JP2009211828A - Illuminating device and method of manufacturing illuminating device - Google Patents

Illuminating device and method of manufacturing illuminating device Download PDF

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JP2009211828A
JP2009211828A JP2008050919A JP2008050919A JP2009211828A JP 2009211828 A JP2009211828 A JP 2009211828A JP 2008050919 A JP2008050919 A JP 2008050919A JP 2008050919 A JP2008050919 A JP 2008050919A JP 2009211828 A JP2009211828 A JP 2009211828A
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light emitting
organic light
support substrate
substrate
cathode
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Junji Kakigi
淳司 柿木
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Rohm Co Ltd
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Rohm Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an illuminating device with light and dark points due to joints suppressed, and to provide a method of manufacturing the same. <P>SOLUTION: The illuminating device 30 includes: an organic light-emitting element 10 having flexibility with an organic light-emitting layer 3 arranged in a state pinched by an positive electrode 2 and a negative electrode 4 on a substrate 1 and sealed with a sealing plate 7 together with the positive electrode 2 and the negative electrode 4, and with an positive electrode terminal 2a and a negative electrode terminal 4a exposed from the sealing plate 7; and a nearly cylindrical support substrate 20 having a notched part 20a along an axis direction. The organic light-emitting element 10 is arranged folded on the surface of the support substrate 20, with the positive electrode terminal 2a and the negative electrode terminal 4a arranged in the vicinity of the notched part 20a. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、有機発光素子を用いた照明装置及び照明装置の製造方法に関し、特に、つぎ目による明暗の発生を改善した照明装置及び照明装置の製造方法に関する。   The present invention relates to a lighting device using an organic light emitting element and a method for manufacturing the lighting device, and more particularly, to a lighting device and a method for manufacturing the lighting device that improve the occurrence of light and darkness due to the next.

近年、有機発光素子として有機EL(EL:Electroluminescence)素子を用いた照明装置が実用化に向けて開発が進められている。従来、有機発光部や電極を保護するために封止ガラス等で封止した有機EL素子が知られている(例えば、特許文献1参照。)。   In recent years, lighting devices using organic EL (EL) elements as organic light-emitting elements have been developed for practical use. 2. Description of the Related Art Conventionally, an organic EL element sealed with sealing glass or the like in order to protect an organic light emitting unit or an electrode is known (for example, see Patent Document 1).

図7に、従来の有機EL素子構造の一例を示す。従来の有機EL素子では、ガラス基板51上に積層して形成された陽極52、発光層53、及び絶縁層55を介して陽極52と絶縁された陰極54を、ガラスからなる封止板57でシール材56によってガラス基板51上に接着封止している。   FIG. 7 shows an example of a conventional organic EL element structure. In a conventional organic EL element, an anode 52 formed by laminating on a glass substrate 51, a light emitting layer 53, and a cathode 54 insulated from the anode 52 via an insulating layer 55 are formed by a sealing plate 57 made of glass. The sealing material 56 is adhesively sealed on the glass substrate 51.

上述した有機EL素子を用いて、広範囲に照明する場合、有機EL素子を複数並べて配置する必要がある。しかしながら、図7に示すように、有機EL素子には発光層53の基板51側における発光領域とシール材56の基板51側において非発光領域があるため、発光領域と有機EL素子間のつぎ目における非発光領域により明暗が生じ、暗部が縞状に見えるなど、光に一体感が得られないといった問題があった。
特開2007−128726号公報
When the above-described organic EL element is used to illuminate a wide range, it is necessary to arrange a plurality of organic EL elements side by side. However, as shown in FIG. 7, the organic EL element has a light emitting region on the substrate 51 side of the light emitting layer 53 and a non-light emitting region on the substrate 51 side of the sealing material 56. There is a problem that light and darkness is caused by the non-light emitting region in the light, and the dark portion looks like a stripe shape, so that a sense of unity cannot be obtained in the light.
JP 2007-128726 A

本発明の目的は、つぎ目による明暗の発生を改善した照明装置及び照明装置の製造方法を提供することにある。   The objective of this invention is providing the manufacturing method of the illuminating device and illuminating device which improved generation | occurrence | production of the brightness by the next.

上記目的を達成するための本発明の一態様によれば、基板上に陽極及び陰極に挟まれた有機発光層を配置し、前記陽極及び前記陰極と共に前記有機発光層が封止板で封止され、該封止板から陽極端子及び陰極端子が露出した、可撓性を有する有機発光素子と、軸方向に沿って切欠部を有する略円筒状の支持基板とを備え、前記有機発光素子は、前記支持基板の表面に折曲して配置され、前記陽極端子及び前記陰極端子を前記切欠部近傍に配置したことを特徴とする照明装置が提供される。   According to one aspect of the present invention for achieving the above object, an organic light emitting layer sandwiched between an anode and a cathode is disposed on a substrate, and the organic light emitting layer is sealed with a sealing plate together with the anode and the cathode. A flexible organic light-emitting element having an anode terminal and a cathode terminal exposed from the sealing plate, and a substantially cylindrical support substrate having a cutout portion along the axial direction, the organic light-emitting element comprising: A lighting device is provided, wherein the lighting device is bent on the surface of the support substrate, and the anode terminal and the cathode terminal are arranged in the vicinity of the notch.

