JP2009216466A - Probe card provided with contact unit and replacement method of contact unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card which facilitates replacement of respective contact units separately. <P>SOLUTION: A probe card 20 provided with contact units 38S and 38L includes: a plurality of contact units each having a plurality of contacts to be contacted with or separated from an input/output signal terminal group in an inspection object, a substrate supporting a predetermined number of the contacts arranged in rows on one surface, and a conductor layer formed on the other (opposite) surface of the substrate and electrically connected to the plurality of the contacts; an external connection terminal; and a conductor layer for electrically connecting the plurality of the contact units and the external connection terminal, and includes a mother board for supporting the plurality of the contact units. The plurality of the contact units are directly or indirectly and removably connected with the surface of the mother board 34 with a heat-separable adhesive or solder material. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a probe card including a contact unit and a replacement method of the contact unit.

  An electrical characteristic inspection is performed to determine whether or not a plurality of circuits and circuit patterns formed vertically and horizontally on a semiconductor device such as a silicon wafer are acceptable. In such an inspection, for example, an inspection apparatus (test system) including a probe card as shown in Patent Document 1 is used.

  For example, as shown in Patent Document 2, the probe card includes a probe head having a plurality of spring probes that are electrically connected to each circuit pattern of a silicon wafer as an object to be inspected, and a probe card that sandwiches the probe head. And two fastening members.

  The two fastening members are arranged to face each other via a stiffener and a probe board.

  In addition, such a probe head includes a bottom board, an intermediate board, and a top board that each have a through hole on a common axis so as to hold a plurality of spring probes in cooperation, and are overlapped with each other. It is configured to include. As a result, when a spring probe deemed defective is replaced, the spring probe is pulled out of the through hole and replaced by removing the top board with the bottom board facing down.

JP 2004-172551 A JP 2007-71699 A

  In the probe head of the probe card as described above, the diameter of the probe head increases as the diameter of the silicon wafer to be tested increases. This makes it difficult to disassemble and reassemble the probe head composed of a plurality of boards as described above when replacing one spring probe, which is regarded as defective in the probe head. A plurality of spring probes may be accidentally damaged. In other words, yield and repair of damaged contacts in the probe card manufacturing process are problematic.

  In view of the above problems, the present invention is a probe card including a contact unit, and a contact unit replacement method, which includes a contact unit that can be easily replaced individually. It is an object of the present invention to provide a probe card and a method for replacing a contact unit.

  In order to achieve the above-described object, a probe card including a contact unit according to the present invention includes a plurality of contacts that are in contact with or separated from an input / output signal terminal group in an object to be inspected, and a plurality of contacts. A plurality of contacts each including a substrate supported on one surface for each predetermined number and a conductor layer formed on the opposite surface of the substrate and electrically connected to the plurality of contacts. A plurality of contact units, comprising a unit, an external connection terminal, and a mother board that has a conductor layer that electrically connects the plurality of contact unit and the external connection terminal, and supports the plurality of contact units. Is removably bonded directly or indirectly to the surface of the motherboard with a heat-peelable adhesive or brazing material.

  According to the contact unit replacement method of the present invention, one contact unit among a plurality of contact units detachably joined to a predetermined position of the mother board described above is repaired with infrared or heated air. And disposing one contact unit from the inside of the repair nozzle after a predetermined time, and joining a new contact unit to a predetermined position of the motherboard with a joining material.

  As is clear from the above description, according to the probe card including the contact unit and the contact unit replacement method according to the present invention, the plurality of contact units are made of an adhesive or brazing material that can be thermally peeled. The contactor unit can be easily replaced individually because it is detachably joined directly or indirectly to the surface of the motherboard.

  FIG. 3 schematically shows a configuration of a test system including a test head in which each embodiment of the probe card including the contact unit according to the present invention is used.

  In FIG. 3, the test system is used, for example, to perform a lighting inspection of a liquid crystal panel constituting a part of a liquid crystal display as an object to be inspected or a circuit operation inspection of a silicon wafer described later.

