CN109623602B - Automatic cleaning device and method for sucker and method for automatically identifying abnormal point of sucker - Google Patents

Automatic cleaning device and method for sucker and method for automatically identifying abnormal point of sucker Download PDF

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CN109623602B
CN109623602B CN201710931321.7A CN201710931321A CN109623602B CN 109623602 B CN109623602 B CN 109623602B CN 201710931321 A CN201710931321 A CN 201710931321A CN 109623602 B CN109623602 B CN 109623602B
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assembly
sucker
suction cup
driving
polishing
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CN109623602A (en
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韩春燕
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/007—Weight compensation; Temperature compensation; Vibration damping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Cleaning In General (AREA)

Abstract

According to the automatic cleaning device for the sucker, the positions of the abnormal points of the sucker are automatically obtained through the sensor assembly, the sucker is automatically cleaned through the polishing assembly according to the positions of the abnormal points, the operation is simple, the cleaning period is shortened, and therefore the yield of equipment is improved. Furthermore, the polishing assembly or the driving sucker fixing assembly is driven to move relatively through the driving assembly, the size of the whole sucker automatic cleaning device is reduced, the sucker can be automatically cleaned without being detached, and the cleaning cost is reduced. Furthermore, the automatic sucker cleaning device provided by the invention uses a full-automatic mode, automatically identifies the positions of abnormal points of the sucker, is easy to control the cleaning force and speed of the polishing assembly, reduces the requirement on operators, reduces the secondary pollution to the sucker, has higher cleaning efficiency and accurate calculation, increases the precision of cleaning the sucker, and simultaneously reduces the requirement on the operators.

Description

Automatic cleaning device and method for sucker and method for automatically identifying abnormal point of sucker
Technical Field
The invention relates to an automatic cleaning device for a sucker, an automatic cleaning method for the sucker and a method for automatically identifying abnormal points of the sucker.
Background
As the degree of integration of integrated circuits increases and the size of components decreases, the requirements for flatness of a chuck used for holding a substrate (e.g., a wafer or a substrate for a display panel) in a semiconductor device are becoming more stringent. On the other hand, each process in the production of integrated circuits has the potential to contaminate the substrate and, therefore, the chuck, which can lead to the formation of defects on the substrate and the failure of the device during the chuck attachment process. Therefore, it is necessary to identify the location of the abnormal point of the suction cup and clean the suction cup at regular time to reduce the occurrence probability of the above-mentioned problems.
The existing sucker cleaning method is manual cleaning and comprises two processes of manually identifying abnormal points of a sucker and manually polishing the sucker. The process of identifying the abnormal point of the suction cup includes: at least measuring the surface shape of more than 2 substrates, drawing the surface shape of the substrate into a surface shape graph, and determining the positions of abnormal points on the sucker by observing the surface shape graph. The manual polishing sucker process comprises the following steps: ensuring that the workpiece table is in a termination state and protecting the area outside the sucker on the motion table; pressing the polishing unit 21 (such as oilstone) with a finger requires moderate force, slides circularly from inside to outside (as shown in fig. 1), and has uniform and slow speed until the surface of the sucking disc 7 is smooth; then the dust-free cloth is folded into a rectangle, a proper amount of alcohol or acetone is poured, the dust-free cloth is lightly wiped on the sucker 7, and the dust-free cloth cannot slide on the sucker due to strict attention, so that the situation that the dust-free cloth fiber is clamped on the salient points of the sucker is avoided, and the requirement on operators is high. The inventor finds that when the method is used for deep cleaning of the sucker, the sucker needs to be disassembled, so that the cleaning period is long and the cleaning efficiency is low.
Therefore, it is desirable to provide an automatic cleaning device, an automatic cleaning method and a method for automatically identifying abnormal points of a sucker to solve the above problems.
Disclosure of Invention
The invention aims to provide an automatic sucker cleaning device, an automatic sucker cleaning method and a method for automatically identifying abnormal points of a sucker, so that the cleaning efficiency of the sucker is improved, and the operation difficulty is reduced.
