CN116153803B - Semiconductor wafer test bench with cleaning structure and method - Google Patents
Semiconductor wafer test bench with cleaning structure and method Download PDFInfo
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- CN116153803B CN116153803B CN202310440678.0A CN202310440678A CN116153803B CN 116153803 B CN116153803 B CN 116153803B CN 202310440678 A CN202310440678 A CN 202310440678A CN 116153803 B CN116153803 B CN 116153803B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 238
- 238000012360 testing method Methods 0.000 title claims abstract description 50
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 20
- 230000000712 assembly Effects 0.000 claims description 16
- 238000000429 assembly Methods 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 5
- 230000033001 locomotion Effects 0.000 claims description 4
- 238000001310 location test Methods 0.000 claims 2
- 238000012545 processing Methods 0.000 abstract description 7
- 230000003749 cleanliness Effects 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 113
- 230000006872 improvement Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012956 testing procedure Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- B08B1/143—
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- B08B1/32—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Abstract
The invention relates to the technical field of wafer processing, in particular to a semiconductor wafer test bench with a cleaning structure and a method. The wafer cleaning device comprises a bearing table, a conveyor arranged on one side of the bearing table and a positioning test machine table arranged on the surface of the bearing table, wherein the positioning test machine table comprises a base for bearing a wafer, a plurality of side cleaning components are arranged on the base, a top cleaning component is arranged on the base, and when the wafer is cleaned, the side cleaning components are used for cleaning foreign matters falling on the side face of the wafer and the base, and the side cleaning components form a positioning structure so as to position the wafer on the base. The side cleaning arm, the inner cleaning arm and the outer cleaning arm are always attached to the surface of the wafer so as to clean the top surface and the side surface of the wafer, and the side cleaning arm cleans the surface of the base table along with the top surface of the wafer when cleaning the wafer so as to improve the cleanliness of the wafer and the base table and facilitate the subsequent test of the wafer.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a semiconductor wafer test bench with a cleaning structure and a method.
Background
The wafer processing step comprises a wafer processing step and a wafer needle testing step, wherein the wafer is subjected to repeated steps of film coating, exposure, development, etching, ion implantation, metal sputtering and the like through the wafer processing step, and finally a plurality of layers of circuits and components are processed and manufactured on the wafer, and then the wafer is subjected to the needle testing step through a test bench so as to position the position with damage abnormality on the wafer.
After a large number of wafers pass through a plurality of processing steps in a wafer processing procedure, a large number of wafers are stored at fixed points or are directly conveyed to a test bench in a wafer needle testing procedure through a conveying belt for testing, but after a plurality of steps are processed or are stacked and stored in a naked mode, small particles such as dust are inevitably adhered to the surfaces of the wafers, so that in order to improve the accuracy of the wafer needle testing procedure, the wafers are cleaned quickly in a surface and side cleaning mode, for example, the small particles are cleaned simultaneously on a plurality of sides of the wafers through cotton plates in the conventional mode, and meanwhile, the aim of cleaning is to improve the overall cleaning efficiency of the large number of wafers, but a certain problem is also caused, and the method comprises the following steps of:
when the top surface of the wafer (the top surface is wiped because the wafer is tested on the front surface during the testing process, that is, the top surface, and the cotton plate is usually adopted to slide along one end of the surface to wipe the other side at present) and the side surface (the cotton plate is usually adopted to wipe the side surface of the wafer to wipe the side surface by rotating a bit around the side surface of the wafer in a ring shape), the particulate matters on the surface of the wafer roll off to the side along the edge of the surface of the wafer during the top surface wiping, and at the moment, the wiped part of the side surface of the wafer is influenced again;
the particles roll to the side and then fall on the test bench, so that the test bench is influenced when the wafer is placed stably, and when the wafer cannot be placed on the test bench in a horizontal state due to the influence of the particles, the test probes in the wafer needle test procedure apply different pressures to the surface of the wafer, so that the wafer is influenced and the needle test accuracy is influenced;
with reference to the above, before cleaning and testing the wafer, the wafer needs to be placed on the test bench by the mechanical arm and positioned, and the currently adopted positioning device is usually a large positioning mechanism and cannot be matched with the step of cleaning the wafer in an auxiliary manner, so that an excessive use cost is generated.
