JP7093390B2 - Board cleaning equipment - Google Patents

Description

The present disclosure relates to a substrate cleaning apparatus and a substrate cleaning method, and a roll sponge for the substrate cleaning apparatus.

The substrate polishing device first polishes the substrate and then cleans the substrate. For example, a roll sponge is used for cleaning the substrate. The substrate cleaning device of the conventional substrate polishing device cannot always clean the substrate effectively.

Japanese Unexamined Patent Publication No. 2009-246190 Japanese Unexamined Patent Publication No. 2009-267368

In view of such problems, a substrate cleaning apparatus and a substrate cleaning method capable of effectively cleaning the substrate, and a roll sponge for the substrate cleaning apparatus are provided.

According to one aspect of the present disclosure, a substrate cleaning unit comprising a substrate holding unit that holds the substrate and a nozzle cleaning liquid supply unit that supplies the cleaning liquid at an irradiation angle of 5 degrees or more and less than 30 degrees to the held substrate. Equipment is provided.
By supplying the cleaning liquid to the substrate at an appropriate irradiation angle, the substrate can be effectively cleaned.

According to another aspect of the present disclosure, the substrate holding portion for holding the substrate and the nozzle for supplying the cleaning liquid to the held substrate are provided, and the force exerted by the cleaning liquid on the substrate when the cleaning liquid is supplied is provided. Provided is a substrate cleaning apparatus in which the ratio Fy / Fx of the force component Fx in the direction parallel to the substrate and the force component Fy in the direction orthogonal to the substrate is 0.0875 or more and less than 0.577.
By supplying the cleaning liquid to the substrate at an appropriate irradiation angle, the substrate can be effectively cleaned.

According to another aspect of the present disclosure, the substrate holding portion that holds the substrate, the cleaning portion that contacts at least the central portion of the held substrate to clean the substrate, and a part of the held substrate. It comprises one or a plurality of nozzles for supplying cleaning liquid, and when the cleaning unit comes into contact with the substrate to clean the substrate, at least one of the nozzles is associated with the cleaning unit on the substrate. Supply the cleaning liquid to different positions, and when the cleaning unit is not in contact with the substrate and the substrate is rinsed, at least one of the nozzles supplies the cleaning liquid to at least the central portion of the substrate. Cleaning equipment is provided.
As a result, the central portion of the substrate can also be effectively cleaned.

It is desirable to include a nozzle control unit that adjusts the supply position of the cleaning liquid by at least one nozzle.
As a result, the cleaning liquid can be supplied to a position different from the cleaning portion on the substrate during cleaning and to the central portion on the substrate during rinsing.

It is desirable that the nozzle control unit moves the supply position of the cleaning liquid from the central portion of the substrate to the outer periphery when the substrate is rinsed without the cleaning unit coming into contact with the substrate.
As a result, the cleaning liquid can be efficiently discharged to the outside of the substrate.

According to another aspect of the present disclosure, a substrate holding portion for holding the substrate, a first nozzle for supplying the cleaning liquid to the held substrate, and a second nozzle for supplying the cleaning liquid to the held substrate are provided. Provided is a substrate cleaning apparatus in which the first nozzle and the second nozzle do not supply a cleaning liquid to the substrate at the same time.
As a result, the cleaning liquid from the first nozzle and the cleaning liquid from the second nozzle are prevented from being mixed, and the substrate W can be effectively cleaned.

The first nozzle supplies a cleaning liquid to at least the central portion on the substrate, and the second nozzle is the substrate. It is desirable to supply the cleaning liquid to a position different from that of the cleaning portion above.
As a result, the central portion of the substrate can also be effectively cleaned.

According to another aspect of the present disclosure, there is provided a substrate cleaning apparatus including a substrate holding portion for holding a substrate and a nozzle for unsteadily supplying a cleaning liquid to the held substrate.
By supplying the cleaning liquid unsteadily, the pressure can be changed on the substrate, and the substrate can be effectively cleaned.

The nozzle may intermittently supply the cleaning liquid, or the supply amount of the cleaning liquid may be varied.

According to another aspect of the present disclosure, the cleaning unit cleans the substrate while supplying the cleaning liquid to a position different from the cleaning unit on the substrate and the step of bringing the cleaning unit into contact with at least the central portion of the substrate. A substrate cleaning method comprising a step of separating the cleaning portion from the substrate, and a step of supplying a cleaning liquid to at least a central portion on the substrate is provided.
As a result, the central portion of the substrate can also be effectively cleaned.

According to another aspect of the present disclosure, a cylindrical roll body and a plurality of nodule portions protruding outward from the outer peripheral surface thereof in a cylindrical shape are provided, and at least a part of the surface of the plurality of nodule portions is a skin. Roll sponges for substrate cleaning equipment are provided that lack layers.
The substrate can be effectively cleaned by taking advantage of the characteristics of the skin layer.

