three holes 650 provided in the pin fixing plate 65, and a disk-shaped counter plate 66 is formed at the upper end of the support column 630. Are fixed by screws 660.

  The counter plate 66 is provided with holes 661 at three equal intervals in the circumferential direction. The upper part of the restriction pin 64 is inserted into the hole 661, and the upper part of the inserted restriction pin 64 is expanded. The diameter portion 641 is fixed. The restriction pin 64 is prevented from coming off from the counter plate 66 by the enlarged diameter portion 641. The support plate 63 is provided with three holes 631 at equal intervals in the circumferential direction, and the lower part of the regulation pin 64 is inserted into the hole 631. The restriction pin 64 fixed to the pin fixing plate 65 is guided to move in the Z-axis direction by the hole 661 of the counter plate 66 and the hole 631 of the support plate 63.

  Between the pin fixing plate 65 and the opposing plate 66, an elastic member 67 is mounted on the restriction pin 64 and interposed, and an elastic force is applied to the pin fixing plate 65 so as to be separated from the opposing plate 66 by the elastic member 67. ing. The disk-shaped pin fixing plate 65 has an engaging portion 651 that protrudes in the outer peripheral direction from the regulating pin 64 and engages the abutting portion 52.

  The abutting portion 52 is disposed at a position facing the engaging portion 651 of the pin fixing plate 65 on the outer periphery of the holding surface 510 of the mounting table 51, and the upper end of the abutting portion 52 is above the holding surface 510 (Z It protrudes in the axial direction.

  Next, operation | movement of the conveyance means 60 is demonstrated based on FIGS. FIG. 4 is a cross-sectional view schematically showing the wafer unloading operation (part 1) of the transfer means. FIG. 5 is a cross-sectional view schematically showing the wafer carrying-out operation (part 2) of the carrying means. FIG. 6 is a cross-sectional view schematically showing the wafer carrying-in operation (part 1) of the carrying means. FIG. 7 is a cross-sectional view schematically showing the wafer carrying-in operation (part 2) of the carrying means.

[Unloading operation]
An operation in which the transfer means 60 carries the wafer W out of the temporary placement table 50 will be described. On the mounting table 51 of the temporary placement table 50 shown in FIG. 4, a wafer W before being ground and placed by being placed from the supply side cassette 90 by the placement means 80 is placed. The transfer means 60 unloads the wafer W mounted on the mounting table 51. For example, the transport unit 60 rotates the base end portion of the arm 620 of the moving unit 62 so that the three sandwiching members 61 are placed on the mounting table 51 of the temporary table 50 above the wafer W. Place it so that it surrounds At this time, the engaging portion 651 of the pin fixing plate 65 is positioned above the abutting portion 52, and there is a certain distance between the engaging portion 651 and the abutting portion 52. In the state where the three clamping members 61 surround the periphery above the wafer W, the transfer unit 60 lowers the arm 620 of the moving unit 62 and the three clamping members 61 supported by the support plate 63; The three restricting pins 64 fixed to the pin fixing plate 65 are lowered in the arrow Q direction (Z-axis direction). At this time, the clamping member 61 is located on the outermost side in the long hole 632 opened in the radial direction of the support plate 63.

  When the conveying means 60 is lowered, as shown in FIG. 5, the engaging portion 651 of the pin fixing plate 65 comes into contact with the abutting portion 52 to stop the lowering of the pin fixing plate 65 and is fixed to the pin fixing plate 65. The lowering of the regulating pin 64 stops. On the other hand, the support plate 63 and the counter plate 66 continue to descend while the elastic member 67 is contracted, and the three clamping members 61 supported by the support plate 63 reach substantially the same height as the wafer W on the mounting table 51. Descend. At this time, the transport unit 60 stops the lowering of the arm 620 of the moving unit 62 and stops the lowering of the support plate 63 and the counter plate 66.

  With the lower end of the regulation pin 64 stopped at a position above the wafer W on the holding surface 510, the three clamping members 61 are moved in the radial direction toward the center of the support plate 63 by the drive mechanism 68. The outer periphery of the wafer W held on the holding surface 510 of the mounting table 51 is sandwiched and held by the recess 610 from three directions.

  At this time, the three restricting pins 64 are stopped at a retracted position separated above the wafer W held by the holding member 61. In other words, each regulating pin 64 is abutted by the abutting portion 52 and is restricted to be lowered in the middle, and stops at a position where it rises relative to the clamping member 61 in the arrow U direction (Z-axis direction). ing.

