CN220454532U - Wafer edge detection system - Google Patents
Wafer edge detection system Download PDFInfo
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- CN220454532U CN220454532U CN202321499954.2U CN202321499954U CN220454532U CN 220454532 U CN220454532 U CN 220454532U CN 202321499954 U CN202321499954 U CN 202321499954U CN 220454532 U CN220454532 U CN 220454532U
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- 238000003708 edge detection Methods 0.000 title claims abstract description 29
- 238000001179 sorption measurement Methods 0.000 claims abstract description 23
- 238000007689 inspection Methods 0.000 claims description 11
- 229920000459 Nitrile rubber Polymers 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 10
- 230000000007 visual effect Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a wafer edge detection system which comprises a mounting platform, a vacuum adsorption rotating platform, a horizontal shooting device, a vertical shooting device and a control device, wherein the vacuum adsorption rotating platform on the mounting platform can adsorb and fix a wafer to be detected, the horizontal shooting device and the vertical shooting device can respectively shoot an edge chamfer photo and a Notch angle photo of the wafer to be detected, the wafer to be detected is not required to be contacted in the whole wafer edge detection process, the wafer to be detected is not scratched, meanwhile, the edge chamfer and Notch angle can be detected in the same station, the detection efficiency is improved, and the technical problems that the wafer edge is scratched easily in a traditional contact wafer edge detection mode and the efficiency of a multi-station wafer edge detection mode is low are solved.
Description
Technical Field
The present utility model relates to the field of wafer processing technologies, and in particular, to a wafer edge detection system.
Background
In the process of manufacturing chips, after a wafer (simply referred to as a wafer) is cut, a polishing process is started to polish the wafer to reduce saw marks on the front and back surfaces and surface damage. After grinding, an etching and cleaning process is performed using a mixture of sodium hydroxide, acetic acid and nitric acid to mitigate damage and cracking during lapping. The key chamfering process is to round the edges of the wafer, completely eliminating the possibility of breakage in the future during circuit fabrication. The shape requirements of different customers on the wafer edging are also different, including round edge chamfering, straight edge chamfering, notch angle and other types.
The traditional wafer edge detection mode is contact type edge chamfering detection and Notch angle detection, and multi-station type edge chamfering detection and Notch angle detection, the contact type wafer edge detection mode is easy to scratch the wafer edge, and the multi-station type wafer edge detection mode is low in efficiency. In order to solve the problems that the traditional contact type wafer edge detection mode is easy to scratch the wafer edge and the multi-station type wafer edge detection mode is low in efficiency, the utility model provides a wafer edge detection system which can avoid scratching the wafer edge caused by contacting the wafer edge and solve the problem of low efficiency caused by multi-station detection.
Disclosure of Invention
The utility model provides a wafer edge detection system which is used for solving the technical problems that the traditional contact wafer edge detection mode is easy to scratch the wafer edge and the multi-station wafer edge detection mode is low in efficiency.
In view of the above, the utility model provides a wafer edge detection system, which comprises a mounting platform, a vacuum adsorption rotary table, a horizontal shooting device, a vertical shooting device and a control device;
the vacuum adsorption rotary table comprises a rotary table and a vacuum chuck, the rotary table is arranged on the mounting platform, and the vacuum chuck is arranged at the top of the rotary table;
the vacuum chuck is used for adsorbing a wafer to be detected;
the horizontal shooting device is arranged on the first bracket and is used for shooting an edge chamfer photo of the wafer to be detected in the horizontal direction;
the vertical shooting device is arranged on the second bracket and is used for shooting a Notch angle photo of the wafer to be detected in the vertical direction;
the vacuum adsorption rotating table, the horizontal shooting device and the vertical shooting device are all connected with the control device;
and the control device is used for judging whether the edge chamfer and the Notch angle of the wafer to be detected are qualified or not according to the edge chamfer photo and the Notch angle photo.
Optionally, the mounting platform comprises an X-axis moving platform and a Y-axis moving platform;
the X-axis moving platform is movably connected with the Y-axis moving platform, and the rotary table is movably arranged on the X-axis moving platform.
Optionally, the horizontal shooting device comprises an industrial camera and a horizontal light source in the horizontal direction;
the horizontal light source is used for providing a shooting light source for the industrial camera in the horizontal direction.
Optionally, the vertical shooting device comprises an industrial camera and a vertical light source in a vertical direction;
the vertical light source is used for providing a shooting light source for the industrial camera in the vertical direction.
Optionally, the control device comprises a PLC controller and a camera controller;
the mounting platform and the vacuum adsorption rotating platform are respectively connected with the PLC;
the horizontal shooting device and the vertical shooting device are respectively connected with the camera controller.