The schematic plan view of the substrate processing apparatus provided with the substrate cleaning apparatus which concerns on this embodiment. The perspective view which shows typically the substrate cleaning apparatus which concerns on 1st Embodiment. The cross-sectional view schematically showing the substrate W and the foreign matter P adhering on the surface thereof. A graph schematically showing the relationship between the irradiation angle θ and the removal rate. The perspective view which shows typically the substrate cleaning apparatus which concerns on 2nd Embodiment. The perspective view which shows typically the cleaning liquid supply in a cleaning process. The perspective view which shows typically the cleaning liquid supply in a rinsing process. The schematic perspective view of the substrate cleaning apparatus which concerns on 3rd Embodiment. The schematic perspective view of the substrate cleaning apparatus which concerns on 4th Embodiment. The schematic perspective view of the substrate cleaning apparatus which concerns on 5th Embodiment. The schematic perspective view of the substrate cleaning apparatus which concerns on 6th Embodiment. The perspective view which shows typically the substrate cleaning apparatus which concerns on 7th Embodiment. The figure which shows the cleaning liquid supply timing by a nozzle 32a, 32b. The figure which shows typically the supply flow rate of the cleaning liquid which concerns on an example of 8th Embodiment. The figure which shows typically the supply flow rate of the cleaning liquid which concerns on another example of 8th Embodiment. The figure which shows the 1st example of a roll sponge 33. The figure which shows the 2nd example of a roll sponge 33. The figure which shows the 3rd example of a roll sponge 33. The figure which shows the 4th example of the roll sponge 33. The figure which shows the 1st example of the pencil sponge 38. The figure which shows the 2nd example of the pencil sponge 38. The figure which shows the 3rd example of the pencil sponge 38. The figure which shows the 4th example of the pencil sponge 38. The figure which shows the 5th example of the pencil sponge 38. The figure which shows another cleaning part 391. The figure which shows the other cleaning part 392. The figure which shows the other cleaning part 393. The figure which shows the other cleaning part 394. The figure which shows the other cleaning part 395.

Hereinafter, embodiments will be specifically described with reference to the drawings.

FIG. 1 is a schematic plan view of a substrate processing apparatus including the substrate cleaning apparatus according to the present embodiment. As shown in FIG. 1, this substrate processing apparatus includes a substantially rectangular housing 1, and the inside of the housing 1 is divided into a load / unload portion 2, a polishing portion 3, and a cleaning portion 4 by partition walls 1a and 1b. It is partitioned. The load / unload section 2, the polishing section 3, and the cleaning section 4 are assembled independently and exhausted independently. The polishing unit 3 polishes the substrate. The cleaning unit 4 cleans and dries the polished substrate. Further, the substrate processing apparatus has a control unit 5 for controlling the substrate processing operation.

The load / unload unit 2 includes two or more (four in this embodiment) front load units 20 on which a substrate cassette for stocking a large number of substrates (for example, semiconductor wafers) is placed. These front load portions 20 are arranged adjacent to the housing 1 and arranged along the width direction (direction perpendicular to the longitudinal direction) of the substrate processing apparatus.

Further, in the load / unload section 2, a traveling mechanism 21 is laid along the line of the front loading section 20, and two transfer robots that can move along the arrangement direction of the substrate cassettes on the traveling mechanism 21. (Loader) 22 is installed. The transfer robot 22 can access the board cassette mounted on the front load unit 20 by moving on the traveling mechanism 21. Each transfer robot 22 has two hands on the upper and lower sides. Then, use the upper hand when returning the processed board to the board cassette, and use the lower hand when removing the processed board from the board cassette so that the upper and lower hands can be used properly. It has become. Further, the lower hand of the transfer robot 22 is configured to be able to invert the substrate by rotating around its axis.

The polishing unit 3 is a region where the substrate is polished (flattened), and includes, for example, four substrate polishing devices 3A to 3D arranged in order from the load / unload unit 2 side.

The cleaning unit 4 is an area where the substrate is cleaned and dried, and the cleaning chamber 190, the transport chamber 191 and the transport chamber 192, the transport chamber 193, and the drying chamber 190 are dried in order from the side opposite to the load / unload portion 2. It is divided into rooms 194.

In the cleaning chamber 190, two substrate cleaning devices 201 (only one is shown in FIG. 1) arranged along the vertical direction are arranged. Similarly, in the cleaning chamber 192, two substrate cleaning devices 202 (only one is shown in FIG. 1) arranged along the vertical direction are arranged. The substrate cleaning devices 201 and 202 are cleaning machines that clean the substrate using a cleaning liquid. Since these substrate cleaning devices 201 and 202 are arranged along the vertical direction, the advantage of a small footprint area can be obtained.

In the drying chamber 194, two substrate drying devices 203 (only one is shown in FIG. 1) arranged along the vertical direction are arranged. These two substrate drying devices 203 are isolated from each other. A filter fan unit for supplying clean air into the substrate drying apparatus 203 is provided above the substrate drying apparatus 203.

The substrate processing device may be provided with a control unit 5 to control the substrate cleaning devices 201, 202, etc., or each of the substrate cleaning devices 201, 202 may be provided with a control unit (control device).

Next, a transport mechanism for transporting the substrate will be described. As shown in FIG. 1, a linear transporter 6 is arranged adjacent to the substrate polishing devices 3A and 3B. The linear transporter 6 transports the substrate between four transport positions (transport positions TP1 to TP4 in order from the load / unload portion 2 side) along the direction in which the substrate polishing devices 3A and 3B are arranged. ..

Further, a linear transporter 7 is arranged adjacent to the substrate polishing devices 3C and 3D. The linear transporter 7 transports the substrate between three transport positions (transport positions TP5 to TP7 in order from the load / unload portion 2 side) along the direction in which the substrate polishing devices 3C and 3D are arranged. ..

The substrate is conveyed to the substrate polishing devices 3A and 3B by the linear transporter 6. The transfer of the substrate to the substrate polishing device 3A is performed at the transport position TP2. The transfer of the substrate to the polishing device 3B is performed at the transport position TP3. The transfer of the substrate to the substrate polishing device 3C is performed at the transport position TP6. The transfer of the substrate to the substrate polishing device 3D is performed at the seventh transfer position TP7.

