JP2009283834A - 放射線検出器 - Google Patents
放射線検出器 Download PDFInfo
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- JP2009283834A JP2009283834A JP2008136631A JP2008136631A JP2009283834A JP 2009283834 A JP2009283834 A JP 2009283834A JP 2008136631 A JP2008136631 A JP 2008136631A JP 2008136631 A JP2008136631 A JP 2008136631A JP 2009283834 A JP2009283834 A JP 2009283834A
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- 230000005855 radiation Effects 0.000 title claims abstract description 52
- 239000011669 selenium Substances 0.000 claims abstract description 79
- 229910052711 selenium Inorganic materials 0.000 claims abstract description 25
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052783 alkali metal Inorganic materials 0.000 claims abstract description 23
- 150000001340 alkali metals Chemical class 0.000 claims abstract description 23
- 230000005525 hole transport Effects 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 128
- 238000007740 vapor deposition Methods 0.000 description 28
- 238000002425 crystallisation Methods 0.000 description 19
- 238000000034 method Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 18
- 239000010408 film Substances 0.000 description 16
- 230000035945 sensitivity Effects 0.000 description 16
- 238000003860 storage Methods 0.000 description 15
- 230000008025 crystallization Effects 0.000 description 13
- 238000006243 chemical reaction Methods 0.000 description 10
- 238000001704 evaporation Methods 0.000 description 10
- 230000008020 evaporation Effects 0.000 description 10
- -1 chalcogenide compounds Chemical class 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 229920000620 organic polymer Polymers 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920000515 polycarbonate Polymers 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000001095 inductively coupled plasma mass spectrometry Methods 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 3
- 229920000052 poly(p-xylylene) Polymers 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 2
- 229910004613 CdTe Inorganic materials 0.000 description 2
- 229910019015 Mg-Ag Inorganic materials 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- SLGBZMMZGDRARJ-UHFFFAOYSA-N Triphenylene Natural products C1=CC=C2C3=CC=CC=C3C3=CC=CC=C3C2=C1 SLGBZMMZGDRARJ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229910052792 caesium Inorganic materials 0.000 description 2
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 2
- AIYUHDOJVYHVIT-UHFFFAOYSA-M caesium chloride Chemical compound [Cl-].[Cs+] AIYUHDOJVYHVIT-UHFFFAOYSA-M 0.000 description 2
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Inorganic materials [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 2
- 238000011088 calibration curve Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010549 co-Evaporation Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 150000002222 fluorine compounds Chemical class 0.000 description 2
- 229910003472 fullerene Inorganic materials 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- 238000009607 mammography Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 150000007978 oxazole derivatives Chemical class 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920003050 poly-cycloolefin Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910052701 rubidium Inorganic materials 0.000 description 2