上記目的を達成するための本発明の他の態様によれば、基板上に陽極及び有機発光層を形成する工程と、絶縁層及び陰極を形成する工程と、絶縁層及び封止板を形成して有機発光素子を作製する工程と、円筒部材に切欠部を形成して支持基板を形成する工程と、前記有機発光素子を折曲して前記支持基板の表面に取付ける工程とを有する照明装置の製造方法が提供される。   According to another aspect of the present invention for achieving the above object, a step of forming an anode and an organic light emitting layer on a substrate, a step of forming an insulating layer and a cathode, and forming an insulating layer and a sealing plate are formed. An organic light emitting device, a step of forming a notch in a cylindrical member to form a support substrate, and a step of bending the organic light emitting device and attaching it to the surface of the support substrate. A manufacturing method is provided.

本発明の照明装置及び照明装置の製造方法によれば、つぎ目による明暗の発生を改善することができる。   According to the illumination device and the method of manufacturing the illumination device of the present invention, it is possible to improve the occurrence of light and darkness due to the next.

以下、図面を参照して本発明の実施の形態による照明装置を説明する。以下の図面の記載において、同一又は類似の部分には同一又は類似の符号を付している。ただし、図面は模式的なものであり、現実のものとは異なり、また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることに留意すべきである。   Hereinafter, a lighting device according to an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, differ from actual ones, and also include portions having different dimensional relationships and ratios between the drawings.

[第1の実施の形態]
(照明装置の構造)
本発明の第1の実施の形態に係る照明装置は、図1及び図2に示すように、基板1上に陽極2及び陰極4に挟まれた有機発光層3を配置し、陽極2及び陰極4と共に有機発光層3が封止板7で封止され、封止板7から陽極端子2a及び陰極端子4aが露出した、可撓性を有する有機発光素子10と、軸方向に沿って切欠部20aを有する略円筒状の支持基板20とを備え、有機発光素子10は、支持基板20の表面に折曲して配置され、陽極端子2a及び陰極端子4aを切欠部20a近傍に配置する。なお、図1において、有機発光素子10の断面構造は省略して記載してある。
[First embodiment]
(Structure of lighting device)
As shown in FIGS. 1 and 2, the lighting device according to the first embodiment of the present invention includes an organic light emitting layer 3 sandwiched between an anode 2 and a cathode 4 on a substrate 1. 4, the organic light emitting layer 3 is sealed with a sealing plate 7, the anode terminal 2 a and the cathode terminal 4 a are exposed from the sealing plate 7, and a flexible organic light emitting element 10, and a notch along the axial direction. The organic light emitting device 10 is bent on the surface of the support substrate 20 and the anode terminal 2a and the cathode terminal 4a are disposed in the vicinity of the notch 20a. In FIG. 1, the cross-sectional structure of the organic light emitting element 10 is omitted.

第1の実施の形態においては、複数の有機発光素子10が支持基板20の軸方向に沿って互いに隣接して配置される。  In the first embodiment, the plurality of organic light emitting elements 10 are arranged adjacent to each other along the axial direction of the support substrate 20.

有機発光素子10は、図2(a)に示すように、基板1上に、陽極2、有機発光層3及び陰極4が順に積層されて形成されている。陽極2と陰極4は絶縁層5,6を介して絶縁されており、陽極2には陽極2が延伸して配置された陽極端子2aが、陰極4には陰極4が延伸して配置された陰極端子4aがそれぞれ形成されている。有機発光層3の陽極2と陰極4とで上下に挟まれた部分が発光領域となる。なお、図2(a)は、図2(b)のI−I線の断面構造図を示す。   As shown in FIG. 2A, the organic light emitting element 10 is formed by sequentially laminating an anode 2, an organic light emitting layer 3, and a cathode 4 on a substrate 1. The anode 2 and the cathode 4 are insulated through insulating layers 5 and 6, the anode 2 has an anode terminal 2 a arranged with the anode 2 extended, and the cathode 4 has the cathode 4 arranged with an extension. Cathode terminals 4a are respectively formed. A portion sandwiched between the anode 2 and the cathode 4 of the organic light emitting layer 3 is a light emitting region. FIG. 2A shows a cross-sectional structure view taken along the line II of FIG.