Disclosure of Invention
The present invention is directed to a semiconductor wafer test bench with a cleaning structure and a method thereof, so as to solve the above-mentioned problems in the prior art.
In order to achieve the above object, one of the objects of the present invention is to provide a semiconductor wafer test bench with a cleaning structure, comprising a receiving bench, a conveyor disposed at one side of the receiving bench, and a positioning test bench mounted on the surface of the receiving bench, wherein the positioning test bench comprises a base for receiving a wafer, a plurality of side cleaning components are disposed on the base, the side cleaning components are used for cleaning the side surface of the wafer, a top cleaning component is mounted on the base, the top cleaning component is used for cleaning the surface of the wafer, and when cleaning the wafer, the side cleaning components clean foreign matters falling on the side surface of the wafer and the base, wherein:
the plurality of side cleaning assemblies form a positioning structure for positioning the wafer on the susceptor.
As a further improvement of the technical scheme, the side cleaning assembly comprises a side cleaning arm arranged on the base, one end of the side cleaning arm is contacted with the side face of the wafer, a driving arm is arranged on the side cleaning arm in a sliding mode, a fixing portion is arranged on the driving arm in a rotating mode and driven by a transmission motor, the top cleaning assembly comprises an inner cleaning arm, two sides of the inner cleaning arm are provided with outer cleaning arms, the outer cleaning arms are driven by transmission cylinders, and top cylinders are arranged on the side face of the inner cleaning arm.
As a further improvement of the technical scheme, the side cleaning arms are fixedly connected with the driving arms through supporting springs, and the side cleaning arms form a positioning structure for the wafer in the moving process, and the wafer is positioned through the positioning structure.
As a further improvement of the technical scheme, when the side cleaning arm and the driving arm synchronously move, the side cleaning arm and the driving arm are used for cleaning the foreign matters falling on the base.
As a further improvement of the technical scheme, the thickness dimension of the side cleaning arm is the same as that of the wafer, and when the inner cleaning arm and the outer cleaning arm are separated from the surface of the wafer, the side cleaning arm contacts the bottoms of the inner cleaning arm and the outer cleaning arm and cleans foreign matters attached to the bottoms.
As a further improvement of this technical scheme, install a plurality of locating component on the base, locating component is including setting up the outer locating arm on the base, be connected with the interior locating arm on the outer locating arm, the outer locating arm is used for contacting with the side clearance arm, clears away the foreign matter on the side clearance arm side through the outer locating arm, wherein:
after the outer positioning arm is contacted with the side cleaning arm, the outer positioning arm guides the foreign matters on the base to move to one side.
As a further improvement of the technical scheme, the outer positioning arm is provided with a first sliding arm in a sliding manner, the first sliding arm is connected with the outer positioning arm through an inner positioning spring, one end, far away from the outer positioning arm, of the first sliding arm is connected with a second sliding arm, the second sliding arm is fixed on the inner positioning arm, and the second sliding arm is connected with the first sliding arm through a sliding arm spring.
As a further improvement of the technical scheme, a closed gathering and retaining chamber is formed among the outer positioning arm, the side cleaning arm and the wafer, a bearing bin is arranged on the base, and the bearing bin is positioned on the gathering and retaining chamber.
As a further improvement of the technical scheme, one end of the fixing part is connected with a side air cylinder, and the side air cylinder is used for controlling the position of the side cleaning arm;
the driving arm is connected with the fixing part through an external positioning spring.
The second object of the present invention is to provide a method for using a semiconductor wafer test bench with a cleaning structure, comprising the following steps:
step one: the top cleaning component and the side cleaning component move to clean the surface and the side wall of the wafer, and the side cleaning component moves on the base according to the side cleaning component, so that the side cleaning component can clean the residual foreign matters on the surface of the base along with the movement of the side cleaning component;
step two: a plurality of side cleaning components form a positioning structure, and the positioning structure is used for positioning and correcting the wafer on the base so as to test the wafer.