In order to achieve the above object, an aspect of the present invention provides an automatic cleaning device for a suction cup, for automatically cleaning a suction cup, the device including a main substrate, a polishing assembly, a sensor assembly, a suction cup fixing assembly, and a driving assembly;
the sucker fixing assembly is used for fixing a sucker, the sucker fixing assembly moves relative to the main substrate along a second direction, and the polishing assembly and the sensor assembly can move relative to the sucker fixing assembly along the second direction;
the polishing assembly and the sensor assembly are fixed on the main substrate through an adapter plate and can move along a first direction, the sensor assembly is used for measuring the position of an abnormal point of the sucker, and the polishing assembly is used for cleaning the sucker according to the position of the abnormal point of the sucker;
the first direction is different from the second direction.
Optionally, in the automatic suction cup cleaning device, the driving assembly includes a first driving assembly and a second driving assembly, the first driving assembly is configured to drive the polishing assembly to move along a first direction, and the first direction is perpendicular to a plane where the suction cup is located; the second driving assembly is used for driving the sucker fixing assembly to move on the plane where the sucker fixing assembly is located relative to the main substrate, or driving the polishing assembly to move on the plane where the main substrate is located relative to the sucker fixing assembly.
Optionally, in the automatic suction cup cleaning device, the polishing assembly includes a polishing unit, a driving unit, and an external frame, the external frame is fixed to the main substrate and is used for supporting the polishing unit and the driving unit, and the driving unit is used for driving the polishing unit to clean the suction cup.
Optionally, in the automatic cleaning device for suction cups, the polishing assembly further includes a positive pressure generator, a negative pressure generator and a filter screen, the external frame includes a support and a housing, the support is fixed on the housing, the housing includes at least one opening for preventing dust particles in the polishing process from polluting the suction cups, and the polishing unit, the driving unit, the filter screen and the support are all located in an inner cavity of the housing; the shell is connected with the main substrate, and the bracket is connected with the top of the inner cavity of the shell; the positive pressure generator is used for the polishing unit during operation to the casing provides the malleation, negative pressure generator is used for the polishing unit during operation, to the casing provides the negative pressure.
Optionally, in the above automatic cleaning device for the sucker, at least one air outlet groove is formed in an opening of the housing, and when the polishing unit cleans the sucker, the air outlet groove is used for air sealing an inner cavity of the housing, so that dust particles in a cleaning process are prevented from polluting the sucker.
Optionally, in the automatic cleaning device for a suction cup, the sensor assembly further includes a particle detection unit for detecting a particle size of the suction cup, and when the particle size of the suction cup is lower than a predetermined value, the positive pressure generator and the negative pressure generator stop working.
Optionally, in the above automatic suction cup cleaning device, the automatic suction cup cleaning device further includes a damping assembly for fixing the suction cup fixing assembly and damping when the polishing assembly works.
In order to achieve the above object, according to another aspect of the present invention, there is provided a method for automatically identifying a location of an abnormal point of a suction cup using any one of the automatic suction cup cleaning devices as described above, comprising the steps of:
step 1: loading a substrate onto a chuck, wherein the chuck fixes the substrate;
step 2: acquiring a first path on the sucker, wherein the first path comprises m measuring points, the second driving assembly drives the sucker fixing assembly to move along the first path on a plane where the sucker fixing assembly is located, and the sensor assembly acquires height values of all the measuring points on the upper surface of the substrate;
establishing a coordinate axis by taking the central point of the substrate as the central point of the coordinate axis, wherein the X position of the ith measuring point is XmiThe Y position of the ith measurement point is Ymi；
And step 3: repeating the step 1 and the step 2, and respectively obtaining height values of all measuring points on the upper surfaces of the n substrates, wherein n is greater than or equal to 3;
the height value of the ith measurement point on the upper surface of the kth substrate is represented by Zi k；
And 4, step 4: according to the height values of all the measuring points on the upper surfaces of the n substrates and a formula:
Figure GDA0002710346980000031
Figure GDA0002710346980000032
Figure GDA0002710346980000033
obtaining an average value Mavg of the surface shapes of the n substrates; zm (z)iThe average value measured by n substrates of the ith measuring point is obtained;
and 5: carrying out low-pass filtering on the average value Mavg of the n substrate surface shapes by adopting a Gaussian filtering algorithm to obtain a filtered surface shape Ms;
step 6: calculating the difference surface shape Md according to a formula Md-Mavg-Ms;
and 7: a set threshold value T is used for screening the differential surface shape Md to find out a measurement area Mt exceeding the threshold value;
and 8: and acquiring information of all abnormal points according to the Mt.
