JP2009298961A - Epoxy resin composition for sealing and method for manufacturing the same - Google Patents
Epoxy resin composition for sealing and method for manufacturing the same Download PDFInfo
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- JP2009298961A JP2009298961A JP2008156753A JP2008156753A JP2009298961A JP 2009298961 A JP2009298961 A JP 2009298961A JP 2008156753 A JP2008156753 A JP 2008156753A JP 2008156753 A JP2008156753 A JP 2008156753A JP 2009298961 A JP2009298961 A JP 2009298961A
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 114
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 112
- 239000000203 mixture Substances 0.000 title claims abstract description 69
- 238000007789 sealing Methods 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 117
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 56
- 239000011342 resin composition Substances 0.000 claims abstract description 54
- 239000000843 powder Substances 0.000 claims abstract description 52
- 239000005011 phenolic resin Substances 0.000 claims abstract description 27
- 239000011256 inorganic filler Substances 0.000 claims abstract description 25
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 25
- 238000004898 kneading Methods 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- 239000011164 primary particle Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 33
- 238000003860 storage Methods 0.000 abstract description 24
- 230000000903 blocking effect Effects 0.000 abstract description 17
- 239000011248 coating agent Substances 0.000 abstract description 11
- 238000000576 coating method Methods 0.000 abstract description 11
- 230000007423 decrease Effects 0.000 abstract description 5
- 239000002245 particle Substances 0.000 description 15
- 229920003986 novolac Polymers 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 11
- 239000007822 coupling agent Substances 0.000 description 10
- 230000007774 longterm Effects 0.000 description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 7
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000008187 granular material Substances 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910002026 crystalline silica Inorganic materials 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 235000013869 carnauba wax Nutrition 0.000 description 2
- 239000004203 carnauba wax Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- -1 curing accelerator Substances 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 description 1
- TZLVUWBGUNVFES-UHFFFAOYSA-N 2-ethyl-5-methylpyrazol-3-amine Chemical compound CCN1N=C(C)C=C1N TZLVUWBGUNVFES-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 101100294331 Drosophila melanogaster nod gene Proteins 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000009878 intermolecular interaction Effects 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- LIBWSLLLJZULCP-UHFFFAOYSA-N n-(3-triethoxysilylpropyl)aniline Chemical compound CCO[Si](OCC)(OCC)CCCNC1=CC=CC=C1 LIBWSLLLJZULCP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- AHLSHTSIRHIXOJ-UHFFFAOYSA-N n-[3-[diethoxy(ethyl)silyl]propyl]aniline Chemical group CCO[Si](CC)(OCC)CCCNC1=CC=CC=C1 AHLSHTSIRHIXOJ-UHFFFAOYSA-N 0.000 description 1
- YZPARGTXKUIJLJ-UHFFFAOYSA-N n-[3-[dimethoxy(methyl)silyl]propyl]aniline Chemical compound CO[Si](C)(OC)CCCNC1=CC=CC=C1 YZPARGTXKUIJLJ-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical class [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Epoxy Resins (AREA)
Abstract
Description
本発明は、封止用エポキシ樹脂組成物およびその製造方法に関し、さらに詳しくは、成形時の粘度が低く流れ性が良好であると共に、長期保管時の耐ブロッキンク性、保存安定性に優れ、半導体素子の封止に好適に用いられる封止用エポキシ樹脂組成物、およびその製造方法に関する。 The present invention relates to an epoxy resin composition for sealing and a method for producing the same, and more specifically, it has a low viscosity during molding and good flowability, and has excellent blocking resistance and storage stability during long-term storage. The present invention relates to a sealing epoxy resin composition suitably used for sealing an element, and a method for producing the same.
近年の電子部品のプリント配線板への高密度実装化に伴い、半導体装置はピン挿入型のパッケージから、表面実装型のパッケージが主流になっている。さらに表面実装型のＩＣ、ＬＳＩ等は、実装密度を高くし実装高さを低くするために、薄型のパッケージになっており、同時に、素子のパッケージに対する占有体積が大きくなってきている。また、素子の多機能化、大容量化によって、チップ面積の増大、多ピン化が進み、さらにはパッド数の増大によって、パッドピッチの縮小化とパッド寸法の縮小化、いわゆる狭パッドピッチ化も進んでいる。 With recent high-density mounting of electronic components on printed wiring boards, semiconductor devices are mainly used in surface mount packages rather than pin insertion packages. Furthermore, surface-mounted ICs, LSIs, and the like are thin packages in order to increase the mounting density and reduce the mounting height, and at the same time, the occupied volume of the element in the package is increasing. In addition, the increase in the chip area and the increase in the number of pins have progressed due to the multi-functionality and large capacity of the elements, and further the increase in the number of pads has led to a reduction in pad pitch and a reduction in pad size, so-called narrow pad pitch. Progressing.
このような薄型化、狭パッドピッチ化された半導体装置を製造するために、従来用いられていたＯ−クレゾールノボラック型エポキシ樹脂を用いた封止用エポキシ樹脂組成物に代えて、成形時の粘度が低く流れ性が良好な封止用エポキシ樹脂組成物を用いることが検討されている。例えば、結晶性エポキシ樹脂はその融点を超えると分子間の相互作用が著しく低下し低粘度となることから、このような溶融粘度の低い結晶性エポキシ樹脂を封止用エポキシ樹脂組成物におけるエポキシ樹脂として用いることで、無機充填剤を高充填化して耐熱性、耐湿性に優れたものとしつつ、薄型化、狭パッドピッチ化された半導体装置を製造することができる。また、エポキシ樹脂としてＯ−クレゾールノボラック型エポキシ樹脂を用いる場合であっても、より溶融粘度の低いものを用いることにより、上記要求をある程度満たすものを得ることができる。 In order to manufacture such a thinned, narrow pad pitch semiconductor device, instead of the conventionally used epoxy resin composition for sealing using an O-cresol novolac type epoxy resin, the viscosity at the time of molding It has been studied to use an epoxy resin composition for sealing having a low flow rate and good flowability. For example, when the crystalline epoxy resin exceeds its melting point, the intermolecular interaction is remarkably lowered and the viscosity becomes low, so such a crystalline epoxy resin having a low melt viscosity is used as an epoxy resin in an epoxy resin composition for sealing. As a result, it is possible to manufacture a semiconductor device having a reduced thickness and a narrower pad pitch while making the inorganic filler highly filled and having excellent heat resistance and moisture resistance. Even when an O-cresol novolac type epoxy resin is used as the epoxy resin, a resin satisfying the above requirements to some extent can be obtained by using one having a lower melt viscosity.