Compared with the prior art, the invention has the beneficial effects that:
1. in the semiconductor wafer test table with the cleaning structure and the method, the side cleaning arm, the inner cleaning arm and the outer cleaning arm are always attached to the surface of the wafer so as to clean the foreign matters on the top surface and the side surface of the wafer, and the side cleaning arm is used for cleaning the foreign matters on the surface of the base table when cleaning the wafer so as to improve the cleanliness of the wafer and the base table and facilitate the subsequent test of the wafer.
2. In the semiconductor wafer test table with the cleaning structure and the method, the side cleaning arm is contacted with the outer positioning arm, the outer positioning arm is used for cleaning foreign matters attached to the surface of the side cleaning arm, and the side cleaning arm and the outer positioning arm form a guiding structure so as to guide the cleaned primer into the gathering and reserving chamber to collect the foreign matters.
3. In the semiconductor wafer test table with the cleaning structure and the method, the side cleaning arm is contacted with the inner cleaning arm and the outer cleaning arm so as to clean foreign matters attached to the bottoms of the inner cleaning arm and the outer cleaning arm, and the cleanliness of the wafers cleaned by the inner cleaning arm and the outer cleaning arm is improved.
4. In the semiconductor wafer test table with the cleaning structure and the method, the positioning structure is formed by the plurality of side cleaning arms, so that the wafer is positioned by the positioning structure, and when the wafer is not placed on the base table, the side cleaning arms extend out of the driving arms to enlarge the cleaning area of the base table and improve the cleanliness of the base table.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a second schematic diagram of the overall structure of the present invention;
FIG. 3 is a schematic diagram of a positioning test machine according to the present invention;
FIG. 4 is a schematic view of the structure A of FIG. 3 according to the present invention;
FIG. 5 is a schematic view of a side cleaning assembly and positioning assembly of the present invention;
FIG. 6 is a schematic view of a side cleaning assembly and base station configuration of the present invention;
FIG. 7 is a schematic view of a side cleaning assembly of the present invention;
FIG. 8 is a schematic view of a positioning assembly according to the present invention;
FIG. 9 is a top view of a positioning test machine structure of the present invention;
fig. 10 is a schematic view of the structure of the receiving bin of the invention.
The meaning of each reference sign in the figure is:
10. a receiving table;
20. a conveyor;
30. positioning a test machine;
310. a base;
320. a side cleaning assembly; 321. a side cleaning arm; 322. a driving arm; 323. a fixing part; 324. a drive motor; 325. a side cylinder; 326. a positioning spring; 327. a support spring;
330. a top cleaning assembly; 331. an inner cleaning arm; 332. an outer cleaning arm; 333. a top cylinder;
340. a positioning assembly; 341. an outer positioning arm; 342. a first slider arm; 343. a second slide arm; 344. an inner positioning arm; 345. positioning a spring; 346. a slide arm spring;
350. and a receiving bin.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 and 2, an object of the present invention is to provide a semiconductor wafer test table with a cleaning structure, which includes a receiving table 10, a conveyor 20 disposed on one side of the receiving table 10, and a positioning test table 30 mounted on a surface of the receiving table 10, wherein the positioning test table 30 includes a base 310 for receiving a wafer, a plurality of side cleaning assemblies 320 are disposed on the base 310, the side cleaning assemblies 320 are used for cleaning a side surface of the wafer, a top cleaning assembly 330 is mounted on the base 310, the top cleaning assembly 330 is used for cleaning a surface of the wafer, and when cleaning the wafer, the side cleaning assemblies 320 clean foreign matters falling on the side surface of the wafer and the base 310, and the plurality of side cleaning assemblies 320 form a positioning structure to position the wafer on the base 310. The wafer on the conveyor 20 is clamped by the mechanical arm (for both the mechanical arm and the conveyor 20, this is not illustrated in the present embodiment), and the wafer is located between