Optionally, in the method for automatically identifying the position of the abnormal point of the suction cup, step 8 includes step 81: setting the radius of an abnormal point as R, searching all the measuring points exceeding the threshold value in the radius R range of the abnormal point, and taking the average value of the X and Y values of all the measuring points exceeding the threshold value in the radius R range as the position of the abnormal point; taking the difference between the maximum value and the minimum value of the X and Y values of all the measurement points exceeding the threshold value in the radius R range as the size of the abnormal point; taking the difference between the maximum value and the minimum value of the height values of all the measurement points exceeding the threshold value in the radius R range as the height of the abnormal point;
and repeating the step 81 to acquire the information of all the abnormal points.
Optionally, in the method for automatically identifying the position of the abnormal point of the suction cup, after the step 8, the method further includes: step 82: determining a cleaning path of an abnormal point according to the information of the abnormal point and the size of the grinding assembly;
and repeating the steps to determine the cleaning paths of all the abnormal points.
Optionally, in the method for automatically identifying the position of the abnormal point of the suction cup, the information of the abnormal point includes one or more of a position, a size and a height of the abnormal point.
In summary, in the automatic cleaning device for the sucker, the positions of the abnormal points of the sucker are automatically obtained through the sensor assembly, and the sucker is automatically cleaned through the polishing assembly according to the positions of the abnormal points, so that the automatic cleaning device is simple to operate, the cleaning period is shortened, and the yield of equipment is improved. Furthermore, the polishing assembly or the driving sucker fixing assembly is driven to move relatively through the second driving assembly, the size of the whole sucker automatic cleaning device is reduced, the sucker can be automatically cleaned without being detached, and the cleaning cost is reduced. Furthermore, the automatic cleaning device for the sucker provided by the invention adopts a full-automatic mode, the cleaning force and speed of the polishing assembly are easy to control, the requirement on operators is reduced, the secondary pollution to the sucker is reduced, and the cleaning efficiency is higher. Furthermore, the method for automatically identifying the abnormal points of the sucker calculates the average surface shape by obtaining the height values of the plurality of measuring points and the upper surfaces of the plurality of substrates, then carries out filtering and threshold judgment on the average surface shape to obtain the positions of all the abnormal points on the sucker, has accurate calculation, increases the precision of cleaning the sucker, and simultaneously reduces the requirements on operators.
Drawings
FIG. 1 is a schematic view of a prior art manual cleaning suction cup;
FIG. 2 is a schematic view of an automatic cleaning device for a sucker according to an embodiment of the present invention;
FIG. 3 is a schematic view of a polishing assembly according to an embodiment of the present invention;
figures 4 and 5 are bottom views of the grinding assembly of figure 3;
FIG. 6 is a schematic view of an automatic cleaning device for a sucker according to another embodiment of the present invention;
FIG. 7 is a schematic view of an automatic cleaning device for a suction cup according to an embodiment of the present invention in an application scenario with low cleanliness requirement;
FIG. 8 is a flowchart illustrating a method for automatically identifying abnormal points of a chuck according to an embodiment of the present invention;
FIG. 9 is a diagram illustrating a first path in a method for automatically identifying abnormal points of a chuck;
FIG. 10 is a schematic diagram of a surface filtering process in the method for automatically identifying abnormal points of the suction cup;
FIG. 11 is a schematic view of a cleaning path determined in the method for automatically identifying abnormal points of a suction cup;
FIG. 12 is a flowchart illustrating an exemplary method for automatically cleaning a chuck according to an embodiment of the present invention.