At the transfer position TP1, a lifter 11 for receiving the substrate from the transfer robot 22 is arranged. The substrate is passed from the transfer robot 22 to the linear transporter 6 via the lifter 11. A shutter (not shown) is provided on the partition wall 1a located between the lifter 11 and the transfer robot 22 so that the shutter is opened when the substrate is transferred and the substrate is passed from the transfer robot 22 to the lifter 11. It has become.

Further, a swing transporter 12 is arranged between the linear transporters 6 and 7 and the cleaning unit 4. The swing transporter 12 has a hand that can move between the transport positions TP4 and TP5, and the transfer of the substrate from the linear transporter 6 to the linear transporter 7 is performed by the swing transporter 12.

The substrate is conveyed to the substrate polishing apparatus 3C and / or the substrate polishing apparatus 3D by the linear transporter 7. Further, the substrate polished by the polishing unit 3 is conveyed to the cleaning unit 4 via the swing transporter 12. On the side of the swing transporter 12, a temporary mounting table 180 of a substrate installed on a frame (not shown) is arranged. As shown in FIG. 1, the temporary stand 180 is arranged adjacent to the linear transporter 6 and is located between the linear transporter 6 and the cleaning unit 4.

(First Embodiment)
The first embodiment relates to a preferable irradiation angle of a cleaning liquid with respect to a substrate to be cleaned in a substrate cleaning device.

FIG. 2 is a perspective view schematically showing the substrate cleaning device according to the first embodiment. The substrate cleaning device includes a substrate holding portion 31 that holds and rotates the substrate W to be cleaned substantially horizontally, and a nozzle 32 that supplies a cleaning liquid to the held substrate W. The nozzle 32 is, for example, a single-tube nozzle having a diameter of 1 mm, and irradiates a narrow area on the substrate W with the cleaning liquid. The cleaning solution is pure water, chemical solution, or the like. In the present specification, the angle formed by the substrate surface and the cleaning liquid irradiated from the nozzle 32 is defined as the irradiation angle θ.

First, an appropriate irradiation angle θ is theoretically derived using a simplified model.
FIG. 3 is a cross-sectional view schematically showing the substrate W and the foreign matter P adhering to the surface thereof. Here, it is assumed that the foreign matter P is a sphere having a radius a, and the cleaning liquid is supplied at an irradiation angle θ. In this case, it can be considered that the force F caused by the cleaning liquid acts on the hemisphere of the foreign matter P on the nozzle 32 side. The larger the moment M about the contact point A between the substrate W and the foreign matter P, the more the foreign matter P can be removed. This moment M can be derived as follows.

On the way, it was considered that Fx = Fcosθ and Fy = Fsinθ. As a result, the moment M is proportional to cos θ. That is, it was found that the smaller the irradiation angle θ, the more the foreign matter P can be removed.

Next, an appropriate irradiation angle θ will be considered experimentally. An experiment was conducted in which the substrate W was contaminated, a cleaning liquid was supplied to the center of the substrate W at various irradiation angles θ, and the removal rate of foreign substances was measured.

FIG. 4 is a graph schematically showing the relationship between the irradiation angle θ and the removal rate. As shown in the figure, in the range of θ = 15 to 40 degrees, the removal rate decreases as the irradiation angle θ increases. This is consistent with the results derived using FIG. When the irradiation angle θ exceeds 40 degrees, the removal rate becomes almost constant, which is considered to be because the fluid force of the cleaning liquid becomes constant. In any case, if the irradiation angle θ is large, the detergency is low, which is not preferable.

On the other hand, in the range where the irradiation angle θ is 10 degrees or less, the removal rate decreases as the irradiation angle θ becomes smaller, and especially when the irradiation angle θ is less than 5 degrees, the removal rate decreases. It is considered that this is because when the irradiation angle θ is too small, the supplied cleaning liquid branches on the substrate W (so-called liquid yarn), and the amount of the cleaning liquid reaching the foreign matter decreases. Further, due to the mechanical restrictions of the nozzle 32, it is difficult to make the irradiation angle θ too small.

From the above, the irradiation angle θ is preferably 5 degrees or more and less than 40 degrees, and more preferably 5 degrees or more and less than 30 degrees.

Here, the force component Fx in the horizontal direction (to be exact, the direction parallel to the substrate W) and the force component Fy in the vertical direction (to be exact, the direction orthogonal to the substrate W) given to the substrate W by the cleaning liquid are irradiated. The angle θ satisfies the following relationship.
tanθ = Fy / Fx

Therefore, in other words, the above-mentioned preferable irradiation angle θ is set so that the range of the ratio Fy / Fx of the vertical force Fy to the horizontal force Fx is 0.0875 (= tan5) or more and less than 0.839 (= tan40). Is preferable, and it is more preferably 0.0875 (= tan5) or more and less than 0.577 (= tan30).

As described above, in the first embodiment, since the irradiation angle θ of the cleaning liquid is set to an appropriate value, the substrate W can be effectively cleaned. The concept of the present embodiment can be applied regardless of the specific configuration of the substrate cleaning device, and for example, the substrate W may be held in the vertical direction. Further, the nozzle 32 may supply the cleaning liquid to the lower surface of the substrate W instead of the upper surface.

(Second embodiment)
The second embodiment described below relates to a position where the cleaning liquid is supplied by the nozzle 32 in a substrate cleaning device that cleans the substrate using a cleaning portion such as a roll sponge.

FIG. 5 is a perspective view schematically showing the substrate cleaning device according to the second embodiment. The substrate cleaning device includes a substrate holding portion 31 and one or a plurality of nozzles 32, as well as a roll sponge 33 which is a cleaning portion. The roll sponge 33 extends in the horizontal direction and comes into contact with at least the center of the upper surface of the held substrate W to clean the substrate W.

