JP2009230955A - Manufacturing method of organic electroluminescent element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an organic EL element having an organic layer and a pattern-like insulating layer formed between electrodes, wherein patterning of the insulating layer is easy, and there is no risk of exerting a bad influence on the organic layer when forming the insulating layer. <P>SOLUTION: A positive electrode substrate 11 in which an organic layer 13 containing a positive electrode 3 and a luminescent layer 5, and a negative electrode substrate 8 in which a negative electrode 7 is formed are prepared, the pattern-like insulating layer 6 is provided by transferring the transfer layer of an insulating layer transfer film to the surface of the organic layer 13 of the positive electrode substrate 11, and the negative electrode substrate 11 on which the pattern-like insulating layer 6 is formed is pasted to the negative electrode substrate 12 to manufacture the organic EL element 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an organic electroluminescent element in which an organic light emitting layer is sandwiched between a pair of electrodes by bonding a cathode substrate and an anode substrate.

  In an organic electroluminescence element (hereinafter referred to as an organic EL element), a thin film (light emitting layer) containing a light emitting organic material is sandwiched between a cathode substrate provided with a cathode and an anode substrate provided with an anode. Have a structure. In an organic EL element, when a low voltage is applied between both electrodes and a current flows, holes are injected from the anode into the light emitting layer and electrons are injected from the cathode, and the holes and electrons are regenerated inside the light emitting layer. It is a self-luminous element that utilizes light (fluorescence, phosphorescence, etc.) that is emitted when it is coupled to an excited state and returns to the ground state.

  As a means for causing the light emitting surface of the organic EL element to emit light in a predetermined pattern, for example, an insulating layer is inserted between the electrodes where it is not desired to emit light, and carrier injection and carrier recombination from the electrodes are impossible due to the insulating layer In addition, an organic EL element in which a portion of the insulating layer is a non-light emitting portion and a portion where no insulating layer is provided is a light emitting portion is known (see Patent Document 1). In Patent Document 1, as a means for forming an insulating layer in a pattern, a pattern is formed by a photolithography technique using an insulating photoresist, and a pattern-like insulation is formed by a thin film forming method such as vacuum deposition, sputtering, or coating. The formation of a layer is described.

  Also, as a means for forming the insulating layer in a pattern, after the insulating layer is formed on the entire surface of the electrode layer, the composition of the light emitting layer is applied to the surface of the insulating layer in a predetermined pattern using an inkjet device. A so-called self-alignment method is known in which a light emitting layer is formed in a predetermined pattern by mixing an insulating layer and a light emitting layer at a portion where the light emitting layer is applied.

  Further, as a means for forming the insulating layer in a pattern, the insulating layer is formed in a predetermined pattern directly on the surface of an organic layer such as a light emitting layer provided on the electrode by a printing method such as screen printing or gravure printing. Printing methods are known.

Japanese Patent Laid-Open No. 10-270173

  The method of forming an insulating layer in a predetermined pattern using the photolithography method described in Patent Document 1 described above is capable of high-definition patterning, but has a problem that it requires a lot of processing steps and is very troublesome. In addition, when a glass plate is used for the substrate of the organic EL element, processing is possible, but when a resin film is used as the substrate, there is a problem that it is difficult to form an accurate pattern because it is easily deformed. .

  Further, the method of forming the insulating layer in a pattern by the self-alignment method has a problem that the components of the insulating layer are easily mixed in the light emitting layer, and the light emission characteristics are likely to be deteriorated.

  In addition, the method of forming the insulating layer in a pattern by a printing method is included in the insulating layer composition because the insulating layer composition containing an organic solvent is applied to the surface of the organic layer when forming the insulating layer. There is a problem that the organic material layer is altered or deformed by the solvent used, or the organic material layer is thermally deteriorated or deformed by heat during drying.

  The problem to be solved by the present invention is to solve the above-mentioned problems, and in the method of manufacturing an organic EL element in which the insulating layer is formed in a predetermined pattern, the patterning of the insulating layer is easy and the insulating layer is insulated. An object of the present invention is to provide a method for producing an organic EL element, which does not have an adverse effect on an organic layer such as a light emitting layer when forming a layer.