一方、このような溶融粘度の低いエポキシ樹脂を用いる封止用エポキシ樹脂組成物については、例えばエポキシ樹脂とその硬化剤との反応を抑制し、成形時の流れ性を維持するために１００℃以下の温度で製造されるが、このような製造温度で溶融するエポキシ樹脂を用いた封止用エポキシ樹脂組成物については、長期保管時に塊状物が発生するブロッキングや、成形時の流れ性が経時的に低下する保存安定性の問題がある。このため、例えば特定の融解挙動を示す結晶性エポキシ樹脂を用いることで、製造時の作業性を維持しつつ、ブロッキングや保存安定性を改善することが検討されている（例えば、特許文献１、２参照）。
封止用エポキシ樹脂組成物については、薄型化、狭パッドピッチ化された半導体装置を製造するために、これまで以上に成形時の流れ性が要求されると共に、長期保管時のブロッキングや、成形時の流れ性の経時的な低下が抑制され、保存安定性に優れることが求められている。また、封止用エポキシ樹脂組成物については、半導体装置の生産性を向上させる観点から、硬化時間の短縮が求められると共に、作業性を向上させる観点から常温において長期保管しても成形時の硬化性の劣化が少ないことが求められている。 For the epoxy resin composition for sealing, in order to produce a semiconductor device with a thinner and narrower pad pitch, flowability during molding is required more than before, and blocking and molding during long-term storage are required. There is a demand for excellent deterioration in storage stability by suppressing a decrease in flowability over time. In addition, for the epoxy resin composition for sealing, shortening of the curing time is required from the viewpoint of improving the productivity of the semiconductor device, and curing at the time of molding even if stored for a long time at room temperature from the viewpoint of improving workability. There is a demand for little deterioration of properties.
特に、複数のチップを積み重ねてボンディングワイヤによって接続する積層型ＣＳＰ（チップサイズパッケージ）については、必然的にボンディングワイヤが長くなることから成形時に損傷しやすく、また複数のチップを１キャビティで封止する一括モールド法については、キャビティ内に十分に封止用エポキシ樹脂組成物を行き渡らせる必要があり、これらに適用される封止用エポキシ樹脂組成物にはより一層優れた成形時の流れ性が求められる。 In particular, a stacked CSP (chip size package) in which a plurality of chips are stacked and connected by bonding wires inevitably becomes long during bonding because the bonding wires are long, and the plurality of chips are sealed with one cavity. For the batch molding method to be performed, it is necessary to sufficiently spread the sealing epoxy resin composition in the cavity, and the sealing epoxy resin composition applied to these has a further excellent flowability at the time of molding. Desired.
本発明は、このような課題を解決するためになされたものであって、成形時の流れ性に優れると共に、長期保管時のブロッキングや、成形時の流れ性の経時的な低下が抑制され、保存安定性に優れる封止用エポキシ樹脂組成物、およびその製造方法を提供することを目的としている。 The present invention has been made to solve such problems, and is excellent in flowability at the time of molding, blocking at the time of long-term storage, and the decrease in flowability at the time of molding is suppressed, It aims at providing the epoxy resin composition for sealing excellent in storage stability, and its manufacturing method.
本発明者らは上記目的を達成するために鋭意研究を重ねた結果、エポキシ樹脂、フェノール樹脂、硬化促進剤、および無機充填剤を必須成分として含有する樹脂組成物本体の表面を微細シリカ粉で被覆することにより、成形時の流れ性に優れると共に、長期保管時のブロッキングや、成形時の流れ性の経時的な低下が抑制され、保存安定性に優れる封止用エポキシ樹脂組成物を得られることを見出し、本発明を完成させたものである。 As a result of intensive studies to achieve the above object, the present inventors have determined that the surface of the resin composition main body containing epoxy resin, phenol resin, curing accelerator, and inorganic filler as essential components is made of fine silica powder. By coating, the flowability during molding is excellent, and blocking during long-term storage and deterioration of flowability during molding are suppressed over time, and an epoxy resin composition for sealing having excellent storage stability can be obtained. The present invention has been found and the present invention has been completed.
すなわち、本発明の封止用エポキシ樹脂組成物は、（Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）硬化促進剤、および（Ｄ）無機充填剤を必須成分として含有する封止用エポキシ樹脂組成物であって、前記（Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）硬化促進剤、および（Ｄ）無機充填剤を必須成分として含有する粉状、顆粒状、またはシート状の樹脂組成物本体と、前記樹脂組成物本体の表面を被覆する（Ｅ）微細シリカ粉とを有することを特徴とする。 That is, the epoxy resin composition for sealing of the present invention is an epoxy for sealing containing (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler as essential components. A resin composition comprising (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler as essential components, in the form of a powder, granule, or sheet It has a resin composition main body and (E) fine silica powder which coat | covers the surface of the said resin composition main body, It is characterized by the above-mentioned.
前記（Ｅ）微細シリカ粉は、１次粒子径が５ｎｍ以上１００ｎｍ以下であり、かつ嵩密度が３０ｇ／Ｌ以上８０ｇ／Ｌ以下の乾式シリカであることが好ましい。また、本発明の封止用エポキシ樹脂組成物は、前記樹脂組成物本体１００質量部に対して、前記（Ｅ）微細シリカ粉を０．０１質量部以上０．２質量部以下含有することが好ましい。 The fine silica powder (E) is preferably dry silica having a primary particle diameter of 5 nm to 100 nm and a bulk density of 30 g / L to 80 g / L. Moreover, the epoxy resin composition for sealing of this invention may contain 0.01 mass part or more and 0.2 mass part or less of said (E) fine silica powder with respect to 100 mass parts of said resin composition main bodies. preferable.
本発明の封止用エポキシ樹脂組成物の製造方法は、（Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）硬化促進剤、および（Ｄ）無機充填剤を混練して粉状、顆粒状、またはシート状の樹脂組成物本体を得る工程と、前記樹脂組成物本体の表面に（Ｅ）微細シリカ粉を被覆する工程とを有することを特徴とする。 The method for producing an epoxy resin composition for sealing according to the present invention comprises kneading (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler to form powders and granules. Or a step of obtaining a sheet-shaped resin composition main body and a step of (E) coating the surface of the resin composition main body with fine silica powder.
本発明によれば、（Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）硬化促進剤、および（Ｄ）無機充填剤を必須成分として含有する粉状、顆粒状、またはシート状の樹脂組成物本体と、この樹脂組成物本体の表面を被覆する（Ｅ）微細シリカ粉とを有するものとすることで、成形時の流れ性に優れると共に、長期保管時のブロッキングや、成形時の流れ性の経時的な低下が抑制され、保存安定性に優れる封止用エポキシ樹脂組成物とすることができる。 According to the present invention, a powdery, granular, or sheet-like resin composition containing (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an inorganic filler as essential components. By having the product body and the (E) fine silica powder covering the surface of the resin composition body, it has excellent flowability during molding, blocking during long-term storage, and flowability during molding. The time-dependent fall of this is suppressed and it can be set as the epoxy resin composition for sealing which is excellent in storage stability.
また、本発明によれば、（Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）硬化促進剤、および（Ｄ）無機充填剤を混練して粉状、顆粒状、またはシート状の樹脂組成物本体を得る工程と、この樹脂組成物本体の表面に（Ｅ）微細シリカ粉を被覆する工程とを有するものとすることで、成形時の流れ性に優れると共に、長期保管時のブロッキングや、成形時の流れ性の経時的な低下が抑制され、保存安定性に優れる封止用エポキシ樹脂組成物を容易に製造することができる。 According to the present invention, (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler are kneaded to obtain a powdery, granular, or sheet-like resin composition. By having a step of obtaining a product main body and a step of coating the surface of the resin composition main body with (E) fine silica powder, while being excellent in flowability during molding, blocking during long-term storage, It is possible to easily produce an encapsulating epoxy resin composition that suppresses a temporal decrease in flowability during molding and is excellent in storage stability.