有機発光素子10は、図2(b)に示すように、平面視で略四角形の形状を有しており、一方の対向する一対の辺の外縁部の全体又は一部に陽極端子2a及び陰極端子4aが配置されている。後述するように、複数の有機発光素子10を支持基板20に配置する際、陽極端子2a及び陰極端子4a側を切欠部20a側に配置し、他方の対向する一対の辺側に互いに隣接して有機発光素子10を配置する。これにより、支持基板20の軸方向の有機発光素子10間のつぎ目において発光領域が近接するので、つぎ目の部分における明暗の発生が低減される。   As shown in FIG. 2B, the organic light emitting element 10 has a substantially square shape in plan view, and an anode terminal 2a and a cathode are formed on the whole or a part of the outer edges of one pair of opposing sides. Terminal 4a is arranged. As will be described later, when the plurality of organic light emitting devices 10 are arranged on the support substrate 20, the anode terminal 2a and the cathode terminal 4a side are arranged on the notch portion 20a side and adjacent to the other pair of opposite sides. The organic light emitting device 10 is disposed. Thereby, since the light emitting region is close at the next between the organic light emitting elements 10 in the axial direction of the support substrate 20, the occurrence of light and darkness at the next portion is reduced.

有機発光素子10は、封止板7により陽極端子2a及び陰極端子4aを除いて、陰極4側の表面が封止されている。   The surface of the organic light emitting device 10 on the cathode 4 side is sealed by the sealing plate 7 except for the anode terminal 2a and the cathode terminal 4a.

この照明装置30では、基板1側から光が取り出されるように構成されているので、基板1は、可撓性を有し、かつ光を透過する透明基板が用いられる。基板1の材質として、例えば、ポリカーボネート、ポリエチレンテレフタレート等の透明な樹脂やガラス等が挙げられる。厚さは、例えば、約50〜500μm程度であるのがよい。   Since the illumination device 30 is configured such that light is extracted from the substrate 1 side, the substrate 1 is a transparent substrate that has flexibility and transmits light. Examples of the material of the substrate 1 include transparent resins such as polycarbonate and polyethylene terephthalate, and glass. The thickness is preferably about 50 to 500 μm, for example.

陽極2は、基板1と同様に、光を透過可能で、厚さは、例えば、約150〜160nm程度のITO(インジウム−スズ酸化物)の透明電極からなる。   As with the substrate 1, the anode 2 can transmit light and has a thickness of, for example, a transparent electrode of ITO (indium-tin oxide) having a thickness of about 150 to 160 nm.

基板1と陽極2の間には、ガスバリア層(略図示)を配置することが好ましい。これにより、有機発光素子10の寿命の劣化の原因となる水蒸気の侵入を防止することができる。ガスバリア層としては、例えば、酸化ケイ素や酸化アルミニウム等の金属酸化物又は窒化アルミニウム、窒化珪素等の金属窒化物が挙げられる。   A gas barrier layer (schematically illustrated) is preferably disposed between the substrate 1 and the anode 2. Thereby, the invasion of water vapor that causes deterioration of the lifetime of the organic light emitting device 10 can be prevented. Examples of the gas barrier layer include metal oxides such as silicon oxide and aluminum oxide, or metal nitrides such as aluminum nitride and silicon nitride.

有機発光層3は、基板1側から、正孔輸送層、発光部及び電子輸送層が順に積層されている。   In the organic light emitting layer 3, a hole transport layer, a light emitting portion, and an electron transport layer are sequentially laminated from the substrate 1 side.

正孔輸送層は、陽極2から注入された正孔を円滑に発光部に輸送するためのものであり、厚さは、例えば、約60nm程度のNPB(N,N−ジ(ナフタリル)−N,N−ジフェニル−ベンジデン)からなる。   The hole transport layer is for smoothly transporting holes injected from the anode 2 to the light emitting portion, and has a thickness of, for example, about NPB (N, N-di (naphthalyl) -N of about 60 nm. N-diphenyl-benzylidene).

電子輸送層は、陰極4から注入された電子を円滑に発光部に輸送するためのものであり、厚さは、例えば、約35nm程度のAlq(アルミニウムキノリノール錯体)からなる。 The electron transport layer is for smoothly transporting electrons injected from the cathode 4 to the light emitting portion, and is made of, for example, Alq 3 (aluminum quinolinol complex) having a thickness of about 35 nm.

発光部は、注入された正孔及び電子が再結合して発光するためのものであり、例えば発光種であるクマリン化合物(C545T)が、例えば、約1%程度ドーピングされ、厚さが、例えば、約30nm程度のAlqからなる。 The light emitting portion is for emitting light by recombination of injected holes and electrons. For example, a coumarin compound (C 545 T), which is a luminescent species, is doped with, for example, about 1% and has a thickness of For example, it is made of Alq 3 of about 30 nm.

なお、有機発光層3は、上記、正孔輸送層、電子輸送層以外の層、例えば、正孔注入層、電子注入層等を用いて構成しても良い。   In addition, you may comprise the organic light emitting layer 3 using layers other than the said positive hole transport layer and an electron carrying layer, for example, a positive hole injection layer, an electron injection layer, etc.

陰極4は、厚さが、例えば、約150nm程度のアルミニウムからなる。   The cathode 4 is made of aluminum having a thickness of about 150 nm, for example.

