JP2010045337A - Light-emitting body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting body having high flexibility of cutting, without having to arrange a cutting part beforehand. <P>SOLUTION: The light-emitting body 10 includes: a positive electrode base material 14, equipped with a positive electrode layer 12; a negative electrode base material 18 equipped with a negative electrode layer 16; an organic layer 22, including a light-emitting layer 20, sandwiched between the positive electrode layer 12 and the negative electrode layer 16; and an insulating adhesive layer 24, arranged between the positive electrode base material 14 and the negative electrode base material 18. The insulating adhesion layer 24 includes a pair of linear sections 24a, 24b arranged in a plan view, in the longitudinal direction of both the verge sides of the emitting layer 20, or in the longitudinal direction of both the outsides of the emitting layer 20, or in a single verge side of the longitudinal direction of the emitting layer 20 and the other outside of the longitudinal direction. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a light emitter.

  Conventionally, an organic electroluminescence element (hereinafter, simply referred to as “organic EL element”) is known as a typical light emitter.

  The organic EL element has, for example, a structure in which a light emitting layer is sandwiched between an anode base material on which an anode layer is formed and a cathode base material on which a cathode layer is formed. The organic EL element emits light by recombination of electrons injected from the cathode layer and holes injected from the anode layer in the light emitting layer.

  As the organic EL element, for example, in Patent Document 1, in an organic EL element having a light emitting layer between an anode layer and a cathode layer, a patterned insulating layer is provided between the anode layer and the cathode layer. An organic EL element in which a non-light-emitting portion corresponding to the pattern is formed by insertion is disclosed.

  Further, for example, Patent Document 2 discloses an organic EL device manufactured by stacking an anode film on which an organic layer including a light emitting layer is formed and a cathode film, joining each other, and cutting each device. .

  Patent Document 3 discloses a display tape using an organic EL element as a display unit.

Japanese Patent Laid-Open No. 10-270173 JP 2005-38816 A JP 2003-84597 A

  In recent years, for example, there is a demand for cutting a light emitter at an arbitrary position in order to form a long light emitter such as a light emitting tape in an arbitrary size.

  However, when the light emitting body by the conventional organic EL element is cut at the light emitting layer portion, the anode layer and the cathode layer facing each other come into contact with each other due to the shearing force at the time of cutting, and light emission becomes impossible due to a short circuit. This tendency is particularly remarkable when a resin base material having low rigidity is used.

  Further, depending on the internal stress distribution state in the light emitter, the anode base material and the cathode base material may be peeled off at the cutting position. In this case, the electrons injected from the cathode layer and the holes injected from the anode layer do not recombine in the light emitting layer due to misalignment of both base materials, making it impossible to emit light.

  In order to avoid these problems, for example, as described in Patent Document 2, for example, a cutting portion where the electrode layer and the light emitting layer are not arranged is arranged in advance, and cutting is performed at this portion. It was normal. For this reason, the light emitting body using the conventional organic EL element has a problem that the degree of freedom in cutting is extremely low.

  This invention is made | formed in view of the said situation, The subject which this invention tends to solve is providing the light-emitting body with a high freedom degree of cutting.

  In order to solve the above problems, a light emitter according to the present invention is sandwiched between an anode substrate having an anode layer, a cathode substrate having a cathode layer, and the anode layer and the cathode layer. An organic material layer including a light emitting layer; and an insulating adhesive layer disposed between the anode base material and the cathode base material, the insulating adhesive layer in a longitudinal direction of the light emitting layer in a plan view. The gist of the invention is to have a pair of linear portions located on both edge sides or on both outer sides in the longitudinal direction of the light emitting layer or on one longitudinal edge side of the light emitting layer and on the other outer side in the other longitudinal direction.

  Here, as for the said light-emitting body, it is preferable that the cutting plan direction is a direction which cross | intersects a longitudinal direction. More preferably, in the light emitter, the planned cutting direction is a direction substantially perpendicular to the longitudinal direction.

  Moreover, it is preferable that the said light-emitting body is formed by bonding.

  The insulating adhesive layer preferably has a reinforcing portion between the pair of linear portions in plan view.

  In this case, the reinforcing part is preferably one or more selected from a bridging part that connects the pair of linear parts, a dot part, and a linear part different from the pair of linear parts.

  The insulating adhesive layer is preferably disposed in close contact with the cathode layer and / or the anode layer.

  The upper insulating adhesive layer is preferably between the organic layer and the cathode layer.

  Moreover, it is preferable that the said light-emitting body is formed in tape shape.

  Moreover, it is preferable that the circumference | surroundings of the said light-emitting body are sealed with the barrier base material.

  Further, in the light emitting body, a part of the light emitting body that has lost its light emitting function may exist in the sealed portion.

  On the other hand, the light-emitting body cutting method according to the present invention is a method of cutting a light-emitting body whose periphery is sealed with a barrier base material, and the direction intersecting the longitudinal direction of the light-emitting body is defined as a barrier base material. The gist is to have a thermocompression bonding process for thermocompression bonding from the surface and a cutting process for cutting along the formed thermocompression bonding site.

  In the luminescent material according to the present invention, an insulating adhesive layer is disposed between the anode base material and the cathode base material, and the insulating adhesive layer is, in plan view, both sides in the longitudinal direction of the light emitting layer or the above. It has a pair of linear parts located in the longitudinal direction both outer sides of the light emitting layer or one longitudinal direction edge side and the other longitudinal direction outside of the said light emitting layer.