Optionally, the display module is further included;
the display module is connected with the camera controller and used for displaying the pictures shot by the horizontal shooting device and the vertical shooting device.
Optionally, the light source angle of the horizontal light source is adjustable.
Optionally, the light source angle of the vertical light source is adjustable.
Alternatively, the vacuum chuck is a bellows-type vacuum chuck made of nitrile rubber or silicone rubber.
Optionally, a rotating table limiting device is arranged on the X-axis moving platform, and the rotating table limiting device is used for limiting the moving range of the rotating table on the X-axis moving platform.
From the above technical solution, the wafer edge detection system provided by the utility model has the following advantages:
the wafer edge detection system provided by the utility model comprises the mounting platform, the vacuum adsorption rotary table, the horizontal shooting device, the vertical shooting device and the control device, wherein the vacuum adsorption rotary table on the mounting platform can adsorb and fix the wafer to be detected, the horizontal shooting device and the vertical shooting device can respectively shoot the edge chamfer photo and the Notch angle photo of the wafer to be detected, the wafer to be detected is not required to be contacted in the whole wafer edge detection process, the wafer to be detected is not scratched, meanwhile, the detection of the edge chamfer and the Notch angle can be completed at the same station, the detection efficiency is improved, and the technical problems that the wafer edge is scratched easily in the traditional contact wafer edge detection mode and the efficiency of the multi-station wafer edge detection mode is low are solved.
Meanwhile, the wafer edge detection system provided by the utility model has the advantages that the mounting platform comprises the X-axis moving platform and the Y-axis moving platform, and the movement in the X direction and the Y direction can be realized, so that the position of the wafer to be detected on the vacuum adsorption rotating platform can be flexibly adjusted.
The vacuum chuck is made of nitrile rubber or silicone rubber and provided with a corrugated pipe, so that the surface of the wafer to be detected is further prevented from being scratched.
Drawings
For a clearer description of embodiments of the utility model or of solutions according to the prior art, the figures which are used in the description of the embodiments or of the prior art will be briefly described, it being obvious that the figures in the description below are only some embodiments of the utility model, from which, without the aid of inventive efforts, other relevant figures can be obtained for a person skilled in the art.
FIG. 1 is a schematic diagram of a wafer edge inspection system according to the present utility model;
wherein, the reference numerals are as follows:
A. a mounting platform; B. a vacuum adsorption rotary table; C. a horizontal photographing device; D. a vertical photographing device; 1. a wafer to be inspected; 2. a Y-axis moving platform; 3. an X-axis mobile platform; 4. a rotary table; 5. a vacuum chuck; 6. an industrial camera in a horizontal direction; 7. a horizontal light source; 8. an industrial camera in a vertical direction; 9. a vertical light source.
Detailed Description
In order to make the present utility model better understood by those skilled in the art, the following description will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
For easy understanding, referring to fig. 1, an embodiment of a wafer edge detection system is provided in the present utility model, which includes a mounting platform a, a vacuum adsorption rotary table B, a horizontal photographing device C, a vertical photographing device D, and a control device;
the vacuum adsorption rotary table B comprises a rotary table 4 and a vacuum chuck 5, the rotary table 4 is arranged on the installation platform A, and the vacuum chuck 5 is arranged at the top of the rotary table 4;
the vacuum chuck 5 is used for adsorbing the wafer 1 to be detected;
a horizontal photographing device C is mounted on the first bracket, and the horizontal photographing device C is used for photographing an edge chamfer photo of the wafer 1 to be detected in the horizontal direction;
a vertical photographing device D is arranged on the second bracket and is used for photographing a Notch angle photo of the wafer 1 to be detected in the vertical direction;
the mounting platform A, the vacuum adsorption rotary table B, the horizontal shooting device C and the vertical shooting device D are all connected with the control device;
the control device is used for judging whether the edge chamfer and the Notch angle of the wafer 1 to be detected are qualified or not according to the edge chamfer photo and the Notch angle photo.
The wafer edge detection system provided by the utility model comprises the mounting platform A, the vacuum adsorption rotating platform B, the horizontal shooting device C, the vertical shooting device D and the control device, wherein the vacuum adsorption rotating platform B on the mounting platform A can adsorb and fix the wafer 1 to be detected, the horizontal shooting device C and the vertical shooting device D can respectively shoot an edge chamfer photo and a Notch angle photo of the wafer 1 to be detected, the wafer 1 to be detected is not required to be contacted in the whole wafer edge detection process, the wafer 1 to be detected is not scratched, meanwhile, the edge chamfer and Notch angle detection can be completed at the same station, the detection efficiency is improved, and the technical problems that the wafer edge is scratched easily in the traditional contact wafer edge detection mode and the efficiency of the multi-station wafer edge detection mode is low are solved.
