JP2009251572A - Substrate for multiple exposure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for multiple exposure which supplies an exposure substrate to a proximity exposure device exposing the exposure substrate using a plurality of exposure masks smaller in area than that of an exposure region of the exposure substrate , the exposure mask facing the exposure substrate. <P>SOLUTION: This substrate for multiple exposure supplies an exposure substrate to the proximity exposure device exposing the exposure substrate using the plurality of exposure masks smaller in area than that of the exposure region of the exposure substrate, the exposure mask facing the exposure substrate. The substrate for multiple exposure has a plurality of active regions and a plurality of inactive regions, where the dimension of each inactive region is integer multiple of the pixel pitch of the active region. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure substrate supplied to a proximity exposure apparatus, and more particularly, suitable for performing exposure while scanning the exposure surface of an exposure substrate using an exposure mask smaller than the exposure area of the exposure substrate. Further, the present invention relates to a multi-surface exposure substrate.

  A substrate of a liquid crystal display device (for example, a color filter substrate) is a plurality of active areas (hereinafter simply referred to as “color display areas”) formed by exposure on a single multi-surface exposure substrate as shown in FIG. And the color display area are obtained by dividing the color display area from an area where there are no red, blue, and green colored pixels (hereinafter simply referred to as “inactive area”).

The exposure apparatus used for the exposure includes (1) a system that performs batch exposure using an exposure mask having the same size as the exposure substrate (Patent Document 1), and (2) the color display region. There is a system in which one region is sequentially exposed with a step movement relative to a multi-sided exposure substrate using an equivalent exposure mask (Patent Document 2).
Further, in order to cope with the recent increase in the size of a multi-sided exposure substrate, (3) an exposure method in which an exposure mask smaller than the exposure area of the exposure substrate is exposed while continuously moving relative to the multi-sided exposure substrate. A thing (patent document 3) is also used.
JP 07-201711 A JP 2003-270795 A JP 2006-292955 A

However, in the methods (1) and (2), it is necessary to use an exposure mask that matches the inactive area and the inactive area of the multi-planar exposure substrate, and the respective positions of the inactive area and the inactive area are used. There has been a problem that the entire exposure mask has to be replaced for each multi-cavity exposure substrate having a different ratio.
On the other hand, in the method (3), exposure is performed while continuously moving the exposure mask relative to the multi-planar exposure substrate. Red, blue, and green colored pixels are arranged in a staggered manner. In addition to the above, in order to improve the flatness of the color filter formed by exposure, the exposure pattern of the exposure mask has a shape as shown in FIG. As the exposure light, a flash lamp that performs intermittent irradiation is used in accordance with the movement of the multi-surface exposure substrate.

  However, in the method (3), since the color display area and the inactive area continuously pass below the exposure mask, the exposure mask crosses the color display area and the inactive area. It is necessary to operate a shutter provided on the exposure mask so that the portion corresponding to the inactive area of the exposure mask is shielded from light and the other portions are not shielded.

However, as shown in FIG. 10, when the exposure mask straddles the color display area and the inactive area, the position of the pixel portion of the color display area following the inactive area and the exposure of the exposure mask corresponding thereto. There is a problem that the positions of the patterns do not match and the exposure timing is shifted.

Further, as shown in FIG. 10, an exposure mask smaller than the exposure area of the exposure substrate along a direction perpendicular to the moving direction of the multi-face exposure substrate (the direction of arrow A in FIG. 2) (the same in each drawing). In order to form a group of exposure masks, it is necessary to prepare a dedicated exposure mask corresponding to the position and width of the inactive area.

  In order to solve the above problems, the present invention is a multi-sided exposure substrate that is supplied to an exposure apparatus that exposes an exposure substrate using an exposure mask having an area smaller than the area of the exposure region of the exposure substrate. The multi-surface exposure substrate has a plurality of active regions and a plurality of inactive regions, and the size of each inactive region is an integral multiple of the pixel pitch of the active region.