Wherein, 1-main substrate, 2-grinding component, 21-grinding unit, 22-driving unit, 23-bracket, 24-positive pressure generator, 25-negative pressure generator, 26-shell, 27-air outlet groove, and 28-filter screen; 3-a sensor component, 4-a first driving component, 5-a sucker fixing component, 6-a second driving component, 7-a sucker and 8-a shock absorption component.
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. Advantages and features of the present invention will become apparent from the following description and claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Referring to fig. 2 to 4, an embodiment of the present invention provides an automatic cleaning device for automatically cleaning a suction cup, including a main substrate 1, a polishing assembly 2, a sensor assembly 3, a driving assembly and a suction cup fixing assembly 5, wherein the driving assembly includes a first driving assembly 4 and a second driving assembly 6.
Referring with emphasis to fig. 2, the suction cup fixing assembly 5 is used for fixing a suction cup 7, for example, the suction cup 7 may be fixed above the suction cup fixing assembly 5. The second driving component 6 is used for driving the sucker fixing component 5 to move on the plane where the sucker fixing component is located, so that the sucker fixing component 5 and the grinding component 2 can move relatively. Or the second driving assembly 6 drives the grinding assembly 2 and the sensor assembly 3 to move relative to the sucker fixing assembly 5 on the plane of the main substrate 1. The polishing assembly 2 and the sensor assembly 3 are fixed on the main substrate 1 through a transfer member (not shown), the first driving assembly 4 is used for driving the polishing assembly 2 and the sensor assembly 3 to move along a first direction, the sensor assembly 3 is used for measuring the position of an abnormal point of the suction cup 7, and the polishing assembly 2 is used for cleaning the suction cup 7 according to the position of the abnormal point of the suction cup 7.
The first direction is perpendicular to the plane of the suction cup, specifically, for example, the Z direction (longitudinal direction) in fig. 2. The direction of movement of the chuck holding assembly 5 is, for example, perpendicular to the first direction (transverse direction), and likewise, the direction of movement of the sanding assembly 2 and the sensor assembly 3 may be the same as the direction of movement of the chuck holding assembly 5, with the planes of movement being parallel to each other. The relative movement directions (second directions) of the sucker fixing component 5, the polishing component 2 and the sensor component 3 are not limited at all, and the plane of the second direction is parallel to the plane of the sucker 7.
With continued reference to figure 2, the automatic suction cup cleaning device preferably further comprises a shock absorbing assembly 8 for securing the suction cup securing assembly 5 and absorbing shock during operation of the sanding assembly 2.
Specifically, referring to fig. 3, the polishing assembly 2 in this embodiment includes a polishing unit 21, a driving unit 22, a positive pressure generator 24, a negative pressure generator 25, an external frame and a filter screen 28, the external frame includes a bracket 23 and a housing 26, the bracket 23 is fixed on the housing 26 (for example, vertically fixed on the lower surface of the inner cavity of the housing) for supporting the polishing unit 21 and the driving unit 22, and the driving unit 22 is used for driving the polishing unit 21 to clean the suction cup 7.
Preferably, the housing 26 includes at least one opening for preventing dust particles from contaminating the suction plate during grinding, and the grinding unit 21, the driving unit 22, the filter screen 28 and the bracket 23 are all located in the inner cavity of the housing 26; the shell 26 is connected with the main substrate 1, and the bracket 23 is connected with the top of the inner cavity of the shell 26; the positive pressure generator 24 is used for providing positive pressure to the shell 26 when the grinding unit 21 works, and the negative pressure generator 25 is used for providing negative pressure to the shell 26 when the grinding unit 21 works.
Specifically, referring to fig. 4 and 5, at least one air outlet groove 27 is formed at an opening of the casing 26, and when the polishing unit cleans the suction cup 7, the air outlet groove 27 is used for air-sealing an inner cavity of the casing 26, so that dust particles in the polishing process are prevented from polluting the suction cup 7. The air outlet groove 27 is, for example, formed in the bottom of the housing 26, and is formed with an air outlet groove 45 ° downward at a position close to the substrate, so that dust particles in the polishing process can be prevented from polluting the suction cup. It should be understood that the present invention does not limit the shape, number and position of the air outlet slots.