  Therefore, when cut in the direction crossing the longitudinal direction, the insulating base layer having the pair of linear portions having a relatively simple configuration, the anode base material and the cathode base material resulting from the shearing force at the time of cutting. Contact with is suppressed. In addition, the anode base material and the cathode base material are prevented from being peeled off during cutting due to the distribution of internal stress in the light emitter. Therefore, the light emitter according to the present invention can maintain light emission even when it is cut and has a high degree of freedom in cutting.

  Here, when the planned cutting direction is a direction intersecting the longitudinal direction, in particular, a direction substantially perpendicular to the longitudinal direction, a light emitting body that can be formed to an arbitrary length by cutting, such as a light emitting tape, is obtained.

  In addition, when the light emitter is formed by bonding, a light emitter with relatively low cost and good productivity can be obtained.

  Further, when the insulating adhesive layer has a reinforcing portion between the pair of linear portions in a plan view, the distance between the pair of linear portions is relatively large, Even when the rigidity is relatively low, it is possible to obtain a light emitting body that can more easily suppress the short circuit and the peeling.

  At this time, when the reinforcing portion is one or more selected from a bridging portion connecting the pair of linear portions, a dot portion, and a linear portion different from the pair of linear portions, light emission It is possible to obtain a light emitter that can easily achieve the effect of forming the reinforcing portion while securing the above.

  Further, when the insulating adhesive layer is disposed in close contact with the cathode layer and / or the anode layer, the distance between the electrode layers (between the cathode layer and the anode layer) is easily maintained constant. Become.

  Further, when the insulating adhesive layer is between the organic layer and the cathode layer, it is easy to form the other layer during production, and a light emitting body excellent in productivity can be obtained.

  Moreover, when the said light-emitting body is formed in tape shape, the light-emitting body which can be used suitably for the manufacturing apparatus of a display tape, etc. is obtained.

  Further, when the periphery of the luminous body is sealed with a barrier base material, the organic material layer, the anode layer, and the cathode layer are hardly deteriorated by oxygen, water, and the like in the external environment. Therefore, it is possible to obtain a light emitter that has a high degree of freedom in cutting and has an excellent light emission lifetime.

  On the other hand, the light-emitting body cutting method according to the present invention is a method of cutting a light-emitting body whose periphery is sealed with a barrier base material, and the direction intersecting the longitudinal direction of the light-emitting body is defined as a barrier base material. It has a thermocompression bonding process for thermocompression bonding from the surface and a cutting process for cutting along the formed thermocompression bonding site. Therefore, a thermocompression bonding portion is formed in the direction intersecting with the longitudinal direction of the light emitter by the thermocompression bonding. The thermocompression bonding portion is not related to light emission, and becomes a sealing portion of the light emitter after cutting in the next step. After the thermocompression bonding step, cutting is performed along the formed thermocompression bonding portion, so that a light emitting body in which the cutting portion is sealed is obtained. Therefore, according to the light-emitting body cutting method according to the present invention, a light-emitting body having an excellent light emission lifetime even after cutting is obtained.

It is the figure which showed typically sectional drawing of the light-emitting body which concerns on 1st Embodiment. It is the figure which showed typically sectional drawing of the light-emitting body which concerns on 2nd Embodiment. It is the figure which showed typically sectional drawing of the light-emitting body which concerns on 3rd Embodiment. It is the figure which showed typically sectional drawing of the light-emitting body which concerns on 4th Embodiment. It is the figure which showed typically sectional drawing of the light-emitting body which concerns on 5th Embodiment. It is a top view (however, a cathode base material is abbreviate | omitted) of the light-emitting body which has the cross section of FIG. It is the figure which showed the modification (when a linear part is dotted line shape) of FIG. It is the figure which showed the other modification (when it has a bridge | crosslinking part as a reinforcement part) of FIG. It is the figure which showed the other modification (when it has a dot part as a reinforcement part) of FIG. It is the figure which showed the modification (when it has another linear part as a reinforcement part) of FIG. It is the figure which showed the light-emitting body which has a barrier base material based on this embodiment, (a) is an external appearance perspective view, (b) is AA sectional drawing. It is a figure for demonstrating the cutting method of the light-emitting body which concerns on this embodiment. It is the photograph which showed the light-emitting body (light emission state) which concerns on Example 1 before cutting. It is the photograph which showed the light-emitting body (light emission state) based on Example 1 after cutting. 4 is a photograph showing a light emitter with a barrier substrate according to Example 3. It is the photograph which showed the state which formed the thermocompression bonding part in the direction substantially perpendicular | vertical to the longitudinal direction about the light-emitting body of FIG. 15 in the state which has not applied the voltage. It is the photograph which showed the state which made the light-emitting body light-emit after forming a thermocompression bonding part. It is the photograph which showed the state which light-emitted the light-emitting body, after cutting along the thermocompression bonding part of FIG.

  Luminescent body according to the present embodiment (hereinafter sometimes referred to as “the present luminous body”), a manufacturing method thereof (hereinafter also referred to as “the present manufacturing method”), and a method for cutting the luminous body (Hereinafter, it may be referred to as “the cutting method”.) Will be described in detail.

