JP2009275114A - 樹脂組成物及びそれを含む被膜形成材料 - Google Patents
樹脂組成物及びそれを含む被膜形成材料 Download PDFInfo
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- JP2009275114A JP2009275114A JP2008127620A JP2008127620A JP2009275114A JP 2009275114 A JP2009275114 A JP 2009275114A JP 2008127620 A JP2008127620 A JP 2008127620A JP 2008127620 A JP2008127620 A JP 2008127620A JP 2009275114 A JP2009275114 A JP 2009275114A
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Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
【解決手段】本発明の樹脂組成物は、(A)樹脂と、(B)無機及び/又は有機フィラーとを含む樹脂組成物であって、前記(A)樹脂の数平均分子量が22,000〜50,000である。また、数平均分子量が異なる(A)樹脂を2以上混合した溶剤を含む樹脂溶液に、(B)無機フィラー及び/又は有機フィラーが分散している。被膜形成材料は、上記樹脂組成物を含む。
【選択図】なし
Description
また、本発明は、前記(A)成分は、ポリイミド樹脂、ポリアミドイミド樹脂、ポリアミド樹脂から選択される少なくとも1種の樹脂のイソシアネート残基を、酸無水物基を有する3価以上のポリカルボン酸またはその誘導体で反応せしめて得られる樹脂である前記熱硬化性樹脂組成物に関する。
また、本発明は、前記(A)成分が、ポリカーボネート骨格を有することを特徴とする前記熱硬化性樹脂組成物に関する。
また本発明は、前記(C)を含む無機フィラー含有量が、前記(A)樹脂100重量部に対して、1〜5質量%であり、前記無機フィラー中に占めるシリカの含有率が5〜30質量%である前記熱硬化性樹脂組成物に関する。
また、本発明は、銅箔をポリイミド基材に積層したフレキシブルプリント基板の保護膜用である前記熱硬化性樹脂組成物に関する。
本発明の樹脂組成物は、(A)少なくとも1つの酸無水物基を有する樹脂、(B)エポキシ樹脂、(C)シリカを含む無機フィラーを必須成分として含有する。
(A)成分の少なくとも1つの酸無水物基を有する樹脂としては、ブタジエン構造やシリコーン構造を有するエポキシ樹脂、フェノール樹脂、アクリル樹脂、ポリウレタン、ポリブタジエン、水添加ポリブタジエン、ポリエステル、ポリカーボネート、ポリエーテル、ポリスルホン、ポリテトラフルオロ樹脂、ポリシリコーン、メラミン樹脂、ポリアミド、ポリアミドイミド、ポリイミド等の樹脂の主鎖及び/又は側鎖に酸無水物基を導入したものが挙げられる。これらは、単独又は2種類以上組み合わせて使用することができる。また、酸無水物基を有する樹脂と酸無水物を有さない樹脂を併用することもできる。
酸無水物基を導入する方法としては、ブタジエン構造やシリコーン構造を有するエポキシ樹脂、フェノール樹脂、アクリル樹脂、ポリウレタン、ポリブタジエン、水添加ポリブタジエン、ポリエステル、ポリカーボネート、ポリエーテル、ポリスルホン、ポリテトラフルオロ樹脂、ポリシリコーン、メラミン樹脂、ポリアミド、ポリアミドイミド、ポリイミド樹脂由来のエポキシ残基、イソシアネート残基、水酸基残基及びカルボキシル基等と下記一般式(I)及び/又は一般式(II)を反応させて得ることができる。
(式(I)中、Z1は有機基を表し、Wは、水酸基、イソシネート基、カルボキシル基、エポキシ基、グリシジル基を表す。)
(式(II)中、Z2は下記有機基を表す。Wは、水酸基、イソシネート基、カルボキシル基、エポキシ基、グリシジル基を表す。)
(式中、Y2は、式(V)で示される基:
である)で示されるテトラカルボン酸二無水物を使用することができる。これらは、単独で又は2種類以上を組み合わせて使用することができる。
(式中、複数個のRは、それぞれ独立に炭素数1〜18のアルキレン基であり、m及びnは、それぞれ独立に1〜20の整数である)
で示されるジイソシアネート類を用いることができる(以下、(b−1)化合物とする)。
(式中、Rは、独立に炭素数1〜18のアルキレン基であり、mは、1〜20の整数である)
で示されるカーボネートジオール類と、式(IX):
OCN−X−NCO (IX)
(式中、Xは、二価の有機基である)
で示されるジイソシアネート類を反応させることにより得られる。
a)数平均分子量(Mn)
Mn=Σ(NiMi)/Ni=ΣXiMi
