CN106680288A - Grinding equipment and grinding method - Google Patents

Grinding equipment and grinding method Download PDF

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Publication number
CN106680288A
CN106680288A CN201710001281.6A CN201710001281A CN106680288A CN 106680288 A CN106680288 A CN 106680288A CN 201710001281 A CN201710001281 A CN 201710001281A CN 106680288 A CN106680288 A CN 106680288A
Authority
CN
China
Prior art keywords
foreign body
grinding head
grinding
height
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710001281.6A
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Chinese (zh)
Inventor
李娟�
马光和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201710001281.6A priority Critical patent/CN106680288A/en
Publication of CN106680288A publication Critical patent/CN106680288A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106—General arrangement of respective parts
    • G01N2021/0112—Apparatus in one mechanical, optical or electronic block
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106—General arrangement of respective parts
    • G01N2021/0118—Apparatus with remote processing
    • G01N2021/0143—Apparatus with remote processing with internal and external computer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N2021/8411—Application to online plant, process monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8861—Determining coordinates of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/102—Video camera

Abstract

The invention provides grinding equipment and a grinding method. The grinding equipment comprises a grinding strip, a grinding part, a moving unit, an acquiring unit, a measuring unit and a control unit, wherein the grinding part comprises a grinding head and a grinding equipment box connected to the grinding head; the moving unit is used for moving the grinding head; the acquiring unit can move along with the grinding part and acquire the information of a foreign matter on a base plate to be ground in a preset area in the current position where the grinding head is in real time, and the information of the foreign matter includes the position information of the foreign matter; the measuring unit is used for measuring the height of the foreign matter in the current position where the grinding part is; and the control unit is used for controlling the moving unit to move the grinding head to a position corresponding to the foreign matter according to the information of the foreign matter acquired by the acquiring unit, and when the grinding head is in the position corresponding to the foreign matter, controlling the moving unit to lift the grinding head to a preset height according to the height of the foreign matter measured by the measuring unit, thereby grinding the foreign matter. The grinding equipment provided by the invention can greatly shorten the grinding time and improve the grinding efficiency.

Description

A kind of milling apparatus and Ginding process
Technical field
The present invention relates to display technology field, more particularly to a kind of milling apparatus and Ginding process.
Background technology
Lcd technology is still the current mainstream technology for showing basin, wherein most widely used for TFT-LCD (Thin Film Transistor-Liquid Crystal Display, Thin Film Transistor-LCD), its main composition is battle array Row substrate (Array), color membrane substrates (CF), liquid crystal and sealed plastic box.The major function of color membrane substrates is to realize the color of TFT-LCD Show, the production technology of color film is predominantly coated with, exposure, development, baking, so as to glass baseplate surface formed black surround matrix, Chromatic filter layer and chock insulator matter (Photo spacer, PS), the acting as of PS support between array base palte and color membrane substrates into Box gap.
In color membrane substrates processing procedure, before baking, the film layer of black surround and chromatic photoresist material is in incomplete oven-dried condition, if Granule in standby internal, environment drops on color membrane substrates surface, is easily adhered or is wrapped in photoresist, in follow-up processing procedure In cannot clean removal, during color film is sticked to after baking, and form bad point.When bad point height is beyond PS height, right Can form that bright spot, dim spot etc. are bad after box, affect the performance of display device, therefore, in color membrane substrates processing procedure, it is necessary to these Bad point is removed.
At present, the most widely used method of foreign body removed on color membrane substrates is polishing, and by grinding head lapping tape is wrapped up Foreign body is ground, and by, to the measurement of foreign body height, determining whether to be ground to object height before and after grinding. In existing milling apparatus, the metering system of contact is generally adopted to the elevation carrection of foreign body, foreign body is entered by induction apparatuss Row contact linear scanning, is scanned to granule foreign body by glass substrate, then is scanned to glass substrate, is calculated by scanning curve Foreign body relative to glass substrate height as foreign body height, feed back to grinding head, grinding head is by foreign body height and target height Degree is compared, and the height for declining is needed when calculating grinding, after grinding, needs to detect grinding effect, by induction apparatuss again to grinding Foreign body after mill is scanned measurement, is calculated the foreign body height after grinding, then compared with object height, if being less than target Highly, then grinding is completed；If above object height, then regrinding, is surveyed again height, is judged after grinding using induction apparatuss.
This lapping mode, needs first to scan survey height, then grinds foreign body, and survey high detection is then scanned again, time-consuming longer, And using the high mode of survey of contact, if there is PS near foreign body or foreign body area is larger beyond induction apparatuss scanning distance When, it is interfered due to surveying high datum level when surveying high, it is impossible to accurately calculate the height of foreign body, so as to affect what grinding head declined Highly, cause below foreign body grinding fall short height, or, it is ground many and damaged on glass substrate black surround matrix, Chromatic filter layer, causes quality bad；Requirement measurement induction apparatuss are needed to have to scan through to foreign body additionally, contact surveys high mode Peak, when induction apparatuss run-off the straight, deviates foreign body peak during scanning, the foreign body for calculating is highly low, grinding head The height of decline is also low, and so as to cause foreign body peak position sufficiently not ground, it may highly remain above PS Highly, TFT layer can be contacted after to box, causes bright spot to occur；Additionally, contact induction apparatuss (Sensor) are in measurement process, Easily polluted by extraneous foreign body, it is sticky on Sensor surfaces, affect the accuracy of measurement；Also, stick to Sensor tables The foreign body in face is likely to pollute normal film layer when surveying high or scratches film layer, causes bad generation.As can be seen here, contact is surveyed High lapping mode needs to carry out strict management to Sensor, to guarantee the accuracy of its measurement.
The content of the invention
It is an object of the invention to provide a kind of milling apparatus and Ginding process, can solve the problem that in prior art using contact The problem of measurement milling time length, achievable to survey high and grinding while carrying out caused by formula measurement lapping mode, carries out instant Elevation carrection and feedback so that grinding and detection can be completed once, lift working performance.
Technical scheme provided by the present invention is as follows：
A kind of milling apparatus, including：
Lapping tape；
Grind section, including for the grinding head pressed on the lapping tape on substrate to be ground and being connected to the grinding Milling apparatus box on head；
Mobile unit, is connected with the grind section, for moving the grinding head；
Acquiring unit, is connected with the grind section, can move with the grind section, the grinding head is obtained in real time current The foreign substance information of the substrate to be ground at position in presumptive area, the foreign substance information includes the positional information of foreign body；
Measuring unit, is arranged in the grind section, for measuring the foreign body height at the grind section present position Degree；
And, control unit, for the foreign substance information according to acquired in the acquiring unit, controls the mobile unit by institute State grinding head to be moved at position corresponding with foreign body, and when the grinding head is in position corresponding with foreign body, according to survey The foreign body height obtained measured by amount unit, controls the mobile unit and the grinding head is lifted into preset height, different to grind Thing.