  As shown in FIG. 5 and FIG. 6, the liquid crystal panel WO as an object to be inspected is formed at the center portion thereof by superimposing the display portion DD composed of a polarizing filter, a color filter and the like on the display portion DD. And a connection terminal board DE that transmits and receives a drive signal and the like to the display unit DD. In the display unit DD, an image or the like is displayed in the inner area DA. A terminal group TA composed of a plurality of contact pads is formed at predetermined intervals on the entire periphery of the display portion DD in the connection terminal board DE.

  The test system is supported by a prober 10 having a stage 16 on which a liquid crystal panel WO is detachably mounted, and a base 10B provided in parallel with the prober 10 via a joint 14, and is indicated by a two-dot chain line. As shown in FIG. 4, a storage head in which a plurality of liquid crystal panels WO to be tested or a plurality of tested liquid crystal panels WO are stored is stored. And a chamber 25.

  The stage 16 in the prober 10 is movably supported by a rotational drive system in a drive mechanism (not shown) and a translational drive system along the three axes of the orthogonal coordinate system. Thereby, the rotation angle and the three-dimensional coordinate position in the stage 16 are controlled by a control unit (not shown).

  The inspection object mounting surface 16S of the stage 16 is formed with a plurality of pores communicating with suction means (not shown). As a result, when the suction means is selectively activated, the liquid crystal panel WO as an object to be inspected has a predetermined group on the object mounting surface 16S with its terminal group TA facing the probe card 20 of the test head 12. It will be mounted and held in position.

  The test head 12 is electrically connected to the controller 22 via the connection cable 18. The controller 22 forms and supplies a test signal group DC for the test head 12. Thereby, the test pattern is displayed on the display portion DD of the liquid crystal panel WO. At that time, by a visual inspection of the liquid crystal panel WO, an inspection based on an image recognition technique using a CCD camera (not shown) or the like controlled by the controller 22, or both inspections, the liquid crystal panel has missing dots, uneven color, etc. A lighting test is performed for each liquid crystal panel WO. Thereby, the quality of each liquid crystal panel WO is determined.

As shown in FIGS. 1 and 2, when the test head 12 takes a position close to the stage 16, the test head 12 is provided with the probe card 20 that is electrically connected to the terminal group TA of the liquid crystal panel WO. It has at the lower end.

  The probe card 20 is detachably supported with respect to the end of the test head 12, and includes a mother board 34 having contact units 38L and 38S described later.

  The mother board 34 is formed into a thin plate shape using, for example, a thermosetting resin (BT resin: trade name), glass epoxy resin, glass, and ceramic. An opening 34A for visual inspection is formed at the center of the mother board 34. The dimension of the opening 34A is set to be equal to or larger than the size of the display part DD of the liquid crystal panel WO.

  As shown in FIG. 1, a plurality of contact units 38 </ b> L and 38 </ b> S are joined to the edge portion on one surface of the mother board 34 along one of the long side and the short side, respectively. The rows of contact units 38L and 38S are joined in an L shape so as to cross each other. The contact units 38L and 38S are arranged in a line at a predetermined interval.

  Since the contact units 38L and 38S have the same structure, the contact unit 38S will be described, and the description of the contact unit 38L will be omitted.

  As shown in enlarged views in FIGS. 7A and 7B, the contact unit 38S is fixed by soldering onto a substrate 38B bonded to one surface of the motherboard 34 and one surface of the substrate 38B. Contact 38ai (i = 1 to n, n is a positive integer).

  As shown in an enlarged view in FIG. 7B, each contactor is provided on the surface of the substrate 38B formed of glass epoxy resin or the above-described thermosetting resin and bonded to one surface of the mother board 34. A solder ball 38bi (i = 1 to n, n is a positive integer) is formed corresponding to 38ai. The solder ball 38bi is made of, for example, a low melting point brazing material (Sn—Zn or Sn—Zn—Bi). The solder balls 38bi are formed in three columns. Each row is formed substantially parallel to each other with a predetermined interval.

  The solder balls 38bi in each row are electrically connected to external connection pins 36ai (i = 1 to n, n is a positive integer) through a conductor layer formed inside the mother board 34. As shown in FIG. 1, the external connection pins 36ai are arranged at predetermined intervals along the long side and the short side corresponding to the contact units 38L and 38S. The external connection pin 36ai is connected to a connection socket of the test head 12 (not shown).