- AHLATJUETSFVIM-UHFFFAOYSA-M rubidium fluoride Inorganic materials [F-].[Rb+] AHLATJUETSFVIM-UHFFFAOYSA-M 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 125000005580 triphenylene group Chemical group 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- QSNAVZQFIDCTQI-UHFFFAOYSA-N 1,2,3-trinitro-9h-fluorene Chemical compound C1=CC=C2C(C=C(C(=C3[N+]([O-])=O)[N+]([O-])=O)[N+](=O)[O-])=C3CC2=C1 QSNAVZQFIDCTQI-UHFFFAOYSA-N 0.000 description 1
- YLYPIBBGWLKELC-RMKNXTFCSA-N 2-[2-[(e)-2-[4-(dimethylamino)phenyl]ethenyl]-6-methylpyran-4-ylidene]propanedinitrile Chemical compound C1=CC(N(C)C)=CC=C1\C=C\C1=CC(=C(C#N)C#N)C=C(C)O1 YLYPIBBGWLKELC-RMKNXTFCSA-N 0.000 description 1
- DNTVTBIKSZRANH-UHFFFAOYSA-N 4-(4-aminophenyl)-3-(3-methylphenyl)aniline Chemical compound CC1=CC=CC(C=2C(=CC=C(N)C=2)C=2C=CC(N)=CC=2)=C1 DNTVTBIKSZRANH-UHFFFAOYSA-N 0.000 description 1
- DDTHMESPCBONDT-UHFFFAOYSA-N 4-(4-oxocyclohexa-2,5-dien-1-ylidene)cyclohexa-2,5-dien-1-one Chemical class C1=CC(=O)C=CC1=C1C=CC(=O)C=C1 DDTHMESPCBONDT-UHFFFAOYSA-N 0.000 description 1
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910017255 AsSe Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004985 Discotic Liquid Crystal Substance Substances 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910019086 Mg-Cu Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910018321 SbTe Inorganic materials 0.000 description 1
- 229910018110 Se—Te Inorganic materials 0.000 description 1
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 1
- 229910007709 ZnTe Inorganic materials 0.000 description 1
- OWXLRKWPEIAGAT-UHFFFAOYSA-N [Mg].[Cu] Chemical compound [Mg].[Cu] OWXLRKWPEIAGAT-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000004770 chalcogenides Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 230000005264 electron capture Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003097 hole (electron) Substances 0.000 description 1
- 150000007857 hydrazones Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Inorganic materials [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- GLLJEXIFFRQOQX-UHFFFAOYSA-N n-[2-(benzenesulfonamido)-4,5-dimethylphenyl]benzenesulfonamide Chemical compound C=1C=CC=CC=1S(=O)(=O)NC=1C=C(C)C(C)=CC=1NS(=O)(=O)C1=CC=CC=C1 GLLJEXIFFRQOQX-UHFFFAOYSA-N 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 125000003748 selenium group Chemical group *[Se]* 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Inorganic materials [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 125000006617 triphenylamine group Chemical group 0.000 description 1
- 150000004961 triphenylmethanes Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Images
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/244—Auxiliary details, e.g. casings, cooling, damping or insulation against damage by, e.g. heat, pressure or the like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/246—Measuring radiation intensity with semiconductor detectors utilizing latent read-out, e.g. charge stored and read-out later
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
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- Spectroscopy & Molecular Physics (AREA)