Further, the measuring unit includes：
The height meter being arranged on the milling apparatus box, the height meter be used for measure the grinding head away from From the height of substrate to be ground；
The pressure transducer being arranged on the grinding head, can the grinding head between substrate to be ground apart During the elemental height of predeterminable range declines to close orientation substrate to be ground, when the pressure acquired in the pressure transducer When value is more than preset value, trigger is sent；
And, processing module, for obtaining the elemental height of the grinding head that the height meter is detected, and when reception During to the trigger, the present level of the grinding head is obtained by the height meter, according to the elemental height Determine foreign body height with the present level, wherein the foreign body highly be the elemental height and the present level it Difference.
Further, the height meter includes：
It is arranged on the milling apparatus box, and can be with the optical scale of the grinding head elevating movement；
And, for reading the optical scale reading induction apparatuss of reading on the optical scale.
Further, the acquiring unit includes：For gathering at the grinding head present position in predeterminable area Substrate surface image to be detected, to obtain the ccd image processing meanss of the foreign substance information；
Wherein, the ccd image processing meanss include：
It is arranged in array in multiple CCD cameras of the milling apparatus box periphery；
For providing the light source of light；
The optical lens group being correspondingly arranged at below each CCD camera, the optical lens group can be by the light source The surface of outgoing to substrate to be ground after the deflection of light of offer, and cause the light of substrate surface reflection to be ground to enter described CCD camera, so that the CCD camera gathers the image of substrate surface to be ground；
The dark slide being arranged between the CCD camera and the optical lens group, the dark slide includes light shielding part And peristome, the peristome be used for limit the predeterminable area；
And, the processor being connected with the CCD camera, what the processor can gather the CCD camera Image is processed, to generate the foreign substance information.
Further, the processor includes：
Memory module, for storing the zero defect benchmark image of substrate to be ground；
Comparison module, the image and the zero defect benchmark image for the CCD camera to be gathered is contrasted, and More than predetermined ratio first is reached in the image that the CCD camera is gathered with the coincidence factor of the zero defect benchmark image Image section is used as substrate layer image to be ground；
And, processing module, in the image that the CCD camera is gathered in addition to the substrate layer image to be ground The second image section be defined as foreign body image, and the foreign body image is processed, and generate the foreign substance information.
Further, the grinding head has first state and the second state；
Wherein, in the first state, the grinding head while being lifted, is pressed under mobile unit drive Pressure lapping tape, to carry out pressing type grinding；
In second state, while the grinding head is translated under mobile unit drive, the grinding Head can be rolled, and rotating direction is consistent with grinding tape motion direction, and rolling speed is matched with lapping tape movement velocity, to carry out Roller grinds.
Further, the foreign substance information is also including the size information of foreign body；
Described control unit is additionally operable to the size information according to the foreign body to control the grinding head described Switch between one state and second state；
Wherein, when the area of the foreign body is less than preset area value, described control unit controls the mobile unit will The grinding head is moved to the overcentre of foreign body, and controls the grinding head and switch to the first state, single according to measurement The foreign body height that unit obtains, controls the mobile unit and the grinding head is lifted into preset height, to grind foreign body；
When the area of the foreign body is more than preset area value, described control unit controls the mobile unit and grinds described Bistrique is moved at the marginal position of foreign body, and according to the foreign body height that measuring unit is obtained, controls the mobile unit by institute Grinding head lifting preset height is stated, the grinding head is controlled and is switched to second state, to grind foreign body.
Further, described control unit is additionally operable in the grinding head in first state, and the pressure transducer When acquired change value of pressure exceeds preset pressure changing value, control the grinding head and switch to the second state.
A kind of Ginding process, is applied to milling apparatus as above, and methods described includes：
Treat the step of each foreign body is ground on grinding base plate, it is described to treat each foreign body on grinding base plate and ground The step of mill, includes：
The foreign substance information of the substrate to be ground at grinding head present position in presumptive area, the foreign body are obtained in real time Information includes the positional information of foreign body；
According to acquired foreign substance information, control grinding head is moved at position corresponding with foreign body；
When grinding head is on position corresponding with foreign body, the foreign body height at grinding head position is measured；
According to the measured foreign body height for obtaining, control grinding head lifting preset height, it is located with grinding the grinding head Foreign body at position；
After foreign body grinding at the grinding head position is finished, according to the real-time foreign substance information for obtaining, control At grinding head movement position corresponding with another foreign body；
Methods described also includes：
The step of each foreign body is ground on grinding base plate is treated described in repeating, until all different on substrate to be ground Thing grinding is completed.
Further, in methods described, when grinding head is on position corresponding with foreign body, measurement grinding head institute is in place The foreign body height at place is put, is specifically included：
By grinding head from the elemental height between substrate to be ground at a distance of predeterminable range near orientation substrate to be ground Decline；
When the pressure value that the pressure transducer on grinding head is detected is more than preset value, pressure transducer sends triggering letter Number；
When the trigger is received, the present level of grinding head is obtained, and according to the initial position and described Present level determines foreign body height, wherein the foreign body is highly the elemental height and the difference of the present level.
What the present invention was brought has the beneficial effect that：
Milling apparatus provided by the present invention, when being ground, the measuring unit arranged in grind section can be in grinding Head be moved to foreign body just to position when, the foreign body of current position is directly carried out to survey high, and high according to the foreign body of measurement Degree lifting grinding head, is ground with the foreign body to current position；And acquiring unit is while grinding head grinds, can be right Grinding point periphery film layer is measured, and obtains the foreign substance information in grinding side surrounding predetermined area, and grinding head is grinding current After foreign body at position, then foreign body positional information that can be according to acquired in acquiring unit is automatically moved into next foreign body institute in place Place is put, such that it is able to carry out continuous automatic grinding；Also, it is described to obtain when grinding head is moved to next foreign body position Taking unit can carry out instant foreign body to detect to the position for having completed to grind according to acquired foreign substance information Altitude feedback so that grinding and detection can be completed once, lift working performance.
As can be seen here, milling apparatus provided by the present invention, are capable of achieving to obtain foreign substance information, high foreign body survey, grinding and examine Survey process is carried out simultaneously, compared with over-over mode that is high, grinding again, detect again is first surveyed in prior art, can be greatly shortened and be ground Time consuming, lifts grinding efficiency.
Description of the drawings
Fig. 1 represents the structural representation of the milling apparatus provided in the embodiment of the present invention；
Fig. 2 represents the front view of the grind section of the milling apparatus provided in the embodiment of the present invention；
Fig. 3 represents the side view of Fig. 2；
Fig. 4 represent in the embodiment of the present invention provide milling apparatus ccd image processing meanss in be arranged in array it is many The top view of individual CCD camera；
Fig. 5 represents that working condition of the milling apparatus provided in the embodiment of the present invention when being ground to point-like foreign body is shown It is intended to；
Fig. 6 represents work shape of the milling apparatus provided in the embodiment of the present invention when being ground to large-area foreign body State schematic diagram.