封止板7は、陽極2、陰極4、および有機発光層3を保護し、これらを封止するものであり、可撓性を有する。封止板7の材質としては、ガラス、ステンレススチール(SUS)や銅等の金属、或いはセラミック、樹脂等が挙げられる。厚さは、例えば、約50〜500μm程度であるのがよい。   The sealing plate 7 protects the anode 2, the cathode 4, and the organic light emitting layer 3, seals them, and has flexibility. Examples of the material of the sealing plate 7 include glass, metals such as stainless steel (SUS) and copper, ceramics, resins, and the like. The thickness is preferably about 50 to 500 μm, for example.

基板1及び封止板7が可撓性を有するので、有機発光素子10は良好な可撓性を有する。これにより、後述するように、照明装置30の製造の際、有機発光素子10を折曲し、支持基板20に容易に取付けることができる。   Since the substrate 1 and the sealing plate 7 have flexibility, the organic light emitting element 10 has good flexibility. Accordingly, as described later, the organic light emitting element 10 can be bent and easily attached to the support substrate 20 when the lighting device 30 is manufactured.

支持基板20は、複数の有機発光素子10を配置して支持するためのものである。支持基板20は、略円筒状の形状を有しており、軸方向に沿って切欠部20aが形成されている。切欠部20aの大きさは、横断面視で、例えば、円周の1/16〜1/4程度である。   The support substrate 20 is for arranging and supporting the plurality of organic light emitting elements 10. The support substrate 20 has a substantially cylindrical shape, and a notch 20a is formed along the axial direction. The size of the notch 20a is, for example, about 1/16 to 1/4 of the circumference in a cross-sectional view.

支持基板20は、有機発光素子10で発生した熱を放熱するための放熱板の機能も有する。   The support substrate 20 also has a function of a heat radiating plate for radiating heat generated in the organic light emitting element 10.

支持基板20は、材質としては、例えば熱伝導性が良好であれば、特に限定されない。例えば、金属や樹脂等が挙げられる。好ましくは銅やアルミニウム等である。また、厚さは、例えば、約1〜10mm程度である。   The material of the support substrate 20 is not particularly limited as long as the thermal conductivity is good, for example. For example, a metal, resin, etc. are mentioned. Preferably, copper or aluminum is used. The thickness is about 1 to 10 mm, for example.

(動作原理)
本発明の第1の実施の形態に係る照明装置の動作原理は以下の通りである。
(Operating principle)
The operation principle of the lighting device according to the first embodiment of the present invention is as follows.

まず、外部電極(略図示)から有機発光素子10の陽極端子2a及び陰極端子4aを介して、陽極2及び陰極4の間に一定の電圧が印加される。これにより、陽極2から正孔輸送層を介して発光部に正孔が注入されるとともに、陰極4から電子輸送層を介して発光部に電子が注入される。そして、発光部に注入された正孔と電子とが再結合することによって、光を発光する。発光された光は、基板1を介して外部に出射される。   First, a constant voltage is applied between the anode 2 and the cathode 4 from the external electrode (illustrated) through the anode terminal 2 a and the cathode terminal 4 a of the organic light emitting device 10. As a result, holes are injected from the anode 2 into the light emitting part through the hole transport layer, and electrons are injected from the cathode 4 into the light emitting part through the electron transport layer. Then, the holes and electrons injected into the light emitting portion recombine to emit light. The emitted light is emitted to the outside through the substrate 1.

(製造方法)
図3及び図4は、本発明の第1の実施の形態による照明装置の製造方法を説明する図である。
(Production method)
3 and 4 are diagrams illustrating a method of manufacturing the lighting device according to the first embodiment of the present invention.

本実施の形態に係る照明装置の製造方法は、基板1上に陽極2及び有機発光層3を形成する工程と、絶縁層5及び陰極4を形成する工程と、絶縁層6及び封止板7を形成して有機発光素子10を作製する工程と、円筒部材に切欠部20aを形成して支持基板20を形成する工程と、有機発光素子10を折曲して支持基板20の表面に取付ける工程とを有する。   The manufacturing method of the lighting device according to the present embodiment includes the step of forming the anode 2 and the organic light emitting layer 3 on the substrate 1, the step of forming the insulating layer 5 and the cathode 4, the insulating layer 6 and the sealing plate 7. Forming the organic light-emitting element 10 by forming the cut-out portion 20a in the cylindrical member, forming the support substrate 20, and folding the organic light-emitting element 10 on the surface of the support substrate 20 And have.

以下に、製造工程を詳述する。   Below, a manufacturing process is explained in full detail.

(a)まず、図3(a)に示すように、基板1上の陽極2をパターニング、エッチングした後、真空蒸着法等により、酸化ケイ素等からなるガスバリア層(略図示)を形成する。 (A) First, as shown in FIG. 3A, after patterning and etching the anode 2 on the substrate 1, a gas barrier layer (illustrated) made of silicon oxide or the like is formed by a vacuum deposition method or the like.

次いで、真空蒸着装置等により、正孔輸送層、発光部、及び電子輸送層を順に成膜して有機発光層3を形成する。   Next, the organic light-emitting layer 3 is formed by sequentially forming a hole transport layer, a light-emitting portion, and an electron transport layer using a vacuum deposition apparatus or the like.