  The solder balls 38bi in each row are connected to one open end of the through electrode 38t via the conductor pattern 38w. The through electrodes 38t are formed in a staggered pattern along the rows of solder balls 38bi.

  Furthermore, a support 38ST (standoff) having a predetermined height is provided at each corner of the substrate. The support 38ST formed of glass epoxy resin or thermosetting resin is bonded by, for example, a thermocompression sheet.

  Even when the diameter of the solder ball 38bi varies due to the support 38ST, the mounting height of the contact units 38S and 38L (the height from the surface of the motherboard 34 to the surface of the substrate 38B) is varied during mounting. It is suppressed.

  Markers 28MB are formed at four locations adjacent to the support 38ST. The marker 28MB is used for positioning the contact units 38S and 38L with respect to a predetermined position on the mother board 34 by image recognition.

  The other opening end of the through electrode 38t opens on the other surface of the mother board 34. As shown in FIG. 7A, the other open end of each through electrode 38t is connected to one end of a conductor pattern 38PP formed on the surface thereof. The conductor pattern 38PP is formed corresponding to a predetermined interval, for example, a mutual interval between the terminals constituting the terminal group TA of the liquid crystal panel WO described above. A contact 38ai is brazed to the other end on each conductor pattern 38PP.

  A brazing material having a relatively high melting point such as Au—Sn, Sn, Sn—Ag, or Sn—Ag—Cu is formed on the mounting portion of the contact 38ai on the substrate 38B by plating or screen printing.

  Thereby, the board | substrate 38B is locally heated, for example, the contactor unit by which the some contactor 38ai was mounted on the glass base material is manufactured. The contactor mounting accuracy and appearance inspection are performed in the state of the contactor unit 38S, and the defective contactor unit is repaired or discarded. As a result, as the mounting density becomes smaller, for example, there are many factors that lead to a decrease in yield, such as an influence on adjacent contacts during local heating and a fall due to a lack of brazing material. Sorting is very effective for improving yield.

  As shown in an enlarged view of FIG. 7C, the contact 38ai is formed by press working with a thin metal material, and has a movable piece 38C having a contact portion at the tip and a slit inside, and a movable piece. The fixing portion 38F is connected to the base end portion of the portion 38C and fixed to the substrate 38B.

  In FIG. 7A, markers 28MA are formed at three positions in the vicinity of the other end of the conductor pattern 38PP located at both ends and substantially in the center. The marker 28MA is used for positioning and mounting the contact units 38S and 38L with respect to a predetermined position on the mother board 34 by image recognition.

  In such a configuration, in the lighting inspection of the liquid crystal panel WO, first, the suction unit is activated in a state where the liquid crystal panel WO is positioned at a predetermined position on the inspection object mounting surface 16S of the stage 16, whereby FIG. As shown, the liquid crystal panel WO is held on the inspection object mounting surface 16S.

  Next, the probe card 20 of the test head 12 is brought close to the liquid crystal panel WO as shown by a solid line in FIG. At that time, the contact portions of the movable piece portions 38C of the contact units 38S and 38L are brought into contact with the terminal groups TA on one long side and the short side of the liquid crystal panel WO.

  Subsequently, the controller 22 supplies the test signal group DC to the test head 12, and a lighting test is performed. Thereby, the controller 22 determines pass / fail of each liquid crystal panel WO in the lighting inspection for each liquid crystal panel WO based on the obtained data group DQ.

  Subsequently, in a state where the probe card 20 of the test head 12 is separated from the liquid crystal panel WO as shown by a one-dot chain line in FIG. 3, the stage 16 is set at a predetermined angle set based on the control signal. It can be rotated. The predetermined rotation angle is set to, for example, an angle until the contact units 38L and 38S face each other terminal group TA on the other long side and short side of the liquid crystal panel WO that has not been inspected.

  Then, the probe card 20 of the test head 12 is brought close to the liquid crystal panel WO as shown by a solid line in FIG. At that time, the contact portions of the movable piece portions 38C of the contact units 38S and 38L are brought into contact with the terminal groups TA on the other long side and short side of the liquid crystal panel WO.

  Thereafter, similarly to the above, the controller 22 supplies the test signal group DC to the test head 12, and the lighting inspection is performed. Thereby, the controller 22 determines pass / fail of each liquid crystal panel WO in the lighting inspection for each liquid crystal panel WO based on the obtained data group DQ. Note that the second inspection described above may be omitted.