The present invention has the following excellent effects.
According to the first and second aspects of the present invention, the width of the plurality of inactive regions between the plurality of active regions and the active region in the direction perpendicular to the transport direction of the multi-planar exposure substrate is the pixel of the active region. Since the dimension is an integral multiple of the pitch, when the exposure mask straddles the color display area and the inactive area, the position of the pixel portion of the color display area following the inactive area corresponds to this position. Since the position of the exposure pattern of the exposure mask matches, even if the exposure light is intermittently irradiated while passing under the exposure mask at a constant speed, the exposure position and timing are shifted. Exposure can be performed.

Further, it is not necessary to prepare a dedicated exposure mask having a light-shielding portion in which the exposure mask arranged along the direction perpendicular to the conveyance direction of the multi-face exposure substrate is matched to the width of the inactive region. The exposure of the inactive area can be easily prevented by simply mounting and fixing the light shielding plate on the portion of the exposure pattern corresponding to the width of the inactive area of the exposure mask corresponding to the active area.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view showing a multi-planar exposure substrate 1 according to an embodiment of the present invention.
FIG. 2 is a schematic view showing a proximity exposure apparatus 10 using the multi-planar exposure substrate 1 according to an embodiment of the present invention, and schematically shows the concept of the configuration of the main part. .
A multi-sided exposure substrate (hereinafter simply referred to as “work”) 1 is a color filter substrate used in a liquid crystal display device, and is a black matrix formed of an opaque film made of chromium or the like on one surface of a transparent glass substrate 2. (Hereinafter simply referred to as “BM”) 3 and a large number of planned pixel portions (hereinafter simply referred to as “pixels”) 4 provided in the BM 3 in a substantially grid pattern (the aspect ratio of the grid is not 1) 4 A plurality of color display areas 5 and inactive areas 6X and 6Y (also BM portions) between the color display areas 5 and the color display areas 5, and a photosensitive resin on the upper surface. (Hereinafter simply referred to as “resist”).

The width Lx of the inactive area 6X is equal to an integral multiple of the pitch Px in the X-axis direction of the pixels 4 in the color display area 5, and the width 6Ly of the inactive area 6Y is equal to the pixels in the color display area 5. 4 equal to an integral multiple of the pitch Py in the Y-axis direction.

Further, marks 7 and 8 are attached to the work 1 on the outer side of the color display area 5 and in front of the conveying direction of the work 1 (the direction of arrow A in FIG. 1). These marks 7 and 8 are for detecting an angle α formed by a workpiece 1 and a line sensor 22A described later.

The proximity exposure apparatus 10 is provided above the workpiece 1, an exposure unit 11 that irradiates the workpiece 1 with ultraviolet rays, and a stage unit 18 that places the workpiece 1 and continuously moves it in the direction of arrow A in FIG. 2. And an imaging means 22 and a control device 23 for controlling them.

The exposure unit 11 includes an exposure light source 12, an optical system 13, and an exposure mask unit 14.
The exposure light source 12 emits exposure light intermittently. Specifically, the exposure light source 12 is a flash lamp that emits ultraviolet light intermittently, and is connected to the control unit 28 via a lamp control unit 24 described later. Has been.
The lamp control unit 24 receives the signal from the control unit 28 and operates the exposure light source 12.
The operation timing of the exposure light source 12 (flash timing of the flash lamp) is 1 pitch of the pixels 4 (Px in FIG. 1, but colored) when the work 1 passes below the exposure mask unit 14 as described later. When the pixels are arranged in a staggered pattern, the control unit 28 controls the light emission so that the light is emitted every three pitches of Px.

The optical system 13 is disposed between the exposure light source 12 and the exposure mask unit 14, and deflects light emitted from the exposure light source 12 into substantially parallel light and irradiates the exposure mask 15. is there.

The exposure mask unit 14 includes a plurality of exposure masks 15 (FIG. 10) and a shutter unit 16 that can shield a part of the exposure mask 15.
As shown in FIG. 2, the exposure mask unit 14 enables exposure while moving the workpiece 1 in a predetermined direction (the direction of arrow A in FIG. 2). The exposure mask 15 is a transparent substrate as shown in FIG. 15a, a light shielding film 15b, and a plurality of light transmitting holes (hereinafter simply referred to as “exposure pattern”) 15c.
The transparent substrate 15a is a transparent glass substrate that transmits ultraviolet rays and visible light with high efficiency, and is made of, for example, quartz glass. A light shielding film 15b is formed on one surface of the transparent substrate 15a.