the plurality of side cleaning assemblies 320, and the side cleaning assemblies 320 are used to first position the wafer, and then clean the sides and the surface of the wafer according to the movement of the side cleaning assemblies 320 and the top cleaning assemblies 330, where the side cleaning assemblies 320 clean the sides of the wafer, and clean the foreign matters dropped onto the sides of the wafer, and in the process, the side cleaning assemblies 320 clean the foreign matters dropped onto the surface of the base 310, so that the wafer can be cleaned, and the base 310 is cleaned, so that the subsequent wafer is tested on the base 310, and the above technical scheme is as follows:
referring to fig. 1-8, cleaning of the top and side surfaces of the wafer is specifically performed: the side cleaning assembly 320 comprises a side cleaning arm 321 arranged on a base 310, one end of the side cleaning arm 321 is contacted with the side surface of a wafer, a driving arm 322 is slidably arranged on the side cleaning arm 321, a fixing part 323 is connected to the driving arm 322, the fixing part 323 is driven by a transmission motor 324, the top cleaning assembly 330 comprises an inner cleaning arm 331, two sides of the inner cleaning arm 331 are provided with outer cleaning arms 332, the outer cleaning arms 332 are driven by transmission cylinders, the side surface of the inner cleaning arm 331 is provided with a top cylinder 333, the wafer is placed between the side cleaning arms 321, the side cleaning arms 321 are contacted with the side surface of the wafer, the inner cleaning arms 331 and the outer cleaning arms 332 are contacted with the surface of the wafer through the top cylinder 333, then, the inner cleaning arms 331 and the outer cleaning arms 332 are driven to clean the foreign matters on the surface of the wafer through the top cylinder 333, the transmission motor 324 drives the fixing part 323 and the driving arm 322 to rotate, the side cleaning arms 321 move relatively along the surface contacted with the wafer, the side cleaning arms 321 drop to the surface and the wafer to the side surface of the wafer, the inner cleaning arms 331 are matched with the inner cleaning arms 332 or the outer cleaning arms 332 are matched with the inner cleaning arms to the inner cleaning arms.
Wherein, the side cleaning arm 321 and the driving arm 322 are fixedly connected through the supporting spring 327, and the side cleaning arm 321 forms a positioning structure for the wafer in the moving process, the wafer is positioned through the positioning structure, the side cleaning arm 321 is under the elastic pressure of the supporting spring 327, so that the side cleaning arm 321 is always contacted on the side surface of the wafer, and the side surfaces of the plurality of side cleaning arms 321 and the wafer are contacted and continuously pressed to position the wafer, thereby facilitating the cleaning and the subsequent testing of the wafer.
One end of the fixing portion 323 is connected with a side air cylinder 325, and the side air cylinder 325 is used for controlling the position of the side cleaning arm 321; the driving arm 322 is connected with the fixing part 323 through the external positioning spring 326, when the wafer is initially placed, the fixing part 323 is driven to move outwards through the side air cylinder 325, so that the side cleaning arm 321 is gradually far away from the middle position of the base 310, the wafer is placed on the base 310, the side cleaning arm 321 is in reset motion to contact with the side surface of the wafer, the side surface of the wafer can be cleaned along with the rotation of the side cleaning arm 321, and the stability when the fixing part 323 is driven to rotate by the transmission motor 324 is improved through the connection of the external positioning spring 326.
Influence of the side cleaning arms 321 and drive arms 322 on the base 310: when the side cleaning arm 321 and the driving arm 322 move synchronously, the side cleaning arm 321 and the driving arm 322 are used for cleaning the foreign matters falling on the base 310, so that the side cleaning arm 321 and the driving arm 322 are contacted with the base 310, the side cleaning arm 321 and the driving arm 322 can scrape the foreign matters falling on the cleaning base 310, and the side cleaning arm 321 and the driving arm 322 move to push and guide the cleaned foreign matters so as to collect a large amount of foreign matters, and the cleaning convenience of the whole foreign matters is improved.