1. 1 to 5 schematically illustrate cross-sectional views of the light emitter. 1 shows a first embodiment, FIG. 2 shows a second embodiment, FIG. 3 shows a third embodiment, FIG. 4 shows a fourth embodiment, and FIG. 5 shows a sectional view of the luminous body according to the fifth embodiment. ing. FIG. 6 is a diagram showing an example of a plan view of the luminous body having the cross section of FIG. However, for the sake of simplicity, the cathode base material 18 described later is not shown here.

  As shown in FIGS. 1 to 5, the luminous body 10 includes an anode base material 14 including an anode layer 12, a cathode base material 18 including a cathode layer 16, and an organic material layer including a light emitting layer 20. 22 and an insulating adhesive layer 24. The organic layer 22 is sandwiched between the anode layer 12 and the cathode layer 16.

  1 to 5 exemplify the case where the organic material layer 22 has the hole transport layer 21 on the anode layer 12 side in addition to the light emitting layer 20. Although not shown, the organic layer 22 may have an electron injection layer on the cathode layer 16 side.

  In the luminous body 10, the insulating adhesive layer 24 is disposed between the anode base material 14 and the cathode base material 18 as illustrated in FIGS. 1 to 5.

  Specifically, as shown in FIG. 1, the insulating adhesive layer 24 of the light emitter 10 has a cathode layer 16, an organic layer 22, and a direction perpendicular to the surface direction of the light emitter 10 (thickness direction). It may be between. Further, as shown in FIG. 2, it may be in the organic layer 22 (specifically, between the light emitting layer 20 and the hole transport layer 21 in FIG. 2). Further, as shown in FIG. 3, it may be between the organic layer 22 and the anode layer 12. Further, as shown in FIG. 4, it may be between the cathode layer 16 and the anode layer 12. Moreover, as shown in FIG. 5, it may be between the base materials of the cathode base material 18 and the anode base material 14. In addition, although not shown, the insulating adhesive layer 24 is not necessarily disposed between the same layers, and may be disposed between different layers. Preferably, they are arranged between the same layers from the viewpoint of productivity and the like.

  Thus, the insulating adhesive layer 24 may be disposed in various layers or layers in the thickness direction of the light emitter 10.

  Here, the luminous body 10 is preferably a long object, and the insulating adhesive layer 24 extends along the longitudinal direction of the luminous body 10 when viewed in plan as shown in FIG. It has a pair of linear parts 24a and 24b. In FIG. 6, C <b> 1 to C <b> 3 are cutting directions of the light emitter 10 and intersect the longitudinal direction of the light emitter 10 (C <b> 1 is a direction substantially perpendicular to the longitudinal direction). When the planned cutting direction is a direction substantially perpendicular to the longitudinal direction, a light emitter that can be formed to an arbitrary length by cutting is obtained. Therefore, it is suitable as a light emitting tape for display.

  The linear portions 24 a and 24 b of the insulating adhesive layer 24 may be located on both sides in the longitudinal direction of the light emitting layer 20 (FIGS. 1 to 3) with respect to the light emitting layer 20. It may be located on both outer sides in the longitudinal direction (FIGS. 4 and 5). Furthermore, the linear portions 24a and 24b of the insulating adhesive layer 24 may be positioned on one longitudinal edge side of the light emitting layer 20 and on the other longitudinal direction outside of the light emitting layer 20 (not shown). As described above, the linear portions 24 a and 24 b of the insulating adhesive layer 24 may have a portion overlapping the light emitting layer 20 or may not have a portion overlapping the light emitting layer 20 in a plan view.

  In any case, the insulating adhesive layer 24 suppresses contact between the anode base material 14 and the cathode base material 18 due to the shearing force at the time of cutting. Further, the anode base material 14 and the cathode base material 18 are prevented from being peeled off during cutting due to the distribution state of internal stress in the light emitter 10 and the like. As a result, it is possible to maintain light emission even after being cut, and it is not necessary to determine the cutting scheduled position in advance, so that the degree of cutting freedom is high.

  As shown in FIG. 1 to FIG. 3, when the linear portions 24 a and 24 b of the insulating adhesion layer 24 are located on both sides in the longitudinal direction of the light emitting layer 20 with respect to the light emitting layer 20, the insulating property The adhesion layer 24 and other layers can be easily formed, and productivity can be improved. Preferably, the insulating adhesive layer 24 is present at the bonding interface from the viewpoint of easy bonding by a bonding method described later.

  On the other hand, as shown in FIGS. 4 and 5, when the linear portions 24 a and 24 b of the insulating adhesion layer 24 are located on both outer sides in the longitudinal direction of the light emitting layer 20 with respect to the light emitting layer 20, It is easy to suppress peeling from the edge of the light emitter 10, and the stability as a structure can be improved.

  The linear portions 24a and 24b included in the insulating adhesive layer 24 may be continuous lines as illustrated in FIG. 6, or dots are continuously linear as illustrated in FIG. Is also good (dotted line). In addition, when making linear part 24a, 24b into dotted line form, it is preferable to arrange | position linear part 24a and linear part 24b so that a point may exist on the line of the cutting direction.

  In addition, the insulating adhesive layer 24 has a function of the linear portions 24a and 24b between the pair of linear portions 24a and 24b in order to make it easier to suppress the movement of both the base materials 14 and 18 during cutting. You may have the reinforcement part which reinforces. When the reinforcing portion is provided, short-circuiting and peeling are easily suppressed even when the distance between the linear portions 24a and 24b is relatively large, or when the rigidity of the base material is relatively low.