(b)次に、図3(b)に示すように、CVD(Chemical Vapor Deposition)法等によりSiOからなる絶縁層5を形成した後、陰極4をスパッタリング等により成膜する。 (B) Next, as shown in FIG. 3B, after the insulating layer 5 made of SiO 2 is formed by a CVD (Chemical Vapor Deposition) method or the like, the cathode 4 is formed by sputtering or the like.

(c)次に、図3(c)に示すように、CVD法等によりSiOからなる絶縁層6を形成した後、封止板7をスパッタリング等により陽極端子2a及び陰極端子4aを除いて陰極4及び絶縁層5,6の表面に形成する。 (C) Next, as shown in FIG. 3C, after forming the insulating layer 6 made of SiO 2 by the CVD method or the like, the sealing plate 7 is removed by sputtering or the like except the anode terminal 2a and the cathode terminal 4a. It is formed on the surfaces of the cathode 4 and the insulating layers 5 and 6.

(d)次に、図4(d)に示すように、アルミニウムからなる円筒部材に切削加工装置等を用いて、切欠部20aを軸方向に沿って形成し、支持基板20を作製する。支持基板20は、アルミニウムからなる平板をプレスブレーキ等を用いて折り曲げて、切欠部20aを有する円筒状の支持基板20を形成することもできる。 (D) Next, as shown in FIG. 4D, the notch 20a is formed along the axial direction on the cylindrical member made of aluminum using a cutting device or the like, and the support substrate 20 is manufactured. The support substrate 20 can be formed by bending a flat plate made of aluminum using a press brake or the like to form a cylindrical support substrate 20 having a notch 20a.

(e)次に、図4(e)に示すように、有機発光素子10を折曲し、有機発光素子10の封止板7側表面を支持基板20の表面に接着剤等を介して貼り付ける。そして、支持基板20の軸方向に沿って複数の有機発光素子10を互いに隣接して貼り付け、陽極端子2a及び陰極端子4aをクリップ等の外部端子(略図示)で接続し、支持基板20の内部空間に接続配線を収めて、図1に示すような照明装置30が完成する。 (E) Next, as shown in FIG. 4E, the organic light emitting device 10 is bent, and the surface of the organic light emitting device 10 on the sealing plate 7 side is attached to the surface of the support substrate 20 with an adhesive or the like. wear. Then, a plurality of organic light emitting devices 10 are attached adjacent to each other along the axial direction of the support substrate 20, the anode terminal 2 a and the cathode terminal 4 a are connected by an external terminal (schematically illustrated) such as a clip, and the support substrate 20. By connecting the connection wiring in the internal space, the lighting device 30 as shown in FIG. 1 is completed.

このような照明装置30は、有機発光素子10の発光領域が近接して配置されるので、つぎ目の部分においても良好な輝度が得られ、光に一体感のある照明装置30が得られる。   In such an illuminating device 30, since the light emitting regions of the organic light emitting element 10 are arranged close to each other, good luminance can be obtained even at the next portion, and the illuminating device 30 having a sense of unity with light can be obtained.

また、支持基板20は、熱伝導性の部材からなるので、有機発光素子10から発生する熱を効率よく除熱することができる。   Further, since the support substrate 20 is made of a heat conductive member, the heat generated from the organic light emitting element 10 can be efficiently removed.

また、支持基板20の内部空間を配線スペースとして利用できるので、配線部分を隠すことができ、美観性に優れる。   Further, since the internal space of the support substrate 20 can be used as a wiring space, the wiring portion can be hidden, and the aesthetics are excellent.

本実施の形態に係る照明装置及び照明装置の製造方法によれば、つぎ目による明暗の発生を改善することができる。   According to the illumination device and the method for manufacturing the illumination device according to the present embodiment, it is possible to improve the occurrence of light and darkness due to the next.

[第2の実施の形態]
本発明の第2の実施の形態に係る照明装置は、図5に示すように、支持基板20の内壁から切欠部20aを貫通して配置した略平板状の支持部材21を更に備える。その他の構成は、第1の実施の形態と同様であるので説明は省略する。なお、図5において、有機発光素子10の断面構造は省略して記載してある。
[Second Embodiment]
As shown in FIG. 5, the lighting device according to the second embodiment of the present invention further includes a substantially flat support member 21 arranged through the notch 20 a from the inner wall of the support substrate 20. Since other configurations are the same as those of the first embodiment, description thereof is omitted. In FIG. 5, the cross-sectional structure of the organic light emitting element 10 is omitted.

支持部材21は、支持基板20を支持し、外部の係止部(略図示)に支持基板20を係止するためのものである。支持部材21は、平板状の形状を有しており、厚さは、例えば、約1〜10mm程度である。   The support member 21 supports the support substrate 20 and locks the support substrate 20 to an external locking portion (illustrated schematically). The support member 21 has a flat plate shape and has a thickness of about 1 to 10 mm, for example.

また、支持部材21は、有機発光素子10で発生した熱を放熱するための放熱板の機能も有する。   The support member 21 also has a function of a heat sink for radiating heat generated in the organic light emitting element 10.