The mounting platform a is used for mounting the vacuum adsorption rotary table B, and the rotary table 4 of the vacuum adsorption rotary table B is used for rotationally adjusting the position of the wafer 1 to be detected on the horizontal plane, so as to ensure that the detected position of the wafer 1 to be detected is within the shooting visual field range of the horizontal shooting device C or the vertical shooting device D. The rotary table 4 is driven to rotate by a driving motor. The vacuum chuck 5 of the vacuum chuck rotary table B is used for sucking the wafer 1 to be inspected. The vacuum chuck 5 is provided with negative pressure by a vacuum generator to adsorb the wafer 1 to be detected. The vacuum chuck 5 can be a vacuum chuck 5 with a corrugated pipe made of nitrile rubber or silicon rubber, and the surface of the wafer 1 to be detected can be further ensured not to be scratched.
The control device obtains an edge chamfer photo shot by the horizontal shooting device C and a Notch angle photo shot by the vertical shooting device D, analyzes the edge chamfer photo and the Notch angle photo, judges whether the edge chamfer and the Notch angle of the wafer 1 to be detected are qualified or not according to whether the edge chamfer and the Notch angle of the wafer 1 to be detected are within the standard process tolerance range, and judges whether the edge chamfer and the Notch angle of the wafer 1 to be detected are qualified or not. The edge chamfer photograph and the Notch angle photograph are analyzed, and an algorithm for judging whether the edge chamfer and the Notch angle are qualified or not can be adopted in the prior art.
The horizontal photographing device C may include an industrial camera 6 in a horizontal direction and a horizontal light source 7, the horizontal light source 7 for providing a photographing light source for the industrial camera 6 in the horizontal direction. The horizontal light source 7 is used as a wafer measuring horizontal photographing and polishing element, and the camera can be horizontally installed to photograph shadows of the edge chamfer of the wafer 1 to be detected, so that better edge angle contour photographs of the wafer 1 to be detected can be obtained. The horizontal light source 7 can be set in a mode of light source angle adjustment, and fine adjustment of the light source direction can be performed according to specific application scenes.
The vertical photographing device D includes an industrial camera 8 in a vertical direction and a vertical light source 9, and the vertical light source 9 is used to provide a photographing light source for the industrial camera 8 in the vertical direction. The vertical light source 9 is used as a wafer measurement vertical photographing and polishing element, and the vertical installation can enable the camera to photograph shadows of the Notch angle of the wafer 1 to be detected, so that better Notch angle profile photos can be obtained. The vertical light source 9 can be set in a mode of adjustable light source angle, and fine adjustment of the light source direction can be performed according to specific application scenes.
The mounting platform A comprises an X-axis moving platform 3 and a Y-axis moving platform 2, the X-axis moving platform 3 is movably connected with the Y-axis moving platform 2, and the rotary table 4 is movably mounted on the X-axis moving platform 3. Therefore, the X-axis moving platform 3 can move in the Y direction on the Y-axis moving platform 2, and the rotating platform 4 can move in the X direction on the X-axis moving platform 3, so that the position of the wafer 1 to be detected on the vacuum adsorption rotating platform B can be flexibly adjusted, the detected position of the wafer 1 to be detected is ensured to be within the shooting visual field range of the horizontal shooting device C or the vertical shooting device D, and a cleaned photo can be shot. The X-axis moving platform 3 can be provided with a rotating platform limiting device, and the rotating platform limiting device is used for limiting the moving range of the rotating platform 4 on the X-axis moving platform 3 and preventing the rotating platform 4 from sliding off the X-axis moving platform 3.
The control device comprises a PLC controller and a camera controller, the installation platform A and the vacuum adsorption rotary table B are respectively connected with the PLC controller, and the horizontal shooting device C and the vertical shooting device D are respectively connected with the camera controller. The movement of the X-axis moving stage 3 on the Y-axis moving stage 2, and the movement of the rotary table 4 on the X-axis moving stage 3 are controlled by a PLC controller, and the horizontal photographing device C and the vertical photographing device D are controlled by a camera controller. The camera controller may also be connected with a display module, where the display module is configured to display photographs shot by the horizontal shooting device C and the vertical shooting device D, and may also display an analysis result of the camera controller, that is, whether the edge chamfer and Notch angle of the wafer 1 to be detected are qualified.