The light shielding film 15b shields exposure light and is formed of an opaque thin film of, for example, chromium (Cr), and a plurality of exposure patterns 15c are formed and arranged in a matrix on the light shielding film 15b.
The light emitted from the exposure light source 12 is irradiated onto the pixel 4 on the work 1 below the exposure mask unit 14 through the exposure pattern 15c, and the shape of the exposure pattern 15c is transferred to the work 1. is there.

The exposure pattern 15c of the exposure mask 15 is arranged at intervals of 3 pitches of pixels 4 (which will be described later) p3x (a pitch 3 times Py in FIG. 1) p15x in a direction perpendicular to the conveyance direction A of the workpiece 1. In the direction parallel to the conveyance direction (a) of the multi-face exposure substrate 1, the pixels are arranged in three rows (15c1, 15c2, 15c3) at the same pitch interval (Px in FIG. 1) p15y as the pixels 4.
Note that the number of exposure patterns 15c arranged in a direction parallel to the conveying direction of the workpiece 1 is the optimum number of columns depending on the exposure characteristics of the resist film, the number of flashes of the exposure light source 12 per exposure pattern, the intensity of flash light, and the like. Is different.

The exposure mask 15 is arranged in close proximity to and in the arrangement as shown in FIG. 10 above the work 1 conveyed with the surface on which the light shielding film 15b is formed facing down. As shown in FIG. 5, the position and orientation of the exposure mask 15 on each axis of the X axis, Y axis, Z axis, and θ axis (rotation around the center of the XY plane of the exposure mask 15) (around the center of the XY plane of the exposure mask 15) The rotation angle) can be controlled.
A light shielding plate W0 is attached to the exposure mask 15 corresponding to the inactive area 6X in accordance with the width Ly of the inactive area 6Y.
The mask driving means 17 is connected to the control device 23, and receives the signal from the control unit 28 to control the position and posture of the exposure mask 15 as will be described later.
Hereinafter, the rotation angle around the center of the XY plane of the exposure mask 15 is simply referred to as “mask posture”.

As shown in FIG. 4, the shutter portion 16 is composed of light shielding plates W1, W2, and W3. The shutter portion 16 is close to the upper side of the exposure mask 15, and as shown in FIG. ) It is provided at a position on the near side (downstream from the line sensor 22A of the image pickup means 22 by a distance L1 in the conveying direction of the workpiece 1), and the light shielding plates W1, W2, and W3 are arranged in the direction of the arrow B (arrow ) And the direction of c (the direction opposite to the arrow b) is moved by the shutter driving means. In the direction of arrow C, the shutter can be quickly returned by the shutter driving means.
The light shielding width is adjusted by moving the light shielding plates W1, W2, and W3 in the direction indicated by the arrow B in FIG. Are sequentially shielded from light.
The number of light shielding plates W1, W2, and W3 is not limited to this, and the number is changed depending on the number of exposure patterns 15c in the X-axis direction of the exposure mask 15 and the width Lx of the inactive region 6X.

The shutter driving means is connected to the control device 23 and receives a signal from the control unit 28 as will be described later, and sequentially displays the light shielding plates W1, W2, and W3 in accordance with the conveyance speed V of the workpiece 1. 4 (a) to (h), and after (h), the light shielding plates W1, W2, and W3 quickly return to the position (a) again, and (a) to (h) ) Is repeated.
The respective widths of the light shielding plates W1, W2, and W3 can cover each column of the exposure pattern 15c of the exposure mask 15 as shown in FIG. 4D, and the light shielding plates W1, W2, and W3 are covered. In the state where all of the above are spread, the exposure pattern 15c of the exposure mask 15 is all shielded from light.