Specifically, the sensor unit 3 includes a particle detection unit for detecting the particle size of the suction cup 7, and when the particle size of the suction cup 7 is lower than a predetermined value, the positive pressure generator 24 and the negative pressure generator 25 can stop working. The predetermined value is set in advance, and may be set according to an empirical value or the like, which is not limited in the present invention.
When the sucker is automatically cleaned, the method comprises the following steps:
(1) the second driving assembly 6 drives the sucker fixing assembly 5 to move relative to the grinding assembly 2 on the plane of the sucker fixing assembly 5, or drives the grinding assembly 2 and the sensor assembly 3 to move relative to the sucker fixing assembly 5 on the plane of the main substrate 1, so as to move the abnormal point of the sucker below the grinding assembly 2;
(2) the first driving assembly 4 drives the grinding assembly 2 and the sensor assembly 3 to move along a first direction so as to move to a first height of the abnormal point;
(3) the positive pressure generator 24 and the negative pressure generator 25 work, and the driving unit 22 drives the grinding unit 21 to rotate for cleaning;
(4) the second driving assembly 6 drives the sucker fixing assembly 5 to move relative to the main substrate 1 on the plane of the sucker fixing assembly 5 (i.e. the second direction), or drives the grinding assembly 2 to move relative to the sucker fixing assembly 5 on the plane of the main substrate 1 (i.e. the second direction); the rotational speed of the sharpening unit is much greater than the drive speed of the second drive assembly 6;
(5) the positive pressure generator 24 and the negative pressure generator 25 are closed, and the first driving assembly 4 lifts the grinding assembly 2 to complete cleaning.
After cleaning, the first driving component 4 drives the grinding component 2 to move along the first direction, and the sensor component 3 obtains the flatness of the sucker 7 so as to obtain the cleaning effect. And (5) if cleaning is needed again, and finishing the steps (1) - (5).
When automatically cleaning the suction cup, the main substrate 1 may be fixed, and the second driving assembly 6 drives the suction cup fixing assembly 5 to move relative to the main substrate 1 on a plane where the suction cup fixing assembly 5 is located, so as to move an abnormal point of the suction cup to a lower side of the grinding assembly 2, and perform automatic cleaning. Or, the sucker fixing component 5 is fixed, and the second driving component 6 drives the polishing component 2 to move relative to the sucker fixing component 5 on the plane where the main substrate 1 is located, so that the abnormal point of the sucker is moved to the position below the polishing component 2, and automatic cleaning is performed. Still alternatively, both the suction cup fixing assembly 5 and the sanding assembly 2 are moved. In any case, it is sufficient to allow the suction cup fixing assembly 5 to move relative to the sanding assembly 2.
Specifically, referring to fig. 6, in another embodiment of the present invention, the main substrate 1 may be replaced with a frame structure, the polishing assembly 2 and the sensor assembly 3 are fixed to the frame structure, and the second driving assembly 6 drives the polishing assembly 2 and the sensor assembly 3 to move relative to the suction cup fixing assembly 5 (i.e., a second direction) so as to move the polishing assembly 2 above the abnormal point of the suction cup 7 and perform automatic cleaning.
In an application scenario with low cleanliness requirement, the polishing assembly 2 in the embodiment can be simplified to reduce complexity and save cost. Referring to fig. 7, including a grinding unit 21, a bracket 23 and a driving unit 22, the bracket 23 supports the driving unit 22 and the grinding unit 21 and is fixed on the main substrate 1; specifically, the driving unit 22 drives the polishing unit 21 to rotate for direct cleaning. The method is simple to operate and has practicability in application scenes with low cleanliness requirements. The grinding unit 21 in this embodiment includes, but is not limited to, oilstone, and the invention is not limited thereto.
