KR20080096444A - Substrate cleaning apparatus and substrate cleaning method - Google Patents

Abstract

A substrate cleaning apparatus and substrate cleaning method are provided to remove foreign material attached at the edge portion of the substrate without polishing the substrate itself. A substrate cleaning apparatus comprises a junction unit(32) for jointing an edge portion(E) of a substrate(W) and a junction member, an elevating unit for holding and moving up and down the substrate. The junction member consists of an elastic material having the coefficient of elasticity of 0.3MPa to 2.7MPa. The junction member consists of an elastic material including silica.

Description

Substrate cleaning device and substrate cleaning method {SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD}

The present invention relates to a substrate processing apparatus and substrate processing method using a substrate cleaning brush. The substrate to be processed includes, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for a plasma display, a substrate for a field emission display (FED), an optical disk or a magnetic disk, and the like. A substrate cleaning apparatus and a substrate cleaning method for removing foreign matter adhering to an edge portion of a disk-shaped substrate.

Conventionally, in the process of manufacturing a board | substrate, such as a semiconductor wafer, the board | substrate cleaning apparatus which removes the foreign material adhering to the edge part of the board | substrate W is used. 12 is a diagram showing an example of a conventional substrate cleaning apparatus. In the substrate cleaning apparatus of FIG. 12, the substrate W is rotated while the substrate W is held on the holding unit 110, and the substrate W is brought into contact with the edge portion E of the rotating substrate W by the polishing tape 120. Remove the foreign matter from the edge portion (E) of). Since abrasive grains such as diamond are adhered to the surface of the polishing tape 120, the polishing tape 120 is foreign matter on the edge portion E while polishing the edge portion E of the substrate W. Can be removed. 13 is a diagram showing another example of the conventional substrate cleaning apparatus. In the substrate cleaning apparatus of FIG. 13, the substrate W is rotated while holding the substrate W on the gripping portion 210, and the substrate 220 is brought into contact with the brush 220 made of resin against the edge portion E of the rotating substrate W. FIG. The foreign material is removed from the edge portion E of (W).

Such a conventional substrate cleaning apparatus is disclosed in Patent Document 1, for example.

[Patent Document 1] Japanese Patent Application Laid-Open No. 2004-241434

However, the conventional substrate cleaning apparatus shown in FIG. 12 removes foreign substances on the edge portion E while polishing the edge portion E of the substrate W by the polishing tape 120. For this reason, it is necessary to perform secondary washing in order to remove the grinding | polishing powder which generate | occur | produced by grinding | polishing, and there existed a problem which the number of processes of a washing process increases.

On the other hand, in the substrate cleaning apparatus shown in Fig. 13, the edge portion E of the substrate W is not polished, but since the brush made of resin is too soft, the edge portion E, like a metal film or slurry, is used. It was not possible to remove the foreign matter firmly attached to it. In recent years, in order to prevent cross contamination at the time of conveyance, the technical request that the metal slurry, such as tungsten, adhered to the edge part E of the board | substrate W, and the residue slurry of a CMP process are desired to be removed satisfactorily. Is rising.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method capable of satisfactorily removing foreign substances adhered firmly to the edge portion of the substrate without grinding the substrate itself. do.

SUMMARY OF THE INVENTION In order to solve the above problems, the invention according to claim 1 is a substrate cleaning apparatus for cleaning an edge portion of a substrate, the holding means for abutting abutting member against the edge portion of the substrate, and holding the substrate. A relative movement means for relatively moving the substrate and the butting member, wherein the butting member is made of an elastic material having a compressive modulus of not less than 0.3 MPa and not more than 2.7 MPa. It is done.

The invention according to claim 2 is the substrate cleaning device according to claim 1, wherein the butt member is made of the elastic material in which silica is incorporated.

The invention according to claim 3, further comprising a rinse liquid supply means for supplying a rinse liquid to a main surface of the substrate, wherein the rinse liquid supply means is a rinse liquid. It is characterized by supplying pure water.

The invention according to claim 4 is the substrate cleaning device according to claim 3, further comprising: a standby section in which the abutting member is immersed in a liquid in a non-washing time. It is characterized by including.

The invention according to claim 5 is the substrate cleaning device according to claim 4, wherein the abutment means has a plurality of the abutment members that abut against other regions of the edge portion of the substrate.

The invention according to claim 6 is the substrate cleaning apparatus according to claim 5, wherein the plurality of butt members are provided with a first butt member that abuts on one inclined surface of one edge portion of the substrate, and an agent that abuts the head of the edge portion of the substrate. And a second butting member and a third butting member which abuts against the inclined surface of the other side of the edge portion of the substrate.

The invention according to claim 7, the substrate cleaning apparatus according to claim 1, comprising: photographing means for photographing abutting surfaces of the butting member and the abutment member based on image data acquired by the genital imaging means; And detecting means for detecting a contaminant attached to the apparatus.

The invention according to claim 8 is the substrate cleaning apparatus according to claim 7, wherein the abutment means changes an abutment position of the abutment member relative to an edge portion of the substrate based on a detection result of the detection means. It is done.

The invention according to claim 9, wherein the substrate cleaning apparatus according to any one of claims 1 to 8, wherein the substrate is a circular substrate, and the relative movement means rotates the substrate around a central axis and the edge portion of the substrate. It characterized in that the butting member relative movement.

The invention according to claim 10 is a substrate cleaning method for cleaning an edge portion of a substrate, comprising: an abutting step of bringing abutting members into contact with an edge portion of the substrate, and a substrate and the abutting member while holding the substrate while continuing the abutting step; And a relative movement step for relative movement of the abutment member, wherein the abutting member is made of an elastic material having a compressive modulus of 0.3 MPa or more and 2.7 MPa or less.

The invention according to claim 11 is the substrate cleaning method according to claim 10, wherein the butt member is made of the elastic material in which silica is incorporated.

The invention according to claim 12 is the substrate cleaning method according to claim 11, wherein in the butting step, pure water is supplied to the rinse liquid by supplying a rinse liquid to the main surface of the substrate.

The invention according to claim 13 is the substrate cleaning method according to the twelfth aspect, further comprising an atmospheric step of waiting for the butting member to be immersed in a liquid.

The invention according to claim 14 is the substrate cleaning method according to claim 13, wherein in the abutting step, a plurality of the abutting members abut on different regions of the edge portion of the substrate, respectively.

The invention according to claim 15 is the substrate cleaning method according to claim 14, wherein the plurality of butt members include a first butt member that abuts on one inclined surface of one edge portion of the substrate, and the head of the edge portion of the substrate. And a second engaging member that abuts on the part, and a third engaging member that abuts on the inclined surface of the other side of the edge portion of the substrate.

The invention according to claim 16 is a substrate cleaning method according to claim 10, comprising: a photographing step of photographing abutment surfaces of the butt members, and contamination adhered to the butt members based on image data acquired in the photographing step. It is characterized by further comprising a contamination detection step for detecting the portion.

The invention according to claim 17 is the substrate cleaning method according to claim 16, wherein in the butting step, the butt position of the butt member against the edge of the substrate is changed based on a detection result of the contamination detection step. Characterized in that.

The invention according to claim 18 is the substrate cleaning method according to any one of claims 10 to 17, wherein the substrate is a circular substrate, and in the relative movement step, the substrate is rotated around the central axis, It characterized in that the butting member relative movement.

According to the invention of claim 1 or 10, the foreign material adhering to the edge portion is removed by bringing the butt member made of an elastic material having a compressive modulus of 0.3 MPa or more and 2.7 MPa or less to abut on the edge portion of the substrate. For this reason, foreign matters, such as a metal film and a slurry which adhered firmly to an edge part, can be favorably removed, without grind | polishing the edge part of a board | substrate.

In particular, according to the invention as set forth in claim 2 or 11, the foreign material adhering to the edge portion is removed by bringing the butt member made of the elastic material incorporating silica into contact with the edge portion of the substrate. For this reason, the foreign material adhering to the edge part of a board | substrate can be removed more favorably.

In particular, according to the invention according to claim 3 or 12, pure water is supplied as a rinse liquid. For this reason, secondary washing for removing the rinse liquid is not necessary.

In particular, according to the invention as set forth in claim 4 or 13, the non-washing member is made to stand in the state of being immersed in the liquid. For this reason, the butt member can maintain a predetermined compressive modulus.

In particular, according to the invention as set forth in claim 5 or 14, a plurality of said butting members are made to abut each other area | region of the edge part of a board | substrate. For this reason, the foreign material adhering to the some area | region of the edge part of a board | substrate can each remove efficiently.

In particular, according to the invention according to claim 6 or 15, foreign matter adhering to one inclined surface, the head portion and the other inclined surface of the edge portion of the substrate can be efficiently removed, respectively.

In particular, according to the invention as claimed in claim 7 or 16, the butt face of the butt member is photographed to detect a contaminant attached to the butt member based on the acquired image data. For this reason, the contamination part on the butt | matching member can be recognized as information.

In particular, according to the invention described in claim 8 or 17, the butt position of the butt member relative to the edge portion of the substrate is changed in accordance with the degree of contamination of the butt member. For this reason, the reattachment of the foreign material from the butt member to the board | substrate can be prevented, without replacing the butt member.

In particular, according to the invention as set forth in claim 9 or 18, the edge portion of the substrate and the butting member are moved relative to each other by rotating the circular substrate around the central axis. For this reason, the edge part of a board | substrate and abutting member can be moved relatively easily.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described, referring drawings.

<1. First embodiment>

1 is a top view of the substrate cleaning apparatus 1 according to the first embodiment of the present invention. 2 is a longitudinal cross-sectional view which cut | disconnected the board | substrate washing apparatus 1 with the II-II line of FIG. The substrate cleaning device 1 is a device for removing foreign matter such as a metal film or slurry attached to the edge portion E by cleaning the edge portion (the marginal portion) E of the disc-shaped substrate W. As shown in FIG. . As shown in FIG. 1 and FIG. 2, the substrate cleaning apparatus 1 mainly includes a substrate holding rotation unit 10, a pure water supply unit 20, an edge fitting mechanism 30, and a control unit 40. have.

The substrate holding rotation part 10 is a mechanism for rotating the substrate W about an axis perpendicular to the main surface of the substrate W while holding the substrate W in a horizontal position. As shown in FIG. 2, the substrate holding rotation part 10 includes a support part 11 for supporting the substrate W from the lower surface side, and a rotation drive mechanism 12 for rotating the support part 11. Have The support part 11 fixes and grips the board | substrate W in a horizontal posture, adsorption | suction to the lower surface of the board | substrate W by predetermined | prescribed suction pressure. The rotary drive mechanism 12 has a drive source, such as a motor, and rotates the support part 11 and the board | substrate W supported on the support part 11 as one body. Since the board | substrate W rotates around the vertical axis | shaft passing through the center, the edge part E of the board | substrate W during rotation passes about the same trajectory. In this embodiment, the support part 11 and the rotation drive mechanism 12 function as "relative movement means" of this invention.

The pure water supply unit 20 is a mechanism for supplying pure water as a rinse liquid to the upper surface (main surface) of the substrate W. As shown in FIG. As shown in FIG. 1 and FIG. 2, the pure water supply part 20 has the discharge nozzle 21 arrange | positioned above the support part 11 of the substrate holding rotation part 10. As shown in FIG. 2, the discharge nozzle 21 is connected to the pure water supply source 23 via the pure water supply line 22, and the on-off valve 24 is connected in the middle of the pure water supply line 22 path | route. It is installed. Therefore, when the on-off valve 24 is opened, pure water is supplied from the pure water supply source 23 to the discharge nozzle 21 through the pure water supply line 22, so that the upper surface of the substrate W is discharged from the discharge nozzle 21. Pure water is discharged toward. The discharge nozzle 21 discharges pure water toward an almost center of rotation of the substrate W. As shown in FIG. Therefore, when pure water is discharged while rotating the substrate W, the discharged pure water is supplied to the edge portion E of the substrate W while spreading from the rotation center of the substrate W to the entire upper surface of the substrate W. do.

The edge engaging mechanism 30 is a mechanism for making the abutting member 32 abut against the edge portion E of the substrate W. As shown in FIG. As shown in FIG. 1 and FIG. 2, the edge engaging mechanism 30 pivots and lifts the pivotal rock 31, the butt member 32 provided at the tip of the pivotal rock 31, and the pivotal rock 31. (I) it has a drive mechanism 33 for making it stand, and the standby part 34 for waiting the abutting member 32. As shown in FIG. The pivotal arm 31 is a substantially L-shaped rigid member whose tip end on the free end side is bent downward, and an abutting member 32 is provided on the surface of the substrate W side of the tip part bent downward. It is. Moreover, the drive mechanism 33 is connected to the edge part of the turning center side of the turning arm 31. As shown in FIG. The drive mechanism 33 is realized by various well-known mechanisms using a motor or the like. When the drive mechanism 33 is operated, the turning arm 31 pivots around the vertical axis, and the butting member 32 provided at the distal end portion of the turning arm 31 abuts against the edge portion E of the substrate W. As shown in FIG. It moves forward and backward between a position (solid line position in FIG. 1) and the standby position (imaginary line position in FIG. 1) separated from the edge part E of the board | substrate W. As shown in FIG. Then, the turning arm 31 grips the butt member 32 on the surface of the substrate W that faces the edge portion E. As shown in FIG. Therefore, in the butt position, the turning arm 31 and the edge portion E of the substrate W sandwich the butt member 32. For this reason, the butt member 32 abuts the edge part E of the board | substrate W favorably.

The butt member 32 mixes or impregnates a thermosetting resin such as phenol resin, melamine resin, epoxy resin, urethane resin and silica described below with resin such as polyvinyl acetal, polyurethane (PU), or a porous body thereof. By virtue of this, the elastic material whose compression modulus is adjusted is formed in a rectangular pad shape. Here, polyvinyl acetal is produced by making aldehydes react with the water-soluble resin of polyvinyl alcohol (PVA). Specifically, an elastic material having a compressive modulus of 0.3 MPa or more and 2.7 MPa or less in a sufficiently absorbed state is used. There are various methods for measuring the compressive modulus, but the above values may be expressed by, for example, the test method specified in JIS K7181 (corresponding international standard: ISO604). Since the butt member 32 is made of an elastic material having such a compressive modulus, the foreign material firmly attached to the edge portion E can be satisfactorily removed without polishing the edge portion E of the substrate W. Has the function. On the other hand, the shape of the butting member 32 is not limited to a rectangle as long as it is a plate-shaped pad shape, and may be a circumferential shape.

As can be seen from the results of the embodiments described below, when the compressive modulus of elastic materials constituting the butting member 32 is too lower than 0.3 MPa, the removal ability of the butt member 32 against foreign matters is significantly reduced. do. If the compressive elastic modulus of the elastic material constituting the butt member 32 is too high than 2.7 MPa, the butt member 32 is bounced off the edge portion E of the rotating substrate W, whereby the edge portion E It becomes difficult to contact continuously. For this reason, in order to remove the foreign material of the edge part E satisfactorily while continuously contacting the edge part E of the board | substrate W, an appropriate compressive modulus is needed. Specifically, the compressive modulus of the elastic material is preferably 0.3 MPa or more and 2.7 MPa or less, and more preferably 1.3 MPa, as described above, in a sufficiently absorbed state.

In order to obtain good water absorption, the elastic material constituting the butting member 32 preferably has a porosity of 25% by volume or more and 90% by volume or less, and preferably 50% by volume or more and 85% by volume or less. More preferred. If the porosity is lower than 25% by volume, the absorbency is poor. If the porosity is higher than 90% by volume, the strength of the elastic material is lowered, so that it cannot be tolerated during use. The elastic material constituting the butting member 32 is preferably 300% or less while having 3% or more of tensile fracture strain in order to obtain a good ability to remove foreign matters against sliding with the substrate W. If the tensile strain is lower than 3%, the mechanical strength of the elastic material is lowered, so that it cannot withstand use, and if the tensile strain is more than 400%, an adequate removal ability cannot be obtained.

In the elastic material constituting the butting member 32, particles of silica (for example, fumed silica or colloidal silica) are mixed as abrasive grains. For this reason, the butt member 32 can exfoliate the foreign material firmly attached to the edge part E by sliding contact with the edge part E of the board | substrate W. As shown in FIG. In this embodiment, while exhibiting moderate peeling ability with respect to a foreign material, the abrasive grain of 10 micrometers or less is used, while having an average particle diameter of 1 micrometer or more, so that the edge part E itself of the board | substrate W may not be polished. Here, if the average particle diameter of silica is smaller than 1 micrometer, the removal ability with respect to a foreign material will fall, and if the average particle diameter is larger than 10 micrometers, a board | substrate itself will be polished and wound.

Such an elastic material is, for example, mixed and stirred with an aqueous solution of polyvinyl alcohol, starch as a pore forming material, silica as an abrasive grain, and aldehydes as an acetalizing agent, After adding and reacting an acid, it can be formed as a polyvinyl acetal porous body by washing with water, drying and heat treatment. Moreover, you may produce as a polyurethane porous body by mixing polyol as a main material, isocyanate as a crosslinking agent, a foaming agent, and a curing catalyst, and reaction-hardening in a metal mold | die. In addition, these porous bodies may be prepared by impregnating the thermosetting resin with the porous body after mixing or after the reaction. However, the elastic material used by this invention is not limited to what was formed by such a manufacturing method.

3 is an enlarged longitudinal cross-sectional view showing a state when the pivoting arm 31 is pivoted toward the substrate W side to bring the abutting member 32 into contact with the edge portion E of the substrate W. As shown in FIG. Since the butt member 32 is made of an elastic material, when the flat mating surface (butt surface) of the butt member 32 abuts the edge portion E of the substrate W, the butt member 32 is butted. The surface is pushed into the edge portion E to a certain depth and deforms along the surface of the edge portion E. FIG. As a result, the butt member 32 is brought into contact with not only the head portion (apex portion) of the edge portion E but also the inclined surface (bevel portion) formed above and below. When the abutting member 32 is brought into contact with the edge portion E of the substrate W while the substrate W is rotated, the abutting member 32 is in sliding contact with the head portion and the inclined surface of the edge portion E, thereby providing an edge. The foreign material adhering to the head of the part E and the inclined surface is peeled off.

Returning to FIG. 1 and FIG. 2, the waiting section 34 is a portion for allowing the butt member 32 to stand by at the time of non-cleaning. The atmospheric part 34 has the storage tank 34a which has an inner diameter enough to accommodate the front-end | tip of the slewing rock 31, and pure water is stored in the storage tank 34a. It is. 4 is a longitudinal cross-sectional view taken along the line IV-IV in FIG. When the swing arm 31 is lowered by the drive mechanism 33 in a state where the swing arm 31 is pivoted to the upper portion of the storage tank 34a, as shown in FIG. 4, the tip and the tip of the swing arm 31 are shown. The butting member 32 provided in the inside is immersed in the pure water inside the storage tank 34a. The non-cleaning member 32 waits in the state immersed in pure water at the time of non-cleaning, and fully absorbs pure water, and maintains the compressive elastic modulus of an elastic material to a predetermined value.

The control part 40 is a computer device for controlling the operation of each part in the substrate cleaning device 1. As shown in FIG. 1 and FIG. 2, the control unit 40 is electrically connected to the rotary drive mechanism 12, the open / close valve 24, and the drive mechanism 33. The control part 40 advances the cleaning process of the board | substrate W by controlling the operation | movement of said rotation drive mechanism 12, the opening-closing valve 24, the drive mechanism 33, etc. according to a predetermined computer program.

Subsequently, the flow of the cleaning process in the substrate cleaning apparatus 1 will be described with reference to the flowchart of FIG. 5. When performing the cleaning treatment in the substrate cleaning apparatus 1, first, the substrate W after the CMP treatment, the substrate W after the plating wiring process, or the substrate W immediately before the CVD of the protective film formation are transferred out of the drawing. It conveys by a robot, the board | substrate W is mounted on the support part 11 of the board | substrate holding part 10, and the board | substrate W is adsorbed-held on the surface of the support part 11. As shown in FIG. Then, by operating the rotation driving mechanism 12, the substrate W is rotated around the vertical axis (step S11). In order to remove the foreign material satisfactorily without throwing the butt | matching member 32 in step S13 of a later stage, the control part 40 controls the rotation drive mechanism 12 so that the rotation speed of the board | substrate W may be in a predetermined range. . For example, when the diameter of the substrate W to be processed is about 200 mm, the rotation speed of the substrate W is preferably set to 200 rpm or less while being 50 rpm or more.

Next, the substrate cleaning device 1 opens the open / close valve 24 to discharge pure water from the discharge nozzle 21 of the pure water supply unit 20 toward the upper surface of the substrate W (step S12). The pure water discharged on the upper surface of the substrate W is supplied to the edge portion E of the substrate W while spreading from the rotation center of the substrate W to the entire upper surface of the substrate W, and thus the edge of the substrate W. After forming a liquid flow along the surface of the part E, it falls below the edge part E. FIG.

On the other hand, the butting member 32 is waiting in the state immersed in the pure water stored in the storage tank 34a (waiting process). When pure water spreads to the edge part E of the board | substrate W, the board | substrate cleaning apparatus 1 raises the turning rock 31 by operating the drive mechanism 33, and in the pure water stored in the storage tank 34a. By pulling up the butt member 32, it transfers from a standby process to a butt process. Subsequently, the substrate cleaning device 1 performs the butt step of bringing the butt member 32 into contact with the edge portion E of the substrate W by turning the swing arm 31 (step S13). The butt member 32 abuts against the edge portion E of the rotating substrate W to be deformed by pushing it to a certain depth (for example, about 0.5 mm). And the butt member 32 peels off the foreign material adhering to the edge part E by sliding contact with the head part and the inclined part of the edge part E. As shown in FIG. That is, the sliding contact between the butt member 32 and the edge portion E corresponds to the relative movement step of the present invention. The foreign substance peeled off from the edge part E is made to flow with the pure water which flows through the surface of the edge part E, and is removed from the edge part E immediately. For this reason, the foreign material once peeled off does not reattach to the board | substrate W. FIG.

When the abutment processing for a predetermined time is completed, the substrate cleaning device 1 rotates the turning arm 31 toward the standby portion 34 by operating the drive mechanism 33, and the abutting member 32 is moved to the substrate W. FIG. It separates from the edge part E of (step S14). Then, by lowering the swivel rock 31 in the standby position, the process proceeds to the atmospheric step of immersing the butt member 32 in the pure water stored in the storage tank 34a. The butt member 32 recovers its elastic modulus by absorbing pure water in the storage tank 34a, and waits for the next cleaning treatment.

Subsequently, the substrate cleaning device 1 closes the on / off valve 24 and stops the supply of pure water from the discharge nozzle 21 to the substrate W (step S15). Subsequently, the substrate cleaning apparatus 1 rotates the substrate W at a high speed by increasing the rotation speed of the rotation driving mechanism 12 to remove and remove the pure water remaining on the upper surface of the substrate W. FIG. That is, spin drying is performed on the substrate W (step S16). When the spin drying for a predetermined time is completed, the substrate cleaning apparatus 1 stops the rotation of the substrate W by stopping the rotation driving mechanism 12 (step S17), and the cleaning process for one substrate W is performed. Then, the substrate cleaning process is completed. Here, the timing of stopping the discharge of pure water from the discharge nozzle 21 is performed without time after the butt member 32 reaches the standby position, but is separated from the edge portion E of the butt member 32. You may stop at the same time.

As mentioned above, the board | substrate cleaning apparatus 1 of this embodiment uses the butt member 32 which consists of an elastic material which is 0.3 Mpa or more and has a compressive modulus of 2.7 Mpa or less, The edge part E of the board | substrate W The foreign material adhering to the edge part E is removed by making it contact with. For this reason, foreign matters, such as a metal film and a slurry which adhered firmly to the edge part E, can be favorably removed, without grinding the edge part of the board | substrate W. As shown in FIG. In addition, since silica as an abrasive grain is mixed in the elastic material which comprises the butt | matching member 32, the foreign material firmly attached to the edge part E can be peeled off and removed favorably.

Since the substrate cleaning apparatus 1 of the present embodiment does not polish the edge portion E of the substrate W, there is no fear of generating new particles such as abrasive powder during cleaning. In this embodiment, pure water is used as the rinse liquid. Therefore, the substrate cleaning process can be shortened without the need for secondary cleaning for removing the abrasive powder or the rinse liquid.

<Example 2.

FIG. 6 is a diagram showing the results of investigating the removal ability of foreign matter in each compressive modulus by changing the compressive modulus of the elastic material constituting the butt member 32 in the substrate cleaning apparatus 1 described above. . However, only when the compressive modulus is 0.01 MPa, the result of the cleaning process by the conventional substrate cleaning apparatus shown in FIG. 13 is shown. The main component of the elastic material having a compressive modulus of 0.3 to 130 MPa was polyurethane (polyurethane porous body), and the main component of the resin having a compressive modulus of 0.01 MPa (constituent material of the brush 220 in FIG. 13) was polyvinyl alcohol. . On the other hand, for the irradiation, the substrate W having a diameter of 200 mm was used, and the tungsten film formed on the edge portion E of the substrate W by CVD (chemical vapor deposition) was used as the removal object. In addition, the rotation speed of the board | substrate W was 100 rpm.

In this investigation, as shown in Fig. 6, when an elastic material having a compressive modulus of 0.3 to 2.7 MPa was used in a sufficiently absorbed state, a good removal effect of the tungsten film was confirmed. Accordingly, it has been found that, at a compression modulus of at least 0.3 to 2.7 MPa, a conventionally unattained effect of removing the tungsten film from the edge portion E without polishing the edge portion E of the substrate W is obtained. In addition, the removal ability with respect to the tungsten film was found to improve most in the vicinity of 1.3 MPa.

<3. Second Embodiment>

7 is a top view of the substrate cleaning apparatus 2 according to the second embodiment of the present invention. 8 is a longitudinal cross-sectional view which cut | disconnected the board | substrate washing apparatus 2 with the VIII-VIII line | wire of FIG. The substrate cleaning device 2 according to the present embodiment has a point in which the first butt mechanism 51, the second butt mechanism 52, and the third butt mechanism 53 are provided in place of the edge butt mechanism 30. Except for the above, it has a structure equivalent to the substrate cleaning apparatus 1 of the first embodiment. For this reason, below, it demonstrates centering around the structure of the 1st engagement mechanism 51, the 2nd engagement mechanism 52, and the 3rd engagement mechanism 53, The other part is FIG. 1, FIG. The same sign as 2 is used to omit duplicate explanation.

The first engaging mechanism 51 has a first engaging member 51a made of an elastic material equivalent to that of the engaging member 32 of the first embodiment. The first engaging member 51a is provided at the distal end of the first arm 51b, and the first driving mechanism 51c is connected to the other end of the first arm 51b. For this reason, when the 1st drive mechanism 51c is operated, the 1st arm 51b will move forward and backward, and the 1st engagement member 51a provided in the front-end | tip part of the 1st arm 51b will be the edge part of the board | substrate W. As shown in FIG. Abut and space apart with respect to (E). As shown in FIG. 7 and FIG. 8, the first abutting member 51a is an angle at which abutment surface with the substrate W is somewhat lower than the horizontal direction. It is inclined and arrange | positioned so that the angle which may be made is 45 degree | times. For this reason, the 1st engagement member 51a abuts mainly with respect to the upper inclined surface (upper bevel surface) among the edge parts E of the board | substrate W. As shown in FIG.

The second engagement mechanism 52 has a second engagement member 52a made of an elastic material equivalent to that of the engagement member 32 of the first embodiment. The second engaging member 52a is provided at the distal end of the second arm 52b, and the second driving mechanism 52c is connected to the other end of the second arm 52b. For this reason, when the 2nd drive mechanism 52c is operated, the 2nd arm 52b will move forward and backward, and the 2nd engagement member 52a provided in the front-end | tip part of the 2nd arm 52b will be the edge part of the board | substrate W. As shown in FIG. Abut and space apart with respect to (E). As shown in FIG. 7, the 2nd engaging member 52a is arrange | positioned upright so that the contact surface with the board | substrate W may face a horizontal direction. For this reason, the 2nd engaging member 52a abuts mainly with respect to a head part (apex part) among the edge parts E of the board | substrate W. As shown in FIG.

Moreover, the 3rd engagement mechanism 53 has the 3rd engagement member 53a comprised from the elastic material equivalent to the butting member 32 of 1st Embodiment. The third engaging member 53a is provided at the distal end of the third arm 53b, and the third driving mechanism 53c is connected to the other end of the third arm 53b. For this reason, when the 3rd drive mechanism 53c is operated, the 3rd arm 53b will move forward and backward, and the 3rd engagement member 53a provided in the front-end | tip part of the 3rd arm 53b will be the edge part of the board | substrate W. As shown in FIG. Abut and space apart with respect to (E). As shown in FIG. 7 and FIG. 8, the third abutment member 53a is formed at an angle at which the abutment surface with the substrate W is slightly higher than the horizontal direction. The angle formed is inclined at 45 degrees. For this reason, the 3rd engaging member 53a abuts with respect to the inclined surface (lower bevel surface) of the lower part among the edge parts E of the board | substrate W mainly.

9 is a flowchart showing the flow of the cleaning process in the substrate cleaning apparatus 2. In the substrate cleaning apparatus 2, when the cleaning process is performed, first, the substrate W is placed on the support portion 11 and rotated (step S21) as in the first embodiment described above (step S21). Pure water is discharged from the discharge nozzle 21 toward the upper surface of the substrate W (step S22). When pure water spreads to the edge part E of the board | substrate W, the board | substrate cleaning apparatus 2 first advances the 1st arm 51b, and moves the 1st engaging member 51a to the edge part of the board | substrate W. FIG. (E) (step S23). Thereby, the foreign material adhering mainly to the inclined surface of the upper part among the edge parts E of the board | substrate W is peeled off. Then, when the abutment processing for a predetermined time is completed, the substrate cleaning device 2 retreats the first arm 51b to separate the first abutting member 51a from the edge portion E of the substrate W. (Step S24).

Subsequently, the substrate cleaning device 2 advances the second arm 52b to bring the second engagement member 52a into contact with the edge portion E of the substrate W (step S25). Thereby, the foreign material adhering mainly to the part of the edge part E of the board | substrate W is peeled off. Then, when the abutment processing for a predetermined time is completed, the substrate cleaning device 2 retreats the second arm 52b to separate the second abutting member 52a from the edge portion E of the substrate W. (Step S26). Moreover, the board | substrate cleaning apparatus 2 advances the 3rd arm 53b, and makes the 3rd engaging member 53a abut on the edge part E of the board | substrate W (step S27). Thereby, the foreign material adhering mainly to the inclined surface of the lower side among the edge parts E of the board | substrate W is peeled off. Then, when the abutment processing for a predetermined time is completed, the substrate cleaning device 2 retreats the third arm 53b to separate the third abutting member 53a from the edge portion E of the substrate W. (Step S28).

Subsequently, the substrate cleaning apparatus 2 stops the discharge of pure water from the discharge nozzle 21 (step S29) and spin-drys (step S30), as in the first embodiment described above. The rotation of W is stopped (step S31), and the cleaning process with respect to one board | substrate W is complete | finished.

 Like the substrate cleaning device 1 of the first embodiment, the substrate cleaning device 2 of the present embodiment also includes butt members 51a, 52a, made of an elastic material having a compressive modulus of 0.3 MPa or more and 2.7 MPa or less. The foreign material adhering to the edge part E is removed by making 53a) contact the edge part E of the board | substrate W. As shown to FIG. For this reason, foreign matters, such as a metal film and a slurry which adhered firmly to the edge part E, can be favorably removed, without grinding the edge part of the board | substrate W. As shown in FIG. In addition, since the silica as the abrasive grains is mixed in the elastic materials constituting the butting members 51a, 52a, 53a, foreign matter firmly attached to the edge portion E can be removed while being satisfactorily peeled off.

In particular, the substrate cleaning device 2 of the present embodiment engages the three butt members 51a, 52a, and 53a to different regions, respectively, and attaches foreign materials attached to the respective regions to the respective butt members 51a, 52a, 53a. It removes by peeling. For this reason, the foreign material adhering to the some area can be removed efficiently, respectively. Moreover, the board | substrate cleaning apparatus 2 of this embodiment makes three abutting members 51a, 52a, 53a abut one by one in order. For this reason, the pressing force from two directions is not applied to the board | substrate W, and the damage of the board | substrate W can be prevented.

<4. Third Embodiment>

10 is a top view of the substrate cleaning apparatus 3 according to the third embodiment of the present invention. The board | substrate cleaning apparatus 3 of this embodiment has the board | substrate of said 1st embodiment except that the camera 60 is added and the swivel arm 31 of the edge fitting mechanism 30 can be elevated in multiple steps. It has a structure equivalent to the washing | cleaning apparatus 1. For this reason, below, it demonstrates centering around the structure of the edge fitting mechanism 30 and the camera 60, The other part attaches | subjects the same code | symbol as FIG. 1 in FIG. 10, and abbreviate | omits duplication description.

The camera 60 of the board | substrate washing | cleaning apparatus 3 is arrange | positioned at substantially the same height as the board | substrate W, and the imaging direction is toward the upper side of the storage tank 34a. For this reason, the camera 60 can image the abutment surface of the butt | matching member 32 arrange | positioned above the storage tank 34a, when the turning arm 31 turns to the standby part 34 side. In addition, the camera 60 is electrically connected to the control unit 40, and can transmit image data acquired by photographing to the control unit 40. On the other hand, the drive mechanism 33 of the edge alignment mechanism 30 is provided. ) Can raise and lower the swivel rock 31 in multiple stages. For this reason, the swivel arm 31 can adjust the height position of the butt | matching member 32 with respect to the edge part E of the board | substrate W. As shown in FIG.

The substrate cleaning device 3 performs the cleaning process in accordance with the flowchart of FIG. 5 like the substrate cleaning device 1 of the first embodiment. However, if the cleaning process is repeated, as shown in FIG. The contaminated portion 32a by foreign matter is attached to the mating surface of the member 32. Subsequently, the substrate cleaning apparatus 3 photographs the abutment surface of the butt member 32 with the camera 60 during the non-cleaning process, and analyzes the image data photographed in this photographing process by the controller 40 to detect the contaminants. Do it. When the concentration of the contaminated portion 32a in the image data is equal to or higher than a predetermined threshold value, as the detection result of the contaminated portion detecting step, the height of the turning rock 31 is changed during the next cleaning process to change the substrate W. Change the butt position of the butt member 32 with respect to the edge portion (E).

The substrate cleaning device 3 of the present embodiment, like the substrate cleaning device 1 of the first embodiment, also has a substrate 32 including abutting member 32 made of an elastic material having a compressive modulus of 0.3 MPa or more and 2.7 MPa or less. The foreign material adhering to the edge part E is removed by making it contact with the edge part E of (W). For this reason, the foreign material, such as a metal film or slurry firmly attached to the edge part E, can be favorably removed, without grinding the edge part of the board | substrate W. As shown in FIG. In addition, since silica as an abrasive grain is mixed in the elastic material which comprises the butt | matching member 32, the foreign material firmly attached to the edge part E can be removed, peeling favorably.

In particular, the substrate cleaning device 3 of the present embodiment photographs the butt member 32 by the camera 60, and the soiled portion 32a on the butt member 32 based on the image data obtained by the photographing. Detect. For this reason, the contamination part on the butt | matching member 32 can be recognized as information. In addition, the substrate cleaning apparatus 3 changes the abutting position of the butt member 32 with respect to the edge portion E of the substrate W when the detected degree of the contaminated portion 32a becomes severe. For this reason, the reattachment of the foreign material from the butt member 32 to the board | substrate W can be prevented, without replacing the butt member 32.

<5. Variation>

As mentioned above, although main embodiment of this invention was described, this invention is not limited to said embodiment. For example, in the above-described first to third embodiments, all of the substrates W are rotated in only one direction, but the rotation drive mechanism is repeated so as to repeat static electricity and reversal for a predetermined time. You may control (12). In this case, since the peeling force can be applied to the foreign material adhering to the edge part E in two directions, the foreign material which is hard to peel off only by rotation of one direction can be removed. In addition, although pure water was used as a rinse liquid in said 1st Embodiment-3rd Embodiment, you may use carbonated water and another washing | cleaning liquid as a rinse liquid.

Moreover, in the said embodiment, although the butt | matching member 32 is sliding against the edge part E of the board | substrate W by rotating the board | substrate W around the vertical axis which passes through the center, the stopped board | substrate W The relative moving step may be performed by moving the butt member 32 with respect to. In addition, in the said embodiment, although silica was mixed as an abrasive grain in the elastic material which comprises the butting member 32, you may use the elastic material which did not mix silica.

Moreover, you may combine the structure of said 2nd Embodiment and 3rd Embodiment. That is, each of the plurality of butt members 51a, 52a, 53a is photographed with a camera, and the contaminants of the respective butt members 51a, 52a, 53a are detected based on the image data acquired by the photographing, and the substrate ( The butting position of each butting member 51a, 52a, 53a with respect to the edge part E of W) may be changed.

1 is a top view of a substrate cleaning device according to the first embodiment.

FIG. 2 is a longitudinal cross-sectional view of the substrate cleaning device of the first embodiment, taken along line II-II of FIG. 1.

3 is an enlarged longitudinal sectional view showing a state when the butt member is brought into contact with the edge portion of the substrate.

4 is a longitudinal cross-sectional view taken along the line IV-IV of FIG.

5 is a flowchart showing the flow of the cleaning process of the first embodiment.

FIG. 6 is a diagram showing a result of investigating the ability to remove foreign matter in each compressive modulus by varying the compressive modulus of the elastic material constituting the butt member.

7 is a top view of the substrate cleaning device according to the second embodiment.

8 is a longitudinal cross-sectional view of the substrate cleaning device of the second embodiment, taken along the line VIII-VIII in FIG. 7.

9 is a flowchart showing the flow of the cleaning process of the second embodiment.

10 is a top view of the substrate cleaning device according to the third embodiment.

11 is a view showing the shape of the butt member attached to the contamination.

12 is a view showing an example of a conventional substrate cleaning apparatus.

13 is a view showing another example of the conventional substrate cleaning apparatus.

[Description of the code]

1,2,3 substrate cleaning device 10 substrate holding part

20 Pure water supply 30 Edge alignment mechanism

31 Slewing Rock 32 Butt Member

33 Drive mechanism 34 Atmosphere

34a reservoir 40 control unit

51 First Alignment Mechanism 52 Second Alignment Mechanism

53 Third engaging mechanism 51a, 52a, 53a butting member

51b, 52b, 53b Arm 51c, 52c, 53c Drive Mechanism

60 Camera W Board

E edge

Claims (18)

A substrate cleaning device for cleaning the edge of the substrate, Abutting means for bringing the edge portion of the substrate into contact with the butt member; Relative movement means for relatively moving the substrate and the butting member while holding the substrate, And the butt member is made of an elastic material having a compressive modulus of 0.3 MPa or more and 2.7 MPa or less. The method of claim 1, The butt member is composed of the elastic material in which silica is mixed. The method of claim 2, A rinse liquid supplying means for supplying a rinse liquid to a main surface of the substrate, And said rinse liquid supplying means supplies pure water as a rinse liquid. The method of claim 3, A substrate cleaning apparatus, further comprising: a standby section for allowing the abutment member to stand in a liquid state during non-cleaning time. The method of claim 4, wherein And said abutment means has a plurality of said abutment members which abut against other regions of an edge portion of a substrate. The method of claim 5, The plurality of butt members, A first abutting member abutting the inclined surface on one side of the edge portion of the substrate; A second butting member abutting the head of the edge portion of the substrate; And a third engaging member against the inclined surface on the other side of the edge of the substrate. The method of claim 1, Photographing means for photographing the butt surface of the butt member; And a detecting means for detecting a contaminant adhering to the butting member based on the image data acquired by the penis photographing means. The method of claim 7, wherein And said abutment means changes an abutment position of said abutment member relative to an edge portion of the substrate based on a detection result of said detection means. The method according to any one of claims 1 to 8, The substrate is a circular substrate, And the relative movement means relatively moves the edge portion of the substrate and the abutment member by rotating the substrate about a central axis. As a substrate cleaning method for cleaning the edge of the substrate, An abutting step of bringing the butting member into contact with the edge portion of the substrate; A relative movement step of relatively moving the substrate and the butt member while holding the substrate while continuing the abutment step, And the butt member is made of an elastic material having a compressive modulus of 0.3 MPa or more and 2.7 MPa or less. The method of claim 10, And the butt member is made of the elastic material incorporating silica. The method of claim 11, In the butt step, the pure water as a rinse liquid is supplied to the main surface of the substrate. The method of claim 12, And a standby step of allowing the butt member to be immersed in a liquid. The method of claim 13, In the abutting step, a plurality of the abutting members abut on different regions of the edge portion of the substrate, respectively. The method of claim 14, The plurality of butt members, A first abutting member abutting the inclined surface on one side of the edge portion of the substrate; A second butting member abutting the head of the edge portion of the substrate; And a third engaging member against the inclined surface on the other side of the edge portion of the substrate. The method of claim 10, A photographing step of photographing the butt surface of the butt member; And a contaminant detecting step of detecting a contaminated part adhering to the butt member based on the image data acquired in the photographing step. The method of claim 16, In the butt step, the butt position of the butt member relative to the edge of the substrate is changed based on the detection result of the dirt detection step. The method according to any one of claims 10 to 17, The substrate is a circular substrate, In the relative movement step, the substrate cleaning method is characterized by relatively moving the edge portion of the substrate and the butting member by rotating the substrate around the central axis.

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