  FIG. 8 is a view showing a modification of FIG. 6, and the insulating adhesive layer 24 is a bridge that connects between a pair of linear portions 24 a and 24 b arranged in parallel along the longitudinal direction as a reinforcing portion. It has a portion 24c. FIG. 9 is a view showing another modified example of FIG. 6, and the insulating adhesive layer 24 has a dot portion 24d as a reinforcing portion between a pair of linear portions 24a and 24b. Further, FIG. 10 is a diagram showing a modification of FIG. 7, and the insulating adhesive layer 24 has another linear portion 24e as a reinforcing portion between the pair of linear portions 24a and 24b. Yes. In addition, in FIG. 10, although the case where it had two another linear parts 24e was illustrated, one linear part 24e may be sufficient and two or more may be sufficient. Here, the form of the reinforcing portion is not particularly limited, and various forms can be selected as long as they do not affect the use of the light emitter, such as a short wire shape. It is also possible to combine two or more reinforcing parts having different forms.

  In addition, although the case where it has the cross section of FIG. 1 was demonstrated above, the description of FIGS. 6-10 is applicable similarly to the above also about the case where it has the cross section of FIGS. Moreover, when forming reinforcement parts, such as the bridge | crosslinking part 24c and the dot part 24d, between a pair of linear part 24a, 24b, a reinforcement part and the light emitting layer 20 are planar view from a viewpoint of obtaining sufficient light emission. It is preferable that there is no overlap. However, as long as it does not affect the use of the light emitter 10, the reinforcing portion and the light emitting layer 20 may overlap in plan view.

  The luminous body 10 is preferably formed by bonding the anode base material 14 and the cathode base material 18 together. This is because according to the bonding method, it is possible to obtain a light emitting body that is relatively inexpensive and has good productivity.

  In this case, the bonding interface may be between any layers. Preferably, it exists between the cathode layer 16 and the organic material layer 22. This is because the bonding can be performed while suppressing a decrease in the activity of the cathode.

  Hereinafter, the material of the light emitter 10 and the thickness of each member will be described.

  As the base material constituting the anode base material 14 and the cathode base material 18, for example, a transparent resin base material or a glass substrate can be used. Preferably, a resin base material is used. This is because the resin base material has a large effect of the present invention because the base material is greatly deformed by cutting.

  Specific examples of the base material include, for example, polyesters such as polyethylene terephthalate and polyethylene naphthalate, polycarbonate, polyimide, polyether sulfone, polyether imide, polyphenylene sulfide, polysulfone, polyether ether ketone, polyamide, and polymethacrylic acid. Examples thereof include methyl acid, polyarylate, and cycloolefin polymer. These may be contained alone or in combination of two or more.

  The thickness of the base material constituting the anode base material 14 and the cathode base material 18 is usually 3 to 1000 μm, preferably 10 to 500 μm, and more preferably 10 to 300 μm.

  The anode layer 12 is preferably made of a material having good transparency from the viewpoint of taking out emitted light to the outside. Examples of the material of the anode layer 12 include a metal having a high work function (4 eV or more), a conductive compound, or a mixture thereof. Specific examples include ITO (tin-doped indium oxide), IZO (indium zinc oxide), and the like.

  The thickness of the anode layer 12 is generally 1 μm or less, and preferably 200 nm or less. The resistance of the anode layer 12 is several hundred Ω / sq. The following is preferred. The anode layer 12 can be formed by a vacuum deposition method, a sputtering method, a spin coating method, a casting method, an LB method, a pyrosol method, a spray method, or the like.

  Examples of the material of the hole transport layer 21 include phthalocyanine, polyaniline, oligothiophene, benzidine derivative, triphenylamine, pyrazoline derivative, and triphenylene derivative. These may be contained alone or in combination of two or more. In order to improve hole mobility, an electron-accepting acceptor such as a metal halide, a Lewis acid, or an organic acid may be added.

  The thickness of the hole transport layer 21 is preferably 1 to 200 nm, more preferably 10 to 100 nm. As a material of the hole transport layer 21, water-soluble PEDOT: PSS (polystyrene sulfonic acid-doped polyethylene dioxythiophene) is one of the preferable materials. The hole transport layer 21 can be formed by diluting PEDOT: PSS in an alcohol solvent such as isopropyl alcohol, applying the solution by a spin coating method, and heating and drying.

  The light-emitting layer 20 is formed of an organic light-emitting material or an organic material that exhibits carrier transportability (hole transportability, electron transportability, or amphoteric transportability) (hereinafter sometimes referred to as “host material”). It can be formed from a material to which a small amount of an organic light emitting material is added. By selecting an organic light emitting material used for the light emitting layer 20, the light emission color of the light emitter 10 can be easily set.

When the light emitting layer 20 is formed from an organic light emitting material, a material having excellent film forming properties and excellent film stability is used as the organic light emitting material. Examples of such an organic light-emitting material, specifically, for example, Alq 3 - include metal complexes represented by _(tris (8-hydroxyquinolinato) aluminum), polyphenylene vinylene (PPV) derivatives, and polyfluorene derivatives It is done. As the organic light-emitting material used together with the host material, since the addition amount is small, in addition to the organic light-emitting material, a fluorescent dye that is difficult to form a stable thin film by itself can be used. Examples of fluorescent dyes include coumarin, DCM derivatives, quinacridone, perylene, rubrene and the like. Examples of the host material include Alq ₃ , TPD (triphenyldiamine), an electron transporting oxadiazole derivative (PBD), a polycarbonate copolymer, and polyvinyl carbazole. Further, when the light emitting layer 20 is formed of an organic light emitting material as described above, a small amount of an organic light emitting material such as a fluorescent dye can be added in order to adjust the light emission color.