まず、本発明の封止用エポキシ樹脂組成物について説明する。
本発明の封止用エポキシ樹脂組成物は、（Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）硬化促進剤、および（Ｄ）無機充填剤を必須成分として含有する封止用エポキシ樹脂組成物であって、これら（Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）硬化促進剤、および（Ｄ）無機充填剤を必須成分として含有する粉状、顆粒状、またはシート状の樹脂組成物本体と、この樹脂組成物本体の表面を被覆する（Ｅ）微細シリカ粉とを有することを特徴とする。
First, the sealing epoxy resin composition of the present invention will be described.
The epoxy resin composition for sealing according to the present invention comprises an epoxy resin composition for sealing containing (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler as essential components. A powdery, granular, or sheet-shaped resin composition containing these (A) epoxy resin, (B) phenol resin, (C) curing accelerator, and (D) inorganic filler as essential components It has the thing main body and (E) fine silica powder which coat | covers the surface of this resin composition main body, It is characterized by the above-mentioned.
本発明の封止用エポキシ樹脂組成物では、（Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）硬化促進剤、および（Ｄ）無機充填剤を必須成分として含有する粉状、顆粒状、またはシート状の樹脂組成物本体の表面を（Ｅ）微細シリカ粉で被覆することによって、封止用エポキシ樹脂組成物の成形時の流れ性を良好なものとしつつ、長期保管時のブロッキングや、成形時の流れ性の経時的な低下を抑制し、保存安定性に優れたものとすることができる。 In the epoxy resin composition for sealing of the present invention, (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) a powder, granule containing an inorganic filler as essential components, Or by covering the surface of the sheet-shaped resin composition body with (E) fine silica powder, while making the flowability at the time of molding of the epoxy resin composition for sealing good, blocking during long-term storage, It is possible to suppress deterioration of flowability during molding with time and to have excellent storage stability.
（Ａ）成分のエポキシ樹脂としては、1分子当たり２個以上のエポキシ基を有し、半導体素子の封止用材料として一般に用いられるものであれば特に制限されるものではない。このような（Ａ）成分のエポキシ樹脂としては、例えばビフェニル型エポキシ樹脂、ビスフェノールＡ、ビフェノールＦまたはビフェノールＳ型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、Ｏ−クレゾールノボラック型エポキシ樹脂、ナフタレン骨格を有する多官能のエポキシ樹脂、トリまたはテトラ（ヒドロキシフェニル）アルカンのエポキシ樹脂、脂環式エポキシ樹脂、臭素化ビスフェノールＡ型エポキシ樹脂、臭素化フェノールノボラック型エポキシ樹脂等を挙げることができる。これらは単独で用いてもよく、２種以上を組合わせて用いてもよい。本発明の効果は、特に充填性、流動性、耐リフロー性の向上を目的として使用される低分子量のＯ−クレゾールノボラック型エポキシ樹脂（住友化学株式会社製ＥＳＣＮ−９０（軟化点６５℃）等）、ビフェニル型エポキシ樹脂（ジャパンエポキシレジン株式会社製ＹＸ−４０００ＨＫ等）、ビスフェノールＡ型エポキシ樹脂等の低粘度エポキシ樹脂を使用する場合に発揮される。 The epoxy resin as component (A) is not particularly limited as long as it has two or more epoxy groups per molecule and is generally used as a sealing material for semiconductor elements. Examples of the epoxy resin of the component (A) include, for example, biphenyl type epoxy resins, bisphenol A, biphenol F or biphenol S type epoxy resins, phenol novolac type epoxy resins, O-cresol novolac type epoxy resins, and many having a naphthalene skeleton. Examples thereof include functional epoxy resins, tri- or tetra (hydroxyphenyl) alkane epoxy resins, alicyclic epoxy resins, brominated bisphenol A type epoxy resins, brominated phenol novolac type epoxy resins, and the like. These may be used alone or in combination of two or more. The effect of the present invention is a low molecular weight O-cresol novolak type epoxy resin (ESCN-90 (softening point 65 ° C.) manufactured by Sumitomo Chemical Co., Ltd.) used for the purpose of improving the filling property, fluidity, and reflow resistance. ), Biphenyl type epoxy resin (YX-4000HK, etc., manufactured by Japan Epoxy Resin Co., Ltd.), and low viscosity epoxy resin such as bisphenol A type epoxy resin.
（Ｂ）成分のフェノール樹脂としては、１分子当たり２個以上のフェノール性水酸基を有し、上記（Ａ）成分のエポキシ樹脂を硬化させることができるものであって、半導体素子の封止用材料として一般に用いられるものであれば特に制限されるものではない。このような（Ｂ）成分のフェノール樹脂としては、例えばフェノールノボラック樹脂、クレゾールノボラック樹脂、アラルキル型フェノール樹脂、ナフタレン型フェノール樹脂、シクロペンタジエン型フェノール樹脂、トリフェノールアルカン型フェノール樹脂等を挙げることができる。これらは単独で用いてもよく、２種以上を組合わせて用いてもよい。これらの中でも、流動注、難燃性の観点から、フェノールノボラック樹脂（明和化成株式会社製Ｈ−１等）やアラルキル型フェノール樹脂等が好適なものとして挙げられる。 The component (B) phenolic resin has two or more phenolic hydroxyl groups per molecule and can cure the epoxy resin of the component (A). As long as it is generally used, there is no particular limitation. Examples of the (B) component phenolic resin include phenol novolac resin, cresol novolac resin, aralkyl type phenol resin, naphthalene type phenol resin, cyclopentadiene type phenol resin, triphenolalkane type phenol resin, and the like. . These may be used alone or in combination of two or more. Among these, from the viewpoint of fluid injection and flame retardancy, a phenol novolac resin (M-1 Kasei Co., Ltd. H-1) and an aralkyl type phenol resin are preferable.
本発明の成形材料における（Ａ）成分のエポキシ樹脂と（Ｂ）成分のフェノール樹脂の含有割合は、（Ａ）成分のエポキシ樹脂中のエポキシ基１モルに対して、（Ｂ）成分のフェノール樹脂中のフェノール性水酸基が好ましくは０．５モル以上１．６モル以下、より好ましくは０．６モル以上１．４モル以下となるように選定される。（Ａ）成分のエポキシ樹脂中のエポキシ基１モルに対して（Ｂ）成分のフェノール樹脂中のフェノール性水酸基が０．５モル以上であれば硬化物のガラス転移温度が良好となり、一方１．６モル以下であれば、反応性が良好となると共に、充分な架橋密度を有し、強度の高い硬化物を得ることができる。 In the molding material of the present invention, the content ratio of the (A) component epoxy resin and the (B) component phenol resin is 1 mol of the epoxy group in the (A) component epoxy resin, and the (B) component phenol resin. The phenolic hydroxyl group is preferably selected so as to be 0.5 to 1.6 mol, more preferably 0.6 to 1.4 mol. If the phenolic hydroxyl group in the (B) component phenolic resin is 0.5 mol or more relative to 1 mol of the epoxy group in the (A) component epoxy resin, the glass transition temperature of the cured product will be good. When the amount is 6 mol or less, the reactivity is good, and a cured product having a sufficient crosslinking density and high strength can be obtained.