8 and 9 schematically show the appearance of a second embodiment of the probe card including the contact unit according to the present invention.

  The probe card in the first embodiment described above is used for the liquid crystal panel WO as an object to be inspected, but the probe card 20 shown in FIGS. 8 and 9 is a silicon wafer as an object to be inspected. It shall be used for WA (see FIG. 15). In the example shown in FIGS. 8 and 9 and another example described later, the probe card 20 is used in a state where it is mounted on the test head 12 in the test system as shown in FIGS. Is done.

  As shown in FIG. 15, a silicon wafer WA as an object to be inspected has a predetermined diameter, and circuit patterns WAij (i = 1-n, j = 1-n, n is a positive integer). FIG. 16 is an enlarged view of a portion A composed of six circuit patterns WAij in FIG.

  In FIG. 16, circuit pattern A1, A2, A3, A4, A5, and A6 in part A have similar test signal input / output contact pad groups formed in two rows substantially parallel to each other at the center. Has been. Each test signal input / output contact pad group in the circuit patterns A1, A2, A3, A4, A5, and A6 abuts each contact of one contact unit in the probe card 20 described later during the test. Is done.

  As shown in an enlarged view in FIG. 9, the probe card 20 includes a mother board 24, a plurality of external connection pins 26 ai projecting on the peripheral edge of one surface of the mother board 24, and a central portion on the other surface of the mother board 24. A plurality of contact units 28ij (i = 1 to n, j = 1 to n, where n is a positive integer) bonded vertically and horizontally.

  For example, the mother board 24 is formed in a disk shape with a predetermined thickness using glass epoxy resin, the above-described thermosetting resin, ceramic, or glass.

  As shown in FIG. 8, the external connection pins 26ai are evenly spaced at a predetermined angle along the circumferential direction to form a plurality of annular rows. A base end portion of the external connection pin 26ai is connected to one solder ball 28bi (a contact unit 28ij described later) via a conductor layer 30ai (i = 1 to n, n is a positive integer) formed in the mother board 24. (See FIG. 13).

  As shown in an enlarged view in FIG. 11, the contact unit 28ij includes a substrate 28B bonded to one surface of the motherboard 24 and a pair of contacts 28ai (i = 1 to n and n are positive integers).

  The surface bonded to one surface of the mother board 24 in the substrate 28B formed of the glass epoxy resin or the thermosetting resin described above is enlarged as shown in FIG. 12, FIG. 13, and FIG. A solder ball 28bi (i = 1 to n, n is a positive integer) is formed corresponding to each contact 28ai. The solder balls 28bi are formed in six columns. Each row is formed substantially parallel to each other with a predetermined interval. Note that the soldering material of the solder balls 28bi has a lower melting point than the first brazing material described later such as Sn—Zn and Sn—Zn—Bi.

  As shown in FIG. 10, the solder balls 28bi in each row are electrically connected to the external connection pins 26ai (i = 1 to n, n is a positive integer) through a conductor layer 30ai formed inside the mother board 24. It is connected to the. The external connection pin 26ai is connected to a connection socket of the test head 12 (not shown).

  Also, each row of solder balls 28bi corresponding to each contact 28ai is connected to one open end of the through electrode 28t via a conductor pattern 28w. The through electrodes 28t are formed in a staggered pattern along the rows of solder balls 28bi.

  Further, a support 28ST having a predetermined height is provided at each corner of the substrate 28B. Note that the material of the support 28ST is preferably a material with poor wettability of the brazing material. For example, there is a method of sandwiching or bonding a stainless material between the substrates 28B.

  Even when the diameter of the solder ball 38bi varies due to the support 28ST, variation in the mounting height of the contact unit 28ij (the height from the surface of the mother board 24 to the surface of the substrate 28B) is suppressed during mounting. The

  Markers 28MB are formed at four locations adjacent to the support 28ST. A marker 28MB is also formed at an intermediate position between the markers 28MB. The marker 28MB is used for positioning the contact unit 28ij with respect to a predetermined position on the mother board 24 by image recognition.

