JP2009222415A5 - - Google Patents

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Publication number
JP2009222415A5
JP2009222415A5 JP2008064359A JP2008064359A JP2009222415A5 JP 2009222415 A5 JP2009222415 A5 JP 2009222415A5 JP 2008064359 A JP2008064359 A JP 2008064359A JP 2008064359 A JP2008064359 A JP 2008064359A JP 2009222415 A5 JP2009222415 A5 JP 2009222415A5
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JP
Japan
Prior art keywords
dimensional structure
elastic body
substrate member
elements
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008064359A
Other languages
English (en)
Japanese (ja)
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JP2009222415A (ja
JP4508253B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008064359A priority Critical patent/JP4508253B2/ja
Priority claimed from JP2008064359A external-priority patent/JP4508253B2/ja
Priority to US12/920,147 priority patent/US8482086B2/en
Priority to CN2009801072470A priority patent/CN101960275A/zh
Priority to PCT/JP2009/001126 priority patent/WO2009113315A1/ja
Publication of JP2009222415A publication Critical patent/JP2009222415A/ja
Publication of JP2009222415A5 publication Critical patent/JP2009222415A5/ja
Application granted granted Critical
Publication of JP4508253B2 publication Critical patent/JP4508253B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008064359A 2008-03-13 2008-03-13 ３次元構造体およびその製造方法 Expired - Fee Related JP4508253B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008064359A JP4508253B2 (ja) 2008-03-13 2008-03-13 ３次元構造体およびその製造方法
US12/920,147 US8482086B2 (en) 2008-03-13 2009-03-13 Three-dimensional structure and its manufacturing method
CN2009801072470A CN101960275A (zh) 2008-03-13 2009-03-13 三维结构体及其制造方法
PCT/JP2009/001126 WO2009113315A1 (ja) 2008-03-13 2009-03-13 ３次元構造体およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008064359A JP4508253B2 (ja) 2008-03-13 2008-03-13 ３次元構造体およびその製造方法

Publications (3)

Publication Number Publication Date
JP2009222415A JP2009222415A (ja) 2009-10-01
JP2009222415A5 true JP2009222415A5 (enExample) 2010-01-14
JP4508253B2 JP4508253B2 (ja) 2010-07-21

Family

ID=41064988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008064359A Expired - Fee Related JP4508253B2 (ja) 2008-03-13 2008-03-13 ３次元構造体およびその製造方法

Country Status (4)

Country Link
US (1) US8482086B2 (enExample)
JP (1) JP4508253B2 (enExample)
CN (1) CN101960275A (enExample)
WO (1) WO2009113315A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5198608B2 (ja) * 2010-03-18 2013-05-15 韓国標準科学研究院 半導体ストレインゲージを用いたフレキシブルな力または圧力センサアレイ、そのフレキシブルな力または圧力センサアレイの製造方法、及びそのフレキシブルな力または圧力センサアレイを用いた力または圧力測定方法
JP2013090498A (ja) * 2011-10-20 2013-05-13 Sumitomo Precision Prod Co Ltd アクチュエータ及びその製造方法
JP6074414B2 (ja) 2012-05-24 2017-02-01 株式会社村田製作所 センサーデバイスおよび電子機器
DE202013101814U1 (de) * 2013-04-26 2014-07-29 Zumtobel Lighting Gmbh LED-Modul mit Berührungsschutzelement
US10628103B2 (en) 2013-06-07 2020-04-21 Semiconductor Energy Laboratory Co., Ltd. Information processor and program
US11680860B2 (en) * 2016-11-24 2023-06-20 The University Of Queensland Compact load cells
US10512164B2 (en) * 2017-10-02 2019-12-17 Encite Llc Micro devices formed by flex circuit substrates

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4814392A (en) 1987-11-25 1989-03-21 General Electric Company Silicone-polyarylene ether block copolymers, and method for making
US5101669A (en) * 1988-07-14 1992-04-07 University Of Hawaii Multidimensional force sensor
JPH02641Y2 (enExample) * 1988-07-26 1990-01-09
JP2804196B2 (ja) * 1991-10-18 1998-09-24 株式会社日立製作所 マイクロセンサ及びそれを用いた制御システム
US6316796B1 (en) * 1995-05-24 2001-11-13 Lucas Novasensor Single crystal silicon sensor with high aspect ratio and curvilinear structures
JP2000065653A (ja) * 1998-08-26 2000-03-03 Asmo Co Ltd 固定構造、感圧センサ固定方法、及び圧力検出装置
JP2002118201A (ja) * 2000-10-05 2002-04-19 Hitachi Ltd 半導体装置およびその製造方法
JP3704558B2 (ja) 2002-01-18 2005-10-12 国立大学法人 東京大学 ３次元構造体の組立方法
WO2005001422A2 (en) * 2003-06-06 2005-01-06 The Board Of Trustees Of The University Of Illinois Sensor chip and apparatus for tactile and/or flow
JP2005150220A (ja) * 2003-11-12 2005-06-09 Seiko Epson Corp 半導体装置、半導体ウエハおよびその製造方法
US20050172717A1 (en) * 2004-02-06 2005-08-11 General Electric Company Micromechanical device with thinned cantilever structure and related methods
US7032454B2 (en) * 2004-03-05 2006-04-25 Agilent Technologies, Inc. Piezoelectric cantilever pressure sensor array
JP4876240B2 (ja) * 2005-01-28 2012-02-15 国立大学法人 東京大学 触覚センサ及びその製造方法
JP2006275979A (ja) * 2005-03-30 2006-10-12 National Institute Of Information & Communication Technology センサ素子、センサ装置、対象物移動制御装置、対象物判別装置
US7825567B2 (en) * 2006-01-20 2010-11-02 Panasonic Corporation Three-dimensional structure and its manufacturing method
JP4921185B2 (ja) * 2006-01-20 2012-04-25 国立大学法人 東京大学 ３次元構造体の製造方法
JP2008008854A (ja) 2006-06-30 2008-01-17 Osaka Univ 触覚センサ、触覚センサの製造方法および触覚センサユニット
JP2008026178A (ja) 2006-07-21 2008-02-07 Advanced Telecommunication Research Institute International 触覚センサ装置
JP2008044219A (ja) * 2006-08-15 2008-02-28 Fuji Xerox Co Ltd 基板の製造方法と基板、及び液滴吐出ヘッドの製造方法と液滴吐出ヘッド、並びに液滴吐出装置
JP2008049438A (ja) 2006-08-24 2008-03-06 Osaka Univ 半導体装置の製造方法、半導体装置、及び感圧センサ

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