Specific embodiment
To make purpose, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention Accompanying drawing, the technical scheme of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this Bright a part of embodiment, rather than the embodiment of whole.Based on described embodiments of the invention, ordinary skill The every other embodiment that personnel are obtained, belongs to the scope of protection of the invention.
There is milling time using contact type measurement lapping mode when foreign body grinds for color membrane substrates in prior art Long, the low problem of efficiency, the invention provides a kind of milling apparatus and Ginding process, can reduce milling time, lifts operation Efficiency.
As shown in Figures 1 to 6, the milling apparatus that the embodiment of the present invention is provided include：
Lapping tape 100；
Grind section, including for the lapping tape 100 being pressed on the grinding head 200 on substrate to be ground 10 and is connected to Milling apparatus box 300 on the grinding head 200；
Mobile unit, is connected with the grind section, for moving the grinding head 200；
Acquiring unit, is connected with the grind section, can move with the grind section, and the grinding head 200 is obtained in real time The foreign substance information of the substrate to be ground 10 at present position in presumptive area, the foreign substance information includes that the position of foreign body is believed Breath；
Measuring unit, is arranged in the grind section, for measuring the foreign body height at the grind section present position Degree；
And, control unit, for the foreign substance information according to acquired in the acquiring unit, controls the mobile unit by institute State grinding head 200 to be moved at position corresponding with foreign body, and when the grinding head 200 is in position corresponding with foreign body, The foreign body height obtained according to measured by measuring unit, controls the mobile unit and the grinding head 200 is lifted into preset height, To grind foreign body.
The milling apparatus that the embodiment of the present invention is provided, its acquiring unit can obtain grinding point periphery presumptive area inner membrance The foreign substance information of layer, the foreign substance information can include the information such as positional information, the size of foreign body of foreign body, and measuring unit Then foreign body at the present position of grinding head 200 can highly be measured, so as to, the milling apparatus are when being ground, In grind section arrange measuring unit can grinding head 200 be moved to foreign body just to position when, to current position Foreign body directly carries out surveying high, and according to the foreign body lift in height grinding head 200 of measurement, is ground with the foreign body to current position Mill；And acquiring unit is measured while grinding head 200 grinds to grinding point periphery film layer, obtain pre- around grinding side Determine the foreign substance information in region, grinding head 200 then can be obtained after the foreign body for having ground current position according to acquiring unit The foreign body positional information for taking is automatically moved at next foreign body position, such that it is able to carry out continuous automatic grinding；Also, When grinding head 200 is moved to next foreign body position, the acquiring unit can with according to acquired foreign substance information come To completed grind position detect, carry out instant foreign body altitude feedback so that grinding and detect can be once complete Into lifting working performance.
As can be seen here, milling apparatus provided herein, are capable of achieving to obtain foreign substance information, high foreign body survey, grinding and examine Survey process is carried out simultaneously, compared with over-over mode that is high, grinding again, survey high detection again is first surveyed in prior art, can be contracted significantly Short milling time, lifts grinding efficiency.
Hereinafter illustrate the preferred embodiment of milling apparatus provided by the present invention.
In the prior art, the mode that a kind of utilization CCD is focused on is additionally used in color membrane substrates processing procedure, to color membrane substrates On foreign body carry out surveying high grinding, it is the change using CCD focal heights, and grinding head bottom granule foreign body is highly felt Should measure.But this mode, the foreign body measurement for grinding head bottom in process of lapping can be disturbed by grinding head；Together When, in actual use, CCD easily produces the phenomenon of focus blur, can have a strong impact on the accuracy of measurement；In addition, in color film On substrate there is in itself certain difference in height, CCD in black surround matrix, chromatic filter layer and chock insulator matter (Photo spacer, PS) Focusing can be disturbed by each film layer, and the accuracy and resolution capability of measurement can be affected；Also, it is right in process of lapping The larger foreign body of area can only be fixed on some position grinding, it is impossible to carry out whole removing to foreign body and remove；For large area foreign body Human users are needed to be ground same foreign matters point position, it is impossible to realize the continuously grinding of automatization.
For above-mentioned by the way of the measure of the change foreign body height of CCD focal heights, there is the granule of grinding head bottom The problem that the elevation carrection in foreign body region can be interfered and measurement accuracy is poor, in preferred embodiment provided by the present invention In, the measuring unit includes：
The height meter being arranged on the milling apparatus box 300, the height meter is used to measure the grinding 200 apart from substrate to be ground 10 height；
The pressure transducer being arranged on the grinding head 200, can the grinding head 200 from substrate to be ground 10 Between at a distance of predeterminable range elemental height near the direction of substrate to be ground 10 decline during, when the pressure transducer institute When the pressure value of acquisition is more than preset value, trigger is sent；
And, processing module for obtaining the elemental height of the grinding head 200 that the height meter is detected, and is worked as When receiving the trigger, the present level of the grinding head 200 is obtained by the height meter, according to described first Begin highly and the present level determines the foreign body height, wherein the foreign body is highly current with described for the elemental height The difference of height.
Wherein, it is further preferred that as shown in Figures 2 and 3, the height meter includes：It is arranged at the grinding to set On standby box 300, and can be with the optical scale 401 of the elevating movement of the grinding head 200；And, for reading the optics mark The optical scale reading induction apparatuss 402 of reading on chi 401.
Using such scheme, the height meter can measure height of the grinding head 200 apart from substrate to be ground 10 Degree, and pressure transducer can detect the surface pressure of grinding head 200, and by grinding head 200 height of foreign body is sensed.Entering During row grinding, grinder receives the granule foreign body coordinate points of upstream inspection equipment transmission (for example：In color membrane substrates processing procedure The upstream equipment of grinding step can be equipped with a rough acquisition of information in substrate processing process to foreign body coordinate bit), grinding Portion moves according to foreign body coordinate points, makes the acquiring unit stop at detection foreign body top to obtain the information of foreign body, this Step is only to automatically confirm that foreign body position roughly；After confirming foreign body center, grinding head 200 is moved to foreign body overcentre, Control grinding head 200 begins to decline, while acquiring unit starts to obtain the foreign body letter in the peripheral plane predeterminable area of grinding head 200 Breath.Wherein, when the foreign substance information when grinding head 200 according to acquired in acquiring unit moves to foreign body overcentre, this position is made For the initial position of readiness of grinding head 200, calibrated using the front to be ground substrate 10 different for each thickness, setting should Grinding head 200 is H apart from the initial distance of the film layer of substrate to be ground 10 at initial position of readiness0, now, the height meter The reading of middle optical scale 401 is L0；After grinding head 200 reaches the initial position of readiness of foreign body overcentre, by z-axis The modes such as cylinder drive grinding head 200 to begin to decline, during decline when the foreign body of the lower section of particulate abrasive head 200 is touched, The pressure transducer of grinding head 200 can sense decline resistance, and trigger pressure transducer, the now reading of optical scale 401 Number is L1, then, and the height H of foreign bodyy1Can be identified as Hy1=H0-(L1-L0).Grinding head 200 persistently keeps after foreign body is touched Decline, simultaneous grinding band 100 starts to rotate, and lapping tape 100 is ground to foreign body, and keeps lasting optical scale 401 to read Number L1, Hs is preset before the milling as object height, i.e. when grinding head 200 drops to height Hy1=H0-(L1-L0)<It is different during Hs Thing is reached below object height, and the foreign body grinding to the position terminates；Then next step according to acquiring unit obtain it is different Thing information is automatically moved into next foreign body position and carries out automatic grinding, simultaneously as grinding head 200 have been moved into it is next Position is ground, and acquiring unit is no longer influenced by the impact of grinding head 200 at the position, and in grinding head 200 the next position is carried out While grinding, acquiring unit i.e. can to the grinding in the region after it is final highly measure confirmation, when the preset areas When the foreign body for grinding is not needed in domain, grinding head 200 is directly moved to other regions and is ground.