The stage unit 18 is disposed below the exposure unit 11 and includes a stage 19, an imaging unit 22, and a transport unit 21.
The stage 19 has a number of ejection holes (not shown) for ejecting gas on the upper surface and a number of suction ports (not shown) for sucking gas, and is connected to a compressed gas supply device and a gas suction device (not shown). The work 1 is floated on the stage 19 due to the balance between gas ejection and suction, and a portion facing the exposure mask 15 is opened. The opening portion 20 is formed by the exposure mask 15. An image pickup means 22 for picking up an image of the work 1 from the lower side at a position on the near side of the exposure position is provided toward the work 1.

The transport means 21 can transport the work 1 on the stage 19 in the direction of arrow A in a state where a part of the work 1 (one of the edges parallel to the transport direction of the work 1) is gripped by a grip means (not shown). Further, an exposure substrate position sensor (not shown) for detecting the position of the workpiece 1 on the stage 19 in the X-axis direction is provided.

Further, as shown in FIG. 6, the image pickup means 22 is provided on a line sensor 22A in which a large number of light receiving elements 22a are arranged in a line in a direction perpendicular to the transport direction A, and on a straight line parallel to the line sensor. Two photosensors 22b1 and 22b2 are provided, the workpiece 1 is imaged from below, the marks 7 and 8 are imaged by the photosensors 22b1 and 22b2, and the line sensor 22A as shown in FIG. In FIG. 4, the line 4A1 of the pixel 4 (downstream side in the transport direction of the work 1 (left side in FIG. 1)), 4A2 (upstream side in the transport direction of the work 1 (right side in FIG. 1)) and the line 4B are imaged. It is.

The line sensor 22A is arranged so that a predetermined light receiving element 22a1 among the many light receiving elements 22a arranged in a line corresponds to the position of the line 15b of the exposure pattern 15c of the exposure mask 15 in the Y-axis direction. Has been. (Fig. 7)
Further, the line sensor 22A is disposed upstream of the workpiece 1 in the transport direction in parallel with a distance L in the X-axis direction from the exposure mask 15 at the time of initial setting (before the exposure operation is started). This distance L is the distance between the center of the line sensor 22A in the Y-axis direction and the center position of the exposure pattern 15c1 of the exposure mask 15 in the X-axis direction. (Figs. 5 and 8)
Note that L1 and L have a relationship of L> L1.

  The control device 23 includes a lamp control unit 24 that drives the exposure light source 12, a mask control unit 25 that controls the mask drive unit 17, a transport controller unit 26 that controls the transport unit 21, an image processing unit 27, and the like. It is comprised from the control part 28 connected to and controlling. The exposure unit position sensor and external input means 29 are connected to the control unit 28.

  The image processing unit 27 receives the image data of the marks 7 and 8 imaged by the photosensors 22b1 and 22b2 of the image pickup unit 22, and the image data of the pixel 4 of the work 1 imaged by the line sensor 22A, and then receives the image data. By processing the image data, the edges 7A and 8A and the lines 4A1, 4A2, and 4B of the marks 7 and 8 on the downstream side in the transport direction of the workpiece 1 are detected.

The control unit 28 calculates the difference between the detection times of the edges 7A and 8A based on the data of the respective edges 8A and 9A detected by the image processing unit 27, and the workpiece 1 input to the control unit 22 in advance. 9, the angle α formed by the line (parallel to the Y axis) connecting the edges 7A and 8A with respect to the line sensor 22A is calculated, as shown in FIG.
Since the angle α is also an angle formed between the workpiece 1 and the exposure mask 5 at the time of the initial setting, if the angle α is not within a predetermined range (α1), the control unit 28 A control signal is sent to the mask control unit 25 so that the posture of the exposure mask 15 is controlled so that the angle formed by the workpiece 1 and the exposure mask 5 is within α1.

The control unit 28 calculates the time required for the work 1 to be transported the distance L after the line 4A1 is detected by the image processing unit 27. After the obtained time (T0), the control unit 28 performs control. A signal for light emission of the flash lamp 12 is sent from the unit 28 to the lamp control unit 24.