  Thus, when the wafer W held on the holding surface 510 of the mounting table 51 is held by the holding member 61, the regulating pin 64 is separated and stopped at a position above the wafer W. It is possible to prevent the lower end of the regulation pin 64 from coming into contact with the wafer W before being sandwiched between the two.

  When the clamping member 61 clamps the wafer W on the mounting table 51, the transfer means 60 raises the arm 620 of the moving means 62 and raises the support plate 63 and the opposing plate 66 that support the clamping member 61 in the Z-axis direction. Let With this rise, the elastic member 67 interposed between the pin fixing plate 65 engaged with the abutting portion 52 and the opposing plate 66 extends, and the wafer W and the regulation pin 64 sandwiched between the sandwiching members 61. When the opposing plate 66 reaches the enlarged diameter portion 641 of the restriction pin 64, the lower end of each restriction pin 64 is positioned slightly on the outer periphery of the wafer W held by the holding member 61. To do. Since the wafer W is clamped by the clamping member 61, the center of the wafer W is aligned, and even if the regulation pin 64 approaches the wafer W, the lower end of the regulation pin 64 collides with the wafer W. There is no.

  After the opposing plate 66 reaches the enlarged diameter portion 641 of the restricting pin 64, the opposing plate 66 lifts the restricting pin 64, and the engaging portion 651 of the pin fixing plate 65 engaged with the abutting portion 52 moves from the abutting portion 52. Leave. The transfer means 60 further raises the arm 620 of the moving means 62 and, when reaching a predetermined height, rotates the base end portion of the arm 620 to carry the wafer W toward the chuck table 20.

  As described above, when the wafer W is unloaded from the mounting table 51 of the temporary table 50, the engaging portion 651 of the transport unit 60 that descends toward the wafer W on the holding surface 510 of the mounting table 51 is used as the temporary table. The restriction pin 64 stops at a position above the wafer W held on the holding surface 510 by hitting the 50 abutting portion 52, and the restriction pin 64 comes into contact with the wafer W before being held by the holding member 61. Can be prevented.

[Import operation]
Next, an operation in which the transfer unit 60 loads the wafer W unloaded from the temporary placement table 50 into the chuck table 20 will be described. The transport unit 60 rotates the base end of the arm 620 of the moving unit 62 to position the wafer W sandwiched by the sandwiching member 61 above the chuck table 20. After positioning the wafer W above the chuck table 20, as shown in FIG. 6, the transfer means 60 lowers the arm 620 of the moving means 62 and holds the wafer W between the holding surface 22 of the chuck table 20 by the holding member 61. W is approached and stopped at a predetermined position. For example, the conveying means 60 is configured such that the lower end of the regulation pin 64 is less than the thickness of the wafer W with respect to the holding surface 22 of the chuck table 20 in a state where the enlarged diameter portion 641 of the regulation pin 64 is in contact with the counter plate 66. The lowering of the arm 620 is stopped in a state of being separated from each other.

  After the transport unit 60 is lowered, the three clamping members 61 are moved in the radial direction (arrow V direction) toward the outer periphery of the support plate 63 by the drive mechanism 68 to hold the clamped wafer W on the chuck table 20. Release towards face 22. For example, the clamping member 61 releases the wafer W 300 μm above the holding surface 22 of the chuck table 20. The wafer W is released at a predetermined interval (300 μm) so that the holding member 61 does not come into contact with the holding surface 22 of the chuck table 20 and the holding surface 22 is not damaged.

  When the clamping member 61 releases the wafer W, the lower ends of the three restricting pins 64 are stopped at the operating position that reaches a little side of the outer periphery of the wafer W clamped by the clamping member 61. For example, the lower end of the regulation pin 64 is separated from the outer periphery of the wafer W held by the holding member 61 to the outside by about 150 μm. Further, the lower end of the regulation pin 64 is in a state of being separated from the holding surface 22 of the chuck table 20 by a distance equal to or less than the thickness of the wafer W, and regulates the movement of the wafer W in the surface direction. Thereby, when the wafer W is carried into the chuck table 20, the wafer W released from the clamping member 61 can be arranged at a predetermined position by the regulation pin 64 positioned on the side of the wafer W.

  In a state where the movement of the wafer W in the surface direction is restricted by the restriction pin 64, the chuck table 20 holds the wafer W by suction. After the wafer W is attracted and held by the chuck table 20, the transfer means 60 raises the arm 620 of the moving means 62, and when it reaches a predetermined height, the base end of the arm 620 is rotated to hold the holding member 61. Is placed above the temporary placement table 50, and the next wafer W placed on the placement table 51 of the temporary placement table 50 is sandwiched.