  In order to solve the above-described problems, an organic EL device manufacturing method according to the present invention includes an organic material layer including at least a light-emitting layer and a patterned insulating layer formed in the shape of a non-light-emitting portion between a cathode and an anode. As described above, an organic electroluminescence device in which the light emitting layer emits light in a predetermined light emission pattern excluding a non-light emitting portion is manufactured by bonding an anode substrate on which an anode is formed and a cathode substrate on which a cathode is formed. A method of preparing a first substrate on which the organic layer and one electrode are formed, and a second substrate on which the other electrode is formed, and preparing the first substrate or the second substrate The gist of the present invention is to include an insulating layer forming step of providing the patterned insulating layer on a substrate by transfer, and a bonding step of bonding the first substrate and the second substrate together.

  In the manufacturing method, the insulating layer forming step includes providing the patterned insulating layer on an anode substrate on which an anode and an organic material layer are formed, or providing the patterned insulating layer on a cathode substrate on which a cathode is formed. preferable.

  In the manufacturing method, the insulating layer forming step preferably transfers the patterned insulating layer using an insulating layer transfer film in which the patterned insulating layer is provided as a transfer layer on a transfer substrate.

  In the above manufacturing method, it is preferable that the insulating layer transfer film is formed by punching and removing the shape of the light emitting portion to form the patterned insulating layer in the shape of a predetermined non-light emitting portion.

  According to the method of manufacturing an organic EL element according to the present invention, a first substrate on which the organic layer and one electrode are formed, and a second substrate on which the other electrode is formed are prepared, An insulating layer forming step of transferring the patterned insulating layer on the first substrate or the second substrate by transfer, and a bonding step of bonding the first substrate and the second substrate together. Therefore, the patterning of the insulating layer is easy at the time of manufacturing the organic EL element, and there is no possibility of adversely affecting the organic layer such as the light emitting layer when forming the insulating layer. An organic EL element can be manufactured by a simple operation by simply bonding the two.

  In the conventional method of forming an insulating layer in a pattern by a photolithography method, a high-definition pattern can be formed. However, an electrode substrate (an anode substrate and a cathode for forming an electrode of an organic EL element) can be formed. It was necessary to use a hard material such as a glass substrate for the base material. For this reason, it is impossible to use an easily deformable material such as a resin film as the electrode base material. On the other hand, according to the present invention, it is possible to pattern the patterned insulating layer into a predetermined shape using a flexible material such as a resin film for the electrode substrate, and the flexible film-shaped organic EL The device can be easily manufactured.

  Further, in a method in which an insulating layer is formed over the entire surface as in the conventional self-alignment method, a light emitting layer is formed in a predetermined pattern by an ink jet method or the like, and the insulating layer is formed in a pattern, the insulating layer is formed in the light emitting layer. These components are easily mixed, and when the components of the insulating layer are mixed, the light emitting characteristics of the light emitting layer are deteriorated. On the other hand, according to the method of the present invention, since the insulating layer is formed and formed on the surface of the transfer substrate of the transfer film, there is no possibility that the insulating layer is mixed into the light emitting layer, and the light emitting characteristics of the light emitting layer are deteriorated. Thus, an organic EL element having excellent light emission characteristics can be obtained.

  According to the present invention, since the patterned insulating layer is formed on another substrate such as the surface of the transfer substrate of the insulating layer transfer film, for example, directly on the surface of the organic layer including the light emitting layer, There is no need to form. Therefore, compared with the conventional method of forming the insulating layer in a pattern by directly printing on the surface of the organic layer, the organic layer of the organic EL element is altered or deformed by the organic solvent of the insulating layer composition, or dried. It is possible to prevent the organic layer from being thermally deteriorated or deformed by the heat of time.