The substrate cleaning apparatus first brings the roll sponge 33 into contact with the substrate W, and in this state, supplies a cleaning liquid from the nozzle 32 to the upper surface of the substrate W to clean the substrate W (hereinafter referred to as a cleaning step). Next, the substrate cleaning device separates the roll sponge 33 from the substrate W, and in this state, supplies cleaning liquid from the nozzle 32 to rinse the substrate W (hereinafter referred to as a rinsing step).

Here, in the cleaning step, the roll sponge 33 is in contact with the center of the substrate W. Therefore, the nozzle 32 supplies the cleaning liquid to a position deviated from the center of the substrate W so that the cleaning liquid does not collide with the roll sponge 33. That is, in the cleaning step, the cleaning liquid is not supplied so much to the center of the substrate W.

If the cleaning liquid is supplied to a position where the nozzle 32 is deviated from the center of the substrate W even in the subsequent rinsing step, the cleaning of the center of the substrate W becomes insufficient.

Therefore, in the present embodiment, in the cleaning step, the nozzle 32 supplies the cleaning liquid to a position deviated from the center of the substrate W, that is, a position different from the roll sponge 33 (see FIG. 6). Then, after separating the roll sponge 33 from the substrate W, in the rinsing step, the nozzle 32 supplies the cleaning liquid to a position including the central portion of the substrate W (see FIG. 7). As a result, the central portion of the substrate W can also be effectively cleaned.

Various specific methods for switching the supply position of the cleaning liquid can be considered. For example, one nozzle 32 may be provided and the supply position of the cleaning liquid by the nozzle 32 may be adjusted. The specific method will be described in the third to sixth embodiments.

As another example, two or more nozzles 32 (for example, a single tube nozzle and a fan-shaped nozzle that sprays the cleaning liquid in a spray shape) are provided, and the cleaning liquid is placed at a position where one nozzle 32 is deviated from the center of the substrate W in the cleaning step. The cleaning liquid may be supplied and supplied to a position where another nozzle 32 includes the center of the substrate W in the rinsing step.

Further, two or more nozzles 32 may be provided, and the supply position of the cleaning liquid by one or more of the nozzles 32 may be adjusted.

As described above, in the second embodiment, the cleaning liquid is supplied to a position different from that of the roll sponge 33 in the cleaning step using the roll sponge 33, and to the central portion of the substrate W in the rinsing step without using the roll sponge 33. Therefore, the central portion of the substrate W can also be effectively cleaned.

The preferred range of the irradiation angle θ from the nozzle 32 is as described in the first embodiment. Further, the concept of the present embodiment can be applied regardless of the specific configuration of the substrate cleaning apparatus. For example, even if a roll sponge for cleaning the lower surface of the substrate W and a nozzle for supplying the cleaning liquid are provided on the lower surface of the substrate W. good. Further, the substrate W may be held in the vertical direction.

(Third embodiment)
In the second embodiment, it is stated that the supply position of the cleaning liquid by the nozzle 32 may be adjusted. In the third to sixth embodiments described below, a specific configuration example for adjusting the supply position of the cleaning liquid is shown.

FIG. 8 is a schematic perspective view of the substrate cleaning device according to the third embodiment. The substrate cleaning device includes four substrate holding portions 31, a nozzle 32, roll sponges 33a and 33b that come into contact with the upper and lower surfaces of the substrate W, respectively, and rotation mechanisms 34a and 34b that rotate these roll sponges 33a and 33b, respectively. , A guide rail 35, an elevating mechanism 36, and a nozzle control unit 60 for adjusting a cleaning liquid supply position (supply direction) by the nozzle 32. Only the nozzle 32 that supplies the cleaning liquid to the upper surface of the substrate W held by the substrate holding unit 31 and the corresponding nozzle control unit 60 are drawn, but the nozzle that supplies the cleaning liquid to the lower surface of the substrate W corresponds to this. A nozzle control unit may be further provided.

The substrate holding portion 31 is, for example, a roller, and has a two-stage configuration of a holding portion 311 and a shoulder portion (support portion) 312. The diameter of the shoulder portion 312 is larger than the diameter of the holding portion 311, and the holding portion 311 is formed on the shoulder portion 312. At least a part (for example, two adjacent ones) of the four substrate holding portions 31 can be moved in a direction close to and separated from each other by a drive mechanism (for example, an air cylinder).

The rotation mechanism 34a rotates the upper roll sponge 33a. The rotation mechanism 34a is attached to a guide rail 35 that guides its vertical movement, and is supported by the elevating mechanism 36. The rotation mechanism 34a and the upper roll sponge 33a are moved in the vertical direction by the elevating mechanism 36.

Although not shown, a rotation mechanism 34b for rotating the lower roll sponge 33b is also attached to the guide rail so that the rotation mechanism 34b and the lower roll sponge 33b are moved in the vertical direction by an elevating mechanism (not shown). It has become.
As the elevating mechanism 36, for example, a motor drive mechanism using a ball screw or an air cylinder is used.

The roll sponges 33a and 33b are moved by the elevating mechanism 36 as follows.
The roll sponges 33a and 33b are at positions separated from each other when the substrate W is carried in and out. That is, the roll sponge 33a is in the raised state, and the roll sponge 33b is in the lowered state.

In the cleaning step, the roll sponge 33a is lowered and the roll sponge 33b is raised. As a result, the roll sponge 33a comes into contact with the upper surface of the substrate W, and the roll sponge 33b comes into contact with the lower surface of the substrate W.