(Xi=分子量Miの分子のモル分率=Ni/ΣNi)
b)重量平均分子量
Mw=Σ(NiMi 2)/ΣNiMi=ΣWiMi
(Wi=分子量Miの分子の重量分率=NiMi/ΣNiMi)
c)分子量分布(分散度)
分散度=Mw/Mn
(式中、R、X、m、nは上記で定義したとおりである)
で示される繰り返し単位を有するポリアミドイミド樹脂を得ることができる。
(式中、R、X、m、n、Y1は上記で定義したとおりである)
で示される繰り返し単位を有するポリアミドイミド樹脂を得ることができる。
(式中、R、X、m、n、Y2は上記で定義したとおりである)
で示される繰り返し単位を有するポリイミド樹脂を得ることができる。
本発明における(B)成分として用いられる無機フィラーは、ハイドロタルサイト及びシリカを含むものである。また、本発明の効果を損ねない程度にハイドロタルサイトやシリカ以外の無機フィラー及び/又は有機フィラーを加えることができる。
まず、ポリイミド樹脂は、(a)芳香族テトラカルボン酸二無水物と(b)芳香族ジアミン化合物とを反応させて得ることができる。
本発明の樹脂組成物は、(A)成分である樹脂を有機溶剤に溶解して樹脂溶液とし、(B)成分である無機微粒子及び/又は有機微粒子を分散させて製造することができる。
本発明の樹脂組成物は、上述した樹脂組成物を含み、各種電気製品や電子部品の被膜形成材料としてスクリーン印刷、ディスペンサ、スピンコートなどの塗布方法に好適に用いられる。特に、スクリーン印刷に好適に用いられる。
[高分子樹脂の合成]
攪拌機、油分分離機付冷却管、窒素導入管及び温度計を備えた3リットルの四つ口フラスコに、γ-ブチロラクトン61.72g、プラクセルCD−220(ダイセル化学工業株式会社製、1,6−ヘキサンジオール系ポリカーボネートジオールの商品名)74.64g(0.37モル)、4,4’−ジフェニルメタンジイソシアネート125.14g(0.46モル)トルエンジイソシアネート58.4g(0.34モル)を仕込み、150℃まで昇温した。150℃で4時間反応させた。
攪拌機、油分分離機付冷却管、窒素導入管及び温度計を備えた3リットルの四つ口フラスコに、γ-ブチロラクトン61.72g、1,6−ヘキサンジオール系ポリカーボネートジオール(ダイセル化学工業株式会社製、商品名「プラクセルCD−220」)74.64g(0.37モル)、4,4’−ジフェニルメタンジイソシアネート125.14g(0.46モル)トルエンジイソシアネート58.4g(0.34モル)を仕込み、150℃まで昇温し、150℃で4時間反応させた。
合成例1で得られた数平均分子量が38,000のポリカーボネート変性ポリアミドイミド樹脂溶液を混合し、樹脂分100重量部に対して、溶剤処理液を1重量部、消泡剤(A)(楠本化成工業株式会社製 商品名:ディスパロン230)0.1重量部、20℃で30分間攪拌した。更に、硫酸バリウム(堺化学工業株式会社製 商品名:B−31)を70重量部、ハイドロタルサイト(堺化学株式会社製 商品名:HT−P)20重量部、シリカ(日本アエロジル株式会社製 商品名:R−974)10重量部を予めビーズミルで分散したものを配合し、必要に応じてγ−ブチロラクトン等の溶剤を加えて20℃で1時間攪拌し、更に、アミン型エポキシ樹脂(東都化成株式会社製 商品名:YH−434L)を10重量部加え、20℃で1時間攪拌し、ポリカーボネート変性ポリアミドイミド樹脂組成物を得た。
実施例1においてハイドロタルサイトを30重量部にした以外は、実施例1と全く同様の操作を行いポリカーボネート変性ポリアミドイミド樹脂組成物を得た。
実施例1においてハイドロタルサイトを50重量部にした以外は、実施例1と全く同様の操作を行いポリカーボネート変性ポリアミドイミド樹脂組成物を得た。
実施例1においてシリカを20重量部にした以外は、実施例1と全く同様の操作を行いポリカーボネート変性ポリアミドイミド樹脂組成物を得た。
実施例1においてシリカを30重量部にした以外は、実施例1と全く同様の操作を行いポリカーボネート変性ポリアミドイミド樹脂組成物を得た。
実施例1においてハイドロタルサイトを配合しない以外は実施例1全く同様の操作を行いポリカーボネート変性ポリアミドイミド樹脂組成物を得た。
実施例1においてシリカを配合しない以外は実施例1全く同様の操作を行いポリカーボネート変性ポリアミドイミド樹脂組成物を得た。
実施例1においてシリカの代わりにタルク(日本タルク株式会社製 商品名:ST−200)を配合した以外は実施例1全く同様の操作を行いポリカーボネート変性ポリアミドイミド樹脂組成物を得た。