  The thickness of the light emitting layer 20 is preferably 200 nm or less in order to obtain practical light emission luminance. The light emitting layer 20 can be formed by the same method as the hole transport layer 21.

  1 to 5 exemplify a case where the organic layer 22 has a layer configuration in which the hole transport layer 21 / the light emitting layer 20 are stacked in this order from the anode layer 12 side. In addition, the organic layer 22 may have a layer structure in which the light emitting layer 20 / electron injection layer, the hole transport layer 21 / light emitting layer 20 / electron injection layer are stacked in this order from the anode layer 12 side. . The organic material layer 22 may be composed of a single light emitting layer 20. Moreover, the anode base material 14 and the cathode base material 18 may have a barrier layer having a function of not allowing oxygen and / or moisture in the external environment to permeate.

When forming the electron injection layer, the materials include nitro-substituted fluorene derivatives, diphenylquinone derivatives, thiopyran dioxide derivatives, heterocyclic tetracarboxylic anhydrides such as naphthalene pyrylene, carbodiimides, fluorenylidenemethane derivatives, anthra Examples of the electron transporting material include quinodimethane, anthrone derivatives, oxadiazole derivatives, quinoline derivatives, quinoxaline derivatives, perylene derivatives, pyridine derivatives, pyrimidine derivatives, and stilbene derivatives. Alternatively, an aluminum quinolinol complex such as tris (8-hydroxyquinoline) aluminum (Alq ₃ ) may be used.

  The thickness of the electron injection layer is preferably in the range of 5 to 300 nm. The electron injection layer can be formed by the same method as the hole transport layer 21.

  The insulating adhesive layer 24 may be any material as long as it has electrical insulation and is in close contact with the layer or substrate in contact therewith. As the insulating adhesive layer 24, a material having adhesiveness and tackiness can be suitably used. The insulating adhesive layer 24 is preferably formed of an adhesive material from the viewpoints of easily preventing peeling and the like and improving the stability as a structure.

  Specific examples of the material for the insulating adhesive layer 24 include thermosetting resins such as epoxy resins and phenol resins, rubber components such as NBR, polyethylene, Examples include olefin resins such as polypropylene, acrylic resins such as PMMA, polyamide resins, urethane resins, vinyl resins, and the like.

  The insulating adhesive layer 24 can be formed by a method of drawing a coating liquid for forming an insulating adhesive layer using a dispenser or the like, a transfer method of transferring the insulating adhesive layer formed on the surface of the release film, or the like. .

  The thickness of the insulating adhesion layer 24 is preferably 0.05 to 5 μm, more preferably 0.1 to 1 μm, and still more preferably 0.1 to 0.1 μm, from the viewpoints of ease of formation, increase in short-circuit suppressing effect, and the like. It is good to be in the range of 0.5 μm.

  Examples of the material of the cathode layer 16 include metals having a low work function (4 eV or less), alloy compositions, conductive compounds, or mixtures thereof. Specifically, for example, metals such as Al, Ti, In, Na, K, Ca, Mg, Ba, Li, Cs, Rb and rare earth metals, Na—K alloys, Mg—Ag alloys, Mg—Cu alloys, And alloy compositions such as Al-Li alloys.

  The thickness of the cathode layer 16 is generally 1 μm or less, and more preferably 200 nm or less. The resistance of the cathode layer 16 is 1 Ω / sq. The following is preferable. The cathode layer 16 can be formed by the same method as the anode layer 12.

  The light emitter 10 basically has the above-described configuration. In addition to the above-described configuration, the light emitter 10 may further include a barrier base material. FIG. 11 shows the luminous body having a barrier substrate. FIG. 11A is an external perspective view, and FIG. 11B is an AA cross-sectional view. 11 is the same as that shown in FIG. 4, and the anode layer 12 and the cathode layer 16 are omitted.

  As shown in FIG. 11, the periphery of the light emitter 11 is sealed with a barrier base material 26. FIG. 11 illustrates a state in which the sealing portion 28 is formed on the entire circumference of the light emitter 10 (extraction electrodes 13a and 13b are formed from the anode layer 12 and the cathode layer 16). Note that a part of the light emitter 10 may exist in the sealing portion 28. A structure in which a part of the light emitter 10 is present in the sealing portion 28 can be suitably obtained by the cutting method described later.

  In addition, FIG. 11 illustrates a case where bonding is performed in a state where the light emitter 10 is sandwiched between planar barrier substrates 26a and 26b such as a film shape or a sheet shape. Thus, when the light emitter 10 is sandwiched between the two barrier base materials 26a and 26b and the periphery is sealed, the manufacturability of a long object is excellent. However, although not shown, the light emitter 10 may be housed in a bag-like barrier base material and the bag opening may be sealed. In addition, when the light emitter 10 is sandwiched between the barrier base materials 26a and 26b, the necessity of additionally forming a barrier layer on the anode base material 14 or the cathode base material 18 is reduced, and the anode layer, the organic material layer, It becomes difficult to inhibit the film formability of other layers such as the cathode layer. Furthermore, since the barrier base materials 26a and 26b that easily impart a barrier function to a necessary portion can be used, the manufacturing cost can be reduced accordingly. For this reason, sealing with the barrier base materials 26 a and 26 b is more preferable than forming a barrier layer on the anode base material 14 or the cathode base material 18.

