JP2009267071A5 - - Google Patents
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- Publication number
- JP2009267071A5 JP2009267071A5 JP2008114733A JP2008114733A JP2009267071A5 JP 2009267071 A5 JP2009267071 A5 JP 2009267071A5 JP 2008114733 A JP2008114733 A JP 2008114733A JP 2008114733 A JP2008114733 A JP 2008114733A JP 2009267071 A5 JP2009267071 A5 JP 2009267071A5
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- JP
- Japan
- Prior art keywords
- switching element
- control element
- semiconductor device
- island
- control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008114733A JP5132407B2 (ja) | 2008-04-25 | 2008-04-25 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008114733A JP5132407B2 (ja) | 2008-04-25 | 2008-04-25 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009267071A JP2009267071A (ja) | 2009-11-12 |
| JP2009267071A5 true JP2009267071A5 (enExample) | 2011-05-26 |
| JP5132407B2 JP5132407B2 (ja) | 2013-01-30 |
Family
ID=41392543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008114733A Active JP5132407B2 (ja) | 2008-04-25 | 2008-04-25 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5132407B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6227226B2 (ja) * | 2012-05-11 | 2017-11-08 | 株式会社デンソー | 半導体装置 |
| EP3460979B1 (en) * | 2016-07-01 | 2025-06-04 | Rohm Co., Ltd. | Semiconductor device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438063U (enExample) * | 1990-07-27 | 1992-03-31 | ||
| JP2704342B2 (ja) * | 1992-04-03 | 1998-01-26 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP3036256B2 (ja) * | 1992-10-06 | 2000-04-24 | 富士電機株式会社 | 半導体装置 |
| JP3685585B2 (ja) * | 1996-08-20 | 2005-08-17 | 三星電子株式会社 | 半導体のパッケージ構造 |
| KR100317648B1 (ko) * | 1998-08-26 | 2002-02-19 | 윤종용 | 절연접착테이프에의하여다이접착되는반도체소자및다이접착방법그리고그장치 |
| KR100335481B1 (ko) * | 1999-09-13 | 2002-05-04 | 김덕중 | 멀티 칩 패키지 구조의 전력소자 |
| JP3989417B2 (ja) * | 2003-07-28 | 2007-10-10 | シャープ株式会社 | 電源用デバイス |
-
2008
- 2008-04-25 JP JP2008114733A patent/JP5132407B2/ja active Active
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