Specifically, referring to fig. 8, the flow of the method for automatically identifying abnormal points of the suction cup according to the present invention includes:
step 1, substrate uploading: placing the substrate on a sucker, and connecting negative pressure to the sucker to fix the substrate on the sucker; the substrate is a substrate with the pollution degree lower than a standard value;
step 2, executing measurement: acquiring a first path on the sucker, wherein the first path comprises m measuring points, the second driving assembly drives the sucker fixing assembly to move along the first path on a plane where the sucker fixing assembly is located, and the sensor assembly acquires height values of all the measuring points on the upper surface of the substrate; the present invention does not set any limit to the setting of the first path.
Establishing a coordinate axis by taking the central point of the substrate as the central point of the coordinate axis, wherein the X position of the ith measuring point is XmiThe Y position of the ith measurement point is Ymi
The chuck fixing assembly 5 moves stepwise in XY directions according to a first path as shown in fig. 9, and the height measuring sensor collects height information of the upper surface of the substrate;
step 3, repeating the step 1 and the step 2 until n substrates are measured, wherein n is greater than or equal to 3;
step 4, calculating the average surface shape: calculating the measured data of the n substrates according to the formula (1) to obtain an average value Mavg of the surface shapes of the n substrates, as shown in fig. 10 (a);
Figure GDA0002710346980000091
wherein:
n is the number of the measurement substrates;
Zi kmeasuring the height value of the upper surface of the kth substrate at the ith measuring point; (ii) a
XmiIs the X position of the ith measurement point;
Ymiis the Y position of the ith measurement point;
Zmithe average value measured by n substrates at the ith measuring point is obtained.
Step 5, calculating a filtering surface shape: performing low-pass filtering on the data by adopting a Gaussian filtering algorithm to obtain a filtered surface shape Ms, as shown in FIG. 10 (b);
step 6, calculating the difference surface shape: calculating the difference surface shape Md according to equation (2), as shown in fig. 10 (c);
md ═ Mavg-Ms (formula 2)
And 7, calculating the surface shape exceeding the threshold: screening the difference surface shape Md according to a preset threshold value T, and finding out a measurement area Mt exceeding the threshold value, as shown in FIG. 10 (d);
step 8, determining abnormal point positions XPspot and YPspot, abnormal point sizes XRspot and YRSPot and abnormal point height PVspot: setting the radius of an abnormal point as R, searching all the measuring points exceeding the threshold value in the radius R range of the abnormal point from the abnormal point, and taking the average value of the X and Y values of all the measuring points exceeding the threshold value in the radius R range as the position of the abnormal point; taking the difference between the maximum value and the minimum value of the X and Y values of all the measurement points exceeding the threshold value in the radius R range as the size of the abnormal point; and taking the difference between the maximum value and the minimum value of the height values of all the measurement points exceeding the threshold value in the range of the radius R as the height of the abnormal point. And (4) completing the calculation of the positions of all the abnormal points by adopting the steps.
The method has accurate calculation, improves the cleaning accuracy and simultaneously reduces the requirement on operators.
Alternatively, after obtaining the location of the outlier according to the above steps, a cleaning path may be determined, specifically, referring to fig. 11, to guide the grinding assembly 2 to clean.
Specifically, after the position of the abnormal point is obtained, the step of cleaning by using the automatic suction cup cleaning device proposed in this embodiment is described with reference to fig. 12, which includes;
the sensor assembly acquires the position of an abnormal point of a sucker;
the second driving assembly drives the sucker fixing assembly to move on the plane where the sucker fixing assembly is located, and the positions of all abnormal points of the sucker are sequentially moved to the position below the polishing assembly;
the first driving assembly drives the polishing assembly to move to a first height along a first direction, and the second driving assembly drives the sucker fixing assembly to move at a constant speed on a plane where the sucker fixing assembly is located, so that the sucker is cleaned.
Optionally, the housing 26 can prevent dust particles from contaminating the suction cup during cleaning, thereby increasing cleaning cleanliness.