  Hereinafter, the manufacturing method of the organic EL element of this invention is demonstrated in detail using drawing. FIG. 1 is an external perspective view showing an example of an organic EL element manufactured by the manufacturing method of the present invention, and FIG. 2 is a sectional view taken along line BB in FIG. The organic EL device shown in FIGS. 1 and 2 includes an anode 3, a hole transport layer 4, a light emitting layer 5, a patterned insulating layer 6, a cathode 7, and a cathode substrate on the surface of the anode substrate 2. 8 is provided. The anode 3, the hole transport layer 4, the light emitting layer 5, and the cathode 7 are all formed on the same surface, and only the patterned insulating layer 6 is formed in a predetermined pattern. In the organic EL element 1 of this embodiment, the organic material layer 13 is composed of the hole transport layer 4 and the light emitting layer 5.

  In the organic EL element 1 shown in FIG. 1, the light emitting portion 9 is formed in an alphabetic T shape. FIG. 3 is a perspective view showing an insulating layer of the organic EL element of FIG. As shown in FIG. 3, the patterned insulating layer 6 of the organic EL element 1 is formed in a shape that covers a portion other than the light emitting portion 9 by punching a portion of the T-shaped light emitting portion 9, and the non-light emitting portion 10. The pattern is formed. In the organic EL element 1, the portion where the patterned insulating layer 6 is formed is a non-light emitting element in which carrier injection or carrier recombination is prevented by the patterned insulating layer 6 from the electrodes (the anode 3 and the cathode 7) to the light emitting layer 5. The unit 10 is configured. As a result, the organic EL element 1 emits light in a T-shaped pattern of the light emitting unit 9.

  As the anode substrate 2 and the cathode substrate 8, a ceramic substrate such as a glass substrate, a resin plate, a resin film, or the like can be used. The anode substrate 2 and the cathode substrate 8 are preferably resin films. Examples of the resin for the resin film include polyesters such as polyethylene naphthalate and polyethylene terephthalate, polycarbonate, polyimide, polyether sulfone, polyether imide, polyphenylene sulfide, polysulfone, polyether ether ketone, polyamide, polymethyl methacrylate, and polyarylate. And cycloolefin polymers. The thickness of the anode substrate 2 and the cathode substrate 8 is usually 3 to 1000 μm, preferably 10 to 500 μm, more preferably 10 to 300 μm. In addition, a transparent material is normally used for the anode base material 2, the anode 3, the hole transport layer 4, and the like that are located on the light emitting surface side with respect to the light emitting layer 5 of the organic EL element 1.

  The anode substrate 2 and the cathode substrate 8 are preferably subjected to moisture-proof treatment such as forming a barrier layer on the surface. Examples of the barrier layer include thin films or metal films such as silicon oxide (SiO), silicon nitride (SiN), and silicon nitride oxide (SiO, SiN). In the case of using a metal film, it is formed to a thickness that allows the light generated in the light emitting layer to be taken out of the organic EL element. The thickness of the barrier layer is preferably 10 nm to 1 μm. If the barrier layer is less than 10 nm, the barrier effect is small, and if it exceeds 1 μm, the film base material tends to crack when bent.

  The anode 3 is formed from a metal having a high work function (4 eV or more), a conductive compound, or a mixture thereof. Examples of the material for the anode include ITO (tin-doped indium oxide) and IZO (indium zinc oxide). The thickness of the anode 3 is usually 1 μm or less and preferably 200 nm or less. The resistance of the anode 3 is several hundred Ω / sq. The following is preferred. The anode 3 can be formed by a vacuum deposition method, a sputtering method, a spin coating method, a casting method, an LB method, a pyrosol method, a spray method, or the like.

  Examples of the hole transport layer 4 include phthalocyanine, polyaniline, oligothiophene, benzidine derivatives, triphenylamine, pyrazoline derivatives, and triphenylene derivatives. The hole transport layer 4 can be formed using a vacuum deposition method, a spin coating method, a casting method, an LB method, a printing method, or the like. The thickness of the hole transport layer 4 is preferably 2 to 200 nm. As a material for the hole transport layer 4, water-soluble PEDOT: PSS (polystyrene sulfonic acid-doped polyethylene dioxythiophene) is one of preferable materials. The hole transport layer 4 can be formed by diluting PEDOT: PSS in an alcohol solvent such as isopropyl alcohol, applying the solution by spin coating, and drying by heating.