In the rinsing step, the roll sponge 33a rises and the roll sponge 33b falls. As a result, the roll sponges 33a and 33b are separated from the substrate W.

The nozzle control unit 60 controls where the nozzle 32 supplies the cleaning liquid on the substrate W. Specifically, in the cleaning step, the nozzle control unit 60 controls the nozzle 32 so that the cleaning liquid is supplied to a position different from that of the roll sponge 33a (a position deviated from the center of the substrate W). Further, in the rinsing step, the nozzle control unit 60 controls the nozzle 32 so that the cleaning liquid is supplied from the nozzle 32 to the central portion of the substrate W. It can be said that the nozzle control unit 60 controls the irradiation direction of the cleaning liquid by the nozzle 32.

Specifically, the nozzle control unit 60 includes a tube 61, a disk 62, a motor 63, a shaft 64, a guide 65, and a fixture 66.

The tube 61 communicates with the nozzle 32 and guides the cleaning liquid to the nozzle 32. One end of the shaft 64 is fixed to the end portion of the disk 62 rotated by the motor 63, and the other end is fixed to the end side of the nozzle 32. A vertically long opening is formed in the guide 65, and the end of the nozzle 32 is fitted in this opening. An opening is formed in the fixture 66, and the nozzle 32 penetrates through this opening.

The shaft 64 moves as the motor 63 rotates the disk 62. The nozzle 32 fixed to the shaft 64 moves up and down along the opening of the guide 65, and as a result, the angle of the nozzle 32 changes around the fixture 66. Thereby, the irradiation direction of the cleaning liquid is controlled.

(Fourth Embodiment)
In the fourth embodiment described below, the configuration of the nozzle control unit is different from that of the third embodiment. Hereinafter, the nozzle control unit will be described.

FIG. 9 is a schematic perspective view of the substrate cleaning device according to the fourth embodiment. The nozzle control unit 70 in the figure has a cam 71, a motor 72, a shaft 73, a roller 74, a guide 75, and a fixture 76.

One end of the shaft 73 is connected to the cam 71 rotated by the motor 72 via a roller 74, and the other end is fixed to the end side of the nozzle 32. A vertically long opening is formed in the guide 75, and the end of the nozzle 32 is fitted in this opening. An opening is formed in the fixture 76, and the nozzle 32 penetrates through this opening.

When the motor 72 rotates the cam 71, the roller 74 moves along the shape of the cam 71. As a result, the shaft 73 moves up and down, and the nozzle 32 fixed to the shaft 73 moves up and down along the opening of the guide 75. As a result, the angle of the nozzle 32 changes around the fixture 76 as an axis. Thereby, the irradiation direction of the cleaning liquid is controlled.

(Fifth Embodiment)
In the fifth embodiment described below, the configuration of the nozzle control unit is different from that of the third embodiment. Hereinafter, the nozzle control unit will be described.

FIG. 10 is a schematic perspective view of the substrate cleaning device according to the fifth embodiment. The nozzle control unit 80 in the figure has a disk 81, a motor 82, and a shaft 83. A cam may be used instead of the disk 81.

One end of the shaft 83 is connected to a disk 81 rotated by a motor 82, and the other end is fixed to the tip end side of the nozzle 32. When the motor 82 rotates the disk 81, the position of the shaft 83 connected to the tip of the nozzle 32 changes. Thereby, the irradiation direction of the cleaning liquid is controlled.

(Sixth Embodiment)
In the sixth embodiment described below, the configuration of the nozzle control unit is different from that of the third embodiment. Hereinafter, the nozzle control unit will be described.

FIG. 11 is a schematic perspective view of the substrate cleaning device according to the sixth embodiment. The nozzle control unit 90 in the figure has a robot arm 91 and a holder 92.

The robot arm 91 is rotatable about a rotation shaft 911, and a holder 92 is attached to the tip of the robot arm 91. The holder 92 holds the nozzle 32. The rotation of the robot arm 91 changes the direction of the nozzle 32 held by the holder 92. Thereby, the irradiation direction of the cleaning liquid is controlled.

As mentioned above, several nozzle control units have been illustrated, but it goes without saying that various modifications can be conceived. For example, the nozzle control unit may include a lifting mechanism for raising and lowering the nozzle 32 (or a member supporting the nozzle 32) so that the nozzle 32 can be moved in the vertical direction. Alternatively, the nozzle control unit may include a swing mechanism that causes the nozzle 32 (or a member that supports the nozzle 32) to swing in a horizontal plane. In that case, in the rinsing step, the effect of discharging the cleaning liquid may be enhanced by moving the supply position of the cleaning liquid from the central portion to the outer peripheral portion of the substrate W.
In any case, it is desirable that the nozzle control unit has a configuration capable of supplying the cleaning liquid to the central portion of the substrate W and other positions.

As another configuration example, the arm may be attached to the support column, and one or more nozzles may be attached to the arm. The arm may be provided with a pen cleaning mechanism. Further, the nozzle may be a single tube nozzle, a fan-shaped nozzle, a two-fluid jet nozzle, a three-fluid jet nozzle, or the like, and any combination thereof is also possible. Further, the nozzle may be translated in the horizontal plane by the nozzle control unit, may be movable in the vertical direction by the operation of the support column, or may pass through (or deviate from the center) the center of the substrate by rotating around the support column. It may be movable in orbit. When a plurality of nozzles are provided, only one of them may move in an orbit that passes through the center, and the other may move in an orbit that is off-center. Further, the cleaning liquid irradiation angle from the nozzle may be adjusted, and the appropriate angle is as described in the first embodiment.