As can be seen here, in the preferred embodiment of the present invention, the measuring unit is directly using pressure transducer and optical scale 401 fit system measuring the height of foreign body, by way of the change of height is assembled CCD come the height for measuring foreign body Compare, grinding head 200 will not be subject to disturb, measurement result accuracy is high, and can realize measuring and grind while carrying out Purpose.
Of course, it should be understood that in such scheme, the measuring unit can also be realized using other modes, The above is only there is provided a kind of preferred implementation of the measuring unit, but be not that the measuring unit is limited It is fixed, for example：In actual applications, height meter described in the measuring unit can also be and adopt other modes, not only office It is limited to optical scale 401 and optical scale reading induction apparatuss 402 etc., can also be other structures, as long as grinding head can be measured 200 adjustable height.
In addition it is also necessary to explanation, in the milling apparatus that the embodiment of the present invention is provided, the grinding head 200 by Superhard alloy is constituted, its outside covering lapping tape 100, is produced by the rotation of lapping tape 100 and the decline of grinding head 200 Pressure and cutting force, crush foreign body and stick to be pulled away on lapping tape 100, wherein, grinding head 200 can by roller, grind Grinding belt fixing axle 202, rotation motor etc. is constituted, and volume sets lapping tape 100 outside the roller, it is preferred that set in the both sides of roller There is the anti-catch 201 that wanders off, for the screens of lapping tape 100, prevent the phenomenon for causing lapping tape 100 to deviate roller in grinding, Meanwhile, as shown in Figure 2, it is preferred that the driving rolls 101 of the lapping tape 100 can be solid to be carried out by the way of misplacing up and down Fixed, so can effectively reduce that lapping tape 100 is stored in board takes up room, and makes board design compacter.
Additionally, in preferred embodiment provided by the present invention, the acquiring unit includes：For gathering the grinding head Substrate surface image to be detected at 200 present positions in predeterminable area, with the ccd image for obtaining the foreign substance information Reason device；Wherein, as shown in Figure 1 and Figure 4, the ccd image processing meanss include：
It is arranged in array in multiple CCD cameras 501 of the periphery of milling apparatus box 300；
For providing the light source 502 of light；
The optical lens group of the lower section of each CCD camera 501 is correspondingly arranged at, the optical lens group can be by the light The surface of outgoing to substrate to be ground 10 after the deflection of light that source 502 provides, and cause the light of the surface of substrate to be ground 10 reflection Line enters the CCD camera 501, so that the CCD camera 501 gathers the image on the surface of substrate to be ground 10；
The dark slide 503 being arranged between the CCD camera 501 and the optical lens group, the dark slide 503 is wrapped Light shielding part and peristome 5031 are included, the peristome 5031 is used to limit the predeterminable area；
And, the processor being connected with the CCD camera 501, the processor can be by the CCD camera 501 The image of collection is processed, to generate the foreign substance information.
Using such scheme, the acquiring unit is carried out to the foreign substance information in the peripheral position predeterminable area of grinding head 200 The process of acquisition is carried out simultaneously with the abrasive action of grinding head 200, and the acquiring unit preferably adopts ccd image processing meanss, right Three-dimensional planar is measured in the peripheral neighborhood face of grinding head 200, to determine that current abrasion site periphery exceeds with the presence or absence of height Granule foreign body in allowable range is present.It should be appreciated that in other embodiments of the invention, the acquiring unit is also Can be realized using other modes, this is not defined.
In preferred embodiment provided by the present invention, it is preferred that as shown in Figure 1 and Figure 4, the ccd image processes dress In putting, multiple CCD cameras 501 are arranged in array in the surrounding of grinding head 200, according to the field range of required inspection, can To arrange the number of CCD camera 501 that quantity is not waited, square CCD imaging regions are constituted；The optical lens group can include Semi-transparent semi-reflecting lens 504, optical lenses 505 and microscope 506 etc., (light source 502 can adopt generating laser to light source 502 Deng) light of transmitting, Jing semi-transparent semi-reflecting lens are reflexed on optical lenses, and the optical lenses play the work to equalizing light rays With, the surface of substrate 10 to be ground is reached after light Jing microscopes, then foreign body is focused through microscope, CCD takes the photograph As 501 are taken pictures, image is formed, by carrying out difference processing to image, identify foreign matter point gray difference maximum point As foreign body center.Wherein, the predeterminable area size of CCD imagings can pass through the area of peristome 5031 for adjusting dark slide 503 To be adjusted and control.For the color film figure of big pixel, the peristome 5031 of dark slide 503 can be arranged relatively Greatly, it is to avoid foreign body is beyond measurement field range；For the color film figure of small pixel, can be by the peristome 5031 of dark slide 503 It is relatively small that size is arranged.
Ccd image processing meanss employed in the embodiment of the present invention have strong interference immunity, good confidentiality, small volume, Lightweight the advantages of, certainty of measurement is high,Nanoscale can be reached, and will not be affected by assembling definition.
The detailed process for carrying out image procossing and obtaining foreign substance information below for the ccd image processing meanss is said It is bright：
Light source 502 sends white light, and white light forms interference fringe, interference fringe when 10 superficial film of substrate to be ground is reached It is imaged by CCD through optical lenses, is imaged and forms the signal of telecommunication through signal adapter, and pass to computer, through calculates Obtain the 3-D view of the film layer of substrate to be ground 10.Array format is constituted by the CCD of series of identical resolution capability, as needed The resolution requirements and field range of inspection, can be adjusted to the ability of CCD, quantity, so as to realize to grinding head 200 weeks The measurement on the side surface of substrate 10 to be ground.Using the minimum point of 3-D view as datum level, as zero point, Z is designated as0, together When, two-dimentionalization process is carried out to 3-D view, the 3-D view for being obtained is divided into into N parts, each curve according to δ X pitches It is set as Xi, i.e. curve is X0~XN；M parts are divided into according still further to δ Y pitches, each curve setting is Yi, i.e. curve is Y0~ YM.δ X, the width of δ Y can be set as the foreign body minimum dimension of required identification, raised foreign body occurs during preventing from calculating and falls The non-overlay node region of grid element center, so as to caused leakage grinding phenomenon, for consideration of the foreign body on affecting into after box, δ X, δ Y Generally can be set as 3 μm~5 μm.Data and curves XiWith YiIntersect to form grid, each cross point is node in grid, And node is XY00~XYNM, each node and zero point Z0Carry out mathematic interpolation, the difference of gained be the position relative to The height of datum level, sets the point position nonrecognition of a recognition threshold, i.e. difference in height less than the threshold value to difference in height before measuring For defect, difference in height is then identified as defect higher than the threshold value, that is, obtain it is a series of beyond set allowed model in survey face Enclose the position XY of the defect point of altitude rangeNM, as the 2nd, 3 ... foreign bodies height in face.Thus, dress is processed by the ccd image Put the information such as the size of the position of foreign body, the height of foreign body and foreign body of the acquisition in the periphery predeterminable area of grinding head 200.