  The light-emitting layer 5 is formed from an organic light-emitting material, or a small amount of organic light-emitting material in an organic material (hereinafter referred to as a host material) exhibiting carrier transport properties (hole transport property, electron transport property, or amphoteric transport property) It can form from the material which added. The light emission color of the organic EL element 1 can be set by selecting an organic light emitting material used for the light emitting layer 5. The thickness of the light emitting layer 5 is preferably 200 nm or less in order to obtain practical light emission luminance.

When the light emitting layer 5 is formed from an organic light emitting material, a material having excellent film forming properties and excellent film stability is used as the organic light emitting material. As such an organic light-emitting material, a metal complex represented by Alq ₃ (tris- (8-hydroxyquinolinato) aluminum), a polyphenylene vinylene (PPV) derivative, a polyfluorene derivative, or the like is used. As the organic light-emitting material used together with the host material, since the addition amount is small, in addition to the organic light-emitting material, a fluorescent dye that is difficult to form a stable thin film by itself can be used. Examples of fluorescent dyes include coumarin, DCM derivatives, quinacridone, perylene, and rubrene. Examples of the host material include Alq ₃ , TPD (triphenyldiamine), an electron transporting oxadiazole derivative (PBD), a polycarbonate-based copolymer, and polyvinyl carbazole. Even when the light emitting layer 5 is formed of an organic light emitting material as described above, a small amount of an organic light emitting material such as a fluorescent dye can be added in order to adjust the light emission color.

  The patterned insulating layer 6 is made of an insulating material capable of preventing carrier injection from the electrode to the light emitting layer. For example, a thermosetting resin adhesive made of epoxy resin and polyamide, as a softening component A thermosetting resin adhesive containing a thermoplastic resin can be used. The thickness of the patterned insulating layer 6 is 10 nm to 2 μm, preferably 100 nm to 500 nm. If the thickness of the patterned insulating layer 6 is less than 10 nm, the adhesion may be reduced. If the thickness exceeds 2 μm, the step becomes large and the adhesion (light emission) area may be reduced.

  The cathode 7 is formed from a metal having a low work function (4 eV or less), an alloy composition, a conductive compound, or a mixture thereof. Cathode materials include metals such as Al, Ti, In, Na, K, Mg, Li, Cs, Rb, and rare earth metals, Na—K alloys, Mg—Ag alloys, Mg—Cu alloys, and Al—Li alloys. And alloy compositions such as The thickness of the cathode is usually 1 μm or less, preferably 200 nm or less. The resistance of the cathode 7 is several hundred Ω / sq. The following is preferred. The cathode 7 can be formed by a vacuum evaporation method or the like.

  In the organic EL device 1 of the present invention, it is sufficient that at least the light emitting layer 5 is formed as the organic layer 13 between the anode 3 and the cathode 7. In order to improve the light emitting characteristics of the light emitting device, the light emitting layer In addition to 5, the organic material layer 13 can be configured by providing layers such as an electron transport layer, a hole injection layer, and an electron injection layer at predetermined positions as the hole transport layer 4 or other layers. .

  Hereinafter, the manufacturing method of the organic EL element shown in FIG. 1 will be described. FIG. 4 is a cross-sectional view showing an example of a bonding process of the organic EL element of FIG. The organic EL element 1 is manufactured by firstly forming an anode substrate 11 (first substrate) in which an anode substrate 2 made of a resin film is provided with an organic material layer including an anode 3 and a light emitting layer 5, and a cathode made of a resin film. A cathode substrate 12 (second substrate) provided with a cathode 7 is prepared on a base material 8. Next, the patterned insulating layer 6 is formed on the anode substrate 11 by transfer. Then, the anode substrate 11 and the cathode substrate 12 are bonded together so that the anode 3 and the cathode 7 face each other to form the organic EL element 1.