The working principle of the wafer edge inspection system provided in the present utility model can be described as:
after the wafer 1 to be detected is placed on the vacuum chuck 5, the vacuum chuck 5 firmly sucks the wafer 1 to be detected on the rotary table 4, when the suction pressure of the vacuum chuck 5 reaches the set range, the PLC controls the movement of the X-axis moving platform 3 on the Y-axis moving platform 2 and the movement of the rotary table 4 on the X-axis moving platform 3, the rotary table 4 is moved to the visual field range areas of the vertical measuring camera and the horizontal measuring camera, then the rotary table 4 starts to rotate an adjustment angle, so that the detected position of the wafer 1 to be detected is ensured to be within the visual field range of the industrial camera 8 in the vertical direction and the industrial camera 6 in the horizontal direction, and the industrial camera 8 in the vertical direction and the industrial camera 6 in the horizontal direction can take clear pictures. And then controlling the industrial camera 8 in the vertical direction and the industrial camera 6 in the horizontal direction to respectively photograph so as to obtain clear photographs of the wafer 1 to be detected, then utilizing a camera controller to carry out photograph processing analysis so as to obtain the corresponding position size of the wafer 1 to be detected, and comparing the position size with the process size tolerance, if the position size exceeds the process requirement range, judging that the wafer 1 to be detected is unqualified, and if the position size exceeds the process requirement range, judging that the wafer 1 to be detected is qualified.
The above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (10)
1. The wafer edge detection system is characterized by comprising a mounting platform, a vacuum adsorption rotating platform, a horizontal shooting device, a vertical shooting device and a control device;
the vacuum adsorption rotary table comprises a rotary table and a vacuum chuck, the rotary table is arranged on the mounting platform, and the vacuum chuck is arranged at the top of the rotary table;
the vacuum chuck is used for adsorbing a wafer to be detected;
the horizontal shooting device is arranged on the first bracket and is used for shooting an edge chamfer photo of the wafer to be detected in the horizontal direction;
the vertical shooting device is arranged on the second bracket and is used for shooting a Notch angle photo of the wafer to be detected in the vertical direction;
the vacuum adsorption rotating table, the horizontal shooting device and the vertical shooting device are all connected with the control device;
and the control device is used for judging whether the edge chamfer and the Notch angle of the wafer to be detected are qualified or not according to the edge chamfer photo and the Notch angle photo.
2. The wafer edge inspection system of claim 1 wherein the mounting platform includes an X-axis motion platform and a Y-axis motion platform;
the X-axis moving platform is movably connected with the Y-axis moving platform, and the rotary table is movably arranged on the X-axis moving platform.
3. The wafer edge inspection system of claim 1 wherein the horizontal camera includes an industrial camera and a horizontal light source in a horizontal direction;
the horizontal light source is used for providing a shooting light source for the industrial camera in the horizontal direction.
4. The wafer edge inspection system of claim 1 wherein the vertical camera includes an industrial camera and a vertical light source in a vertical direction;
the vertical light source is used for providing a shooting light source for the industrial camera in the vertical direction.
5. The wafer edge inspection system of claim 2 wherein the control device includes a PLC controller and a camera controller;
the mounting platform and the vacuum adsorption rotating platform are respectively connected with the PLC;
the horizontal shooting device and the vertical shooting device are respectively connected with the camera controller.
6. The wafer edge inspection system of claim 5, further comprising a display module;
the display module is connected with the camera controller and used for displaying the pictures shot by the horizontal shooting device and the vertical shooting device.
7. The wafer edge inspection system of claim 3 wherein a source angle of the horizontal light source is adjustable.
8. The wafer edge inspection system of claim 4 wherein a light source angle of the vertical light source is adjustable.
9. The wafer edge inspection system of claim 1 wherein the vacuum chuck is a bellows-type vacuum chuck made of nitrile rubber or silicone rubber.
10. The wafer edge inspection system of claim 2 wherein a turntable stop is disposed on the X-axis translation stage, the turntable stop being configured to limit a range of motion of the turntable on the X-axis translation stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321499954.2U CN220454532U (en) | 2023-06-13 | 2023-06-13 | Wafer edge detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321499954.2U CN220454532U (en) | 2023-06-13 | 2023-06-13 | Wafer edge detection system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220454532U true CN220454532U (en) | 2024-02-06 |
Family
ID=89734419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321499954.2U Active CN220454532U (en) | 2023-06-13 | 2023-06-13 | Wafer edge detection system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220454532U (en) |
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2023
- 2023-06-13 CN CN202321499954.2U patent/CN220454532U/en active Active
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