  The barrier base material 26 has a function of not allowing oxygen and / or moisture in the external environment to permeate. As a configuration of this type of barrier substrate 26, for example, a polymer substrate on which a barrier functional film is formed is preferable from the viewpoint of excellent flexibility, barrier substrate strength, thermocompression bonding property, and the like. It can be illustrated as a thing. The polymer substrate may be composed of one type or two or more types of polymers, or one or more types of polymer substrates may be laminated. In addition, the barrier functional film may be formed of one type or two or more types of thin films or foils of the same or different types.

Examples of the material of the polymer substrate include polyesters such as polyethylene terephthalate and polyethylene naphthalate, polyolefins such as biaxially stretched polypropylene, polyethersulfone, and transparent polyimide. Of these, polyethylene terephthalate and polyethylene naphthalate are preferable from the viewpoint of surface smoothness, heat resistance, production cost, and the like. The material of the barrier functional film, for _example, can be exemplified _{SiO 2, TiO 2, SiON,} SiN, Al, Al alloy, ITO or the like. Among these, Al, Al alloys, and the like are preferable from the viewpoints of transparency and the like, and from the viewpoints of single layer, multiple layers, manufacturing cost, and the like of SiO ₂ and SiON.

  Of course, the anode base material 14 side of the light emitter 10 in the barrier base material 26 has transparency in order to extract light emission, but the cathode base material 18 side of the light emitter 10 is transparent. It may be transparent or opaque and is not particularly limited. In addition, an opaque metal foil such as an Al foil or a Cu foil can be applied to the barrier substrate 26 on the cathode substrate side.

Of the barrier substrate 26, the illuminant 10 on the anode substrate 14 side is excellent in balance of transparency, barrier function, heat resistance, etc., and therefore, a polyethylene terephthalate film with a SiO ₂ thin film or the like can be suitably used. . On the other hand, in the barrier base material 26, on the cathode base material 18 side of the light emitter 10, since a balance of barrier function, base material strength, cost and the like is excellent, a polyethylene terephthalate film with an Al foil is preferably used. it can.

  When the barrier functional film on the surface of the polymer base material constituting the barrier base material 26 has a large irregularity on the surface of the base material, a pinhole-like defect can be formed in the barrier functional film. Cheap. For this reason, the surface roughness Ra is preferably 100 nm or less, more preferably 50 nm or less, and even more preferably 1 nm or less.

2. This Manufacturing Method This manufacturing method is a suitable method for obtaining the luminous body 10. This manufacturing method suitably utilizes the bonding of the anode base material and the cathode base material to obtain the layer configuration. Hereinafter, an example of a method for manufacturing the luminous body 10 having the cross section shown in FIG. 1 will be described as the manufacturing method. In addition, the manufacturing method of this light emitting body 10 having another cross section is manufactured according to the method described below by changing the film formation order, position, and the like of the insulating adhesive layer 24 according to the laminated structure. be able to. Therefore, detailed description is omitted.

  First, an anode substrate having an anode layer formed on the substrate surface is prepared. In addition, a cathode substrate having a cathode layer formed on the substrate surface is prepared.

  Next, a hole transport layer, a light emitting layer, and an insulating adhesion layer are sequentially formed on the anode layer surface of the prepared anode base material.

  Next, the light emitting layer surface on which the insulating adhesion layer of the anode base material is formed and the cathode layer surface of the cathode base material are overlapped with each other, and the roll temperature is set to a predetermined temperature in this state. Heat and pressurize by passing between a pair of heated rolls. Or it heats and pressurizes with the press set to predetermined temperature. Basically, the light emitter 10 can be manufactured through the above steps.

  As the heating / pressurizing method, the former thermal laminating method can be preferably used. This is because rolls, tows, and rolls are possible, which contributes to the improvement of productivity by continuous production, and it is easy to form a long shape such as a tape shape. Note that the heating temperature, the applied pressure, and the like can be appropriately selected as appropriate in accordance with the light emitting material, the organic layer material, and the like.

  When the barrier substrate 26 is coated around the light emitter 10, the barrier substrate 26a of the above-described material is provided on the anode substrate 14 side and the cathode substrate side 18 of the light emitter 10 obtained above. , 26b, respectively, and the periphery of the luminous body 10 may be sealed by thermocompression bonding or the like.

3. This cutting method This cutting method is a method of cutting the light-emitting body having the above-described barrier substrate, and includes the following thermocompression bonding step and cutting step. FIG. 12 shows the procedure of this cutting method. Fig.12 (a) is a top view of the light-emitting body which has a barrier base material. FIG. 12B is a diagram for explaining the thermocompression bonding process. FIG. 12C is a diagram for explaining the cutting process.

(Thermo-compression process)
In this cutting method, the thermocompression bonding step is a step of performing thermocompression bonding from the surface of the barrier base material 26 of the light emitter 11 as shown in FIG. In this thermocompression bonding process, thermocompression bonding is performed in a direction intersecting with the longitudinal direction of the light emitter 11. FIG. 12 illustrates a case where thermocompression bonding is performed in a direction substantially perpendicular to the longitudinal direction of the light emitter 11.