  The other opening end of the through electrode 38t is opened on the other surface of the mother board 24 as shown in FIG. The other open end of each through electrode 28t is connected to one end of a conductor pattern constituting each conductor pattern group 28B1, 28B2, 28B3, 28B4, 28B5, and 28B6 formed on the surface thereof. Each conductor pattern is formed corresponding to a predetermined interval, for example, a contact pad mutual interval constituting the test signal input / output contact pad group of the silicon wafer WA described above. A contact 28ai is fixed by soldering to the other end on each conductor pattern. A brazing material is formed on the mounting portion of the contact 28ai on the substrate 28B by plating or screen printing. In addition, the brazing material of the contact mounting part has a relatively high melting point such as Au—Sn, Sn, Sn—Ag, Sn—Ag—Cu so as not to be affected by heat when the contact unit is mounted. A material (first brazing material) is preferably used.

  Thereby, the board | substrate 28B is locally heated, for example, the contactor unit by which the some contactor 28ai was mounted on the glass base material is manufactured. In the state of the contact unit 28ij, mounting accuracy and appearance inspection of the contact are performed, and the defective contact unit is repaired or discarded. As a result, as the mounting density becomes smaller, for example, there are many factors that lead to a decrease in yield, such as the influence on adjacent contacts during local heating and the collapse due to the lack of brazing material. Sorting is very effective for improving yield.

  As shown in an enlarged view in FIG. 12, the contact 28ai is formed by press working with a thin metal material, and has a contact piece at the tip and a movable piece 28C having a slit inside, and a movable piece 28C. And a fixed portion 28F that is fixed to the substrate 28B.

  In FIG. 11, the substrate 28B is positioned at both ends thereof, between the conductor pattern groups 28B1 and 28B2, between the conductor pattern groups 28B2 and 28B3, between the conductor pattern groups 28B4 and 28B5, and between the conductor pattern groups 28B5 and 28B6. In the vicinity of the conductor pattern to be performed, markers 24MA are formed in a total of eight locations. The marker 24MA is used for positioning the contact unit 28ij with respect to a predetermined position on the mother board 24 by image recognition.

  Note that the contacts in the contact unit 28ij are not limited to such an example. For example, as shown in FIGS. 17 (A), (B), (C), (D), and (E), A pair of contacts 48ai having sharp needle-like contact portions elastically displaceable are supported on the substrate 48B, and a pair of contacts 50ai having arc-shaped contact portions elastically displaceable are supported on the substrate 50B. A pair of contacts 52ai supported on the substrate 52B at the tip of the movable piece bent like a bell shape, and a contact 54ai having a contact on one end of the arcuate movable piece. A pair of contacts 56ai supported on the substrate 54B and a pair of contacts 56ai having a shape similar to that of the contactor shown in FIG. 12 having no slit may be supported on the substrate 56B.

  In addition, a contactor is not restricted to press work, For example, you may manufacture by an etching, MEMS, a wire cut, etc.

  In such a configuration, in the electrical characteristic inspection of the silicon wafer WA, first, the suction means is activated in a state where the silicon wafer WA is positioned at a predetermined position on the inspection object mounting surface 16S of the stage 16, The silicon wafer WA is held on the inspection object mounting surface 16S.

  Next, the probe card 20 of the test head 12 is brought close to the silicon wafer WA. At that time, the contact portion of the contact 28ai of the contact unit 28ij is brought into contact with the contact pad group of the circuit pattern WAij of the silicon wafer WA. At that time, the electrical characteristic inspection for one silicon wafer WA is performed, for example, in two rows, that is, every column having a predetermined interval, that is, in a thinned state.

  Subsequently, the controller 22 supplies the test signal group DC to the test head 12, and an electrical characteristic inspection is performed. Thereby, the controller 22 determines the quality of the electrical characteristic inspection based on the obtained data group DQ.

  FIG. 18 schematically shows the main part of a third embodiment of the probe card provided with the contact unit according to the present invention.

  In the example shown in FIG. 10, the external connection pin 26ai is directly connected to the contact unit 28ij through the conductor layer 30ai. On the other hand, in the example shown in FIG. 18, the external connection pin 26 ai is contacted via the probe pin 34 ai (i = 1 to n, n is a positive integer) built in the conductor layer 30 ai and the connection block member 32. It is connected to the unit 58ij (i, j = 1 to n, n is a positive integer).

  18 to 22, the same components as those in the example shown in FIG. 10 are denoted by the same reference numerals, and redundant description thereof is omitted.

  The connection block member 32 formed of glass epoxy resin, ceramic or the like is positioned with respect to the mother boat 24 and is fixed by a predetermined fastening member such as a screw. A plurality of spring probes 34ai (i = 1 to n, where n is a positive integer) group is disposed through each hole at a position where each contact unit 28ij is positioned on the connection block member 32. In addition, it is not restricted to such an example, For example, the contact pin made from a bow-shaped leaf | plate spring may be sufficient instead of a spring probe.

  As shown in enlarged views in FIGS. 19 and 20, the contact unit 58ij includes a substrate 58B bonded to one surface of the mother board 24 and a pair of contacts 28ai fixed to one surface of the substrate 58B. (Where i = 1 to n, n is a positive integer).

  As shown in enlarged views in FIGS. 21 and 22, a contact pad 58cpi (corresponding to each contact 28ai is provided on the surface of the substrate 58B formed of glass epoxy resin, which is bonded to one surface of the mother board 24. i = 1 to n, where n is a positive integer). The contact pads 58 cpi arranged at a mutual interval larger than the mutual interval between the contacts 28 ai are formed to be six columns. Each row is formed substantially parallel to each other with a predetermined interval.

  In addition, each row of contact pads 58cpi corresponding to each contact 28ai is connected to one open end of the through electrode 58t via a conductor pattern 58w. The through electrodes 58t are formed in a staggered pattern along the row of contact pads 58cpi.

  The substrate 58B is bonded to the connection block member 32 with a predetermined ultraviolet curable adhesive, for example. The ultraviolet curable adhesive is, for example, an adhesive (model A-1582) that can be peeled off by heating at 100 ° C. This adhesive can be peeled when the resin is melted by heating at 100 ° C. After peeling, the deposit is dissolved with an alcohol solvent. The adhesive is not limited to such an example, and is, for example, an adhesive that can be peeled off by heating at 80 ° C. (model A-1579) or an adhesive that can be peeled off by heating at 160 ° C. (model A-1611). May be.

  Further, as shown in FIG. 21, eight markers 58MB are formed at the same position as the above-described substrate 28B. The other opening end of the through electrode 58t is opened toward the other surface of the connection block member 32 as shown in FIG. The other open end of each through electrode 58t is connected to one end of a conductor pattern constituting each conductor pattern group 58B1, 58B2, 58B3, 58B4, 58B5, and 58B6 formed on the surface thereof. Each conductor pattern is formed corresponding to a predetermined interval, for example, a contact pad mutual interval constituting the test signal input / output contact pad group of the silicon wafer WA described above. A contact 28ai is fixed by soldering to the other end on each conductor pattern.

  In FIG. 19, the substrate 58B is positioned at both ends thereof, between the conductor pattern groups 58B1 and 58B2, between the conductor pattern groups 58B2 and 58B3, between the conductor pattern groups 58B4 and 58B5, and between the conductor pattern groups 58B5 and 58B6. In the vicinity of the conductor pattern to be performed, markers 58MA are formed in a total of eight locations. The marker 58MA is used for positioning the contact unit 58ij with respect to a predetermined position in the connection block member 32 by image recognition.

  Therefore, the yield at the time of manufacture can be improved by inspecting the contact unit alone and using only good products. In addition, it is possible to replace and repair parts damaged due to accidents during use and durability, and unit costs can be reduced. By providing the external connection terminal on the back surface of the contact unit, the mounting density of the contact unit is increased and a more efficient test can be performed.

  By using the spring probe 34ai of the connection block member 32, for example, the same motherboard can be used by standardizing the position of the external connection terminal of the contact unit even for ICs having different pad arrangements, and the cost can be greatly reduced.

  FIG. 23 schematically shows a main part of a fourth embodiment of the probe card including the contact unit according to the present invention.

  In the example shown in FIG. 10, the external connection pin 26ai is directly connected to the contact unit 28ij through the conductor layer 30ai. On the other hand, in the example shown in FIG. 23, the external connection pins 26ai are connected to the contact unit 68ij through the conductor layer 30ai, the FPC connector 68CN, and the flexible wiring board 68FC.

  23 to 26, the same components as those in the example shown in FIG. 10 are denoted by the same reference numerals, and redundant description thereof is omitted.

  As shown in enlarged views in FIGS. 24, 25, and 26, the contact unit 68ij is fixed on one surface of the substrate 68B and a substrate 68B bonded to one surface of the motherboard 24. A pair of contacts 28ai (i = 1 to n, n is a positive integer) and a flexible wiring board 68FC having one end connected to the FPC connector 68CN and the other end connected to the board 68B are configured. .

  The substrate 68B formed of glass epoxy resin is bonded to the mother board 24 with a predetermined ultraviolet curable adhesive, for example. The ultraviolet curable adhesive is, for example, an adhesive (model A-1582) that can be peeled off by heating at 100 ° C. This adhesive can be peeled when the resin is melted by heating at 100 ° C. After peeling, the deposit is dissolved with an alcohol solvent. The adhesive is not limited to such an example, and is, for example, an adhesive that can be peeled off by heating at 80 ° C. (model A-1579) or an adhesive that can be peeled off by heating at 160 ° C. (model A-1611). May be.

  Conductive pattern groups 68B1, 68B2, 68B3, 68B4, 68B5, and 68B6 are formed on one surface of the substrate 68B.

  Each conductor pattern constituting the conductor pattern group is formed corresponding to a predetermined interval, for example, a contact pad mutual interval constituting the test signal input / output contact pad group of the silicon wafer WA described above. A contact 28ai is brazed to the other end side of each conductor pattern.

  In FIG. 19, the substrate 68B is positioned at both ends thereof, between the conductor pattern groups 68B1 and 68B2, between the conductor pattern groups 68B2 and 68B3, between the conductor pattern groups 68B4 and 68B5, and between the conductor pattern groups 68B5 and 68B6. In the vicinity of the conductor pattern to be performed, markers 68M are formed in a total of eight locations. The marker 68M is used for positioning the contact unit 68ij with respect to a predetermined position on the mother board 24 by image recognition. Further, as shown in FIG. 27, a contact pad group 68FCP is formed at one end of the flexible wiring board 68FC.

  Accordingly, since it is not necessary to form a through electrode or the like on the substrate 68B, the contact unit 68ij can be manufactured at a low cost.

  In an example of the contact unit replacement method according to the present invention in which the contact unit 28ij in the probe card 20 can be replaced individually, first, as shown in FIG. The contact unit 28ij that is joined to the connector and needs to be replaced is removed. In removing the contact unit 28ij, first, as shown in FIGS. 29 and 30, the repair nozzle 70 is put on the contact unit 28ij disposed at a predetermined position AR. In the repair nozzle 70, infrared rays or warm air is irradiated or blown from a light source (not shown) for a predetermined time.

  Thereby, since the above-mentioned solder ball is melted, the contact unit 28ij is easily removed.

  Next, as shown in FIG. 28, a new contact unit 28ij is joined to a predetermined position AR on the mother board 24 via solder balls. At that time, the markers 24MA to 24MD on the mother board 24 and the marker 24MA of the contact unit 28ij are referred to, and the new contact unit 28ij is positioned at the predetermined position AR by the image recognition technique.

  Thereby, the replacement | exchange operation | work of a contactor unit will be complete | finished.

  Therefore, by forming the low melting point bump, the same mounting method and apparatus as those of the conventional BGA type can be used. Also, a general rework device can be used for replacement and repair of the contact unit. Furthermore, by making the second brazing material have a low melting point, it is possible to replace and repair the contact unit without affecting the mounting of the contact.

It is a front view which shows roughly the external appearance of 1st Example of a probe card provided with the contactor unit which concerns on this invention. FIG. 2 is a top view of the example shown in FIG. 1. 1 schematically shows a configuration of a test system including a test head in which each embodiment of a probe card including a contact unit according to the present invention is used. It is a top view in the example shown by FIG. It is a top view of the liquid crystal panel test | inspected by 1st Example of a probe card provided with the contactor unit which concerns on this invention. FIG. 6 is a front view of the liquid crystal panel shown in FIG. 5. (A) is a top view which shows the contact unit used for 1st Example of a probe card provided with the contact unit which concerns on this invention, (B) is the back surface of the contact unit shown by (A). (C) is sectional drawing which expands and shows a part of FIG. 2 partially. It is a front view which shows roughly the external appearance of 2nd Example of a probe card provided with the contactor unit which concerns on this invention. FIG. 9 is a top view of the example shown in FIG. 8. It is a fragmentary sectional view which expands and shows a part in the example shown by FIG. It is a top view which shows the contact unit in 2nd Example of a probe card provided with the contact unit which concerns on this invention. It is a side view in the example shown by FIG. FIG. 12 is a rear view of the contact unit shown in FIG. 11. FIG. 14 is a front view of the example shown in FIG. 13. It is a top view which shows the external appearance of the silicon wafer inspected by 2nd Example of a probe card provided with the contactor unit which concerns on this invention. FIG. 16 is a configuration diagram schematically showing an enlarged part of a circuit pattern in the silicon wafer shown in FIG. 15. (A), (B), (C), (D), and (E) are partial sectional views showing other examples of the contact used in the contact unit. It is a fragmentary sectional view which shows the principal part of 3rd Example of a probe card provided with the contactor unit which concerns on this invention. It is a top view of the contact unit used for the 3rd example of a probe card provided with the contact unit concerning the present invention. It is a side view in the example shown by FIG. FIG. 20 is a back view of the example shown in FIG. 19. It is a front view in the example shown by FIG. It is a fragmentary sectional view which shows the principal part of 4th Example of a probe card provided with the contactor unit which concerns on this invention. It is a top view of the contact unit used for the 4th example of a probe card provided with the contact unit concerning the present invention. It is a front view in the example shown by FIG. It is a side view in the example shown by FIG. It is a back view in the example shown by FIG. It is a block diagram of the probe card used for description of an example of the exchange method of the contactor unit which concerns on this invention. It is a figure with which it uses for description of the repair nozzle used for an example of the exchange method of the contactor unit which concerns on this invention. It is a block diagram which expands and shows a part of contactor unit on the board | substrate shown by FIG.

Explanation of symbols

12 Test head 20 Probe card 28ij, 38S, 38L, 58ij, 68ij Contact unit WO Liquid crystal panel WA Silicon wafer

Claims (6)

A plurality of contacts that are brought into contact with or separated from an input / output signal terminal group in the object to be inspected, a substrate that supports the plurality of contacts on one surface for each predetermined number, and the other opposite to each other on the substrate A plurality of contact units each including a conductor layer formed on the surface of the contact layer and electrically connected to the plurality of contacts.
An external connection terminal, a plurality of contact units and a conductor layer that electrically connects the external connection terminals, and a mother board that supports the plurality of contact units,
A probe card comprising a contact unit, wherein the plurality of contact units are detachably joined directly or indirectly to the surface of the mother board by a heat-peelable adhesive or brazing material.   The plurality of contacts are fixed to the substrate by a first brazing material, and the conductor layer of the contact unit is made of a second brazing material having a melting point lower than the melting point of the first brazing material. The probe card comprising the contact unit according to claim 1, wherein the probe card is a solder ball.   It further comprises a connection block member containing a contact terminal electrically connected to the conductor layer of the motherboard, and the plurality of contact units are electrically connected to the conductor layer of the motherboard via the contact terminal A probe card comprising the contact unit according to claim 1.   The probe card having the contact unit according to claim 2, wherein a substrate of the contact unit has a support that is in contact with the motherboard.   The contact unit is electrically connected to the conductor layer of the motherboard via a flexible wiring board connected to the conductor layer of the board of the contact unit and a connector provided on the motherboard and connected to the flexible wiring board. The probe card comprising the contact unit according to claim 1, wherein the probe card is connected to the probe card. One contact unit of the plurality of contact units removably joined to a predetermined position of the motherboard according to claim 1 for a predetermined time inside a repair nozzle to which infrared rays or heated air is supplied, Arrange
After the predetermined time has elapsed, the one contact unit is removed from the inside of the repair nozzle,
A method for replacing a contactor unit, comprising joining a new contactor unit to a predetermined position of the mother board with a bonding material.

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