JP2009246334A5 - - Google Patents
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- Publication number
- JP2009246334A5 JP2009246334A5 JP2008304642A JP2008304642A JP2009246334A5 JP 2009246334 A5 JP2009246334 A5 JP 2009246334A5 JP 2008304642 A JP2008304642 A JP 2008304642A JP 2008304642 A JP2008304642 A JP 2008304642A JP 2009246334 A5 JP2009246334 A5 JP 2009246334A5
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- resin composition
- alkoxide
- light reflection
- alumina
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 6
- 229920001187 thermosetting polymer Polymers 0.000 claims 5
- 239000002245 particle Substances 0.000 claims 4
- 239000011342 resin composition Substances 0.000 claims 4
- 150000004703 alkoxides Chemical class 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- -1 silane alkoxide Chemical class 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 229910052809 inorganic oxide Inorganic materials 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008304642A JP2009246334A (ja) | 2008-03-12 | 2008-11-28 | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008062574 | 2008-03-12 | ||
| JP2008304642A JP2009246334A (ja) | 2008-03-12 | 2008-11-28 | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009246334A JP2009246334A (ja) | 2009-10-22 |
| JP2009246334A5 true JP2009246334A5 (enExample) | 2011-12-01 |
Family
ID=41307872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008304642A Pending JP2009246334A (ja) | 2008-03-12 | 2008-11-28 | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009246334A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011159767A (ja) | 2010-01-29 | 2011-08-18 | Toshiba Corp | Ｌｅｄパッケージ及びその製造方法 |
| JP5879739B2 (ja) * | 2010-04-28 | 2016-03-08 | 三菱化学株式会社 | 半導体発光装置用パッケージ及び発光装置 |
| JP2012049519A (ja) * | 2010-07-26 | 2012-03-08 | Mitsubishi Chemicals Corp | 半導体発光装置用パッケージ及び発光装置 |
| JP5682257B2 (ja) * | 2010-07-30 | 2015-03-11 | 三菱化学株式会社 | 半導体発光装置用樹脂組成物 |
| JP5792375B2 (ja) * | 2011-05-19 | 2015-10-14 | 晶能光電（江西）有限公司Ｌａｔｔｉｃｅ Ｐｏｗｅｒ（Ｊｉａｎｇｘｉ）Ｃｏｒｐｏｒａｔｉｏｎ | 窒化ガリウムベースフィルムチップの生産方法および製造方法 |
| JP7256382B2 (ja) * | 2019-04-26 | 2023-04-12 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2947072B2 (ja) * | 1994-05-25 | 1999-09-13 | 信越化学工業株式会社 | 表面処理アルミナの製造方法 |
| JP5060707B2 (ja) * | 2004-11-10 | 2012-10-31 | 日立化成工業株式会社 | 光反射用熱硬化性樹脂組成物 |
| JP2007297601A (ja) * | 2006-04-06 | 2007-11-15 | Hitachi Chem Co Ltd | 光反射用熱硬化性樹脂組成物、これを用いた光半導体素子搭載用基板とその製造方法および光半導体装置 |
-
2008
- 2008-11-28 JP JP2008304642A patent/JP2009246334A/ja active Pending
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