  The patterned insulating layer 6 is formed on the anode substrate 11 by transfer. The patterned insulating layer 6 is formed on the surface of the organic layer 13 including the light emitting layer 5 of the anode substrate 11. Here, in order to form the patterned insulating layer 6, the insulating layer transfer film 20 (see FIG. 5D) having the patterned insulating layer 6 formed in advance in the pattern of the non-light emitting portion 10 is used to form the patterned insulating layer 6. The insulating layer 6 is formed by transferring. By using the insulating layer transfer film 20, the patterned insulating layer 6 can be reliably formed. Hereinafter, a method for transferring and forming a patterned insulating layer using an insulating layer transfer film will be described.

  5A to 5D show a method for producing an insulating layer transfer film, and are cross-sectional views of each step. In order to manufacture the insulating layer transfer film 20, first, as shown in FIG. 1A, a transfer base material 21 having releasability with respect to the transfer layer is prepared. Next, a transfer layer composition made of the material of the patterned insulating layer 6 is applied to the entire surface of the transfer base material 21 by gravure printing or the like, and dried to form the transfer layer 22 [FIG. ]. Next, on the surface of the transfer layer 22, a release sheet 23 having a higher releasability with respect to the transfer layer 22 than the transfer base material 21 is laminated [FIG. The laminated body is removed by punching and removing a portion corresponding to the shape of the light emitting portion 9 with a Thomson mold or the like. As a punching method at this time, in addition to the method using the above-mentioned Thomson die, a method of punching with a die, a male and female die having a punching blade on the upper die and the lower die capable of more complicated punching And the like. A method of punching and removing the shape of the light emitting portion to form the patterned insulating layer 6 may be an extremely simple operation as pattern forming means, and pattern formation is easy. The patterned insulating layer 6 may be previously patterned on the transfer film by gravure printing or the like.

  As shown in FIG. 4D, the laminated body after punching is formed with the transfer base material 21, the transfer layer 22, and the release sheet 23 in the pattern of the non-light emitting portion 10, and the transfer layer 22 is the patterned insulating layer 6. The insulating layer transfer film 20 formed in the shape is obtained.

  As the transfer base material 21 and the release sheet 23, a resin film having releasability with respect to the transfer layer 22 is used. For example, a polyester film such as a polyethylene terephthalate film having a thickness of about 3 to 1000 μm can be used as the resin film. The surface of the resin film can be appropriately subjected to a release treatment in order to adjust the release property with respect to the transfer layer.

  The formation of the patterned insulating layer 6 on the transfer film 20 as described above has the following advantages. Conventionally, when an insulating layer is patterned on the surface of the cathode, an active material having a good electron-injecting property is often used for the cathode. Therefore, it is necessary to perform patterning when forming the cathode layer under vacuum. However, when patterning is performed in a vacuum in this way, the manufacturing method is limited to the mask method or the like. On the other hand, when the patterned insulating layer is formed on the transfer substrate, it is not necessary to form it under vacuum, and since the patterned insulating layer can be formed at atmospheric pressure, patterning can be easily performed. it can.

  FIGS. 6A to 6C are cross-sectional views of a main part of each step showing a method for forming an anode substrate. Hereinafter, a method for forming the anode substrate 11 will be described. First, as shown in FIG. 1A, an anode substrate 2 made of a resin film or the like for forming an anode is prepared. Then, the anode 3 is formed on the surface of the anode substrate 2, and organic layers such as the hole transport layer 4 and the light emitting layer 5 are formed on the surface of the anode 3. At this time, each layer of the anode 3, the hole transport layer 4 and the light emitting layer 5 is formed over the entire surface.