Interaction between side clearance arm 321, inner clearance arm 331 and outer clearance arm 332: because the thickness dimension of the side cleaning arm 321 is the same as that of the wafer, the inner cleaning arm 331 and the outer cleaning arm 332 are contacted with each other on the wafer, and therefore, the top surface of the side cleaning arm 321, the bottom surface of the inner cleaning arm 331 and the bottom surface of the outer cleaning arm 332 are contacted with each other, and therefore, firstly, the inner cleaning arm 331 and the outer cleaning arm 332 are moved to clean the foreign matters on the surface of the wafer, and then after the inner cleaning arm 331 and the outer cleaning arm 332 are separated from the wafer, the side cleaning arm 321 is continuously extended outwards under the elasticity of the supporting spring 327 and contacts the foreign matters on the bottoms of the inner cleaning arm 331 and the outer cleaning arm 332, so that the cleanliness of the inner cleaning arm 331 and the outer cleaning arm 332 can be improved, and the cleaning degree of the wafer can be synchronously improved.
With reference to fig. 3, 5 and 8, expansion and extension are performed on the basis of the above technical scheme: the base 310 is provided with a plurality of positioning assemblies 340, the positioning assemblies 340 comprise outer positioning arms 341 arranged on the base 310, the outer positioning arms 341 are connected with inner positioning arms 344, the outer positioning arms 341 are used for being in contact with the side cleaning arms 321, foreign matters on the side surfaces of the side cleaning arms 321 are cleaned through the outer positioning arms 341, after the outer positioning arms 341 are in contact with the side cleaning arms 321, the outer positioning arms 341 guide the foreign matters on the base 310 to move to one side, the inner positioning arms 344 are controlled to rotate through a driving motor, a fixing seat is arranged on the driving motor, the fixing seat is arranged on a top cylinder 333, therefore, when the side cleaning arms 321 move laterally to clean the foreign matters attached to the side surfaces of a wafer, the driving motor controls the inner positioning arms 344 and the outer positioning arms 341 to rotate inwards (the center of the base 310), so that the outer positioning arms 341 always scrape and clean the side surfaces of the side cleaning arms 321, and a large amount of foreign matters are gathered when the foreign matters are guided by the side cleaning arms 321 and the outer positioning arms 341, so that the foreign matters are cleaned.
The outer positioning arm 341 is slidably provided with a first sliding arm 342, the first sliding arm 342 is connected with the outer positioning arm 341 through an inner positioning spring 345, one end of the first sliding arm 342 far away from the outer positioning arm 341 is connected with a second sliding arm 343, the second sliding arm 343 is fixed on an inner positioning arm 344, the second sliding arm 343 is connected with the first sliding arm 342 through a sliding arm spring 346, an elastic structure is formed among the outer positioning arm 341, the first sliding arm 342 and the second sliding arm 343 through an elastic connection of the inner positioning spring 345 and the sliding arm spring 346 (wherein the second sliding arm 343 and the inner positioning arm 344 are of an integral structure), when the outer positioning arm 341 is under the pressure of the side cleaning arm 321, the outer positioning arm 341 slides and retracts along the first sliding arm 342, when the outer positioning arm 341 is closer to the outer positioning arm 341 due to the moving distance, the first sliding arm 342 slides on the second sliding arm 343, so that the outer positioning arm 341 always contacts the surface of the side cleaning arm 321 and the foreign matters on the surface of the side cleaning arm 321 are scraped off, the outer positioning arm 321 cannot clean the side 321, and the side cleaning side wall 321 cannot be cleaned by the outer positioning arm 321 is prevented from being caused by the fact that the side cleaning is too much pressure is difficult to be cleaned.
Different from one of the possible cases described above: when the wafer is not placed on the susceptor 310 and the side cylinders 325 do not adjust the position of the side cleaning arms 321, the side cleaning arms 321 extend toward the middle of the susceptor 310 under the elastic force of the supporting springs 327, and at this time, the driving arms 322 and the side cleaning arms 321 are controlled to rotate by the driving motor 324, so that multiple positions on the surface of the susceptor 310 can be cleaned, and the cleaning area of the susceptor 310 is increased.