Additionally, in the prior art, when treating grinding base plate 10 and being ground process, may deposit on substrate to be ground 10 In the part with certain altitude that some substrates there is in itself, for example：When the substrate to be ground 10 is color membrane substrates, There is chock insulator matter (PS), if deposited near foreign body using contact type measurement mode in the prior art on the color membrane substrates of finished product In PS or the larger scanning distance beyond induction apparatuss of foreign body area, it is interfered due to surveying high datum level when surveying high, it is impossible to The height of foreign body is accurately calculated, grinding effect is affected.
And in embodiment provided by the present invention, it is preferred that the processor includes：
Memory module, for storing the zero defect benchmark image of substrate to be ground 10；
Comparison module, it is right that image and the zero defect benchmark image for the CCD camera 501 to be gathered is carried out Than, and with the coincidence factor of the zero defect benchmark image reach predetermined ratio in the image that the CCD camera 501 is gathered with On the first image section as the film layer image of substrate to be ground 10；
And, processing module removes the film layer figure of the substrate to be ground 10 in the image for gathering the CCD camera 501 The second image section as outside is defined as foreign body image, and the foreign body image is processed, and generates the foreign body letter Breath.
Using such scheme, for not carrying out PS operation situations on color membrane substrates, now measure substrate surface and there was only black surround There is flatness layer (OC) in matrix, chromatic filter layer, on chromatic filter layer without PS interference, the then three-dimensional for generating CCD The minimum point of image is stored as the zero defect benchmark image of substrate to be ground 10 as datum level, by the CCD camera The first more than predetermined ratio image section conduct is reached in the image of 501 collections with the coincidence factor of the zero defect benchmark image The film layer of substrate to be ground 10, in the image of the collection of the CCD camera 501 in addition to the film layer image of the substrate to be ground 10 Second image section is defined as foreign body image, and the foreign body image is processed, high beyond set allowable range The position XY of the defect point of degree scopeNM, the peak of foreign body can accurately be found by the method.It is scattered in sight plane Foreign matter point, position (X when initially being ground by calculating grinding head 2000, Y0) and XYNMRelative displacement, grinding head 200 completes After some foreign body grindings, after returning back to initial position of readiness, position XY is automatically moved intoNMStarting other foreign bodies in opposite is carried out certainly Dynamic grinding, is repeated the execution action of above-mentioned grinding steps.
For the situation for carrying out PS operations on color membrane substrates, for the automatic lookup of foreign body, include on substrate to be ground 10 There is flatness layer (OC) and PS on chromatic filter layer in black surround matrix, chromatic filter layer, due to PS sheets as with datum level There is the column of 2~4um or so segment difference, it is easy during height is surveyed that PS is mistakenly identified as into foreign body, so in image procossing mistake Cheng Zhong, needs to shield the measurement data of PS, could accurately calculate other projection foreign bodies in analysis face.PS is included processing CF substrates before, intercept first flawless comprising complete black surround matrix, chromatic filter layer or on chromatic filter layer There is the substrate surface image of flatness layer (OC) and PS, its measurement image is obtained by optical pickocff, and be stored as base to be ground The zero defect benchmark image of plate 10, in be ground substrate 10 of the grinding comprising foreign body, the CCD camera 501 is gathered Image is compared with zero defect benchmark image, when the image and the weight of zero defect benchmark image of the collection of the CCD camera 501 When conjunction rate reaches certain proportion, that is, think to be reached with zero defect benchmark image coincidence factor in the image that the CCD camera 501 is gathered It is substrate layer image to be ground to a certain proportion of this parts of images, i.e., this part image data is filtered, remainder Partial image carries out again foreign body search procedure as described above, by beyond the defect point of set allowable range altitude range Position XYNM, the peak of foreign body can accurately be found by the method, grinding head 200 is carried out further according to set other foreign body Grinding.
As can be seen here, using such scheme, milling apparatus provided by the present invention can solve prior art and prize film base There is a problem of producing interference during PS on plate.
Additionally, large area granule foreign body or harder foreign body, from surface grinding the fracture of lapping tape 100 is easily caused Or the phenomenon that grinding is not gone down, in the prior art in color membrane substrates processing procedure also by the way of picture intensity slicing, place The grinding of reason large area granule foreign body, but intensity slicing is carried out again using CCD acquisition pictures, for the resolution energy of large area foreign body Power is limited, the phenomenon for None- identified easily occur；And in process of lapping, the grinding number that the needs that grinding head 200 is obtained decline According to generally by contact Sensor measurement foreign body provide, although by portrait process, can make grinding head 200 be moved to foreign body its Its protruding part, but because measurement height is subject to periphery foreign materials away, it is impossible to it is supplied to grinding head 200 accurately to need decline to grind , easily there are ground many phenomenons in mill height after grinding, so as to cause grinding failure.
Large area foreign body grinding effect is bad in order to solve the problems, such as above-mentioned prior art, in reality provided by the present invention In applying example, it is preferred that the grinding head 200 has first state and the second state；Wherein, it is described to grind in the first state Bistrique 200 while being lifted, presses lapping tape 100, to carry out pressing type grinding under mobile unit drive； Second state, while the grinding head 200 is translated under mobile unit drive, the energy of the grinding head 200 It is enough to roll, and rotating direction is consistent with the direction of motion of lapping tape 100, rolling speed is matched with the movement velocity of lapping tape 100, to enter Row roller grinds.
Using such scheme, the milling apparatus provided in the embodiment of the present invention, grinding head 200 can be with two kinds of work Pattern, one kind is pressing type grinding pattern, and one kind grinds pattern for roller, and wherein pressing type grinding pattern is little suitable for single-point The grinding of the granule foreign body of size, rotary motion of the grinding head 200 without itself, the only down maneuver of Z axis, with reference to lapping tape 100 rotation, pressing type grinding is carried out to foreign body, and grinding head 200 is located at foreign body top, and the method is for small sized particles foreign body There is preferable grinding effect；But for large area granule foreign body or harder foreign body, the grinding from surface is easily caused grinding The phenomenon that the fracture or grinding of band is not gone down, can now automatically switch to roller grinding pattern, and which is applied to big face Product granule foreign body or harder foreign body, roller grinding pattern is adopted from foreign body lateral edges and starts grinding, and grinding head 200 is cylinder There is the driver part 203 that can provide its rotation body structure, its both sides, are that grinding head 200 provides the driving force for rotating, lapping tape 100 are covered on grinding head 200.