（Ｃ）成分の硬化促進剤としては、エポキシ基と反応してエポキシ樹脂を硬化させる化合物の硬化速度を促進させる化合物であって、トリフェニルホスフィン等のリン系硬化促進剤、アミン系硬化促進剤、イミダゾール系硬化促進剤が用いられる。アミン系化合物としては、硬化促進効果の観点から、エチレンジアミン、トリメチレンジアミン、テトラメチレンジアミンが特に好ましい。また、イミダゾール系硬化促進剤としては、２−エチル−4−メチルイミダゾール、２−メチルイミダゾール、２−フェニル−４−メチル−５−ヒドロキシメチルイミダゾールが好ましい。これらは単独で用いてもよく、２種以上を組合わせて用いてもよい。 (C) Component curing accelerator is a compound that accelerates the curing rate of a compound that reacts with an epoxy group to cure an epoxy resin, and is a phosphorus-based curing accelerator such as triphenylphosphine, or an amine-based curing accelerator. An imidazole curing accelerator is used. As the amine compound, ethylenediamine, trimethylenediamine, and tetramethylenediamine are particularly preferable from the viewpoint of curing acceleration effect. Moreover, as an imidazole series hardening accelerator, 2-ethyl-4-methylimidazole, 2-methylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole are preferable. These may be used alone or in combination of two or more.
（Ｄ）成分の無機充填剤としては、ボールミル等で粉砕した 溶融シリカ 、火炎溶融することで得られる球状シリカ 、ゾルゲル法などで製造される球状シリカ 、結晶シリカ 、アルミナ、ボロンナイトライド、窒化アルミニウム、窒化ケイ素、マグネシア、マグネシウムシリケート等が挙げられる。半導体素子が発熱の大きいものの場合、熱伝導率ができるだけ大きく、かつ熱膨張係数の小さなもの、例えばアルミナ、ボロンナイトライド、窒化アルミニウム、窒化ケイ素等を使用することが望ましい。また、これらを溶融シリカ等とブレンドして使用してもよい。なお、無機充填剤の形状は特に限定されるものではなく、例えばフレーク状、樹枝状、球状等が挙げられ、これらは単独または混合して用いることができる。これらの中でも、球状のものが、低粘度化、高充填化には最も望ましいものである。 As the inorganic filler of component (D), fused silica pulverized by a ball mill or the like, spherical silica obtained by flame melting, spherical silica produced by a sol-gel method, crystalline silica, alumina, boron nitride, aluminum nitride , Silicon nitride, magnesia, magnesium silicate and the like. When the semiconductor element generates a large amount of heat, it is desirable to use a material having as high a thermal conductivity as possible and a low thermal expansion coefficient, such as alumina, boron nitride, aluminum nitride, or silicon nitride. These may be blended with fused silica or the like. In addition, the shape of an inorganic filler is not specifically limited, For example, flake shape, dendritic shape, spherical shape etc. are mentioned, These can be used individually or in mixture. Among these, spherical ones are the most desirable for lowering viscosity and increasing packing.
（Ｄ）成分の無機充填剤は、粒径が過度に大きいと狭部等への充填が困難になるだけでなく、分散性も低下して成形品が不均一になることから、最大粒径が１５０μｍであることが好ましい。また、（Ｄ）成分の無機充填剤は、所望の粘度特性、流動特性とする観点から、平均粒径が１μｍ以上４０μｍ以下であることが好ましい。 (D) The inorganic filler of component (D) is not only difficult to fill the narrow portion when the particle size is excessively large, but also the dispersibility is lowered and the molded product becomes non-uniform. Is preferably 150 μm. The inorganic filler of component (D) preferably has an average particle size of 1 μm or more and 40 μm or less from the viewpoint of obtaining desired viscosity characteristics and flow characteristics.
（Ｄ）成分の無機充填剤の含有量は、樹脂組成物本体全体中、好ましくは７５質量％以上９５質量％以下であり、より好ましくは８０質量％以上９２質量％以下である。無機充填剤の含有量が７５質量％以上であれば、硬化物の膨張係数を十分に低減させ、また吸水率も低減させることができ、半田リフローの際のクラックの発生を抑制することができる。一方、９５質量％以下であれば適度の溶融粘度を有し、成形性が良好となる。 The content of the inorganic filler of component (D) is preferably 75% by mass or more and 95% by mass or less, more preferably 80% by mass or more and 92% by mass or less, in the entire resin composition main body. If the content of the inorganic filler is 75% by mass or more, the expansion coefficient of the cured product can be sufficiently reduced, the water absorption can be reduced, and the occurrence of cracks during solder reflow can be suppressed. . On the other hand, if it is 95 mass% or less, it has an appropriate melt viscosity and good moldability.
（Ｅ）成分の微細シリカ粉は、上記した（Ａ）成分〜（Ｄ）成分を必須成分として含有する粉状、顆粒状、またはシート状の樹脂組成物本体を被覆するものであり、封止用エポキシ樹脂組成物の成形時の流れ性を良好なものとしつつ、長期保管時のブロッキングや、成形時の流れ性の経時的な低下を抑制し、保存安定性に優れたものとするために用いられる。 The fine silica powder of component (E) covers a powdery, granular, or sheet-shaped resin composition body containing the above-described components (A) to (D) as essential components, and is sealed. To improve the flow stability during molding of the epoxy resin composition for use, and to prevent blocking during long-term storage and deterioration of flowability during molding over time, and to have excellent storage stability Used.
（Ｅ）成分の微細シリカ粉は、樹脂組成物本体に含有される（Ｄ）成分の無機充填剤に比べて十分に微細なものであり、具体的には１次粒子の平均粒径が１ｎｍ以上３００ｎｍ以下の微細なシリカ粉である。１次粒子の平均粒径が１ｎｍ未満のものは製造が容易でなく、また３００ｎｍを超えると十分なブロッキング防止効果を得ることができない。（Ｅ）成分の微細シリカ粉は、ゾル・ゲル法、直接酸化法等、いずれの方法により製造されたものであってもよいが、気相反応によって得られる微細シリカ（乾式シリカ）が好ましい。 The fine silica powder of component (E) is sufficiently finer than the inorganic filler of component (D) contained in the resin composition body, and specifically, the average particle size of primary particles is 1 nm. This is a fine silica powder of 300 nm or less. If the average particle size of the primary particles is less than 1 nm, the production is not easy, and if it exceeds 300 nm, a sufficient anti-blocking effect cannot be obtained. The fine silica powder of component (E) may be produced by any method such as a sol-gel method or a direct oxidation method, but fine silica (dry silica) obtained by a gas phase reaction is preferred.
（Ｅ）成分の微細シリカ粉は、好ましくは、１次粒子の平均粒径が５ｎｍ以上１００ｎｍ以下、かつ嵩密度が３０ｇ／Ｌ以上８０ｇ／Ｌである。１次粒子の平均粒径が５ｎｍ未満では２次凝集しやすく、１００ｎｍを超えるとブロッキング防止効果が低下するおそれがある。また、嵩密度が３０ｇ／Ｌ未満ではブロッキング防止効果が低下するおそれがあり、８０ｇ／Ｌを超えると封止用エポキシ樹脂組成物のブロッキング防止効果が少なく、成形性が低下するおそれがある。 The fine silica powder of component (E) preferably has an average primary particle size of 5 nm to 100 nm and a bulk density of 30 g / L to 80 g / L. If the average particle size of the primary particles is less than 5 nm, secondary aggregation tends to occur, and if it exceeds 100 nm, the antiblocking effect may be reduced. Further, when the bulk density is less than 30 g / L, the anti-blocking effect may be reduced, and when it exceeds 80 g / L, the anti-blocking effect of the sealing epoxy resin composition is small, and the moldability may be reduced.
（Ｅ）成分の微細シリカ粉は、樹脂組成物本体１００質量部に対して、０．０１質量部以上０．２質量部以下であることが好ましい。微細シリカ粉の含有量が少なくとも０．０１質量部あればブロッキング防止効果を得ることができ、また０．２質量部程度あれば十分なブロッキング防止効果を得ることができると共に、これを超えて含有させても効果が飽和し、かえって製造時の混練性や成形時の流れ性等の他の特性が低下するおそれがあるため好ましくない。 (E) It is preferable that the fine silica powder of a component is 0.01 mass part or more and 0.2 mass part or less with respect to 100 mass parts of resin composition main bodies. If the content of the fine silica powder is at least 0.01 parts by mass, an anti-blocking effect can be obtained, and if it is about 0.2 parts by mass, a sufficient anti-blocking effect can be obtained, and the content exceeds this. Even if it makes it, an effect will be saturated, and on the contrary, since there exists a possibility that other characteristics, such as the kneadability at the time of manufacture and the fluidity | liquidity at the time of shaping | molding, may fall, it is not preferable.
なお、樹脂組成物本体、すなわち（Ｅ）成分の微細シリカ粉による被覆前の樹脂組成物本体には、微細シリカ粉が含有されていないことが好ましい。樹脂組成物本体の内部に含有された微細シリカ粉はブロッキング防止効果に乏しく、かえって製造時の混練性や成形時の流れ性等の他の特性を低下させるおそれがある。このように樹脂組成物本体の内部には微細シリカ粉が含有されていないことが好ましいが、樹脂組成物本体の表面を被覆するために用いた（Ｅ）成分の微細シリカ粉の一部が樹脂組成物本体の内部に含有されていても構わない。 In addition, it is preferable that the fine silica powder is not contained in the resin composition main body, that is, the resin composition main body before coating with the fine silica powder of the component (E). The fine silica powder contained in the resin composition main body has a poor anti-blocking effect, and may deteriorate other characteristics such as kneadability during production and flowability during molding. As described above, it is preferable that the fine silica powder is not contained in the resin composition main body, but a part of the fine silica powder of the component (E) used for coating the surface of the resin composition main body is a resin. It may be contained inside the composition body.
本発明の封止用エポキシ樹脂組成物、より具体的には樹脂組成物本体については、上記した（Ａ）成分〜（Ｄ）成分に加えて、必要に応じて、かつ本発明の趣旨に反しない限度において、カップリング剤を始めとする各種添加成分を含有させることができる。 About the epoxy resin composition for sealing of the present invention, more specifically, the resin composition body, in addition to the components (A) to (D) described above, if necessary, contrary to the spirit of the present invention. In the limit not to be included, various additive components including a coupling agent can be contained.
カップリング剤は、封止用エポキシ樹脂組成物の硬化物と配線板等との接着強度を向上させる等の目的で添加される。カップリング剤としては、例えば１級アミノ基、２級アミノ基、または３級アミノ基を有するシラン化合物、具体的にはエポキシシラン、メルカプトシラン、アルキルシラン、フェニルシラン、ウレイドシラン、ビニルシラン等の各種シラン化合物、チタン系化合物、アルミニウキレート類、アルミニウム／ジルコニウム系化合物等が挙げられる。 The coupling agent is added for the purpose of improving the adhesive strength between the cured epoxy resin composition for sealing and the wiring board or the like. Examples of coupling agents include silane compounds having a primary amino group, a secondary amino group, or a tertiary amino group, specifically epoxy silane, mercapto silane, alkyl silane, phenyl silane, ureido silane, vinyl silane, and the like. Examples thereof include silane compounds, titanium compounds, aluminium chelates, and aluminum / zirconium compounds.
上記カップリング剤の中でも、充填性の観点からは、例えばγ−アニリノプロピルトリメトキシシラン、γ−アニリノプロピルトリエトキシシラン、γ−アニリノプロピルメチルジメトキシシラン、γ−アニリノプロピルメチルジエトキシシラン、γ−アニリノプロピルエチルジエトキシシラン等の２級アミノ基を有するシランカップリング剤が好ましい。 Among the above coupling agents, from the viewpoint of filling properties, for example, γ-anilinopropyltrimethoxysilane, γ-anilinopropyltriethoxysilane, γ-anilinopropylmethyldimethoxysilane, γ-anilinopropylmethyldiethoxy. Silane coupling agents having secondary amino groups such as silane and γ-anilinopropylethyldiethoxysilane are preferred.
本発明の封止用エポキシ樹脂組成物におけるカップリング剤の含有量は、封止用エポキシ樹脂組成物（樹脂組成物本体）中、好ましくは０．０３質量％以上５質量％以下であり、より好ましくは０．１０質量％以上０．２５質量％以下であることが好ましい。カップリング剤の含有量が０．０３質量％以上であれば配線板等との接着強度が十分なものとなり、一方５質量％以下であれば揮発分が少なく、ボイド等の充填性に関する成形不良の発生を抑制できると共に、パッケージの成形性も良好となる。 The content of the coupling agent in the epoxy resin composition for sealing of the present invention is preferably 0.03% by mass to 5% by mass in the epoxy resin composition for sealing (resin composition main body), and more. Preferably it is 0.10 mass% or more and 0.25 mass% or less. If the coupling agent content is 0.03% by mass or more, the adhesive strength with the wiring board and the like will be sufficient, whereas if it is 5% by mass or less, the volatile content is low and the molding defect relating to the filling properties such as voids is poor. Generation can be suppressed, and the moldability of the package is also improved.
また、本発明の封止用エポキシ樹脂組成物におけるカップリング剤以外の添加成分としては、例えばシリコーンゴムやシリコーンゲル等の粉末、シリコーン変性エポキシ樹脂やフェノール樹脂、メタクリル酸メチル−ブタジエン−スチレン共重合体のような熱可塑性樹脂等の低応力化剤；臭素化エポキシ樹脂、酸化アンチモン等の難燃剤や難燃助剤；ｎ−ブチルグリシジルエーテル、フェニルグリシジルエーテル、スチレンオキサイド、t−ブチルフェニルグリシジルエーテル、ジシクロペンタジエンジエポキシド、フェノール、クレゾール、ｔ−ブチルフェノール等の粘度降下用希釈剤；カーボンブラック等の着色剤；ノニオン系界面活性剤、フッ素系界面活性剤、シリコーンオイル等の濡れ向上剤や消泡剤；等を適宜含有させることができる。 Examples of the additive component other than the coupling agent in the sealing epoxy resin composition of the present invention include powders such as silicone rubber and silicone gel, silicone-modified epoxy resins and phenol resins, and methyl methacrylate-butadiene-styrene copolymer. Low stress agents such as thermoplastic resins such as coalescence; flame retardants and flame retardant aids such as brominated epoxy resins and antimony oxides; n-butyl glycidyl ether, phenyl glycidyl ether, styrene oxide, t-butylphenyl glycidyl ether , Dicyclopentadiene diepoxide, phenol, cresol, t-butylphenol and other viscosity-reducing diluents; colorants such as carbon black; nonionic surfactants, fluorosurfactants, wetting improvers such as silicone oil Foaming agent; etc. can be included as appropriate The
次に、本発明の封止用エポキシ樹脂組成物の製造方法について説明する。本発明の封止用エポキシ樹脂組成物の製造方法は、（Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）硬化促進剤、および（Ｄ）無機充填剤を混練して粉状、顆粒状、またはシート状の樹脂組成物本体を得る工程と、この樹脂組成物本体の表面に（Ｅ）微細シリカ粉を被覆する工程とを有することを特徴とする。 Next, the manufacturing method of the epoxy resin composition for sealing of this invention is demonstrated. The method for producing an epoxy resin composition for sealing according to the present invention comprises kneading (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler to form powders and granules. Or a step of obtaining a sheet-shaped resin composition main body, and a step of coating the surface of the resin composition main body with (E) fine silica powder.