Further, the control unit 28 determines whether or not the line 4A2 detected by the image processing unit 27 is a boundary with the inactive region 6X (hereinafter referred to as “specific line 4A2”).
In addition, the line sensor 22A is newly determined even after a predetermined time (time when the workpiece 1 passes through the width of the BM 3 in the conveyance direction of the workpiece 1 between the pixels 4) after the detection of the line 4A2. Judgment is made based on whether or not the correct line 4A1 is detected. That is, when the new line 4A1 is not detected after the predetermined time has elapsed, it is determined that the detected line 4A2 is the specific line 4A2.

Then, the control unit 28 calculates the time (T1) required for the workpiece 1 to move the distance L1 from the conveyance speed V of the workpiece 1 and the distance L1, and after the line sensor 22A detects the specific line 4A2. After T1 time, a signal for sequentially moving the light shielding plates W1, W2, W3 of the shutter unit 16 in the direction of the arrow B from (a) to (h) in FIG. To be sent to.
Further, after the specific line 4A2 is detected by the line sensor 22A, and after the new specific line 4A1 is detected, the light shielding plates W1, W2, and W3 of the shutter unit 16 are integrated with each other within the time T1 as shown in FIG. A signal for quickly returning to the position of the state (a) (same as the position of L1 in FIG. 5) in the direction of arrow C is sent to the shutter driving means.

The rapid return speed is a speed at which the light shielding plates W1, W2, and W3 traverse the exposure light flux in the direction of B and do not hinder the exposure of the work 1 during the exposure operation.
The rapid return speed includes the weights of the respective light shielding plates W1, W2, and W3, the workpiece V conveying speed V, the exposure light intensity, the number of exposure light flashes per exposure pattern, and the photosensitive characteristics of the workpiece 1 resist. Etc., the optimum speed differs.

Next, the exposure operation of the proximity exposure apparatus configured as described above will be described with reference to FIGS.
First, in Step 1 (ST1), after the light shielding plate W0 is attached to the portion of the exposure pattern 15c of the exposure mask 15 corresponding to the X-axis direction position of the inactive region 6, the exposure condition (exposure light) is applied from the external input means 29. Intensity, the number of flashes for the exposure pattern 15c, the conveyance speed V of the work 1, the width 6y of the inactive area 6), the values of L and L1, and the allowable angle α1 of the angle α are input to the controller 28. Thereafter, the workpiece 1 is set at a predetermined position of the stage unit 18 along the conveyance direction (the direction of arrow A).

Next, in step 2 (ST2), the workpiece 1 is continuously conveyed at a predetermined speed V in the direction of the arrow A in FIG. The lines 4A1, 4B, and 4A2 of the marks 7 and 8 and the pixel 4 are imaged, and these imaged data are transmitted to the image processing unit 27.

Next, in step 3 (ST3), the imaging data is binarized by the image processing unit 27, and the edges 7A and 8A and the lines 4A1, 4B, and 4A2 are detected. The angle α of the workpiece 1 is calculated from the position data of the workpiece 1 from the exposure substrate position sensor and the detection positions of the edges 7A and 8A, and the result is compared with the preset allowable angle α1. At the same time, it is determined whether or not the light receiving element 22a that has detected the line 4B is the expected light receiving element 22a1.

When the angle α of the workpiece 1 is not within the allowable range, a signal is sent from the control unit 28 to the mask driving means 17 so that the angle α of the workpiece 1 and the mask posture of the exposure mask 15 are controlled to coincide with each other. The If the light receiving element 22a that has detected the line 4B is not the intended light receiving element 22a1, the distance between the light receiving element 22a that has detected the line 4B and the light receiving element 22a1 is calculated from the number of light receiving elements 12a existing between the two. Then, a signal based on the result is transmitted to the mask driving means 17, and the exposure mask 15 is moved in the Y-axis direction.

Next, in step 4 (ST4), at time T0 after detection of the line 4A1, a light emission signal is transmitted from the control unit 28 to the lamp control unit 24 of the exposure light source 12, and the flash lamp of the exposure light source 12 is flashed. The flash is repeated for each pitch of the pixels 4 of the work 1.