合成例2で得られた数平均分子量が38,000のポリカーボネート変性ポリアミドイミド樹脂溶液を混合し、樹脂分100重量部に対して、溶剤処理液を1重量部、消泡剤(A)(楠本化成工業株式会社製 商品名:ディスパロン230)0.1重量部、20℃で30分間攪拌した。更に、硫酸バリウム(堺化学工業株式会社製 商品名:B−31)を70重量部、ハイドロタルサイト(堺化学株式会社製 商品名:HT−P)20重量部を予めビーズミルで分散したものを配合し、必要に応じてγ−ブチロラクトン等の溶剤を加えて20℃で1時間攪拌し、更に、アミン型エポキシ樹脂(東都化成株式会社製 商品名:YH−434L)を10重量部加え、20℃で1時間攪拌し、ポリカーボネート変性ポリアミドイミド樹脂組成物を得た。
上記の実施例及び比較例で得られたポリカーボネート変性ポリアミドイミド樹脂組成物及びポリアミドイミド樹脂組成物のポリイミドフィルムとの張り付き特性を下記の方法で測定し、結果を表1に示した。
35μmの銅箔上に、得られたポリカーボネート変性ポリアミドイミド樹脂組成物を印刷機(ニューロング株式会社製 商品名:LS―34GX)とメッシュ版(株式会社ムラカミ製 150メッシュ)により、印刷速度100mm/secで30mm角を印刷し、印刷直後のレベリング性及び樹脂組成物の糸引きを目視で観察した。レベリングが良好で且つ糸引きがない場合を○、レベリングが若干悪く、糸引きもある場合を△、レベリング、糸引きが顕著にある場合を×とする。
印刷外観
35μmの銅箔上に、得られたポリカーボネート変性ポリアミドイミド樹脂組成物を印刷機(ニューロング株式会社製 商品名:LS―34GX)とメッシュ版(株式会社ムラカミ製 150メッシュ)により、印刷速度100mm/secで30mm角を印刷し、
印刷後の外観(泡跡、凝集物など)を100倍率の顕微鏡で観察した。泡跡、凝集物がない場合を○、若干ある場合を△、顕著にある場合を×とする。
ポリイミド基材上にライン幅15μm、スペース幅15μmでくし型状にスズメッキされた銅電極を覆うように、得られたポリカーボネート変性ポリアミドイミド樹脂組成物を印刷機(ニューロング株式会社製 商品名:LS−34GX)とメッシュ版(株式会社ムラカミ製 150メッシュ)で印刷速度100mm/secで印刷し、空気雰囲気下で120℃、60分加熱硬化してポリカーボネート変性ポリアミドイミド樹脂被膜付きポリイミド基材くし型電極を得た。得られたポリカーボネート変性ポリアミドイミド樹脂被膜付きポリイミド基材くし型電極を連続抵抗測定機(IMV株式会社製 商品名:Ion Migration Tester MIG−8600)と不飽和型プレッシャークッカ(株式会社平山製作所製 商品名:HAST PC−422R8D)を用いて温度120℃、湿度85%、印加電圧60V、印加時間100時間の条件で通電後の108Ω以上の抵抗の保持を確認する。評価は同条件で3回行ない、3回とも抵抗の保持が確認できれば良好である。
印刷後のポリカーボネート変性ポリアミドイミド樹脂組成物を空気環境下で120℃、60分で硬化させた試験片をリール状のポリイミドフィルムに挟み、巻き取った後500gの荷重をかけ、25℃で48時間放置する。所定時間放置した後の試験片をポリイミドフィルムから剥がれる荷重を測定する。フィルムから剥がれる荷重はゼロに近いほど良好である。
作製したポリカーボネート変性ポリアミドイミド樹脂組成物を25℃の温度下でE型粘度計の10rpmで粘度を測定する。測定後設定温度7℃の冷蔵庫内に保管し、1ヶ月後に同条件で粘度を測定し、下記に示す式で作製時からの増粘率を算出した。
増粘率=1ヶ月後の粘度/作製時の粘度
樹脂組成物中にハイドロタルサイト及びシリカを配合することで、高温高湿下において安定した電気特性を得ることができ、更に保存安定性が良好で、硬化後のポリイミドフィルムとの張り付き性を低減できる。しかし、過剰な配合量は消泡性、レベリング性の悪化など印刷外観上不具合を生じ、好ましくない。
Claims (5)
- (A)少なくとも1つの酸無水物基及び/又はカルボキシル基を有する樹脂、(B)ハイドロタルサイト及びシリカを含む無機フィラー及び(C)エポキシ樹脂、を含有する熱硬化性樹脂組成物。
- 前記(A)成分が、イソシアネート残基を、酸無水物基を有する3価以上のポリカルボン酸またはその誘導体で反応せしめて得られるイミド結合、アミドイミド結合、アミド樹脂から選択される少なくとも1種の結合を有する樹脂である請求項1又は2に記載の熱硬化性樹脂組成物。
- 前記(B)ハイドロタルサイト及びシリカを含む無機フィラー含有量が、前記(A)樹脂100重量部に対して、50〜100重量%であり、前記無機フィラー中に占めるハイドロタルサイトの含有率が20〜50質量%であり、更にシリカの含有率が10〜30質量%である請求項1から請求項3のうち、いずれか1項に記載の熱硬化性樹脂組成物。
- 銅箔をポリイミド基材に積層したフレキシブルプリント基板の保護膜用である請求項1〜4のいずれか一項に記載の熱硬化性樹脂組成物。
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