  Next, in the insulating layer forming step, the patterned insulating layer 6 is transferred and formed on the surface of the light emitting layer 5 of the anode substrate using the insulating layer transfer film 20. In the insulating layer forming step, as shown in FIG. 6B, the release sheet 23 of the insulating layer transfer film 20 [see FIG. 5D] is peeled off, and the surface of the light emitting layer 5 of the anode substrate 11 is peeled off. The transfer layer 22 and the light emitting layer 5 are laminated so as to be in contact with each other. Then, as shown in FIG. 4C, the transfer substrate 21 is peeled off and the transfer layer 22 is transferred, so that the anode substrate 11 having the patterned insulating layer 6 formed on the surface thereof as shown in FIG. can get.

  FIG. 7 is an explanatory view showing a state in which an anode substrate and a cathode substrate are stacked and heated and pressurized with a heating roll. Hereinafter, the bonding process will be described. As shown in FIG. 7, the anode substrate 11, the cathode substrate 12, and the patterned insulating layer 6 and the cathode 7 are overlapped to form a laminated body. The laminate is passed through a pair of heating rollers 31, 32, and the laminate is heated and pressurized. In the laminated body, the thermosetting adhesive constituting the pattern insulating layer 6 is softened by heating, and is closely attached to the light emitting layer by pressurization, whereby the anode substrate 11 and the cathode substrate 12 are joined and integrated to form the organic EL element 1. Is obtained. The heating / pressing method of the anode substrate and the cathode substrate in the bonding step is not limited to the method using the pair of rollers described above, for example, a method using a pair of heating rollers, a method using a pair of heating plates, A method of combining a heating roller and a heating plate can be used.

  In the drawings, the vertical direction (thickness direction) which is the vertical direction in the figure is shown by a scale enlarged 1000 times or more with respect to the horizontal direction which is the horizontal direction in the figure. For this reason, in the laminate of the anode substrate 11 and the cathode substrate 12 before pressurization, the punched portion of the patterned insulating layer 6 (the portion corresponding to the light emitting portion 9) appears to be formed as a gap, but the light emitting layer The distance between 5 and the cathode 7 is small, and when the laminate of the anode substrate 11 and the cathode substrate 12 is heated and pressurized, the light emitting layer 5 and the cathode 7 are immediately adhered.

  In the above description of the method for manufacturing an organic EL element, the case where a patterned insulating layer is provided on the anode substrate side in the insulating layer forming step has been described. The patterned insulating layer 6 may be formed on the cathode substrate 12 side. FIG. 8 shows another example of the method for manufacturing the organic EL element of FIG. 1, and is a process diagram showing an example in the case where a patterned insulating layer is provided on the cathode substrate side. FIG. 9 shows the bonding of the manufacturing method of FIG. It is sectional drawing which shows a process.

  When the patterned insulating layer 6 is provided on the cathode substrate 12 side, first, the cathode 7 is formed on the surface of the cathode base 8 as shown in FIG. 8A (see FIG. 8B). Then, using the insulating layer transfer film 20, the patterned insulating layer 6 is transferred to the surface of the cathode 7 as in the case of FIG. As shown in FIG. 2C, the cathode substrate 12 having the patterned insulating layer 6 formed on the surface of the cathode 7 is obtained.

  Next, in the bonding step, as shown in FIG. 9, an anode substrate 11 is prepared in which the anode 3, the hole transport layer 4, and the light emitting layer 5 are sequentially formed on the surface of the anode base 2. Then, the anode substrate 11 and the cathode substrate 12 on which the patterned insulating layer 6 is formed are stacked so that the light emitting layer 5 and the patterned insulating layer 6 are in contact with each other to form a laminated body. Then, similarly to FIG. 7, the laminated body of the anode substrate 11 and the cathode substrate 12 is heated and pressurized by passing between the heating rolls 31 and 32, and the light emitting layer 5 and the patterned insulating layer 6 are joined. The organic EL element 1 shown in FIG. 2 is obtained.