Specifically, in preferred embodiment provided by the present invention, described control unit can be according to the acquiring unit The size information of acquired foreign body come control the grinding head 200 the first state and second state it Between switch；Wherein, when the area of the foreign body is less than preset area value, described control unit controls the mobile unit by institute State grinding head 200 and be moved to the overcentre of foreign body, and control the grinding head 200 and switch to the first state, according to survey The foreign body height that amount unit is obtained, controls the mobile unit and the grinding head 200 is lifted into preset height, to grind foreign body； When the area of the foreign body is more than preset area value, described control unit controls the mobile unit by the grinding head 200 It is moved at the marginal position of foreign body, and according to the foreign body height that measuring unit is obtained, controls the mobile unit and grind described Bistrique 200 lifts preset height, controls the grinding head 200 and switches to second state, to grind foreign body.
Using such scheme, the granule foreign body larger for continuous area, the granule acquired in ccd image processing meanss The point position XY of foreign bodyNMWith (X0, Y0) neighbouring, then judge that the area of foreign body, more than preset area value, now, can control grinding head 200 automatically switch to roller grinding pattern to grind foreign body.
Additionally, in preferred embodiment provided by the present invention, if the grinding cover width of grinding head 200 is the first width d1, length of the foreign body acquired in the ccd image processing meanss in the direction of motion of lapping tape 100 is the first length l1, hanging down The straight width in the direction of motion of lapping tape 100 is the second width d2。
Preferably, described control unit is additionally operable to when the area of the foreign body is more than preset area value, controls the shifting Moving cell is moved to the grinding head 200 at the first edge position of foreign body, and the foreign body height obtained according to measuring unit, Control the mobile unit and the grinding head 200 is lifted into preset height, control the grinding head 200 and switch to second shape State, and march at the second edge position of foreign body；
When the grinding head 200 advance first apart from h1More than or equal to first length l1When, control the grinding head 200 return first apart from h1Length, and reach at the first edge of the foreign body, and vertical with the direct of travel of grinding head 200 Direction on misplace predetermined width d3, predetermined width d3Less than or equal to the first width d1, obtain further according to measuring unit Foreign body height, control the mobile unit and the grinding head 200 lifted into preset height, control the grinding head 200 and switch To second state, and march at the second edge position of foreign body；
Control the grinding head 200 and grind the foreign body n times, N=d according to above-mentioned steps2/d1。
Using such scheme, when grinding head 200 grinds pattern in roller, grinding head 200 is processed according to ccd image Device provide granule foreign body defect point position, grinding head 200 can coverage the first width d1(about 30 μm), according to CCD The foreign body area that image processing apparatus determine, it is assumed that foreign body section Kuan regions are d2, according to d1Width divided, be divided into N Equal portions, N=d2/d1Equal portions, are ground successively, for example per equal portions grinding head 200：Grinding head 200 is moved to the first equal portions edge Position, directly drops to object height Hs, is to reduce the resistance that grinding head 200 is born in process of lapping, in this kind of pattern Grinding head 200 itself keeps identical rotational speed with lapping tape 100, grinding is proceeded by from foreign body edge, in grinding head 200 During rotating lapping tape 100 with lapping tape 100, grinding head 200 carries out traveling grinding along foreign body distribution arrangement simultaneously, Till the edge of recognized foreign body, grinding head 200 is moved to again the second equal portions region and is ground, in this manner, directly To the grinding of granule foreign body is finished.
Time to prevent super large foreign body continuously grinding from causing wastes, and described control unit can also set most grindings Number of times, the grinding number of times of the same area foreign body carries out NG judgements beyond when setting grinding number of times to the foreign body.
Additionally, in embodiment provided by the present invention, it is preferred that described control unit is additionally operable in the grinding head 200 be in first state, and the change value of pressure acquired in the pressure transducer exceed preset pressure changing value when, control institute State grinding head 200 and switch to the second state.
Using such scheme, during grinding head 200 is ground using pressing type grinding pattern, foreign body highly declines Not substantially or without during decline, now, the pressure transducer of grinding head 200 gets the pressure of grinding head 200 and normally declines with grinding When pressure gap exceed set threshold value when, then judge the hardness is bigger of the foreign body, then control grinding head 200 be automatically changeb to rolling Dynamic formula grind pattern, cause lapping tape 100 to rupture with the foreign body for avoiding hardness is bigger or grind do not go down phenomenon generation.
Milling apparatus provided in the preferred embodiment of the present invention, when all defect point grinding on a substrate to be ground 10 After being disposed, substrate to be ground 10 is automatically drained out, next piece of substrate to be ground puts into again milling apparatus.The present invention is excellent The milling apparatus provided in embodiment are selected, the face to grinding foreign body periphery by the way of optics survey is high is measured, and leads to Cross measurement grinding head 200 itself lifting to be ground and survey high, solves the problems, such as grinding with take when surveying height alternately it is longer. Simultaneously current grinding foreign body periphery is measured by the way of optical measurement, can grinding with effectively solving large area foreign body Mill, and by the special construction of grinding head 200, there is provided a kind of two kinds of lapping modes, foreign body of correspondence small area carries out single-point Grinding, grinds large-area foreign body second by the way of roller.PS two is not contained otherwise for face comprising PS and face Grinding object is planted, different foreign bodies is devised and is searched modes, the carrying out for enabling grinding automatic accurate.
Furthermore, it is necessary to explanation, in embodiment provided by the present invention, described control unit can include data processing Device 601, signal adapter 602, signal amplifier 603 etc.；The mobile unit can include X guide rails, Y guide rail and Z axis gas Cylinder 604 etc., to realize the movement to grinding head 200.
Milling apparatus provided in the preferred embodiment of the present invention, using ccd image processing meanss to grinding point periphery film Layer is measured, and whether has other defects to be ground in recognition and verification foreign body size and peripheral visual field, and it is scarce to provide needs grinding Trapping spot position coordinateses, grinding head is automatically moved according to coordinate position and carries out continuous automatic grinding；Using the light of grinding head itself Scale setting benchmark and measurement dropping distance are learned, so as to confirm to grind point height and the height after grinding, foreign body surveys high and grinding Carry out simultaneously, survey high compared with method alternately is ground with foreign body in prior art, greatly shorten milling time, improve different Thing surveys high accuracy, lifts grinding effect；Also, the milling apparatus also provide two kinds of lapping modes, and one kind is for point-like foreign body Pressing type lapping mode is directly adopted, is then entered using roller lapping mode for the big foreign body of the big foreign body of area or hardness Row grinding, grinding head is rolled while advance, and lapping tape carries out rotation grinding, is ground in traveling, and grinding head is certainly dynamic The height of foreign body should be ground, for ground region, height again is carried out simultaneously again by ccd image processing meanss true Recognize, so as to lift the grinding efficiency of foreign body.