A plurality of nozzles may supply the same chemical solution, or different chemical solutions may be supplied. The chemical solution may be alkaline, acidic or neutral, or may be pure water, pure water mixed with gas, functional water, or pure water mixed with a trace amount of chemical solution.

(7th Embodiment)
A seventh embodiment to be described next relates to a substrate cleaning device including a plurality of nozzles 32, relating to the supply timing of the cleaning liquid by each nozzle 32. Hereinafter, the differences from the first embodiment will be mainly described.

FIG. 12 is a perspective view schematically showing the substrate cleaning device according to the seventh embodiment. The substrate cleaning device includes a substrate holding portion 31 and two nozzles 32a and 32b. As an example, the nozzle 32a is a single-tube nozzle, and the nozzle 32b is a fan-shaped nozzle. In addition, the nozzles 32a and 32b may be nozzles that inject a plurality of fluids. Further, one nozzle 32a may supply the cleaning liquid to the central portion of the substrate W, and the other nozzle 32b may supply the cleaning liquid to a portion other than the central portion of the substrate W (for example, the outer peripheral portion). The cleaning liquid from the nozzle 32a may be the same as or different from the cleaning liquid from the nozzle 32b.

If the cleaning liquid is supplied from the two nozzles 32a and 32b at the same time, the cleaning effect may be reduced in the region where the cleaning liquid from the nozzle 32a and the cleaning liquid from the nozzle 32b are mixed on the substrate W.

Therefore, in the present embodiment, as shown in FIG. 13, the nozzles 32a and 32b do not supply the cleaning liquid to the substrate W at the same time. More specifically, first, the nozzle 32a supplies the cleaning liquid to the substrate W. Then, after stopping the supply of the cleaning liquid from the nozzle 32a, the nozzle 32b supplies the cleaning liquid to the substrate W. Then, after stopping the supply of the cleaning liquid from the nozzle 32b, the nozzle 32a supplies the cleaning liquid to the substrate W. Of course, there may be a period in which both the nozzles 32a and 32b do not supply the cleaning liquid.

As described above, in the seventh embodiment, since the nozzles 32a and 32b exclusively supply the cleaning liquid to the substrate W, the substrate W can be effectively cleaned. Even when three or more nozzles are provided, they may exclusively supply the cleaning liquid to the substrate W.

(8th Embodiment)
In the eighth embodiment described below, the cleaning liquid is unsteadily supplied from the nozzle 32. The configuration of the substrate cleaning device is the same as that shown in FIG.

FIG. 14 is a diagram schematically showing the supply flow rate of the cleaning liquid according to the example of the eighth embodiment. In this example, the nozzle 32 intermittently supplies the cleaning liquid. For example, the nozzle 32 supplies the cleaning liquid during the periods T1, T3 and T5, and does not supply the cleaning liquid during the periods T2 and T4 in the meantime. That is, the period in which the cleaning liquid is supplied and the period in which the cleaning liquid is not supplied are alternately repeated.

During the period when the cleaning liquid is not supplied, the cleaning liquid film disappears on the substrate W due to T2 and T4. By suddenly supplying the cleaning liquid in such a state (periods T3 and T5) and giving a shock (pressure fluctuation) to the substrate W, the cleaning effect is improved.

Such control is realized, for example, by opening and closing the solenoid valve at the base of the nozzle 32.

FIG. 15 is a diagram schematically showing the supply flow rate of the cleaning liquid according to another example of the eighth embodiment. In this example, the nozzle 32 varies the supply amount of the cleaning liquid. For example, the nozzle 32 gradually reduces the supply amount of the cleaning liquid in the period T11, rapidly increases the supply amount in the subsequent period T12, keeps the supply amount substantially constant in the subsequent period T13, and supplies the supply amount in the subsequent period T14. To decrease sharply. That is, the supply amount of the cleaning liquid gradually decreases / increases, rapidly decreases / increases, or becomes almost constant.

Even in such an embodiment, the substrate W can be shocked, especially during the period in which the supply amount of the cleaning liquid is rapidly increased, and the cleaning effect is improved.

Such control is realized, for example, by adjusting the pressure applied to the supply tank at the base of the nozzle 32 by using a regulator.

As described above, in the eighth embodiment, the cleaning liquid is unsteadily supplied from the nozzle to one substrate W, so that the cleaning power is improved.

(9th embodiment)
The ninth embodiment described below relates to the surface material of the roll sponge 33.

When the roll sponge 33 is manufactured by molding a resin such as polyvinyl alcohol (PVA), a surface layer portion (hereinafter referred to as a skin layer) in contact with the mold at the time of molding and a lower layer portion inside the surface layer portion are formed. The fact that there is no skin layer and the lower layer is exposed is also called the lack of a skin layer.

The skin layer is a hard layer having a thickness of about 1 to 10 μm and a small pore diameter of several μm to several tens of μm. Therefore, it is easy to hold the cleaning liquid, but there is a risk of damaging the surface of the substrate during cleaning.

On the other hand, the lower layer portion without the skin layer has a large pore diameter of 10 μm to several hundred μm and is a soft layer. Therefore, it is easy to fit on the surface of the substrate and it is difficult to damage the surface of the substrate. In addition, the cleaning liquid easily enters and exits, and easily flows out.

In consideration of the above characteristics, it is desirable to design which part of the roll sponge 33 is the skin layer and which part lacks the skin layer. Various specific embodiments can be considered.

FIG. 16 is a diagram showing a first example of the roll sponge 33. FIG. 3A is a side view of the roll sponge 33a in the longitudinal direction, and FIG. 9B is a side view of FIG. 3A. In the figures after FIG. 16, the spotted portion indicates that the skin layer is lacking. The roll sponge 33 has a cylindrical roll main body 331 and a plurality of nodule portions 332 protruding outward from the outer peripheral surface in a cylindrical shape. As shown, the skin layer may be missing only on both sides of the roll body 331. That is, the skin layer may be covered except for both side surfaces of the roll body 331.

FIG. 17 is a diagram showing a second example of the roll sponge 33. As shown, the skin layer may be missing only on the surface of the roll body 331 and the side surface of the nodule portion 332. That is, the side surface of the roll body 331 and the tip of the nodule portion 332 may be covered with a skin layer.

FIG. 18 is a diagram showing a third example of the roll sponge 33. As shown, the skin layer may be missing only at the tip of the nodule portion 332. That is, the side surfaces of the roll body 331 and the nodule portion 332 may be covered with a skin layer.

FIG. 19 is a diagram showing a fourth example of the roll sponge 33. As shown, the skin layer may be missing only at the tip of a part of the nodule portion 332. That is, other than the tip of these nodule portions 332, the other nodule portions 332 and the roll body 331 may be covered with a skin layer.

In addition, all surfaces of the roll sponge 33 may be covered with a skin layer, or all surfaces may lack a skin layer. Further, any two or more aspects of the illustrated roll sponge 33 may be combined, and the skin layer may be formed on the surface of the roll body 331, the same side surface, the side surface of the nodule portion 332 and / or a part or the whole of the same tip. It may be absent or covered with a skin layer.

(10th Embodiment)
The tenth embodiment described below relates to a cleaning portion having a shape other than the roll sponge 33. First, a case where the cleaning portion is a pencil sponge that is in contact with a portion including the center of the substrate W and performs cleaning while rotating will be described.

FIG. 20 is a diagram showing a first example of the pencil sponge 38. The pencil sponge 38 in the figure has a cylindrical shape, and the lower surface thereof is a cleaning surface. As shown, the skin layer may be missing only on the sides. That is, the upper surface and the lower surface may be covered with a skin layer.

FIG. 21 is a diagram showing a second example of the pencil sponge 38. As shown, the skin layer may be missing only on the sides and bottom. That is, the upper surface may be covered with a skin layer.

FIG. 22 is a diagram showing a third example of the pencil sponge 38. As shown, the skin layer may be missing only on the top surface. That is, the side surface and the lower surface may be covered with a skin layer.

FIG. 23 is a diagram showing a fourth example of the pencil sponge 38. As shown, the skin layer may be missing only on the underside. That is, the sides and top may be covered with a skin layer.

FIG. 24 is a diagram showing a fifth example of the pencil sponge 38. The pencil sponge 38 in the figure has a plurality of nodule portions 381 protruding from the lower surface in a columnar shape. Only the lower surface of the nodule portion 381 may be covered with the skin layer, the skin layer may be missing on the entire surface of the nodule portion 381, or the skin layer may be missing only on the side surface of the nodule portion 381. However, the skin layer may be missing only at the tip of the nodule portion 381, or the skin layer may be missing only at the tip of a part of the nodule portion 381. In addition, any of the above-mentioned nodule portions 381 may be added to the pencil sponge 38 shown in FIGS. 20 to 23, respectively.

In addition, the entire surface may be covered with a skin layer, or the entire surface may lack a skin layer.

FIG. 25 is a diagram showing another cleaning unit 391. The cleaning portion 391 has a circular brush 391b attached substantially in the center of the base portion 391a, and four brushes 391c arranged at equal intervals and extending along the radial direction, and the lower surface thereof is a cleaning surface. be. The skin layer may be absent in a part or the whole of the base portion 391a, the brush 391b and / or the brush 391c, or both cleaning surfaces may be covered with the skin layer.

FIG. 26 is a diagram showing another cleaning unit 392. The cleaning portion 392 has a cross-shaped brush 392b attached to the base portion 392a, and the lower surface thereof is a cleaning surface. The central portion of the brush 392b is open, and the cleaning liquid may be supplied from this opening. The skin layer may be absent or covered with a skin layer in part or all of the base portion 392a and / or the brush 392b.

FIG. 27 is a diagram showing another cleaning unit 393. In the cleaning portion 393, a sponge portion 393b and a brush portion 393c are formed in a part of the scrub member 393a. The skin layer may be absent or covered with a skin layer in a part or all of the scrub member 393a, the sponge portion 393b and / or the brush portion 393c.

FIG. 28 is a diagram showing another cleaning unit 394. The cleaning portion 394 has protrusions 394b and 394c formed on the sheet 394a. The protrusion 394b extends in a ridge shape from the vicinity of the center of the sheet 394a to the outer periphery, and the protrusion 394c extends in a ridge shape from the outer peripheral side of the protrusion 394b to the outer periphery of the sheet 394a. The skin layer may be absent or covered with a skin layer in some or all of the protrusions 394b and / or the protrusions 394c.

FIG. 29 is a diagram showing another cleaning unit 395. The cleaning unit 395 has a pedestal 395a and a brush 395b attached to the lower surface thereof. The skin layer may be absent or covered with a skin layer in part or all of the brush 395b.

Each of the above-described embodiments may be arbitrarily combined. Further, the substrate cleaning device described can be applied not only to the substrate processing device shown in FIG. 1, but also to a bevel polishing device for polishing the bevel of the substrate, a back surface polishing device for polishing the back surface, and a partial polishing device for partial polishing. Further, it can be applied to a cleaning device of an exposure device.