  Moreover, although the manufacturing method of said organic EL element demonstrated the method of using the anode substrate which formed the organic substance layer containing the light emitting layer on the anode side, the manufacturing method of the organic EL element of this invention has a light emitting layer on the cathode side. A cathode substrate (first substrate) on which an organic material layer is formed and an anode substrate (second substrate) on which only an anode is formed without forming an organic material layer are prepared, and the cathode substrate or the anode substrate is prepared. A patterned insulating layer may be provided on one of the substrates by transfer, and the cathode substrate and the anode substrate may be bonded to produce an organic EL element.

Examples of the present invention will be described below.
Example 1
(1-1) Production of Insulating Layer Transfer Film On the surface of a polyethylene terephthalate (PET) film subjected to release treatment as a transfer substrate, a transfer layer forming coating solution (polyamide resin and epoxy resin diluted with toluene and methanol) The product was subjected to gravure printing and then vacuum-dried at 0.1 MPa and 80 ° C. for 5 minutes to form a transfer layer having a thickness of 250 nm on the entire surface. Further, a laminate of transfer substrate / transfer layer / release film is formed on the surface of the transfer layer by laminating a PET film having a higher release property to the transfer layer than the PET film of the transfer substrate as a release sheet. did. This laminated body was punched out with a Thomson die at a portion corresponding to the T-shaped light emitting portion to obtain an insulating layer transfer film in which a transfer layer was formed in a pattern of a non-light emitting portion.

(1-2) Production of Anode Substrate As a base film, a polyethylene naphthalate (PEN) film having a thickness of 200 μm is formed on both sides with SiO ₂ and SiN as barrier layers, and on one side with indium tin oxide (ITO as an anode) ) To a thickness of 150 nm to form an anode substrate.

(1-3) Cleaning The anode substrate was subjected to ultrasonic cleaning for 5 minutes each in the order of pure water, organic alkali cleaning liquid (Furuuchi Chemical Co., Ltd .: Semico Clean), pure water, and acetone solution. Then, it processed for 30 minutes with the UV ozone cleaner.

(1-4) Formation of hole transport layer On the surface of the anode of the cleaned anode substrate, a coating liquid for forming a hole transport layer [PEDOT: PSS aqueous solution (manufactured by Starck) diluted with IPA] The coating was carried out by spin coating under the condition of a rotational speed of 2000 rpm × 60 seconds and dried in an oven at 120 ° C. for 30 minutes to form a hole transport layer having a thickness of 100 nm.

(1-5) Formation of Light-Emitting Layer The surface of the hole transport layer of the anode substrate is spin-coated with a polyfluorene-based light-emitting material (glass transition temperature: 116 ° C., DSC method) as the light-emitting layer material to a thickness of 80 nm. It was applied by the method and dried to form a light emitting layer on the entire surface.

(1-6) Formation of Insulating Layer After peeling off the release film of the insulating layer transfer film and laminating the surface of the anode substrate provided with the light emitting layer so that the transfer layer is in contact with the light emitting layer, the transfer base material is After peeling, a patterned insulating layer was provided on the surface of the light emitting layer of the anode substrate.

(1-7) Production of Cathode Substrate SiO ₂ and SiN are formed as barrier layers on both sides of a 100 μm thick PEN film as a base film, and Mg—Ag is used as a cathode on one side with a vacuum film forming apparatus of 200 nm. A film was formed to a thickness to obtain a cathode substrate.

(1-8) Production of Organic EL Element The anode substrate provided with the above patterned insulating layer and the cathode substrate provided with the cathode are overlapped so that the patterned insulating layer and the cathode are in contact with each other, and the temperature is 140 ° C. By passing between the two heating rolls set to, and pressurizing the anode substrate and the cathode substrate so that the roll pressure is 2 MPa, the light emitting layer and the insulating layer are softened, The organic EL element of Example 1 was obtained by bonding.