Additionally, additionally providing a kind of Ginding process in embodiments of the invention, milling apparatus as above, institute are applied to The method of stating includes：
Treat the step of each foreign body is ground on grinding base plate 10, it is described to treat each foreign body on grinding base plate 10 and enter The step of row grinding, includes：
The foreign substance information of the substrate to be ground 10 at the present position of grinding head 200 in presumptive area, institute are obtained in real time State positional information of the foreign substance information including foreign body；
According to acquired foreign substance information, control grinding head 200 is moved at position corresponding with foreign body；
When grinding head 200 is on position corresponding with foreign body, the foreign body measured at the position of grinding head 200 is high Degree；
According to the measured foreign body height for obtaining, the control lifting preset height of grinding head 200, to grind the grinding head Foreign body at 200 positions；
After foreign body grinding at the position of the grinding head 200 is finished, according to the real-time foreign substance information for obtaining, control Grinding head processed 200 is moved at position corresponding with another foreign body；
Methods described also includes：
The step of each foreign body is ground on grinding base plate 10 is treated described in repeating, until the institute on substrate to be ground 10 There is foreign body grinding to complete.
Further, in methods described, when grinding head 200 is on position corresponding with foreign body, grinding head 200 is measured Foreign body height at position, specifically includes：
By grinding head 200 from the elemental height between substrate to be ground 10 at a distance of predeterminable range near substrate to be ground 10 directions decline；
When the pressure value that the pressure transducer on grinding head 200 is detected is more than preset value, pressure transducer sends and touches Signal；
When the trigger is received, the present level of grinding head 200 is obtained, and according to the initial position and institute State present level and determine foreign body height, wherein the foreign body is highly the elemental height and the difference of the present level.
Further, in methods described, obtain to be ground in presumptive area at the present position of grinding head 200 in real time The foreign substance information of substrate 10, including：
Store the zero defect benchmark image of substrate to be ground 10；
The image that the CCD camera 501 is gathered is contrasted with the zero defect benchmark image, and by the CCD The first more than predetermined ratio image portion is reached in the image of the collection of photographic head 501 with the coincidence factor of the zero defect benchmark image It is allocated as the film layer image of substrate to be ground 10；
The second figure in the image that the CCD camera 501 is gathered in addition to the film layer image of the substrate to be ground 10 As part is defined as foreign body image, and the foreign body image is processed, and generate the foreign substance information.
Further, in methods described, according to the measured foreign body height for obtaining, the default height of the control lifting of grinding head 200 Degree, to grind the foreign body at the position of the grinding head 200, specifically includes：
When the area of the foreign body is less than preset area value, the grinding head 200 is moved to into the overcentre of foreign body, And control the grinding head 200 and switch to the first state, according to the foreign body height that measuring unit is obtained, control the movement The grinding head 200 is lifted preset height by unit, to grind foreign body；
When the area of the foreign body is more than preset area value, the grinding head 200 is moved to into the marginal position of foreign body Place, and according to the foreign body height that measuring unit is obtained, control the mobile unit and the grinding head 200 is lifted into preset height, Control the grinding head 200 and switch to second state, to grind foreign body.
Further, if the grinding cover width of grinding head 200 is the first width d1, the ccd image processing meanss institute Length of the foreign body of acquisition in the direction of motion of lapping tape 100 is the first length l1, in the direction of motion of lapping tape 100 Width be the second width d2；In methods described,
When the area of the foreign body is more than preset area value, the grinding head 200 is moved to into the first edge of foreign body At position, and according to the foreign body height that measuring unit is obtained, the grinding head 200 is lifted into preset height, control the grinding 200 switch to second state, and march at the second edge position of foreign body；
When the grinding head 200 advance first apart from h1During more than or equal to first length, the grinding head is controlled 200 return first apart from h1Length, and reach at the first edge of the foreign body, and vertical with the direct of travel of grinding head 200 Direction on misplace predetermined width d3, predetermined width d3Less than or equal to the first width d1, obtain further according to measuring unit Foreign body height, the grinding head 200 is lifted into preset height, control the grinding head 200 and switch to second state, and March at the second edge position of foreign body；
Control the grinding head 200 and grind the foreign body n times, N=d according to above-mentioned steps2/d1。
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art For member, on the premise of without departing from the technology of the present invention principle, some improvement and replacement can also be made, these improve and replace Also should be regarded as protection scope of the present invention.

Claims (10)

1. a kind of milling apparatus, it is characterised in that include：
Lapping tape；
Grind section, including for the grinding head pressed on the lapping tape on substrate to be ground and being connected to the grinding head Milling apparatus box；
Mobile unit, is connected with the grind section, for moving the grinding head；
Acquiring unit, is connected with the grind section, can move with the grind section, the grinding head is obtained in real time and is currently located The foreign substance information of the substrate to be ground at position in presumptive area, the foreign substance information includes the positional information of foreign body；
Measuring unit, is arranged in the grind section, for measuring the foreign body height at the grind section present position；
And, control unit, for the foreign substance information according to acquired in the acquiring unit, controls the mobile unit and grinds described Bistrique is moved at position corresponding with foreign body, and when the grinding head is in position corresponding with foreign body, it is single according to measurement The foreign body height obtained measured by unit, controls the mobile unit and the grinding head is lifted into preset height, to grind foreign body.
2. milling apparatus according to claim 1, it is characterised in that
The measuring unit includes：
The height meter being arranged on the milling apparatus box, the height meter is treated for measuring the grinding head distance The height of grinding base plate；
The pressure transducer being arranged on the grinding head, can apart preset in the grinding head between substrate to be ground The elemental height of distance near orientation substrate to be ground decline during, when the pressure value acquired in the pressure transducer it is big When preset value, trigger is sent；
And, processing module receives institute for obtaining the elemental height of the grinding head that the height meter is detected, and working as When stating trigger, the present level of the grinding head is obtained by the height meter, according to the elemental height and institute State present level and determine the foreign body height, wherein the foreign body is highly the elemental height and the difference of the present level.
3. milling apparatus according to claim 2, it is characterised in that
The height meter includes：
It is arranged on the milling apparatus box, and can be with the optical scale of the grinding head elevating movement；
And, for reading the optical scale reading induction apparatuss of reading on the optical scale.
4. milling apparatus according to claim 1, it is characterised in that
The acquiring unit includes：For gathering the substrate table to be detected at the grinding head present position in predeterminable area Face image, to obtain the ccd image processing meanss of the foreign substance information；
Wherein, the ccd image processing meanss include：
It is arranged in array in multiple CCD cameras of the milling apparatus box periphery；
For providing the light source of light；
The optical lens group being correspondingly arranged at below each CCD camera, the optical lens group can provide the light source Deflection of light after outgoing to substrate to be ground surface, and cause the light of substrate surface to be ground reflection to enter the CCD Photographic head, so that the CCD camera gathers the image of substrate surface to be ground；
The dark slide being arranged between the CCD camera and the optical lens group, the dark slide includes light shielding part and opens Oral area, the peristome is used to limit the predeterminable area；
And, the processor being connected with the CCD camera, the image that the processor can gather the CCD camera Processed, to generate the foreign substance information.