  The thermocompression bonding means is not particularly limited, and a known heat sealer, impulse sealer, or the like can be used. The thermocompression bonding part 30 is formed in the light-emitting body 11 by the said thermocompression bonding. In the thermocompression bonding part 30, the barrier base material 26 is heat-sealed to the anode base material 14 and the cathode base material 18 of the light emitting body 10 by heating and pressurization at the time of thermocompression bonding. Note that a part of the light emitter 10 is present in the thermocompression bonding part 30 and the light emitting function of the part of the light emitter 10 existing in the thermocompression bonding part 30 is impaired by the thermocompression bonding. Light can be emitted from the remaining portion.

  The width of the thermocompression bonding portion 30 is not particularly limited, and an optimum width can be selected so that cutting is not hindered. The thermocompression bonding is preferably performed without causing the light emitter to emit light.

(Cutting process)
In this cutting method, the cutting process is a process of cutting along the thermocompression bonding portion 30 formed in the above-described thermocompression bonding process (C1 is a cutting line) as shown in FIG. By passing through this cutting process, the light-emitting body 11 with the cut end face sealed after cutting can be obtained.

  That is, the light-emitting body 11 of FIG. 12C obtained after the cutting also has a structure in which the periphery is sealed with the barrier base material 26. However, the light emitter 11 in FIG. 12C has a new sealing portion 28 (that is, a thermocompression bonding portion 30) generated by thermocompression bonding, and the new sealing portion 28 has light emission. A part of the light-emitting body 10 that has lost its function exists in a state of being sandwiched between the barrier base materials 26.

  The cutting means at the time of cutting is not particularly limited, and various cutting means having a blade portion such as scissors and a cutter can be applied.

  The cutting is preferably performed without causing the light emitter to emit light. In this cutting method, the light-emitting body obtained through the cutting method can be repeatedly cut at different sites.

  Examples of the present invention will be described below.

1. Production of luminous body (Example 1)
<Preparation of anode substrate>
A polyethylene naphthalate (PEN) film having a thickness of 200 μm, a length of 75 mm, and a width of 65 mm was prepared as a film substrate. And on both sides of the film substrate, thereby forming a SiO 2, _SiN as a barrier layer, and further indium tin oxide (ITO) and was deposited to a thickness of 150nm to produce an anode substrate as an anode layer on one side.

<Preparation of cathode substrate>
As a film substrate, SiO ₂ and SiN were formed as barrier layers on both sides of a PEN film having a thickness of 100 μm, a length of 70 mm, and a width of 20 mm, and further Mg—Ag as a cathode layer was formed on one side with a vacuum film forming apparatus of 200 nm. A cathode base material was produced by forming a film to a thickness.

<Formation of hole transport layer>
The anode substrate was subjected to ultrasonic cleaning in the order of pure water, organic alkali cleaning solution (Furuuchi Chemical Co., Ltd .: Semico Clean), pure water, and acetone solution for 5 minutes each. Then, it processed for 30 minutes with the UV ozone cleaner.

  Next, on the surface of the anode layer of the cleaned anode base material, a coating solution for forming a hole transport layer [PEDOT: PSS aqueous solution (manufactured by Starck Co., Ltd.) diluted with IPA] was spin-coated to have a rotational speed of 2000 rpm × 60 The coating was carried out for 2 seconds and dried in an oven at 120 ° C. for 30 minutes to form a hole transport layer having a thickness of 100 nm.

<Formation of light emitting layer>
A polyfluorene-based light emitting material (glass transition temperature: 116 ° C., DSC method) is applied as a light emitting layer material to the surface of the hole transport layer of the anode base material by a spin coat method so as to have a thickness of 80 nm, and dried. A light emitting layer was formed.

<Formation of insulating adhesive layer>
Next, a coating liquid for forming an insulating adhesive layer (epoxy resin and polyamide resin diluted with toluene and methanol) is applied to the surface of the light emitting layer of the anode substrate with a microdispenser, and pressure is applied. Vacuum-dried at 0.1 MPa and a temperature of 80 ° C. for 5 minutes to form an insulating adhesive layer having a thickness of 0.2 μm.

  At this time, as shown in FIG. 6, the insulating adhesion layer is formed by drawing a pair of substantially parallel linear portions (width of each linear portion 0.5 mm) on both edges in the longitudinal direction of the light emitting layer. did.

<Lamination>
Two heating rolls in which the anode base material and the cathode base material on which the insulating adhesive layer is formed are overlapped so that the insulating adhesive layer, the light emitting layer and the cathode layer are in contact with each other, and the temperature is set to 140 ° C. The laminated anode base material and cathode base material are pressurized so that the roll pressure is 2 MPa, and the light emitting layer and the insulating adhesive layer are softened to join them. The light emitter according to Example 1 was obtained.

(Example 2)
When forming the insulating adhesive layer of Example 1, in addition to drawing a pair of linear portions, as shown in FIG. 7, a bridge portion (width 1 mm, pitch 5 mm) connecting the pair of linear portions was drawn. In the same manner, a light emitter according to Example 2 was obtained.

(Example 3)
In Example 1, a light emitter was manufactured in the same manner except that the barrier layer was not formed on the anode base material and the cathode base material.