本発明の封止用エポキシ樹脂組成物の製造方法では、まず（Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）硬化促進剤、および（Ｄ）無機充填剤を混練して粉状、顆粒状、またはシート状の樹脂組成物本体を得た後、この樹脂組成物本体の表面に（Ｅ）微細シリカ粉を被覆するようにすることで、樹脂組成物本体の表面を（Ｅ）微細シリカ粉で適切に被覆することができ、成形時の流れ性に優れると共に、長期保管時のブロッキングや、成形時の流れ性の経時的な低下が抑制され、保存安定性に優れる封止用エポキシ樹脂組成物を製造することができる。 In the method for producing an epoxy resin composition for sealing of the present invention, first, (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler are kneaded to form powders and granules. After obtaining the resin composition body in the form of a sheet or sheet, the surface of the resin composition body is coated with (E) fine silica powder, so that the surface of the resin composition body is (E) fine silica. Epoxy resin for sealing that can be properly coated with powder, has excellent flowability during molding, and has excellent storage stability because it prevents blocking during long-term storage and deterioration of flowability during molding over time. A composition can be produced.
（Ｅ）成分の微細シリカ粉が被覆される樹脂組成物本体の調製方法は、特に制限されるものではなく、公知の封止用エポキシ樹脂組成物の製造方法を採用することができるが、例えば以下のような方法を用いることで効率よく調製することができる。 The method for preparing the resin composition main body coated with the fine silica powder of component (E) is not particularly limited, and a known method for producing an epoxy resin composition for sealing can be employed. It can be efficiently prepared by using the following method.
すなわち、既に説明したような（Ａ）成分〜（Ｄ）成分の必須成分、および必要に応じて加えられるカップリング剤やその他の各種添加剤を配合し、高速混合機等を用いて均一に混合した後、二本ロールや連続混練装置等を用いて十分に混練する。このときの混練温度は、混練作業を容易なものとしつつ特性低下を抑制する観点から、例えば５０℃以上１１０℃以下とすることが好ましい。 That is, the essential components (A) to (D) as described above, and coupling agents and other various additives added as necessary are blended and mixed uniformly using a high-speed mixer or the like. Then, the mixture is sufficiently kneaded using a two-roll or continuous kneader. The kneading temperature at this time is preferably 50 ° C. or more and 110 ° C. or less, for example, from the viewpoint of facilitating the kneading operation and suppressing characteristic deterioration.
そして、得られた混練物をシート状に成形して冷却した後、所定の大きさに切断等することにより、シート状の樹脂組成物本体を得ることができる。また、混練物をシート状に成形して冷却した後、粉砕することにより粉状または顆粒状の樹脂組成物本体を得ることができる。 And after shape | molding the obtained kneaded material in a sheet form and cooling, a sheet-like resin composition main body can be obtained by cut | disconnecting etc. to a predetermined magnitude | size. Further, the kneaded product is formed into a sheet shape, cooled, and then pulverized to obtain a powdery or granular resin composition main body.
その後、例えば冷却機付攪拌釜に樹脂組成物本体を入れると共に、この冷却機付攪拌釜に（Ｅ）成分の微細シリカ粉を所定量加えて攪拌混合することにより、樹脂組成物本体の表面に（Ｅ）成分の微細シリカ粉を被覆することができる。樹脂組成物本体への（Ｅ）成分の微細シリカ粉の被覆方法は、必ずしもこのような攪拌混合に限定されるものではなく、樹脂組成物本体の形状に応じて適宜選択することができ、例えば樹脂組成物本体がシート状の場合には、その表面に（Ｅ）成分の微細シリカ粉を噴霧することにより被覆してもよい。 Thereafter, for example, the resin composition main body is put into a stirring pot with a cooler, and a predetermined amount of the fine silica powder of the component (E) is added to the stirring pot with a cooler and stirred and mixed, so that The fine silica powder of the component (E) can be coated. The method of coating the fine silica powder of the component (E) on the resin composition body is not necessarily limited to such stirring and mixing, and can be appropriately selected according to the shape of the resin composition body. When the resin composition main body is in the form of a sheet, the surface thereof may be coated by spraying the fine silica powder of component (E).
このようにして得られる本発明の封止用エポキシ樹脂組成物は、一般成形材料として用いることもできるが、薄型化、狭パッドピッチ化された半導体装置の製造に適用することで、また特に積層型ＣＳＰのように長いボンディングワイヤを有するものや、一括モールド法のようにキャビティ容積の大きいものに適用することで、ボンディングワイヤの損傷を抑制し、またキャビティ内に十分に行き渡らせることができ、従来の封止用エポキシ樹脂組成物に比べて顕著な効果を発揮する。 The epoxy resin composition for sealing of the present invention thus obtained can be used as a general molding material. However, when applied to the manufacture of a semiconductor device having a reduced thickness and a reduced pad pitch, it is also particularly laminated. By applying to a long bonding wire such as a mold CSP or a large cavity volume such as a batch molding method, damage to the bonding wire can be suppressed, and it can be sufficiently distributed in the cavity. Compared with the conventional epoxy resin composition for sealing, a remarkable effect is exhibited.
次に、本発明を実施例を参照してさらに詳細に説明する。
なお、本発明は、これらの実施例によって制限されるものではない。
The present invention will now be described in more detail with reference to examples.
In addition, this invention is not restrict | limited by these Examples.
（実施例１〜７）
表１に示すような配合割合で各成分を配合し、常温で混合（ドライブレンド）した後、８０℃〜１１０℃で加熱混練し、冷却、粉砕して粉状の樹脂組成物本体を製造した。その後、冷却機能付混合釜に樹脂組成物本体を投入すると共に、所定の平均粒径（１次粒径）を有する微細シリカ粉を所定量投入して攪拌混合することにより、樹脂組成物本体の表面に微細シリカ粉を被覆（外添）した。なお、表１における微細シリカ粉（外添剤）の配合量は、樹脂組成物本体１００質量部に対する配合量を示している。
(Examples 1-7)
After blending each component at a blending ratio as shown in Table 1 and mixing (dry blending) at room temperature, the mixture was heated and kneaded at 80 ° C. to 110 ° C., cooled and pulverized to produce a powdery resin composition body. . Thereafter, the resin composition main body is put into a mixing pot with a cooling function, and a predetermined amount of fine silica powder having a predetermined average particle diameter (primary particle diameter) is added and mixed by stirring to obtain a resin composition main body. The surface was coated with fine silica powder (external addition). In addition, the compounding quantity of the fine silica powder (external additive) in Table 1 has shown the compounding quantity with respect to 100 mass parts of resin composition main bodies.