The operation in each embodiment can also be performed using the following software / system. The software / system is composed of, for example, a main controller having a CPU, a memory, a recording medium, and software, a unit controller, and a unit for executing an operation. Taking the substrate cleaning device as a unit in the example of each embodiment, the unit controller controls the amount, angle, time, position movement, etc. of fluid (cleaning liquid) injection by a plurality of nozzles, and the position, rotation speed, etc. of the roll. .. The main controller monitors this control and gives operation instructions. As the sensor required for control, a pressure sensor for supplying the cleaning liquid to the nozzle, a position sensor such as an encoder, a timer, a roll position sensor, a load cell for measuring frictional force, a rotation speed sensor, and the like can be used. In addition, the software can be installed later by updating from the initial software.

The above-described embodiments have been described for the purpose of allowing a person having ordinary knowledge in the technical field to which the present invention belongs to carry out the present invention. Various modifications of the above embodiment can be naturally made by those skilled in the art, and the technical idea of the present invention can be applied to other embodiments. Accordingly, the invention is not limited to the described embodiments and should be the broadest scope in accordance with the technical ideas defined by the claims.

31 Board holding part 32, 32a, 32b Nozzle 33, 33a, 33b Roll sponge 331 Roll body 332 Nodule part 60 Nozzle control part

Claims (6)

The board holding part that holds the board and
A cleaning unit that contacts at least the central portion of the held substrate to clean the substrate, and a cleaning unit.
One or more nozzles that supply cleaning liquid to a part of the held substrate,
A nozzle control unit for adjusting the supply position of the cleaning liquid by at least one of the nozzles is provided.
When the cleaning unit comes into contact with the substrate to clean the substrate, at least one of the nozzles supplies the cleaning liquid to a position on the substrate different from the cleaning unit.
When the substrate is rinsed without the cleaning portion coming into contact with the substrate, at least one of the nozzles supplies the cleaning liquid to at least the central portion of the substrate.
The nozzle control unit
With the motor
With the disk or cam rotated by the motor,
It has a shaft, one end of which is connected to the disk or cam and the other end of which is fixed to the nozzle.
The nozzle control unit is a substrate cleaning device that moves the supply position of the cleaning liquid from the central portion of the substrate to the outer periphery when the substrate is rinsed without the cleaning unit coming into contact with the substrate. The nozzle control unit
A guide provided with an opening into which the nozzle fits, and
The substrate cleaning device according to claim 1, further comprising a fixture provided with an opening through which the nozzle penetrates. The nozzle control unit
With Laura,
With a guide provided with an opening into which the nozzle fits,
The substrate cleaning device according to claim 1, wherein the shaft is connected to the cam via the roller. The board holding part that holds the board and
A cleaning unit that contacts at least the central portion of the held substrate to clean the substrate, and a cleaning unit.
One or more nozzles that supply cleaning liquid to a part of the held substrate,
A nozzle control unit for adjusting the supply position of the cleaning liquid by at least one of the nozzles is provided.
When the cleaning unit comes into contact with the substrate to clean the substrate, at least one of the nozzles supplies the cleaning liquid to a position on the substrate different from the cleaning unit.
When the substrate is rinsed without the cleaning portion coming into contact with the substrate, at least one of the nozzles supplies the cleaning liquid to at least the central portion of the substrate.
The cleaning liquid irradiation angle from at least one of the one or a plurality of nozzles can be adjusted.
The nozzle control unit is a substrate cleaning device that moves the supply position of the cleaning liquid from the central portion of the substrate to the outer periphery when the substrate is rinsed without the cleaning unit coming into contact with the substrate. The board holding part that holds the board and
A cleaning unit that contacts at least the central portion of the held substrate to clean the substrate, and a cleaning unit.
One or more nozzles that supply cleaning liquid to a part of the held substrate,
A nozzle control unit for adjusting the supply position of the cleaning liquid by at least one of the nozzles is provided.
When the cleaning unit comes into contact with the substrate to clean the substrate, at least one of the nozzles supplies the cleaning liquid to a position on the substrate different from the cleaning unit.
When the substrate is rinsed without the cleaning portion coming into contact with the substrate, at least one of the nozzles supplies the cleaning liquid to at least the central portion of the substrate.
The nozzle control unit
A holder for holding the nozzle and
It has a robot arm to which the holder is attached and is rotatable about a rotation axis, and the rotation of the robot arm changes the direction of the nozzle held by the holder.
The nozzle control unit is a substrate cleaning device that moves the supply position of the cleaning liquid from the central portion of the substrate to the outer periphery when the substrate is rinsed without the cleaning unit coming into contact with the substrate. The board holding part that holds the board and
A cleaning unit that contacts at least the central portion of the held substrate to clean the substrate, and a cleaning unit.
One or more nozzles that supply cleaning liquid to a part of the held substrate,
A nozzle control unit for adjusting the supply position of the cleaning liquid by at least one of the nozzles is provided.
When the cleaning unit comes into contact with the substrate to clean the substrate, at least one of the nozzles supplies the cleaning liquid to a position on the substrate different from the cleaning unit.
When the substrate is rinsed without the cleaning portion coming into contact with the substrate, at least one of the nozzles supplies the cleaning liquid to at least the central portion of the substrate.
The nozzle control unit does not move the cleaning liquid supply position from the outer periphery of the substrate to the central portion when the substrate is rinsed without the cleaning portion coming into contact with the substrate. A board cleaning device that moves from the central part of the surface to the outer circumference.

Images