5. milling apparatus according to claim 4, it is characterised in that
The processor includes：
Memory module, for storing the zero defect benchmark image of substrate to be ground；
Comparison module, the image and the zero defect benchmark image for the CCD camera to be gathered is contrasted, and by institute The first more than predetermined ratio image is reached in the image for stating CCD camera collection with the coincidence factor of the zero defect benchmark image Part is used as substrate layer image to be ground；
And, processing module, in the image that the CCD camera is gathered in addition to the substrate layer image to be ground the Two image sections are defined as foreign body image, and the foreign body image is processed, and generate the foreign substance information.
6. milling apparatus according to claim 2, it is characterised in that
The grinding head has first state and the second state；
Wherein, in the first state, the grinding head under the mobile unit drive while being lifted, grind by pressing Grinding belt, to carry out pressing type grinding；
In second state, while the grinding head is translated under mobile unit drive, the grinding head energy It is enough to roll, and rotating direction is consistent with grinding tape motion direction, rolling speed is matched with lapping tape movement velocity, to be rolled Formula is ground.
7. milling apparatus according to claim 6, it is characterised in that
The foreign substance information is also including the size information of foreign body；
Described control unit is additionally operable to the size information according to the foreign body, controls the grinding head in the first state Switch and second state between；
Wherein, when the area of the foreign body is less than preset area value, described control unit controls the mobile unit will be described Grinding head is moved to the overcentre of foreign body, and controls the grinding head and switch to the first state, is obtained according to measuring unit The foreign body height for arriving, controls the mobile unit and the grinding head is lifted into preset height, to grind foreign body；
When the area of the foreign body is more than preset area value, described control unit controls the mobile unit by the grinding head It is moved at the marginal position of foreign body, and according to the foreign body height that measuring unit is obtained, controls the mobile unit and grind described Grinding head lifting preset height, controls the grinding head and switches to second state, to grind foreign body.
8. milling apparatus according to claim 6, it is characterised in that
Described control unit is additionally operable in the grinding head in first state, when the pressure acquired in the pressure transducer becomes When change value exceeds preset pressure changing value, control the grinding head and switch to the second state.
9. a kind of Ginding process, the milling apparatus being applied to as described in any one of claim 1 to 8, it is characterised in that the side Method includes：
The step of each foreign body is ground on grinding base plate is treated, it is described to treat what each foreign body on grinding base plate was ground Step includes：
The foreign substance information of the substrate to be ground at grinding head present position in presumptive area, the foreign substance information are obtained in real time Including the positional information of foreign body；
According to acquired foreign substance information, control grinding head is moved at position corresponding with foreign body；
When grinding head is on position corresponding with foreign body, the foreign body height at grinding head position is measured；
According to the measured foreign body height for obtaining, control grinding head lifting preset height, to grind the grinding head position The foreign body at place；
After foreign body grinding at the grinding head position is finished, according to the real-time foreign substance information for obtaining, control grinding At head movement position corresponding with another foreign body；
Methods described also includes：
The step of each foreign body is ground on grinding base plate is treated described in repeating, until all foreign bodies on substrate to be ground grind Mill is completed.
10. Ginding process according to claim 9, it is characterised in that in methods described, when grinding head is in and foreign body pair When on the position answered, the foreign body height at grinding head position is measured, specifically included：
By grinding head from the elemental height between substrate to be ground at a distance of predeterminable range near orientation substrate to be ground decline；
When the pressure value that the pressure transducer on grinding head is detected is more than preset value, pressure transducer sends trigger；
When the trigger is received, the present level of grinding head is obtained, and according to the initial position and described current Foreign body height is highly determined, wherein the foreign body is highly the elemental height and the difference of the present level.
CN201710001281.6A 2017-01-03 2017-01-03 Grinding equipment and grinding method Pending CN106680288A (en)

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CN107390400A (en) * 2017-08-30 2017-11-24 武汉华星光电技术有限公司 Color membrane substrates flaw prosthetic device and restorative procedure
CN108284388A (en) * 2017-12-26 2018-07-17 华中科技大学 A kind of intelligent Force control grinding and polishing apparatus of vision guide
CN108527144A (en) * 2018-03-28 2018-09-14 昆山国显光电有限公司 Substrate grinding device and its grinding method
CN109031731A (en) * 2018-10-09 2018-12-18 惠科股份有限公司 Color film grinding method for repairing and mending and grinding repair apparatus
CN109297970A (en) * 2017-11-24 2019-02-01 苏州娄格自动化科技有限公司 Solar panels terminal box crator detection components
CN109623602A (en) * 2017-10-09 2019-04-16 上海微电子装备（集团）股份有限公司 The method of sucker automatic cleaning apparatus and method, automatic identification sucker abnormal point
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CN113400196A (en) * 2021-06-18 2021-09-17 西安奕斯伟硅片技术有限公司 Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium
CN113970560A (en) * 2021-10-28 2022-01-25 中国科学院光电技术研究所 Defect three-dimensional detection method based on multi-sensor fusion
CN114126792A (en) * 2019-07-24 2022-03-01 西铁城时计株式会社 Machining device, control device used for same, and control method for machining device

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CN107390400A (en) * 2017-08-30 2017-11-24 武汉华星光电技术有限公司 Color membrane substrates flaw prosthetic device and restorative procedure
CN109623602B (en) * 2017-10-09 2021-03-09 上海微电子装备（集团）股份有限公司 Automatic cleaning device and method for sucker and method for automatically identifying abnormal point of sucker
CN109623602A (en) * 2017-10-09 2019-04-16 上海微电子装备（集团）股份有限公司 The method of sucker automatic cleaning apparatus and method, automatic identification sucker abnormal point
CN109297970A (en) * 2017-11-24 2019-02-01 苏州娄格自动化科技有限公司 Solar panels terminal box crator detection components
CN108284388A (en) * 2017-12-26 2018-07-17 华中科技大学 A kind of intelligent Force control grinding and polishing apparatus of vision guide
CN108284388B (en) * 2017-12-26 2019-09-27 华中科技大学 A kind of intelligent Force control grinding and polishing apparatus of vision guide
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CN108527144A (en) * 2018-03-28 2018-09-14 昆山国显光电有限公司 Substrate grinding device and its grinding method
CN109031731A (en) * 2018-10-09 2018-12-18 惠科股份有限公司 Color film grinding method for repairing and mending and grinding repair apparatus
CN114126792A (en) * 2019-07-24 2022-03-01 西铁城时计株式会社 Machining device, control device used for same, and control method for machining device
CN113400196A (en) * 2021-06-18 2021-09-17 西安奕斯伟硅片技术有限公司 Cleaning method, device and equipment for grinding fixed disc groove and computer storage medium
CN113970560A (en) * 2021-10-28 2022-01-25 中国科学院光电技术研究所 Defect three-dimensional detection method based on multi-sensor fusion
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Application publication date: 20170517