支持部材21は、材質としては、熱伝導性が良好であれば、特に限定されない。例えば、金属や樹脂等が挙げられる。好ましくは銅やアルミニウム等である。  The support member 21 is not particularly limited as long as the material has good thermal conductivity. For example, a metal, resin, etc. are mentioned. Preferably, copper or aluminum is used.

第2の実施の形態に係る照明装置の製造方法は、支持部材21を形成する方法が第1の実施の形態における製造方法と異なる点であり、その他は第1の実施の形態と同様であるので、重複した説明は省略する。   The manufacturing method of the lighting device according to the second embodiment is different from the manufacturing method according to the first embodiment in the method of forming the support member 21, and is otherwise the same as in the first embodiment. Therefore, a duplicate description is omitted.

第2の実施の形態に係る照明装置の製造方法において、アルミニウムからなる平板状の支持部材21を、支持基板20の内壁に接着剤等を介して接合し、切欠部20aを貫通するように形成することにより、照明装置30Aを製造することができる。   In the manufacturing method of the lighting device according to the second embodiment, a flat plate-like support member 21 made of aluminum is joined to the inner wall of the support substrate 20 with an adhesive or the like, and is formed so as to penetrate the notch 20a. By doing so, the illumination device 30A can be manufactured.

或いは、断面がT字型のアルミニウムからなる板の両翼部をプレスブレーキ等を用いて折り曲げて円筒状の支持基板20を形成し、支持基板20と支持部材21を一体化して形成することもできる。   Alternatively, it is also possible to form the cylindrical support substrate 20 by bending both wings of a plate made of aluminum having a T-shaped cross section using a press brake or the like, and to integrally form the support substrate 20 and the support member 21. .

第2の実施の形態によれば、支持基板20の内壁から切欠部20aを貫通して支持部材21を配置したので、支持基板20を安定して所望の場所に設置することができる。   According to the second embodiment, since the support member 21 is disposed through the notch 20a from the inner wall of the support substrate 20, the support substrate 20 can be stably installed at a desired location.

また、第2の実施の形態によれば、支持部材21は伝熱性を有するので、有機発光素子10で発生した熱を支持基板20を介して良好に放熱することができる。  In addition, according to the second embodiment, since the support member 21 has heat conductivity, heat generated in the organic light emitting element 10 can be radiated well through the support substrate 20.

本実施の形態に係る照明装置及び照明装置の製造方法によれば、つぎ目による明暗の発生を改善することができる。   According to the illumination device and the method for manufacturing the illumination device according to the present embodiment, it is possible to improve the occurrence of light and darkness due to the next.

[第3の実施の形態]
本発明の第3の実施の形態に係る照明装置は、図6に示すように、支持部材21の端面に、切欠部20aに対向して支持基板20の上方を覆うように配置した反射部材22を有する。その他の構成は、第2の実施の形態と同様であるので説明は省略する。なお、図6において、有機発光素子10の断面構造は省略して記載してある。
[Third embodiment]
As shown in FIG. 6, the lighting device according to the third embodiment of the present invention is a reflection member 22 arranged on the end surface of the support member 21 so as to cover the upper side of the support substrate 20 so as to face the notch 20 a. Have Since other configurations are the same as those of the second embodiment, description thereof will be omitted. In FIG. 6, the cross-sectional structure of the organic light emitting element 10 is omitted.

反射部材22は、有機発光素子10から切欠部20a側上方に向かって出射される光を反射するためのものである。反射部材22は、切欠部20aに対向して支持基板20の上方を覆うように、横断面が略円弧状の形状を有するのが好ましい。厚さは、例えば、約1〜10mm程度である。   The reflection member 22 is for reflecting the light emitted from the organic light emitting element 10 toward the upper side of the notch 20a. The reflecting member 22 preferably has a substantially arc-shaped cross section so as to cover the upper portion of the support substrate 20 so as to face the notch 20a. The thickness is, for example, about 1 to 10 mm.

また、反射部材22は、有機発光素子10で発生した熱を放熱するための放熱板の機能も有する。   Further, the reflection member 22 also has a function of a heat radiating plate for radiating heat generated in the organic light emitting element 10.

反射部材22は、材質としては、光の反射性がよく、熱伝導性が良好であれば、特に限定されない。例えば、金属や樹脂等が挙げられる。好ましくは銅やアルミニウム等である。樹脂等を用いた場合、反射部材22の内面(切欠部20a側に対向する面)に金属膜等を配置して、光の反射性を高めてもよい。  The reflective member 22 is not particularly limited as long as the material has good light reflectivity and good thermal conductivity. For example, a metal, resin, etc. are mentioned. Preferably, copper or aluminum is used. When resin or the like is used, a metal film or the like may be disposed on the inner surface of the reflecting member 22 (the surface facing the notch portion 20a) to enhance the light reflectivity.