（比較例１〜５）
比較例１〜２、４〜５の封止用エポキシ樹脂組成物については、実施例１〜７と同様にして各成分を表１に示すような配合割合で配合し、混練、粉砕を行うことにより樹脂組成物本体を製造し、この樹脂組成物本体の表面に微細シリカ粉を被覆（外添）することなく、最終的な封止用エポキシ樹脂組成物とした。なお、比較例２の封止用エポキシ樹脂組成物については、微細シリカ粉を樹脂組成物本体に含有させるものとした。
(Comparative Examples 1-5)
About the epoxy resin composition for sealing of Comparative Examples 1-2, 4-5, it mix | blends each component by the compounding ratio as shown in Table 1 like Example 1-7, and knead | mix and grind | pulverize. A resin composition body was produced by the above process, and a final sealing epoxy resin composition was obtained without coating (externally adding) fine silica powder on the surface of the resin composition body. In addition, about the epoxy resin composition for sealing of the comparative example 2, fine silica powder shall be contained in the resin composition main body.
また、比較例３の封止用エポキシ樹脂組成物については、実施例１〜７と同様にして各成分を表１に示すような配合割合で配合し、混練、粉砕を行うことにより樹脂組成物本体を製造し、この樹脂組成物本体の表面に、微細シリカ粉を被覆（外添）する代わりに、従来の大きさの溶融球状シリカ粉を被覆（外添）させて封止用エポキシ樹脂組成物とした。 Moreover, about the epoxy resin composition for sealing of the comparative example 3, similarly to Examples 1-7, it mix | blends each component by the compounding ratio as shown in Table 1, and knead | mix and grind | pulverize the resin composition. Epoxy resin composition for sealing by manufacturing a main body and coating (external addition) a conventional size fused spherical silica powder instead of coating (external addition) fine silica powder on the surface of the resin composition main body It was a thing.
なお、実施例および比較例の封止用エポキシ樹脂組成物の製造に用いた原材料の詳細は以下に示す通りである。 In addition, the detail of the raw material used for manufacture of the epoxy resin composition for sealing of an Example and a comparative example is as showing below.
（エポキシ樹脂）
ＯＣＮ型エポキシ樹脂１：
Ｏ−クレゾールノボラック型エポキシ樹脂、住友化学工業株式会杜製、
商品名「ＥＳＣＮ−１９０」（エポキシ当量１９５、軟化点６５℃）
ＯＣＮ型エポキシ樹脂２：
Ｏ−クレゾールノボラック型エポキシ樹脂、住友化学工業株式会杜製、
商品名「ＥＳＣＮ−１９５」（エポキシ当量２０５、軟化点８０℃）
ビフェニル型エポキシ樹脂：
ジャパンエポキシレジン株式会社製、商品名「ＹＸ−４０００Ｈ」
（エポキシ当量１９６、融点１０６℃）
臭素化エポキシ樹脂：
東都化成株式会社製、商品名「ＹＤＢ−４００」
（エポキシ当量３７５、軟化点８０℃、臭素含有量４８質量％）
(Epoxy resin)
OCN type epoxy resin 1:
O-cresol novolac type epoxy resin, manufactured by Sumitomo Chemical Co., Ltd.
Product name “ESCN-190” (epoxy equivalent 195, softening point 65 ° C.)
OCN type epoxy resin 2:
O-cresol novolac type epoxy resin, manufactured by Sumitomo Chemical Co., Ltd.
Product name “ESCN-195” (epoxy equivalent 205, softening point 80 ° C.)
Biphenyl type epoxy resin:
Product name “YX-4000H” manufactured by Japan Epoxy Resin Co., Ltd.
(Epoxy equivalent 196, melting point 106 ° C.)
Brominated epoxy resin:
Product name "YDB-400", manufactured by Toto Kasei Co., Ltd.
(Epoxy equivalent 375, softening point 80 ° C., bromine content 48% by mass)
（硬化剤）
フェノールノボラック樹脂：明和化成株式会社製、
商品名「Ｈ−１」（軟化点８０℃、水酸基当量１０６）
（硬化促進剤）
イミダゾール系：２−エチル−４−メチルイミダゾール、
四国化成工業株式会社製、商品名「キュアゾール２Ｅ４ＭＺ」
(Curing agent)
Phenol novolac resin: Meiwa Kasei Co., Ltd.
Product name “H-1” (softening point 80 ° C., hydroxyl group equivalent 106)
(Curing accelerator)
Imidazole series: 2-ethyl-4-methylimidazole,
Product name "CURESOL 2E4MZ", manufactured by Shikoku Kasei Kogyo Co., Ltd.
（充填剤）
結晶シリカ：龍森株式会社製、商品名「ＭＣＣ−４」（平均粒径１２μｍ）
溶融球状シリカ：電気化学工業株式会社製、商品名「ＦＢ−１０５」
（平均粒径１０μｍ）
（カップリング剤）
エポキシシラン系カップリング剤、日本ユニカー株式会社製、品名「Ｙ−９６６９」
（ワックス）
カルナバワックス：株式会杜セラリカＮＯＤＡ、
商品名「精製カルナバワックスＮｏ−１」
(filler)
Crystalline silica: manufactured by Tatsumori Co., Ltd., trade name “MCC-4” (average particle size 12 μm)
Fused spherical silica: manufactured by Denki Kagaku Kogyo Co., Ltd., trade name “FB-105”
(Average particle size 10 μm)
(Coupling agent)
Epoxysilane coupling agent, manufactured by Nippon Unicar Co., Ltd., product name “Y-9669”
(wax)
Carnauba Wax: Stock Board Seralica NODA,
Product name "Purified Carnauba Wax No-1"
（その他）
芳香族隣化合物：大塚化学株式会杜製、商品名「ＳＰＥ−１００」
カーボンブラック：三菱化学株式会社製、商品名「ＭＡ−６００」
シリコーンオイル：信越シリコーン株式会社、商品名「Ｘ２２−１６３Ｃ」
難燃助剤：三酸化アンチモン、日本精鉱株式会社製
(Other)
Aromatic neighboring compounds: manufactured by Otsuka Chemical Co., Ltd., trade name “SPE-100”
Carbon black: Product name “MA-600” manufactured by Mitsubishi Chemical Corporation
Silicone oil: Shin-Etsu Silicone Co., Ltd., trade name “X22-163C”
Flame retardant aid: antimony trioxide, manufactured by Nippon Seiko Co., Ltd.