Next, in step 5 (ST5), after the specific line 4A2 is detected by the line sensor 22A, a signal is transmitted from the control unit 28 to the shutter driving means after the time T1, and each light shielding plate of the shutter unit 16 is transmitted. W1, W2, and W3 are sequentially moved as shown in (a) to (h) of FIG.
Note that the flash lamp of the exposure light source 12 is repeatedly flashed for each pitch of the pixels 4 of the work 1 regardless of the movement of the light shielding plates W1, W2, and W3 of the shutter unit 16.

Next, in step 6 (ST6), after a new specific line 4A1 is detected by the line sensor 22A, after time T1, a signal is transmitted from the control unit 28 to the shutter driving means, and each light shielding of the shutter unit 16 is performed. The plates W1, W2, and W3 are quickly returned to the position shown in FIG.

Thereafter, Step 2 (ST2) to Step 6 (ST6) are repeated, and after the exposure target area of the workpiece 1 is completely exposed, the exposure operation is completed.

In the above embodiment, the multiple exposure substrate according to the present invention has been described with respect to the proximity exposure apparatus. However, the multiple exposure exposure substrate according to the present invention can also be used for a projection exposure apparatus.
In the above embodiment, an ultraviolet flash lamp is used as the exposure light source, but a laser oscillator capable of emitting laser light in the ultraviolet region may be used.
Furthermore, although the marks 7 and 8 are attached to the multi-surface exposure substrate, the marks 7 and 8 may not be attached. In this case, the line 4A is formed by the photosensors 22b1 and 22b2 or the line sensor 22A. Based on the captured image data, the angle α of the workpiece 1 may be calculated and the mask posture may be controlled as described above.

It is a top view which shows the board | substrate for multi-cavity exposure (work) of one embodiment of this invention. It is a schematic diagram which shows the structure of the proximity exposure apparatus which supplies the workpiece | work of one embodiment of this invention. 3A and 3B are schematic views showing an exposure mask of the proximity exposure apparatus of FIG. 2, wherein FIG. 3A is a plan view, FIG. 2B is a side view, and FIG. 3C is a bird's-eye view for explaining the posture of the exposure mask. It is a conceptual diagram for demonstrating the movement of a shutter part, and the positional relationship of an exposure mask and a workpiece | work. It is the schematic for demonstrating the positional relationship of an imaging means, a shutter part, and an exposure mask of the X-axis direction. It is the schematic which shows an imaging means. It is a conceptual diagram for demonstrating the relationship between a line sensor and an exposure mask. It is a conceptual diagram for demonstrating the positional relationship of the Y-axis direction of a line sensor and a workpiece | work. It is a conceptual diagram for demonstrating the angle which a line sensor and a workpiece | work make. It is the schematic for demonstrating the case where an exposure mask is arrange | positioned ranging over the non-light-shielding area | region of a workpiece | work. It is a conceptual diagram for demonstrating the problem in case an exposure mask moves relatively across the non-light-shielding area | region of a workpiece | work. 3 is a flow for explaining an exposure method for exposing a workpiece according to an embodiment of the present invention with the proximity exposure apparatus of FIG.

Explanation of symbols

1 Multi-sided exposure substrate (work)
3 Black matrix 4 Pixel 5 Active area (color display area)
6 Inactive area 7 Mark 8 Mark 10 Proximity exposure device 11 Exposure unit 12 Exposure light source 13 Optical system 15 Exposure mask 16 Shutter unit 18 Stage unit 22 Imaging unit 22A Line sensor 22a Light receiving element 27 Image processing unit 28 Control units W0 to W3 Shading plate

Claims (2)

  A multi-sided exposure substrate that is supplied to an exposure apparatus that exposes an exposure substrate using an exposure mask having an area smaller than the area of the exposure region of the exposure substrate, wherein the multi-sided exposure substrate includes a plurality of active regions and A multi-sided exposure substrate having a plurality of inactive areas, wherein the dimensions of each inactive area are an integral multiple of the pixel pitch of the active area A multi-sided exposure substrate that is supplied to a proximity exposure apparatus that exposes an exposure substrate using an exposure mask having an area smaller than an exposure area of the exposure substrate, the multi-sided exposure substrate comprising a plurality of active regions And a plurality of non-active areas, and the dimensions of each non-active area are integer multiples of the pixel pitch of the active area.