第3の実施の形態に係る照明装置の製造方法は、反射部材22を形成する方法が第2の実施の形態における製造方法と異なる点であり、その他は第2の実施の形態と同様であるので、重複した説明は省略する。   The manufacturing method of the lighting device according to the third embodiment is different from the manufacturing method according to the second embodiment in the method of forming the reflecting member 22, and the other is the same as in the second embodiment. Therefore, a duplicate description is omitted.

第3の実施の形態に係る照明装置の製造方法において、反射部材22を支持部材21の端面に接着剤を介して接合することにより、照明装置30Bを製造することができる。   In the method of manufacturing the lighting device according to the third embodiment, the lighting device 30B can be manufactured by bonding the reflecting member 22 to the end surface of the support member 21 via an adhesive.

第3の実施の形態によれば、切欠部20aに対向して支持基板20の上方を覆うように反射部材22を配置するので、有機発光素子10から切欠部20a側上方に向かって出射される光を効率よく反射することができる。   According to the third embodiment, since the reflection member 22 is disposed so as to cover the upper portion of the support substrate 20 so as to face the notch portion 20a, the light is emitted from the organic light emitting element 10 toward the upper side of the notch portion 20a. Light can be reflected efficiently.

また、第3の実施の形態によれば、反射部材22は伝熱性を有するので、有機発光素子10で発生した熱を支持基板20及び支持部材21を介して良好に放熱することができる。  Further, according to the third embodiment, since the reflection member 22 has heat conductivity, heat generated in the organic light emitting element 10 can be radiated well through the support substrate 20 and the support member 21.

本実施の形態に係る照明装置及び照明装置の製造方法によれば、つぎ目による明暗の発生を改善することができる。   According to the illumination device and the method for manufacturing the illumination device according to the present embodiment, it is possible to improve the occurrence of light and darkness due to the next.

[その他の実施の形態]
以上、上述した第1乃至第3の実施の形態によって本発明を詳細に説明したが、当業者にとっては、本発明が本明細書中に説明した第1乃至第3の実施の形態に限定されるものではないということは明らかである。本発明は、特許請求の範囲の記載により定まる本発明の趣旨及び範囲を逸脱することなく修正及び変更形態として実施することができる。従って、本明細書の記載は、例示説明を目的とするものであり、本発明に対して何ら制限的な意味を有するものではない。以下、上述した第1乃至第3の実施の形態を一部変更した変更形態について説明する。
[Other embodiments]
The present invention has been described in detail with the first to third embodiments described above. However, for those skilled in the art, the present invention is limited to the first to third embodiments described in the present specification. Obviously it is not. The present invention can be implemented as modifications and changes without departing from the spirit and scope of the present invention defined by the description of the scope of claims. Therefore, the description of the present specification is for illustrative purposes and does not have any limiting meaning to the present invention. Hereinafter, modified embodiments in which the first to third embodiments described above are partially modified will be described.

例えば、各層の厚み等の寸法や構成する材料を変更することは可能である。   For example, it is possible to change dimensions such as the thickness of each layer and the constituent materials.

上述した第1の実施の形態に係る照明装置において、支持基板20は略円筒状の形状である説明をしたが、円筒が曲管状に形成されてもよい。これにより、美観性を高めることができるとともに、配置場所に対する自由度を高めることが可能となる。   In the lighting device according to the first embodiment described above, the support substrate 20 has been described as having a substantially cylindrical shape, but the cylinder may be formed in a curved tube shape. Thereby, it is possible to enhance the aesthetics and to increase the degree of freedom with respect to the arrangement location.

上述した第2の実施の形態に係る照明装置において、支持基板20に平板状の支持部材21を配置した説明をしたが、平板状の支持部材21に代えて、支持基板20の両端部或いは切欠部20a近傍に支持基板20を支持する支持部材を適宜設けてもよい。   In the illuminating device according to the second embodiment described above, the description has been made with the flat support member 21 disposed on the support substrate 20, but instead of the flat support member 21, both end portions or notches of the support substrate 20 are provided. A support member that supports the support substrate 20 may be provided as appropriate near the portion 20a.

上述した第3の実施の形態に係る照明装置において、反射部材22は、横断面が略円弧状の形状を有する説明をしたが、横断面を直線状或いは折れ線状等に、適宜変更を加えてもよい。   In the lighting device according to the third embodiment described above, the reflecting member 22 has been described as having a substantially arc-shaped cross section, but the cross section is changed to a linear shape or a polygonal line shape as appropriate. Also good.