Example 2
(2-1) Production of Insulating Layer Transfer Film The insulating layer transfer film of (1-1) of Example 1 was used.
(2-2) Production of anode substrate The anode substrate of (1-2) of Example 1 was used.
(2-3) Cleaning The anode substrate was cleaned in the same manner as (1-3) in Example 1. (2-4) Formation of hole transport layer Anode substrate in the same manner as (1-4) in Example 1. A hole transport layer was formed on the substrate.
(2-5) Formation of light emitting layer The light emitting layer was formed in the anode board | substrate similarly to (1-5) of Example 1. FIG.
(2-6) Production of Cathode Substrate A cathode substrate was formed in the same manner as in Example 1 (1-7).
(2-7) Formation of insulating layer The release film of the insulating layer transfer film is peeled off and laminated on the surface of the cathode substrate of (2-6) so that the transfer layer is in contact with the electrode. After peeling, a patterned insulating layer was provided on the cathode surface of the cathode substrate.
(2-8) Fabrication of organic EL element A light emitting layer and a pattern-like structure comprising an anode substrate provided with the light-emitting layer of (2-5) and a cathode substrate provided with the patterned insulating layer of (2-7). The stacked anode plates and cathode substrates are stacked so as to be in contact with the insulating layer, passed between two heating rolls set at a temperature of 140 ° C., and pressed so that the roll pressure is 2 MPa. The organic EL element of Example 2 was obtained by softening the light emitting layer and the insulating layer to join them together.

It is an external appearance perspective view which shows an example of the organic EL element manufactured by the manufacturing method of this invention. It is BB sectional drawing of FIG. It is a perspective view which shows the insulating layer of the organic EL element of FIG. It is sectional drawing which shows the bonding process of an example of the manufacturing method of the organic EL element of FIG. (A)-(d) shows the manufacturing method of an insulating layer transfer film, and is sectional drawing of each process. (A)-(c) is sectional drawing of each process which shows the method of forming a pattern-like insulating layer in an anode substrate by transcription | transfer. It is explanatory drawing which shows the state which heats and pressurizes an anode substrate and a cathode substrate on a heating roll. It is process drawing which shows the other example of the manufacturing method of the organic EL element of FIG. 1, and shows the example in the case of providing a patterned insulating layer in the cathode substrate side. It is sectional drawing which shows the bonding process of the manufacturing method of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Organic electroluminescent (EL) element 2 Anode base material 3 Anode 4 Hole transport layer 5 Light emitting layer 6 Patterned insulating layer 7 Cathode 8 Cathode base material 9 Light emitting part 10 Non-light emitting part 11 Anode substrate 12 Cathode substrate 13 Organic substance layer 20 Insulating layer transfer film 21 Transfer base material 22 Transfer layer 23 Release sheets 31, 32 Heating roll

Claims (5)

  An anode substrate on which an anode is formed and a cathode on which a cathode is formed so that an organic layer including at least a light emitting layer and a patterned insulating layer formed in the shape of a non-light emitting portion are sandwiched between the cathode and the anode A method of manufacturing an organic electroluminescent element in which a light emitting layer emits light in a predetermined light emitting pattern excluding a non-light emitting portion by bonding to a substrate, wherein the organic material layer and one electrode are formed. And a second substrate on which the other electrode is formed, and an insulating layer forming step of providing the patterned insulating layer on the first substrate or the second substrate by transfer, A method for manufacturing an organic electroluminescence element, comprising: a bonding step of bonding one substrate and the second substrate.   2. The method of manufacturing an organic electroluminescence element according to claim 1, wherein the insulating layer forming step provides the patterned insulating layer on an anode substrate on which an anode and an organic material layer are formed.   2. The method of manufacturing an organic electroluminescence element according to claim 1, wherein the insulating layer forming step provides the patterned insulating layer on a cathode substrate on which a cathode is formed.   The insulating layer forming step transfers the patterned insulating layer using an insulating layer transfer film in which the patterned insulating layer is provided as a transfer layer on a transfer substrate. 4. The method for producing an organic electroluminescent element according to any one of 3 above.   5. The organic material according to claim 4, wherein the insulating layer transfer film is formed by punching and removing the shape of the light emitting portion to form the patterned insulating layer in the shape of a predetermined non-light emitting portion. A method for manufacturing an electroluminescent element.

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