（微細シリカ粉）
平均粒径１５ｎｍ品：トクヤマ株式会杜製、商品名「レオロシールＱＳ−１０２」、
嵩密度５０ｇ／Ｌ、乾式シリカ
平均粒径１５ｎｍ品：トクヤマ株式会杜製、商品名「レオロシールＣＰ−１０２」
嵩密度１００ｇ／Ｌ、乾式シリカ
平均粒径５０ｎｍ品：日本アエロジル株式会杜製、商品名「ＯＸ−５０」
嵩密度１３０ｇ／Ｌ、乾式シリカ
(Fine silica powder)
Product with an average particle size of 15 nm: manufactured by Tokuyama Co., Ltd., trade name “Leolo Seal QS-102”
Bulk density 50 g / L, dry silica average particle size 15 nm product: manufactured by Tokuyama Co., Ltd., trade name “Leolosil CP-102”
Bulk density 100 g / L, dry silica average particle size 50 nm product: manufactured by Nippon Aerosil Co., Ltd., trade name “OX-50”
Bulk density 130g / L, dry silica
また、無機充填剤（結晶シリカ、溶融球状シリカ）、微細シリカ粉の平均粒径の測定方法、および微細シリカ粉の嵩密度の測定方法は以下に示す通りである。 Moreover, the measuring method of the inorganic filler (crystalline silica, fused spherical silica), the average particle diameter of the fine silica powder, and the bulk density of the fine silica powder are as follows.
（平均粒径）
レーザー回折粒度分布測定装置、堀場製作所製「シーラスレーザータイプ９２０」を用いて平均粒径を求めた。
（嵩密度）
微細シリカ粉１０ｇを２００ｃｃのメスシリンダーに流し込み、体積を測定することにより嵩密度を算出した。
(Average particle size)
The average particle diameter was determined using a laser diffraction particle size distribution analyzer, “Cirrus Laser Type 920” manufactured by Horiba.
(The bulk density)
The bulk density was calculated by pouring 10 g of fine silica powder into a 200 cc graduated cylinder and measuring the volume.
その後、得られた実施例１〜７、および比較例１〜５の封止用エポキシ樹脂組成物について、製造時作業性、ブロッキング性、スパイラルフロー、およびワイヤー流れの評価を行った。結果を表１に示す。なお、各評価の評価方法、評価基準は以下に示す通りである。 Then, about the obtained epoxy resin composition for sealing of Examples 1-7 obtained and Comparative Examples 1-5, workability | operativity at the time of manufacture, blocking property, spiral flow, and evaluation of the wire flow were performed. The results are shown in Table 1. The evaluation methods and evaluation criteria for each evaluation are as shown below.
（ブロッキング性）
封止用エポキシ樹脂組成物を室温（２５℃）、相対湿度４０％または８５％の環境下で２４時間保管した後に取り出し、塊状物の質量を測定し、封止用エポキシ樹脂組成物全体の質量に対する塊状物の質量の割合で示した。
（製造作業性）
封止用エポキシ樹脂組成物を製造する際の混練作業性を評価した。
○：流動性に優れ混練性が良好。
△：流動性が劣るために、混練時間がやや長め。
×：流動性がさらに劣るために、混練時間が非常に長め。
（スパイラルフロー）
ＥＭＭＩ−１−６６に準じたスパイラルフロー 金型を用い、封止用エポキシ樹脂組成物を１７５℃、成形圧力９．８ＭＰａでトランスファー成形したときのスパイラルフロー長さを測定した。
（ワイヤー流れ）
２５℃で１６８時間保管後の封止用エポキシ樹脂組成物を用いて評価を実施した。すなわち、２連のＱＦＰマトリックスフレーム（試料数：２０）を用い、成形温度１７５℃、成形圧力６．９ＭＰａでマルチプランジャー装置を使用してトランスファー成形し、得られたＱＦＰパッケージについてワイヤー変形の有無をＸ線装置により確認した。
○：ワイヤーの変形なし。
△：ワイヤーの変形あり。
×：ワイヤー切れあり。
(Blocking property)
The sealing epoxy resin composition is stored for 24 hours in an environment of room temperature (25 ° C.) and relative humidity of 40% or 85%, and then taken out. The mass of the lump is measured, and the total mass of the sealing epoxy resin composition is measured. It was shown by the ratio of the mass of the lump with respect to.
(Manufacturing workability)
The kneading workability at the time of producing the epoxy resin composition for sealing was evaluated.
○: Excellent fluidity and good kneadability.
Δ: The kneading time is slightly longer due to poor fluidity.
X: Since the fluidity is further inferior, the kneading time is very long.
(Spiral flow)
Using a spiral flow mold according to EMMI-1-66, the spiral flow length was measured when the sealing epoxy resin composition was transfer molded at 175 ° C. and a molding pressure of 9.8 MPa.
(Wire flow)
Evaluation was carried out using the epoxy resin composition for sealing after storage at 25 ° C. for 168 hours. That is, using two QFP matrix frames (number of samples: 20), transfer molding was performed using a multi-plunger device at a molding temperature of 175 ° C. and a molding pressure of 6.9 MPa, and the obtained QFP package was subject to wire deformation. Was confirmed by an X-ray apparatus.
○: No wire deformation.
Δ: Wire deformed.
X: There is a wire break.
表１から明らかなように、実施例１〜７の封止用エポキシ樹脂組成物については、ブロッキングが抑制されると共に、製造時作業性に優れ、ワイヤー流れも抑制されていることが認められる。これに対して、比較例１〜５の封止用エポキシ樹脂組成物については、全体的にブロッキング性が高く、ブロッキング性が低いものについては製造時作業性に劣ることが認められる。 As is clear from Table 1, it is recognized that the sealing epoxy resin compositions of Examples 1 to 7 are suppressed in blocking, excellent in workability during production, and suppressed in wire flow. On the other hand, about the epoxy resin composition for sealing of Comparative Examples 1-5, it is recognized that it is inferior to workability | operativity at the time of a thing with high blocking property as a whole and low blocking property.
Claims (4)
前記（Ａ）エポキシ樹脂、（Ｂ）フェノール樹脂、（Ｃ）硬化促進剤、および（Ｄ）無機充填剤を必須成分として含有する粉状、顆粒状、またはシート状の樹脂組成物本体と、前記樹脂組成物本体の表面を被覆する（Ｅ）微細シリカ粉とを有することを特徴とする封止用エポキシ樹脂組成物。 An epoxy resin composition for sealing containing (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) an inorganic filler as essential components,
(A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) a powdery, granular, or sheet-shaped resin composition main body containing an inorganic filler as essential components; An epoxy resin composition for sealing, comprising (E) fine silica powder covering the surface of the resin composition main body.
前記樹脂組成物本体の表面に（Ｅ）微細シリカ粉を被覆する工程と
を有することを特徴とする封止用エポキシ樹脂組成物の製造方法。 (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, and (D) a step of kneading an inorganic filler to obtain a powdery, granular, or sheet-like resin composition body;
(E) The process of coat | covering the fine silica powder on the surface of the said resin composition main body, The manufacturing method of the epoxy resin composition for sealing characterized by the above-mentioned.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101302913B1 (en) | 2010-10-21 | 2013-09-06 | 히타치가세이가부시끼가이샤 | Thermosetting resin composition for charging sealing semiconductor and semiconductor device |
| JP2013203798A (en) * | 2012-03-27 | 2013-10-07 | Kaneka Corp | Thermosetting resin composition tablet improved in tuck property and package of semiconductor by using the same |
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| JP2013203798A (en) * | 2012-03-27 | 2013-10-07 | Kaneka Corp | Thermosetting resin composition tablet improved in tuck property and package of semiconductor by using the same |
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