Next, as a barrier substrate, a SiO ₂ thin film-attached PET film substrate (Mitsubishi Resin Co., Ltd., “Tech Barrier”) and an Al foil-coated PET film substrate (Panac Co., Ltd., “Alpet”) are prepared. And the produced light-emitting body was pinched | interposed between these two film base materials with a thin film. At this time, the two film base materials were arranged with the respective thin film forming surfaces facing the light emitters. Also, the anode substrate side of the light emitter, a thin SiO ₂ film with a PET film substrate, the cathode base side of the light emitter placed the Al foil PET film substrate respectively. Moreover, the copper tape with a conductive adhesive was each affixed on the anode layer of an anode base material, and the cathode layer of a cathode base material, and the extraction electrode extended outside the film base material with each thin film was formed.

  Next, the periphery of the light emitter was sealed with a heat sealer. This produced the light-emitting body which has a barrier base material based on Example 3. FIG.

2. Evaluation 1
In a state where the manufactured light emitters according to Example 1 and Example 2 were caused to emit light, the light emitting body was cut in a direction perpendicular to the longitudinal direction (C1 in FIG. 6) at a portion having a light emitting layer. As a result, as shown in FIG. 13 (before cutting, Example 1) and FIG. 14 (after cutting, Example 1), it was confirmed that light emission could be maintained even after cutting. From these results, it can be said that the light emitters according to Example 1 and Example 2 can maintain light emission even when cut, and have a high degree of freedom in cutting.

3. Evaluation 2
About the produced light emitter with the barrier base material according to Example 3 (FIG. 15), thermocompression bonding was performed from the surface of the barrier base material using a heat sealer in a state where no voltage was applied (FIG. 15). 16). The thermocompression bonding was performed in a direction substantially perpendicular to the longitudinal direction. Moreover, the width | variety of the formed thermocompression bonding site | part was 10 mm.

  Next, electricity was applied to the light emitting body with a barrier base material according to Example 3 after forming the thermocompression bonding portion (voltage 4.9 V was applied. The amount of current relating to the two light emitting surfaces was 0.04 A). As a result, as shown in FIG. 17, the thermocompression bonding part did not emit light, but both sides of the thermocompression bonding part could emit light without any problem.

  Next, the voltage application was released, and cutting was performed along the thermocompression bonding portion using scissors. As a result, as shown in FIG. 18, it was confirmed that light emission could be maintained even after cutting. In addition, the amount of current (0.04 A) relating to the two light emitting surfaces hardly changed. For this reason, it was also confirmed that no energization failure such as leakage occurred. Moreover, when the light-emitting body with a barrier base material obtained after cutting was observed, the cut end face was sealed. From this result, it can be said that the light emitter with the barrier base material according to Example 3 has a high degree of freedom in cutting and can further contribute to the improvement of the light emission lifetime by the barrier base material.

  As described above, the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the spirit of the present invention.

10 Light Emitter 11 Light Emitter (with Barrier Substrate)
12 Anode layer 13a Extraction electrode 13b Extraction electrode 14 Anode substrate 16 Cathode layer 18 Cathode substrate 20 Light emitting layer 21 Hole transport layer 22 Organic layer 24 Insulating adhesion layer 24a Linear portion 24b Linear portion 24c Crosslinked portion 24d Dot portion 26 Barrier base material 28 Sealing part 30 Thermocompression bonding part C1-C3 Planned cutting direction

Claims (11)

An anode substrate with an anode layer;
A cathode substrate with a cathode layer;
An organic layer including a light-emitting layer sandwiched between the anode layer and the cathode layer;
An insulating adhesive layer disposed between the anode substrate and the cathode substrate;
The insulative adhesion layer is a pair of lines located on the both sides in the longitudinal direction of the light emitting layer, on both sides in the longitudinal direction of the light emitting layer, or on one side in the longitudinal direction of the light emitting layer and on the outside in the other longitudinal direction. A light emitting body having a shape portion.   The light emitting body according to claim 1, wherein the cutting direction is a direction intersecting the longitudinal direction.   The light-emitting body according to claim 1 or 2, wherein the light-emitting body is formed by bonding.   The light emitting body according to any one of claims 1 to 3, wherein the insulating adhesive layer includes a reinforcing portion between the pair of linear portions in a plan view.   5. The reinforcing portion is one or more selected from a bridging portion connecting the pair of linear portions, a dot portion, and a linear portion different from the pair of linear portions. The light emitter described in 1.   The light-emitting body according to claim 1, wherein the insulating adhesive layer is disposed in close contact with the cathode layer and / or the anode layer.   The light emitting body according to claim 1, wherein the insulating adhesive layer is between the organic material layer and the cathode layer.   The light-emitting body according to claim 1, wherein the light-emitting body is formed in a tape shape.   The light emitting body according to any one of claims 1 to 8, wherein the periphery thereof is sealed with a barrier base material.   The light-emitting body according to claim 9, wherein a part of the light-emitting body that has lost its light-emitting function exists in the sealed portion. It is the cutting method of the light-emitting body according to claim 9 or 10,
A thermocompression bonding step in which the direction intersecting the longitudinal direction of the light emitter is thermocompression bonded from the surface of the barrier substrate;
A cutting step of cutting along the formed thermocompression bonding portion;
A method of cutting a light emitter, comprising: