JP2003202350A - Probe and probe unit for probe card, probe card and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a probe card in low cost and in a short period by manufacturing a probe for a probe card from bulk material of metallic glass. <P>SOLUTION: By a press work, the bulk material of the metallic glass is formed to be a shape in the thickness direction of the probe below crystallization temperature so as to form a probe plate (S10). Then, a contactor is formed at one end of the probe plate (S12), each probe is formed from the probe plate (S14), and the probe is attached and wired to a mainframe substrate (S16). Thereby, the bulk material of the metallic glass is worked, the probe is formed, and the probe card is manufactured. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe for a probe card, a probe card for a probe unit, a probe card and a method for manufacturing the same, and more particularly to a probe for a probe using a bulk material of metallic glass, a probe card. Probe unit, probe card, and manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, in order to inspect the electrical characteristics of a semiconductor element, a probe card for electrically connecting a semiconductor element of an object to be inspected and an external inspection device has been widely used. This probe card is provided with a plurality of probes, and the tips of these probes are provided with contacts that come into contact with the electrode pads of the semiconductor element. In the inspection using this probe card, the contactor contacts the electrode pad of the semiconductor element,
The electrode pad of the semiconductor element and the inspection device are electrically connected via the probe, and the continuity inspection and the function measurement inspection are performed.

As the probe card probe, for example, a probe made of a tungsten material is used, and the tungsten material probe is attached to a base made of an epoxy resin one by one by a skilled worker. Manufactured as a probe card.

In order to cope with the recent increase in the number of electrode pads of semiconductor elements, the reduction in size, and the reduction in pitch,
Although miniaturization of the probe is desired, there is a limit to miniaturization of the conventional tungsten material probe. Therefore, the improved probe card in the related art has a fine probe on the substrate by the photolithography technique. Forming a needle is being done.

[0005]

As described above, in the method of manufacturing the tungsten material probe, the amount of work is increased due to the increase in the number of electrode pads of the semiconductor element in recent years, and the pitch of the electrode pads is narrowed to be manually operated. The production has reached the limit,
Further, there is a problem that manufacturing by automation is difficult.

Further, in manufacturing a probe card probe using the photolithography technique, a mask for forming a probe card probe pattern matching the device to be inspected is required for each device to be inspected. Has the problem that it costs money.

As described above, the probe card probe and its manufacturing method are carried out by various methods, but each has the above-mentioned problems.

As described above, in the present technical situation of the probe card, the present invention solves the above-mentioned problems in terms of labor intensity in manufacturing the probe card, that is, reduction of manufacturing cost and short-term manufacturing. The purpose is to Further, the present invention solves the problem from the viewpoint of labor intensity by solving the manufacturing of the probe for the probe card by automation by machining. Furthermore, the present invention uses a so-called metallic glass bulk material for the probe for a probe card as a material that can withstand the manufacturing method and a material that has the physical properties required for the probe in this manufacturing method by machining. And provide a specific manufacturing method thereof.

That is, an object of the present invention is to provide a probe card probe using a bulk material of metallic glass, a probe card probe unit, a probe card, and a method for manufacturing them.

[0010]

According to the present invention, there is provided a method of manufacturing a probe card probe for electrically connecting to an electrode of an object to be inspected, which comprises press forming a bulk material of metallic glass at a crystallization temperature or lower, The probe plate forming process of forming the probe into the shape in the thickness direction and forming into the probe plate, and the probe forming process of forming notches with leaving the probe width in the probe plate and forming into individual probes And are included.

A method of manufacturing a probe card probe unit having a plurality of probe card probes electrically connected to an electrode of an object to be inspected according to the present invention comprises press working to crystallize a bulk material of metallic glass. At a temperature equal to or lower than the temperature, a probe plate forming step of forming a probe plate in a shape in the thickness direction of the probe and a fixing step of fixing the probe plate to a probe base that can be fixed to the probe card body substrate, A probe forming step of forming a notch in the probe plate while leaving the probe width and forming a plurality of probes on the probe base.

A method of manufacturing a probe card probe unit having a plurality of probe card probes electrically connected to an electrode of an object to be inspected according to the present invention includes a probe base fixed to a probe card body substrate. Fixing process to fix the probe plate made of bulk material of metallic glass, and a plurality of probe with which the tip is in contact with the electrode of the DUT on the probe base by making a notch in the probe plate leaving the probe width And a probe forming step of forming.

The method for manufacturing the probe for a probe card or the probe unit for a probe card according to the present invention includes a contact forming step of providing a contact for contacting an object to be inspected with at least one end of the probe plate. Is characterized by.

Further, in the method for manufacturing the probe card probe or probe card probe unit, in the press working step, at least one end of the bulk material of the metallic glass is formed with a contactor which comes into contact with the object to be inspected. Including that.

The probe card probe of the present invention is a probe card probe electrically connected to an electrode of an object to be inspected and is formed by processing a bulk material of metallic glass. To do.

The probe card probe of the present invention is a probe card probe electrically connected to an electrode of an object to be inspected, and is characterized by being manufactured by any one of the above manufacturing methods.

The probe card probe unit of the present invention is a probe card probe unit having a plurality of probe card probes electrically connected to the electrodes of the object to be inspected. It is manufactured by.

The probe card of the present invention is a probe card having a probe card probe that is electrically connected to an electrode of a device under test, the probe card probe being manufactured by any one of the above-mentioned manufacturing methods. It is characterized by including a probe card probe unit.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention (hereinafter referred to as embodiments) will be described below with reference to the drawings. The same members are designated by the same reference numerals.

[0020] Summary of the Embodiment The present invention, as the material of the probe for a probe card, a metallic glass, further, a probe of a probe card present embodiment, is molded by processing a bulk material of metallic glass It is characterized by being

In the present specification, the metallic glass refers to an amorphous alloy having a supercooled liquid region structure in the glass transition temperature (Tg) range which is lower than the crystallization temperature (Tx). This metallic glass can be processed by plastic deformation in the supercooled liquid region, and has characteristics such as high strength and high hardness that are different from those of crystalline metals at room temperature. Therefore, as described below, the probe card probe can be formed by machining, and the processed probe satisfies the physical properties required for the probe. As the metallic glass material of the probe, Zr-based, Fe
A system, Ti system, Pd system, Co system, Nd system, Pt system, etc. can be used.

FIG. 1 is an overall configuration diagram of a probe card having a probe card probe formed by processing a bulk material of metallic glass.

As shown in FIG. 1, the probe card 1 is
Probe card main board (hereinafter simply referred to as main board)
10 and a plurality of probes 12 fixed to the main body substrate 10 and ensuring contact with the electrode pads of the device under test. A contactor 14 that comes into contact with an electrode pad of an object to be inspected is formed at the tip of the probe 12, and the base end of the probe 12 is connected to the internal wiring 18 of the probe body substrate 10 by a wiring 16. ing.

The probe card 1 configured as described above
In the inspection of electric characteristics, the contactor 14 is brought into contact with the electrode pad of the semiconductor element of the device under test, and the device under test is electrically connected to the test device to perform the continuity test and the function measurement test. ing.

In the present embodiment, the probe 12 is formed by processing a bulk material of metallic glass. Preferably, it is processed by the manufacturing method described later. in this way,
When the probe 12 is made of metallic glass, even if a large strain is applied when the object to be inspected is brought into contact with the electrode pad at the time of inspection, it functions as an elastic body because of its large yield point strength. Therefore,
A large displacement amount and effective stylus pressure can be obtained with a small-sized probe. In addition, since metallic glass has high strength,
It also has the advantage of being less likely to be damaged even after repeated inspections.

Further, the contactor 14 of the probe 12 can be made of metallic glass as described later. Contact 14
In the case where is made of metallic glass, the metallic glass is less likely to be oxidized, so that the contactor can be kept in a clean state.

A preferred method for manufacturing a probe card using the probe card probe or probe card probe unit of the present embodiment will be described below.

Embodiment 1 FIG. 2 is a flow chart for explaining the overall flow of the manufacturing process of the probe card of Embodiment 1. As shown in FIG. 2, first, a bulk material of metallic glass is formed by pressing into a shape in the thickness direction of the probe at a crystallization temperature or lower to form a probe plate (S10). Next, a contact is formed on one end of the probe plate (S12), the probe plate is formed into individual probes (S14), and the probe is attached to the main board to be wired (S16). ). Thereby, the probe material can be obtained by processing the bulk material of metallic glass to form the probe.

FIG. 3 is a diagram showing a configuration example in each step of FIG. In the drawings showing the following steps, the lower drawing is a plan view and the upper drawing is a front view.

As shown in FIG. 3 (A), a bulk material 20 of metallic glass, for example, a bulk material 20 of thin metallic glass is formed into a shape in the thickness direction of the probe at a crystallization temperature or lower by press working. The probe plate 22 is formed. In the step of S14, the probe plate 22 is separated by the width of the probe 12, and therefore, in this press working, bending work or the like is performed in the shape in the thickness direction of the probe. The press working temperature is lower than the crystallization temperature at which the metallic glass is not recrystallized, and more preferably at a temperature in the supercooled liquid region which is higher than the glass transition temperature and lower than the crystallization temperature. In the supercooled liquid region, remarkable plastic deformation occurs and it can be easily molded.

Next, as shown in FIG. 3B, the contactor 14 is formed on the probe plate 22 thus formed. In the step S14, the probe plate 22 is separated according to the width of the probe 12 and is formed into the individual probe 12. Therefore, in the step S12, the probe plate 22 is attached to one end of the probe plate 22. A plurality of contacts 14 are formed for every 12 pitches.

Here, a method of forming the contacts will be described. FIG. 4 is a diagram showing a method of forming the contactor 14. For example, as shown in FIG. 4 (A), a lower die 24 having a contactor die 24a formed thereon and a protrusion 26 corresponding to the contactor die 24a.
It can be formed by a press die including the upper die 26 in which a is formed. The probe plate 22 is sandwiched between the lower mold 24 and the upper mold 26 and pressed. As a result, the contactor 14 and the probe 12 can be integrally formed on the probe plate made of a bulk material of metallic glass. As described above, when the contactor 14 is made of metallic glass, the effects as described above can be obtained. Further, the contact 1 is formed by this press molding.
4, the step of forming the probe plate 22 (S1
0) may be performed at the same time.

Further, the probe plate 22 may be provided with a contact made of another member, for example, a contact made of nickel (Ni). For example, as shown in FIG. 4B, a pyramidal contact type 28a is formed on the silicon substrate 28, and the resist layer 3 is formed.
The area other than the contact die 28a is masked by 2, the Ni plating is embedded in the contact die 28a, and the solder 30 is placed thereon. Then, place the probe plate 22 on the silicon substrate 28,
Solder connection between the probe plate 22 and the contact 14 made of Ni plating is performed.

Next, after forming a plurality of contacts 14 on the probe plate 22, as shown in FIG. 3 (C), notches are made in the probe plate 22 while leaving the width of the probe, and individual probes are formed. The needle 12 is formed. The cutting can be performed with a dancing saw or a wire saw. In this dicing, since residual internal stress does not occur in the metallic glass, warpage due to residual strain does not occur, and dicing can be performed accurately. In this case, as shown in FIG. 3 (C), it is preferable to form the probe 12 in a comb-teeth state in which the base end portion of the probe 12 is connected. It is possible to easily attach a plurality of probes together at once. Further, after forming the probe 12, it is preferable to coat the probe 12 with gold or the like having a low resistance value to increase the conductivity.

As described above, since the probe can be manufactured by machining, it can be manufactured accurately, at low cost, and in a short period of time.

Further, since the probe is molded from a bulk material of metallic glass by machining, the length and thickness of the probe can be easily adjusted each time, and even in the case of small-volume production, low cost, It can be manufactured in a short period of time.

The probe card 1 as shown in FIG. 1 can be obtained by attaching and wiring the probe 12 thus formed to the main body substrate 10.

Embodiment 2 FIG. 5 is a flow chart for explaining the overall flow of the manufacturing process of the probe card in Embodiment 2. A feature of the probe card of the second embodiment is that a probe card probe unit is formed with a plurality of probes and is attached to a main body substrate. As shown in FIG. 5, by pressing, a bulk material of metallic glass is formed into a shape in the thickness direction of the probe to form a probe plate (S20),
A contact is formed on one end of the probe plate (S2
2). After that, the probe plate is fixed to the probe base that can be fixed to the main body substrate (S24), and a plurality of probes are formed on the probe base (S26). As a result, the probe card probe unit can be manufactured, and the probe card probe unit is attached to the main body substrate (S28).

FIG. 6 is a diagram showing a configuration example in each step of FIG.

In FIGS. 6A and 6B, S20 and S22 are shown.
The configuration is shown, and these steps are molded similarly to the first embodiment.

Next, as shown in FIG. 6C, the probe plate 2
2 is fixed to the probe base 34 that can be fixed to the main body substrate 10. As shown in FIG. 6C, the probe base 34 includes an insulating base 34 a made of an insulating material such as ceramic and an insulating base 3 a.
And a metal layer 34b as a conductive layer formed on the upper surface of 4a. The probe base 3 configured in this way
Connect the probe plate 22 to 4 with solder or epoxy resin,
Fix it. The metal layer 34b as the conductive layer may not be provided.

Next, as shown in FIG. 6D, in the step S26, the probe plate 22 is notched while leaving the probe width, and is formed into a plurality of probe 12 on the probe base 34. . This cutting can be performed with a dancing saw or a wire saw as in the first embodiment. In addition, as shown in FIG. 6D, when the probe 12 is formed on the probe base 34, a conductive portion such as the metal layer 34b is cut and groove processing is performed to thereby form a gap between the probe 12. Insulation can be obtained.

As shown in the right side of FIG. 6C, a reinforcing agent 36 such as an epoxy resin may be overcoated to reinforce the joint between the probe plate 22 and the probe base 34.

FIG. 7 is a view (cross-sectional view) showing a side structure in which the probe card probe unit 2 of the second embodiment is attached to the main body substrate 10, and FIG. 7 (A) is a view connected by a wire bonder. Yes, FIG. 7B is a diagram in which the flexible printed circuit board is connected, and FIG. 7C is a diagram in which the connection is made by soldering.

As shown in FIG. 7, wirings 18 are provided inside the substrate body 10, and the pads 18 of the wirings 18 are provided.
a is connected to the probe 12, and the pad 18b is connected to an external inspection device. The probe card probe unit 2 is
It can be attached to the main body substrate 10 with screws or an adhesive such as an epoxy resin. FIG. 7 shows a state in which the main body substrate 10 is screwed with a screw 38.

In the connection with the wire bonder of FIG. 7 (A),
The base end portion 12a of the probe 12 and the pad 18a of the wiring 18 of the main body substrate 10 are connected by the wiring 16. Wiring may be performed from the metal layer 34b of the probe base 34. Further, in the connection with the flexible printed board shown in FIG. 7B, the base end portion 12 a of the probe 12 or the metal layer 34 b of the probe base 34 and the land 40 of the flexible printed board 40.
a is connected, and the connector 40b of the flexible printed board 40 and the pad 18a of the wiring 18 of the main body board 10 are connected. Further, in the soldering connection shown in FIG. 7C, the base end portion 12a of the probe 12 and the pad 18a of the wiring 18 of the main body substrate 10 can be directly soldered. Therefore, in forming the probe plate 22, as shown in the lower diagram of FIG. 7C, the width of the probe base 34 is reduced so that the proximal end portion of the probe 12 projects from the probe base 34. It is preferable to fix it.

FIG. 8 shows an overall configuration diagram of the probe card 3 in which the probe card probe unit 2 of the second embodiment is connected to the substrate body 10 by soldering.

Embodiment 3 FIG. 9 is a flow chart for explaining the overall flow of the manufacturing process of the probe card of Embodiment 3. Embodiment 3
What is characteristic of the above is that a bulk material made of metallic glass is used as a probe plate, fixed to a probe base, a probe card probe unit is molded, and the probe card is attached to the probe card.

As shown in FIG. 9, a contact member is formed at one end using a bulk material of metallic glass as a probe plate (S3).
0), the probe plate is fixed to the probe base (S32), and a plurality of probe tips are formed on the probe base, the tips of which contact the electrodes of the object to be inspected (S34). The probe card probe unit manufactured by these steps is attached to the main body substrate (S36).

FIG. 10 is a diagram showing a configuration example in each step of FIG.

FIG. 10A shows the structure of the step S30, in which the probe plate 4 made of a bulk material of metallic glass is used.
2, a contactor 14 is formed at one end. For example, as for the probe plate 42, a bulk material of a substantially flat metallic glass is used as the probe plate without performing the pressing work as in the second embodiment. The contactor 14 can be formed by the method shown in FIG. 4 as described in the first embodiment.

Next, FIG. 10B shows the structure of the step S32, in which the probe plate 42 is fixed to the probe base 44 which can be fixed to the main body substrate 10. The probe base 44 of the present embodiment also includes the insulating base 4 made of an insulating material such as ceramic.
4a and a metal layer 44b as a conductive layer formed on the upper surface of the insulating base 44a. The difference from the second embodiment is that the contact 14 formed at the tip of the probe plate 42 is brought into contact with the electrode pad of the device under test, and therefore the probe base 44 is used.
Is the point that the upper surface of is formed as a slope.

FIG. 10C shows the structure of the step S34, in which a notch is made in the probe plate 42 while leaving the probe width, and the tip of the probe base 44 is the electrode of the object to be inspected. To form a plurality of probes 12 that come into contact with. This cutting can be performed in the same manner as in the first embodiment. Thereby, the probe card probe unit 4 in which the plurality of probes 12 are fixed to the probe base 44 can be manufactured. In the present embodiment, unlike the second embodiment, the pressing step for forming the probe plate can be omitted.

FIG. 11 is a view showing a side structure in which the probe card probe unit 4 of the third embodiment is attached to the main body substrate 10, and FIG. 11 (A) is a view in which it is connected by a wire bonder. FIG. 11B is a diagram in which they are connected by a flexible printed board, and FIG. 11C is a diagram in which they are connected by soldering. These can be attached similarly to the second embodiment. Further, FIG. 12 shows an overall configuration diagram of the probe card 5 in which the probe card probe unit 4 of the third embodiment is connected to the substrate body 10 by soldering.

Embodiment 4 In Embodiment 4, a probe card for inspecting the electrical connection between the LCD panel and its driver will be described as an application example of the probe card probe unit.

The overall flow of the probe card manufacturing process according to the fourth embodiment is the same as that of the third embodiment shown in FIG. 9, and therefore will be described with reference to FIG.

FIG. 13 is a diagram showing a configuration example in each manufacturing process of the probe card of the fourth embodiment.

As shown in FIG. 13A, in the step S30, the contactor 14 is formed on the probe plate 42 made of a bulk material of metallic glass. In the present embodiment, the contactor 1
4 is the probe 12 at the end on the front surface and the end on the back surface of the probe plate 42.
A plurality of them are formed for each pitch. As will be described later, these contacts 14 contact the electrodes on the LCD panel side and the electrodes on the driver side to inspect the electrical connection.

Next, FIG. 13B shows the structure of the step S32, in which the probe plate 42 is fixed to the probe base 44. The probe base 44 of this embodiment is similar to that of the second embodiment.
3, but with a width shorter than the total length of the probe, and fixed between the contactors 14 provided at both ends of the probe plate 42 as shown in FIG. 13 (B). To be done.

FIG. 13C shows the structure of the step S34. The above method is used to make a notch in the probe plate 42 while leaving the probe width, and the plurality of probe 12 are cut. Mold. Thus, the probe card probe unit 6 capable of inspecting the electrical connection between the LCD panel and the driver can be manufactured.

FIG. 14 is a diagram showing the configuration of a probe card 7 having the probe card probe unit 6 of the fourth embodiment, and FIG. 14A is an enlarged sectional view.
(B) is a view of the entire state as viewed from above.

As shown in FIG. 14, the probe card 7 can be obtained by attaching the probe card probe unit 6 to the frame substrate 46 with the screws 38. For the inspection of electrical characteristics, the probe card 7
Is arranged between the LCD panel 48 and the driver 50. The contactor 14 on the surface of the probe 12 is the LCD panel 48.
Side electrode 48a, and contactor 14 on the back surface of probe 12.
Is in contact with and electrically connected to the electrode 50a on the driver 50 side, and it is possible to perform an electrical characteristic inspection such as a lighting inspection.

[0063]

Example A probe card probe or a probe card probe unit was formed using a bulk material of metallic glass having the following composition.

Composition Pt48.75-Pd9.75-Cu19.5-P22 (Each subscript represents an atomic percentage. The weight ratio is
Pt is 76.8 wt% and Pd is 8.33 wt%. ) Mechanical properties Vickers hardness (HV): 420 Tensile strength (Mpa): 1320 Resistivity (μΩ · m): 1.828 Temperature characteristics Glass transition temperature (Tg): 509.2K (236 ° C) Crystallization temperature ( Tx): 584.0 K (310 ° C.) Melting temperature (Tm): 774.7 K (502 ° C.) The glass transition temperature (Tg) of the metallic glass is pressed within the crystallization temperature (Tx) to obtain a desired shape. I was able to get a probe board. As the probe, a probe having a total length of 1 to 2 mm, a thickness of 100 μm, and a probe width of 50 μm could be obtained.

[0065]

As described above, since the probe card probe and the probe card probe unit are manufactured by machining using the bulk material of metallic glass, the probe card can be manufactured at low cost and in a short time. can do.

[Brief description of drawings]

FIG. 1 is an overall configuration diagram of a probe card having a probe card probe formed by processing a bulk material of metallic glass.

FIG. 2 is a flowchart illustrating an overall flow of manufacturing steps of the probe card according to the first embodiment.

FIG. 3 is a diagram showing a configuration example in each step of FIG.

FIG. 4 is a diagram showing a method of forming a contactor.

FIG. 5 is a flowchart illustrating an overall flow of a probe card manufacturing process according to the second embodiment.

6 is a diagram showing a configuration example in each step of FIG.

FIG. 7 is a view showing a side structure in which the probe card probe unit of the second embodiment is attached to a main body substrate.

FIG. 8 shows an overall configuration diagram of a probe card in which the probe card probe unit of the second embodiment is connected to a substrate body by soldering.

FIG. 9 is a flowchart illustrating an overall flow of a probe card manufacturing process according to the third embodiment.

FIG. 10 is a diagram showing a configuration example in each step of FIG.

FIG. 11 is a view showing a side structure in which the probe card probe unit of the third embodiment is attached to a main body substrate.

FIG. 12 is an overall configuration diagram of a probe card in which a probe card probe unit according to a third embodiment is connected to a substrate body by soldering.

FIG. 13 is a diagram showing a configuration example during a manufacturing process of the probe card according to the fourth embodiment.

FIG. 14 is a diagram showing a configuration of a probe card having a probe card probe unit according to a fourth embodiment.

[Explanation of symbols]

1, 3, 5, 7 probe card, 2, 4, 6 probe card probe unit, 10 probe card body substrate, 12 probe, 14 contacts, 16 wiring, 18 internal wiring, 20 bulk material, 22, 42 Probe plate, 34,
44 Probe base.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masami Nagano             1-10-14 Itabashi, Itabashi-ku, Tokyo Stock market             Company Tokyo Cathode Institute (72) Inventor Yomei             1-10-14 Itabashi, Itabashi-ku, Tokyo Stock market             Company Tokyo Cathode Institute F-term (reference) 2G003 AA07 AA10 AB01 AG03 AG04                 2G011 AA09 AA15 AA17 AB01 AB06                       AE03 AE22                 4M106 AA01 AA02 AA04 BA01 DD03

Claims (9)

[Claims] 1. A method for manufacturing a probe card probe that is electrically connected to an electrode of an object to be inspected, comprising: pressing a bulk material of metallic glass at a crystallization temperature or lower, in a thickness direction of the probe. A probe plate forming step of forming into a shape of a probe plate and forming a notch in the probe plate while leaving a probe width, and forming a probe into an individual probe tip. And a method for manufacturing a probe card probe. 2. A method of manufacturing a probe card probe unit having a plurality of probe card probes electrically connected to an electrode of a device under test, the bulk material of metallic glass being crystallized by press working. A step of forming the probe plate in the thickness direction of the probe at a temperature equal to or lower than the temperature for forming, and a fixing step of fixing the probe plate to a probe base that can be fixed to the probe card body substrate. And a probe forming step of forming a notch in the probe plate while leaving a probe width, and forming into a plurality of probes on a probe base, and manufacturing a probe unit for a probe card. Method. 3. A method of manufacturing a probe card probe unit having a plurality of probe card probes electrically connected to an electrode of a device under test, the probe base being fixable to a probe card body substrate. A fixing step of fixing a probe plate made of a bulk material of metallic glass to, and making a notch in the probe plate leaving a probe width, and a plurality of tips whose tip contacts the electrode of the device under test on the probe base. A method of manufacturing a probe unit for a probe card, comprising: a step of forming a probe into a probe; 4. The method for manufacturing a probe card probe or a probe card probe unit according to claim 1, wherein at least one end of the probe plate is an object to be inspected. A method comprising a contact forming step of providing a contact to contact. 5. The method of manufacturing a probe card probe or probe card probe unit according to claim 1, wherein at least one end of the bulk material of metallic glass is used in the pressing step. Forming a contact in contact with the object under test. 6. A probe card probe that is electrically connected to an electrode of a device under test, wherein the probe card probe is formed by processing a bulk material of metallic glass. Probe card to do. 7. A probe card probe that is electrically connected to an electrode of a device under test, the probe card probe manufactured by the manufacturing method according to claim 1. 8. A probe card probe unit having a plurality of probe card probes electrically connected to an electrode of a device under test, which is manufactured by the manufacturing method according to claim 2. Probe unit for probe card. 9. A probe card having a probe card probe that is electrically connected to an electrode of a device under test, the probe card probe being manufactured by the manufacturing method according to claim 1. A probe card including a probe card probe unit.