With reference to fig. 9 and 10, extensions are made again to the above scheme: a closed gathering chamber is formed among the outer positioning arms 341, the side cleaning arms 321 and the wafer, the bearing bin 350 is mounted on the base 310, the bearing bin 350 is located on the gathering chamber, the outer positioning arms 341 and the side cleaning arms 321 continuously rotate, when two outer positioning arms 341 are close to each other, at the moment, the outer positioning arms 341 and the side cleaning arms 321 are close to each other synchronously, at the moment, the outer positioning arms 341 and the side cleaning arms 321 compress foreign matters scraped off the side surface of the wafer at first, a large amount of foreign matters enter the gathering chamber (the gathering chamber is provided with two symmetrical positions on the surface of the base 310 respectively), and at the moment, the foreign matters enter the bearing bin 350 through the gathering chamber to be collected, so that the whole cleaning and collection of the foreign matters on the wafer and the base 310 are realized.
The second object of the present invention is to provide a method for using a semiconductor wafer test bench with a cleaning structure, comprising the following steps:
step one: the top cleaning component 330 and the side cleaning component 320 are moved to clean the surface and the side wall of the wafer, and the side cleaning component 320 is moved on the base 310 according to the side cleaning component 320, so that the side cleaning component 320 can clean the residual foreign matters on the surface of the base 310;
step two: a plurality of side cleaning assemblies 320 form a positioning structure to position and correct the wafer on the base 310 for testing the wafer.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present invention, and are not intended to limit the invention, and that various changes and modifications may be made therein without departing from the spirit and scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. The utility model provides a semiconductor wafer test bench with clearance structure, includes accepting bench (10), sets up conveyer (20) and install location test machine (30) at accepting bench (10) surface in accepting bench (10) one side, location test machine (30) are including base (310) that are used for accepting the wafer, its characterized in that: be provided with a plurality of lateral part clearance subassembly (320) on base (310), lateral part clearance subassembly (320) are used for clearing up the side of wafer, install top clearance subassembly (330) on base (310), top clearance subassembly (330) are used for the surface cleaning of wafer, and when the clearance wafer, lateral part clearance subassembly (320) all clear up the foreign matter that drops on wafer side and base (310), wherein:
a plurality of side cleaning assemblies (320) forming a positioning structure for positioning the wafer on the susceptor (310);
the side cleaning assembly (320) comprises a side cleaning arm (321) mounted on a base (310), one end of the side cleaning arm (321) is contacted with the side face of a wafer, a driving arm (322) is slidably arranged on the side cleaning arm (321), a fixing portion (323) is connected to the driving arm (322), the fixing portion (323) is driven by a transmission motor (324), the top cleaning assembly (330) comprises an inner cleaning arm (331), outer cleaning arms (332) are arranged on two sides of the inner cleaning arm (331), the outer cleaning arms (332) are driven by transmission cylinders, and top cylinders (333) are mounted on the side faces of the inner cleaning arms (331).
2. The semiconductor wafer test station with cleaning structure of claim 1, wherein: the side cleaning arm (321) is fixedly connected with the driving arm (322) through a supporting spring (327), and the side cleaning arm (321) forms a positioning structure for the wafer in the movement process, and the wafer is positioned through the positioning structure.
3. The semiconductor wafer test station with cleaning structure of claim 1, wherein: when the side cleaning arm (321) and the driving arm (322) synchronously move, the side cleaning arm (321) and the driving arm (322) are used for cleaning the foreign matters falling on the base (310).
4. The semiconductor wafer test station with cleaning structure of claim 1, wherein: the side cleaning arms (321) are the same as the thickness of the wafer, and when the inner cleaning arms (331) and the outer cleaning arms (332) are separated from the surface of the wafer, the bottoms of the inner cleaning arms (331) and the outer cleaning arms (332) are contacted by the side cleaning arms (321) and foreign matters attached to the bottoms are removed.