- Measurement Of Radiation (AREA)
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Abstract
【解決手段】記録用光導電層の両側に電極が設けられ、この電極間に所定のバイアス電圧を印加した状態で、放射線の照射を受けることにより記録用光導電層内部に発生した電荷を電気信号として検出する放射線検出器において、記録用光導電層をアルカリ金属元素を0.0007原子ppm〜0.0035原子ppmの範囲で含有するアモルファスセレンとする。
【選択図】なし
Description
(上部電極)
上部電極としては金属薄膜が好ましく用いられる。材料としてはAu、Ni、Cr、Pt、Ti、Al、Cu、Pd、Ag、Mg、MgAg 3原子%〜20原子%合金、Mg-Ag系金属間化合物、MgCu 3原子%〜20原子%合金、Mg-Cu系金属間化合物などの金属から形成するようにすればよい。特に、AuやPt、Mg-Ag系金属間化合物が好ましく用いられる。例えばAuを用いた場合、厚さ15nm以上200nm以下であることが好ましく、より好ましくは30nm以上100nm以下である。例えばMgAg 3原子%〜20原子%合金を用いた場合、厚さ100nm以上400nm以下であることが好ましい。
電荷蓄積層は、蓄積したい極性の電荷に対して絶縁性を有する物質で構成され、As2S3、Sb2S3、ZnS、As2Se3、Sb2Se3等のカルコゲナイド系化合物や、アクリル系有機樹脂、ポリイミド、BCB、PVA、アクリル、ポリスチレン、ポリカーボネート、ポリエーテルイミド等の有機高分子や、その他酸化物やフッ化物等により構成される。更には、蓄積したい極性の電荷に対しては絶縁性であり、それと逆の極性の電荷に対しては導電性を有する方がより好ましく、移動度×寿命の積が、電荷の極性により3桁以上差があることが好ましい。
読取用光導電層は、電磁波、特に可視光を吸収し電荷を発生する光導電物質で構成され、a−Se、アモルファスSi、結晶Si、ZnO、ZnS、ZnSe、ZnTe、PbO、CdS、CdSe、CdTe、GaAs等のうち少なくとも1つを主成分とする化合物で、エネルギーギャップが0.7eV〜2.5eVの範囲に含まれる半導体物質から構成される。a−Seを主とする光導電物質を用いた場合、本明細書で開示したように電荷輸送性が高いLi, Na, K, Cs, Rb等のアルカリ金属を0.0007原子ppm〜0.0035原子ppmまでの間で微量にドープしたa−Se、またはLiF, NaF, KF, CsF, RbF等のフッ化物を0.01原子ppm〜1000原子ppmまでの間で微量にドープしたa−Se、またはGe、P、As、Sb等のIV族・V族元素を10原子ppm〜1原子%までの間で微量にドープしたa−Se、またはCl、Br、I等のハロゲン元素を原子1ppm〜100原子ppmの間で微量にドープしたa−Se等を用いることができる。特に、Asを10原子ppm〜200原子ppm程度含有させたa−Se、またはAsを0.2原子%〜1原子%程度含有させさらにClを5原子ppm〜100原子ppm含有させたa−Se、または本明細書で開示したように電荷輸送性が高い0.0007原子ppm〜0.0035原子ppm程度のNaを含有させたa−Se、または0.0007原子ppm〜0.0035原子ppm 程度のNaと0.1原子%〜0.5原子%のAsを含有させたa−Se、または1.95±0.02の配位数を有するa−Seが好ましく用いられる。
結晶化防止層としては、記録用光導電層と上部電極の間、あるいは読取用光導電層と下部電極層の間に敷設される。結晶化を防止する目的において、Asが1原子%〜20原子%の範囲でドープされたa−Se、またはS、Te、P、Sb、Geが1原子%〜10原子%の範囲でドープされたa−Se、または上記の元素と他の元素を組み合わせてドープしたa−Se、またはより結晶化温度の高いAs2S3やAs2Se3等を好ましく用いることができる。更に、電極層からの電荷注入を防止する目的で上記ドープ元素に加えて、特に正孔注入を防止するためにLi、Na、K、Rb、Cs等のアルカリ金属、またはLiF、NaF、KF、RbF、CsF、LiCl、NaCl、KCl、RbF、CsF、CsCl、CsBr等の分子を10原子ppm〜5000原子ppmの範囲でドープすることも好ましい。逆に電子注入を防止するために、Cl、I、Br等のハロゲン元素、またはIn2O3等を10原子ppm〜5000原子ppmの範囲でドープすることも好ましい。
電極界面層の厚みは、上記目的を十分果たすように0.05μmから1μm程度が好ましい。
上引き層および下引き層は、暗電流、リーク電流低減の観点から、整流特性を有することが好ましい。上部電極に正バイアスが印加される時にはホールブロック性を、負バイアスが印加される時には電子ブロック性を有することが好ましい。この上塗り層および下引き層の抵抗率は、10-8Ωcm以上であること、膜厚は、0.01μm〜10μmであることが好ましい。
下部電極は、信号取り出しのためにストライプ上に交互配置された櫛型電極構造を有しており、裏面より光を照射するため透明であることと、高電圧印加時の電界集中による破壊などを避けるため平坦性が必要であり、たとえばIZO、ITOが用いられる。下部電極の厚さと平坦性は例えばIZOにおいて、0.2μm、Ra=1nmであることが好ましい。
絶縁処理は電極面が全く大気に触れない構造にすることが必要であり、表面保護層は密着被覆する構造とする。また、表面保護層は印加電位を上回る絶縁破壊強度を有すること、さらに、放射線検出器の機能上、放射線透過を妨げない部材であることが必要である。従って、被覆性、絶縁破壊強度および放射線透過率の高い材料および製法として、絶縁性ポリマーの蒸着または溶剤塗布が好ましい。具体例としては、常温硬化型エポキシ樹脂、ポリカーボネート樹脂、ポリビニルブチラール樹脂、ポリビニルアルコール樹脂、アクリル樹脂、ポリパラキシレン誘導体をCVD法で成膜する方法等があげられる。この中でも常温硬化型エポキシ樹脂、ポリパラキシリレンをCVD法で成膜するが好ましく、特にポリパラキシリレン誘導体をCVD法で成膜する方法が好ましい。好ましい膜厚は10μm以上1000μm以下であり、さらには20μm以上100μm以下であることが好ましい。
2 記録用光導電層
3 電荷蓄積層
4 読取光導電層
5 下部電極
6,7 結晶化防止層
8 上引き層
9 下引き層
10 放射線検出器
15 隣接層
50 真空蒸着装置
52 蒸着容器
53 メッシュ状フィルタ
57 ヒータ
Claims (3)
- 記録用光導電層の両側に電極が設けられ、該電極間に所定のバイアス電圧を印加した状態で、放射線の照射を受けることにより前記記録用光導電層内部に発生した電荷を電気信号として検出する放射線検出器において、前記記録用光導電層がアルカリ金属元素を0.0007原子ppm〜0.0035原子ppmの範囲で含有するアモルファスセレンであることを特徴とする放射線検出器。
- 前記記録用光導電層がさらにAsを0.1原子%〜0.5原子%の範囲で含有することを特徴とする請求項1記載の放射線検出器。
- 前記記録用光導電層の少なくとも片側に隣接して、0.2μm〜2μm厚の、Asを2原子%〜14原子%の範囲で含有するアモルファスセレンからなる層を有することを特徴とする請求項1記載の放射線検出器。
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