  As described above, according to the grinding apparatus 1 according to the embodiment, the three restriction pins 64 are held by the holding member 61 and the retraction position where the lower ends are separated above the wafer W held by the holding member 61. It is configured to be able to advance and retreat to a working position that reaches a slight side of the outer periphery of the wafer W. Thus, when the wafer W is unloaded from the temporary placement table 50, the restriction pin 64 is retracted upward by the abutment portion 52, so that the restriction pin 64 collides with the wafer W before being held by the holding member 61. When the wafer W is carried into the chuck table 20, the movement of the wafer W in the surface direction is restricted by the restriction pin 64, so that the wafer W can be carried into a predetermined position.

  Further, the regulation pin 64 regulates the position of the wafer W by moving up and down in the Z-axis direction, and does not regulate the position of the wafer W by moving in the X-axis direction or the Y-axis direction. This can be realized with a simple mechanism, and the conveying means 60 can be miniaturized.

  In addition to the grinding device as an embodiment, the present invention can be applied to a case where a wafer placed on a temporary placement table is transported to a chuck table in a cutting device or a polishing device.

  Moreover, although the conveyance means 60 demonstrated the example provided with the three clamping members 61, it is not limited to this. For example, the conveying means may include four clamping members arranged at equal intervals in the circumferential direction of the support plate, or may include more clamping members than four. Further, the transfer means may include a pair of arcuate clamping members that match the outer peripheral shape of the wafer.

  Moreover, although the conveyance means 60 demonstrated the example provided with the three control pins 64, it is not limited to this. For example, the conveying means may include four restriction pins arranged at equal intervals in the circumferential direction of the pin fixing plate, or may include more restriction pins than four. Further, the transfer means may include a pair of arc-shaped regulating members that match the outer peripheral shape of the wafer.

  In addition, although the example in which the temporary placement table 50 includes the three butting portions 52 has been described, the invention is not limited thereto. For example, the temporary placement table may include four abutting portions arranged at equal intervals in the circumferential direction of the mounting table, or may include more than four abutting portions. Good. In addition, the temporary placement table may include a pair of abutting portions that support the engaging portion of the pin fixing plate on the surface.

DESCRIPTION OF SYMBOLS 1 Grinding device 20 Chuck table 22 Holding surface 50 Temporary placement table 51 Mounting base 510 Holding surface 52 Abutting part 53 Base 60 Transfer means 61 Nipping member 610 Recessing means 620 Arm 63 Support plate 630 Post 64 Restriction pin 640 Fixing member 641 Expanded diameter portion 65 Pin fixing plate 650 Hole portion 651 Engaging portion 66 Opposing plate 660 Screw 661 Hole portion 67 Elastic member

Claims (2)

A chuck table for holding the wafer; a processing means for processing the wafer held on the chuck table; a temporary table having a holding surface for holding the wafer; and at least three holding the outer periphery of the wafer. A processing device having a holding member and a transfer means for transferring a wafer from the temporary placement table to the chuck table,
The conveying means is
Moving means for moving in a direction parallel to and orthogonal to the holding surface of the temporary placement table;
A support plate fixed to the moving means and supporting the clamping member so as to be movable in a radial direction;
Three restrictions that are configured to be able to advance and retreat into a working position where the lower end reaches a slight side of the outer periphery of the wafer held by the holding member and a retracted position spaced above the wafer held by the holding member. idea,
An engagement portion that protrudes in the outer circumferential direction from the restriction pin and is fixed to the three restriction pins,
The temporary table is
Provided at a position facing the engaging portion of the conveying means on the outer periphery of the holding surface, and has an abutting portion whose upper end protrudes above the holding surface;
When the wafer is carried into the chuck table, the wafer released from the clamping member is restricted from moving in the surface direction by the restriction pin positioned on the side of the wafer,
When unloading the wafer from the temporary placement table, the engaging pin of the transfer means that descends toward the temporary placement table abuts against the abutting portion of the temporary placement table, so that the restriction pin is moved to the holding surface. The processing apparatus is stopped at a position above the wafer held on the wafer and prevents the regulation pin from contacting the wafer before being held by the holding member.   The processing apparatus according to claim 1, wherein the lower end of the restriction pin restricts movement of the wafer in the surface direction in a state of being separated from the holding surface of the chuck table by a distance equal to or less than the thickness of the wafer.

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