本発明の第1の実施の形態に係る照明装置の模式的な一部破断斜視図。The typical partially broken perspective view of the illuminating device which concerns on the 1st Embodiment of this invention. 本発明の第1の実施の形態に係る有機発光素子の説明図であって、(a)模式的断面構造図、(b)模式的平面図。It is explanatory drawing of the organic light emitting element which concerns on the 1st Embodiment of this invention, Comprising: (a) Typical sectional structure drawing, (b) Typical plan view. 本発明の第1の実施の形態に係る照明装置の製造方法の説明図であって、(a)基板1上に陽極2及び有機発光層3を形成する工程図、(b)絶縁層5及び陰極4を形成する工程図、(c)絶縁層6及び封止板7を形成する工程図。It is explanatory drawing of the manufacturing method of the illuminating device which concerns on the 1st Embodiment of this invention, Comprising: (a) Process drawing which forms the anode 2 and the organic light emitting layer 3 on the board | substrate 1, (b) The insulating layer 5 and Process drawing which forms the cathode 4, (c) Process drawing which forms the insulating layer 6 and the sealing board 7. FIG. 本発明の第1の実施の形態に係る照明装置の製造方法の説明図であって、(d)支持基板20を形成する工程図、(e)有機発光素子10を支持基板20に取付ける工程図。It is explanatory drawing of the manufacturing method of the illuminating device which concerns on the 1st Embodiment of this invention, Comprising: (d) Process drawing which forms the support substrate 20, (e) Process drawing which attaches the organic light emitting element 10 to the support substrate 20 . 本発明の第2の実施の形態に係る照明装置の模式的な一部破断斜視図。The typical partially broken perspective view of the illuminating device which concerns on the 2nd Embodiment of this invention. 本発明の第3の実施の形態に係る照明装置の模式的断面構造図。The typical cross-section figure of the illuminating device which concerns on the 3rd Embodiment of this invention. 従来の有機EL素子を用いた照明装置の模式的断面構造図。The typical cross-section figure of the illuminating device using the conventional organic EL element.

符号の説明Explanation of symbols

1・・・基板
2・・・陽極
2a・・・陽極端子
3・・・有機発光層
4・・・陰極
4a・・・陰極端子
5,6・・絶縁層
7・・・封止板
10・・有機発光素子
20・・支持基板
20a・・切欠部
21・・支持部材
22・・反射部材
30,30A,30B・・照明装置
DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Anode 2a ... Anode terminal 3 ... Organic light emitting layer 4 ... Cathode 4a ... Cathode terminal 5,6 .... Insulating layer 7 ... Sealing board 10 ... Organic light emitting element 20 Support substrate 20a Notch 21 Support member 22 Reflective member 30, 30A, 30B Lighting device

Claims (6)

基板上に陽極及び陰極に挟まれた有機発光層を配置し、前記陽極及び前記陰極と共に前記有機発光層が封止板で封止され、該封止板から陽極端子及び陰極端子が露出した、可撓性を有する有機発光素子と、
軸方向に沿って切欠部を有する略円筒状の支持基板と
を備え、前記有機発光素子は、前記支持基板の表面に折曲して配置され、前記陽極端子及び前記陰極端子を前記切欠部近傍に配置したことを特徴とする照明装置。
An organic light emitting layer sandwiched between an anode and a cathode is disposed on the substrate, the organic light emitting layer is sealed together with the anode and the cathode with a sealing plate, and the anode terminal and the cathode terminal are exposed from the sealing plate, An organic light emitting device having flexibility;
A substantially cylindrical support substrate having a cutout portion along the axial direction, and the organic light emitting element is arranged to be bent on the surface of the support substrate, and the anode terminal and the cathode terminal are arranged in the vicinity of the cutout portion. A lighting device characterized by being arranged in
前記支持基板の内壁から前記切欠部を貫通して配置した略平板状の支持部材を更に備えたことを特徴とする請求項1に記載の照明装置。   The lighting device according to claim 1, further comprising a substantially flat support member disposed through the notch from an inner wall of the support substrate. 前記支持基板及び前記支持部材は、伝熱性部材からなることを特徴とする請求項2に記載の照明装置。   The lighting device according to claim 2, wherein the support substrate and the support member are made of a heat conductive member. 複数の前記有機発光素子を前記支持基板の軸方向に沿って互いに隣接して配置したことを特徴とする請求項1〜3のいずれか1項に記載の照明装置。  The lighting device according to claim 1, wherein the plurality of organic light emitting elements are arranged adjacent to each other along the axial direction of the support substrate. 前記支持部材の端面に、前記切欠部に対向して前記支持基板の上方を覆うように配置した反射部材を有することを特徴とする請求項2〜4のいずれか1項に記載の照明装置。  5. The lighting device according to claim 2, further comprising: a reflection member disposed on an end surface of the support member so as to cover the upper portion of the support substrate so as to face the notch portion. 基板上に陽極及び有機発光層を形成する工程と、
絶縁層及び陰極を形成する工程と、
絶縁層及び封止板を形成して有機発光素子を作製する工程と、
円筒部材に切欠部を形成して支持基板を形成する工程と、
前記有機発光素子を折曲して前記支持基板の表面に取付ける工程と
を有する照明装置の製造方法。
Forming an anode and an organic light emitting layer on a substrate;
Forming an insulating layer and a cathode;
Forming an insulating layer and a sealing plate to produce an organic light emitting device;
Forming a notch in the cylindrical member to form a support substrate;
A step of bending the organic light emitting element and attaching it to the surface of the support substrate.
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JP2010045337A (en) * 2008-07-15 2010-02-25 Tokai Rubber Ind Ltd Light-emitting body
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