5. The semiconductor wafer test station with cleaning structure of claim 1, wherein: install a plurality of locating component (340) on base (310), locating component (340) are including setting up outer locating arm (341) on base (310), be connected with interior locating arm (344) on outer locating arm (341), outer locating arm (341) are used for with side clearance arm (321) contact, clear away the foreign matter on side clearance arm (321) side through outer locating arm (341), wherein:
after the outer positioning arm (341) is contacted with the side cleaning arm (321), the outer positioning arm (341) guides the foreign matter on the base (310) to move to one side.
6. The semiconductor wafer test station with cleaning structure of claim 5, wherein: the outer positioning arm (341) is provided with a first sliding arm (342) in a sliding manner, the first sliding arm (342) is connected with the outer positioning arm (341) through an inner positioning spring (345), one end, far away from the outer positioning arm (341), of the first sliding arm (342) is connected with a second sliding arm (343), the second sliding arm (343) is fixed on an inner positioning arm (344), and the second sliding arm (343) is connected with the first sliding arm (342) through a sliding arm spring (346).
7. The semiconductor wafer test station with cleaning structure of claim 6, wherein: a closed gathering chamber is formed among the outer positioning arm (341), the side cleaning arm (321) and the wafer, a receiving bin (350) is mounted on the base (310), and the receiving bin (350) is located on the gathering chamber.
8. The semiconductor wafer test station with cleaning structure of claim 1, wherein: one end of the fixing part (323) is connected with a side air cylinder (325), and the side air cylinder (325) is used for controlling the position of the side cleaning arm (321);
the driving arm (322) is connected with the fixing part (323) through an external positioning spring (326).
9. A method of use for the generation of a semiconductor wafer test station with cleaning structure according to claim 1, characterized in that: the method comprises the following steps:
step one: cleaning the surface and the side walls of the wafer by moving the top cleaning component (330) and the side cleaning component (320), and moving the side cleaning component (320) on the base (310) according to the side cleaning component (320), so that the side cleaning component (320) can remove the residual foreign matters on the surface of the base (310);
step two: a plurality of side cleaning assemblies (320) form a positioning structure, and the positioning structure is used for positioning and correcting the wafer on the base (310) so as to test the wafer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310440678.0A CN116153803B (en) | 2023-04-23 | 2023-04-23 | Semiconductor wafer test bench with cleaning structure and method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310440678.0A CN116153803B (en) | 2023-04-23 | 2023-04-23 | Semiconductor wafer test bench with cleaning structure and method |
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| CN116153803A CN116153803A (en) | 2023-05-23 |
| CN116153803B true CN116153803B (en) | 2023-07-14 |
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| JP2001070896A (en) * | 1999-07-06 | 2001-03-21 | Ebara Corp | Substrate washing device |
| US6550091B1 (en) * | 2000-10-04 | 2003-04-22 | Lam Research Corporation | Double-sided wafer edge scrubbing apparatus and method for using the same |
| JP3933670B2 (en) * | 2005-03-29 | 2007-06-20 | 東京エレクトロン株式会社 | Substrate cleaning method and substrate cleaning apparatus |
| WO2006116263A1 (en) * | 2005-04-25 | 2006-11-02 | Applied Materials, Inc. | Methods and apparatus for cleaning and edge of a substrate |
| KR20080054763A (en) * | 2006-12-13 | 2008-06-19 | 삼성전자주식회사 | Cleaning apparatus of semiconductor test equipment and method for cleaning thereof |
| US7823241B2 (en) * | 2007-03-22 | 2010-11-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | System for cleaning a wafer |
| US9748090B2 (en) * | 2015-01-22 | 2017-08-29 | Toshiba Memory Corporation | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
| CN110280506B (en) * | 2019-07-10 | 2021-01-15 | 中广核研究院有限公司 | Cambered surface foreign matter cleaning method |
| JP7348021B2 (en) * | 2019-10-15 | 2023-09-20 | 株式会社荏原製作所 | Substrate cleaning equipment and substrate cleaning method |
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