In summary, in the automatic cleaning device for the sucker, the positions of the abnormal points of the sucker are automatically obtained through the sensor assembly, and the sucker is automatically cleaned through the polishing assembly according to the positions of the abnormal points, so that the automatic cleaning device is simple to operate, the cleaning period is shortened, and the yield of equipment is improved. Furthermore, the polishing assembly or the driving sucker fixing assembly is driven to move relatively through the second driving assembly, the size of the whole sucker automatic cleaning device is reduced, the sucker can be automatically cleaned without being detached, and the cleaning cost is reduced. Furthermore, the automatic cleaning device for the sucker provided by the invention adopts a full-automatic mode, the cleaning force and speed of the polishing assembly are easy to control, the requirement on operators is reduced, the secondary pollution to the sucker is reduced, and the cleaning efficiency is higher. Furthermore, the method for automatically identifying the abnormal points of the sucker calculates the average surface shape by obtaining the height values of the plurality of measuring points and the upper surfaces of the plurality of substrates, then carries out filtering and threshold judgment on the average surface shape to obtain the positions of all the abnormal points on the sucker, has accurate calculation, increases the precision of cleaning the sucker, and simultaneously reduces the requirements on operators.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (12)

1. The automatic cleaning device for the sucker is characterized by being used for automatically cleaning the sucker and comprising a main substrate, a grinding assembly, a sensor assembly, a sucker fixing assembly and a driving assembly;
the sucker fixing assembly is used for fixing a sucker, the sucker fixing assembly moves relative to the main substrate along a second direction, and the polishing assembly and the sensor assembly can move relative to the sucker fixing assembly along the second direction;
the polishing assembly and the sensor assembly are fixed on the main substrate through an adapter plate, the polishing assembly can move along a first direction, the sensor assembly is used for measuring the position of an abnormal point of the sucker, the polishing assembly is used for cleaning the sucker according to the position of the abnormal point of the sucker, the polishing assembly comprises a polishing unit, a driving unit and an external frame, the external frame is fixed on the main substrate and used for supporting the polishing unit and the driving unit, the driving unit is used for driving the polishing unit to clean the sucker, the external frame comprises a support and a shell, the shell is connected with the main substrate, the support is connected with the top of an inner cavity of the shell, the support is fixed on the shell, the shell comprises at least one opening, and the opening is provided with at least one air outlet groove, when the polishing unit cleans the sucker, the air outlet groove is used for air sealing the inner cavity of the shell, so that dust particles in the cleaning process are prevented from polluting the sucker;
the first direction is different from the second direction.
2. The automatic suction cup cleaning device according to claim 1, wherein the driving assembly comprises a first driving assembly and a second driving assembly, the first driving assembly is used for driving the grinding assembly to move along a first direction, and the first direction is perpendicular to a plane of the suction cup; the second driving assembly is used for driving the sucker fixing assembly to move relative to the main substrate on the plane where the sucker fixing assembly is located, or driving the polishing assembly and the sensor assembly to move relative to the sucker fixing assembly on the plane where the main substrate is located.
3. The automatic suction cup cleaning device of claim 1, wherein the grinding assembly further comprises a positive pressure generator, a negative pressure generator, and a filter screen, the grinding unit, the drive unit, the filter screen, and the bracket being located in the interior cavity of the housing; the positive pressure generator is used for the polishing unit during operation to the casing provides the malleation, negative pressure generator is used for the polishing unit during operation, to the casing provides the negative pressure.
4. The automatic cleaning apparatus for suction cups according to claim 3, wherein said sensor assembly further comprises a particle detecting unit for detecting the particle size of said suction cup, and said positive pressure generator and said negative pressure generator are stopped when the particle size of said suction cup is lower than a predetermined value.
5. The automatic suction cup cleaning device according to claim 1, further comprising a shock absorbing member for fixing the suction cup fixing member and absorbing shock when the sanding member is operated.
6. A suction cup automatic cleaning method using the suction cup automatic cleaning device according to any one of claims 1 to 5, comprising:
the sensor assembly acquires the position of an abnormal point of a sucker;
the second driving assembly drives the sucker fixing assembly to move on the plane where the sucker fixing assembly is located, and the positions of all abnormal points of the sucker are sequentially moved to the position below the polishing assembly;
the first driving assembly drives the polishing assembly to move to a first height along a first direction, and the second driving assembly drives the sucker fixing assembly to move at a constant speed on a plane where the sucker fixing assembly is located, so that the sucker is cleaned.
7. The automatic cleaning method for the sucking disc as claimed in claim 6, wherein after the first driving assembly drives the grinding assembly to move to the first height along the first direction, the driving unit in the grinding assembly drives the grinding unit to work, and the second driving assembly drives the sucking disc fixing assembly to move on the plane where the sucking disc fixing assembly is located, so as to clean the sucking disc.
8. The method of claim 6, wherein the first driving assembly drives the grinding assembly to move in a first direction to a first height, the second driving assembly drives the suction cup fixing assembly to move at a uniform speed on a plane on which the suction cup fixing assembly is located, and after the suction cup is cleaned, the method further comprises:
the first driving assembly drives the polishing assembly to move along a first direction, and the sensor assembly acquires the flatness of the sucker.
9. A method of automatically recognizing a location of an abnormal point of a suction cup using the automatic suction cup cleaning device according to any one of claims 1 to 5, comprising the steps of:
step 1: loading a substrate onto a chuck, wherein the chuck fixes the substrate;
step 2: acquiring a first path on the sucker, wherein the first path comprises m measuring points, the second driving assembly drives the sucker fixing assembly to move along the first path on a plane where the sucker fixing assembly is located, and the sensor assembly acquires height values of all the measuring points on the upper surface of the substrate;
establishing a coordinate axis by taking the central point of the substrate as the central point of the coordinate axis, wherein the X position of the ith measuring point is XmiThe Y position of the ith measurement point is Ymi；
And step 3: repeating the step 1 and the step 2, and respectively obtaining height values of all measuring points on the upper surfaces of the n substrates, wherein n is greater than or equal to 3;
the height value of the ith measurement point on the upper surface of the kth substrate is represented by Zi k；
And 4, step 4: according to the height values of all the measuring points on the upper surfaces of the n substrates and a formula:
Figure FDA0002710346970000031
Figure FDA0002710346970000032
Figure FDA0002710346970000033
obtaining an average value Mavg of the surface shapes of the n substrates; zm (z)iThe average value measured by n substrates of the ith measuring point is obtained;
and 5: carrying out low-pass filtering on the average value Mavg of the n substrate surface shapes by adopting a Gaussian filtering algorithm to obtain a filtered surface shape Ms;
step 6: calculating the difference surface shape Md according to a formula Md-Mavg-Ms;
and 7: a set threshold value T is used for screening the differential surface shape Md to find out a measurement area Mt exceeding the threshold value;
and 8: and acquiring information of all abnormal points according to the Mt.
10. The method of automatically identifying the location of an anomaly point of a suction cup as claimed in claim 9, wherein step 8 comprises step 81: setting the radius of an abnormal point as R, searching all the measuring points exceeding the threshold value in the radius R range of the abnormal point, and taking the average value of the X and Y values of all the measuring points exceeding the threshold value in the radius R range as the position of the abnormal point; taking the difference between the maximum value and the minimum value of the X and Y values of all the measurement points exceeding the threshold value in the radius R range as the size of the abnormal point; taking the difference between the maximum value and the minimum value of the height values of all the measurement points exceeding the threshold value in the radius R range as the height of the abnormal point;
and repeating the step 81 to acquire the information of all the abnormal points.
11. The method of automatically identifying the location of an anomaly point of a suction cup as recited in claim 9, further comprising, after said step 8: step 82: determining a cleaning path of an abnormal point according to the information of the abnormal point and the size of the grinding assembly;
and repeating the steps to determine the cleaning paths of all the abnormal points.
12. The method of automatically identifying a location of an anomaly point of a suction cup according to any one of claims 9 to 11, wherein said information of an anomaly point comprises one or more of a location, a size and a height of said anomaly point.
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