JP2009200496A5 - - Google Patents
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- Publication number
- JP2009200496A5 JP2009200496A5 JP2009037541A JP2009037541A JP2009200496A5 JP 2009200496 A5 JP2009200496 A5 JP 2009200496A5 JP 2009037541 A JP2009037541 A JP 2009037541A JP 2009037541 A JP2009037541 A JP 2009037541A JP 2009200496 A5 JP2009200496 A5 JP 2009200496A5
- Authority
- JP
- Japan
- Prior art keywords
- segment
- sugar water
- soluble polymer
- polymer
- composition contains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920003169 water-soluble polymer Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/072,015 US20090215266A1 (en) | 2008-02-22 | 2008-02-22 | Polishing Copper-Containing patterned wafers |
| US12/072,015 | 2008-02-22 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009200496A JP2009200496A (ja) | 2009-09-03 |
| JP2009200496A5 true JP2009200496A5 (enExample) | 2012-03-08 |
| JP5514449B2 JP5514449B2 (ja) | 2014-06-04 |
Family
ID=40521506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009037541A Active JP5514449B2 (ja) | 2008-02-22 | 2009-02-20 | 銅含有パターン付きウエーハの研磨 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20090215266A1 (enExample) |
| EP (1) | EP2093789A3 (enExample) |
| JP (1) | JP5514449B2 (enExample) |
| KR (1) | KR101560648B1 (enExample) |
| CN (1) | CN101515546B (enExample) |
| TW (1) | TWI487760B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102121127A (zh) * | 2011-01-04 | 2011-07-13 | 安徽工业大学 | 一种集成电路铜互连结构中铜的电化学机械抛光液 |
| KR101907229B1 (ko) | 2011-02-03 | 2018-10-11 | 니타 하스 인코포레이티드 | 연마용 조성물 및 그것을 이용한 연마 방법 |
| US8435896B2 (en) | 2011-03-03 | 2013-05-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable chemical mechanical polishing composition and methods relating thereto |
| US8440097B2 (en) | 2011-03-03 | 2013-05-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition |
| CN104131289B (zh) * | 2014-07-01 | 2015-09-23 | 安徽拓普森电池有限责任公司 | 一种具有杀菌效果的抛光液及其制备方法 |
| JP6837958B2 (ja) * | 2017-12-28 | 2021-03-03 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| CN116438267A (zh) * | 2020-10-29 | 2023-07-14 | 富士胶片电子材料美国有限公司 | 研磨组成物及其使用方法 |
| CN114561187B (zh) * | 2022-03-07 | 2022-10-21 | 山东麦丰新材料科技股份有限公司 | 一种环保型乳化精磨液及其制备方法 |
| KR20250133292A (ko) * | 2022-12-29 | 2025-09-05 | 바스프 에스이 | Co 및 Cu 중 하나 또는 양자 모두의 산화물 화합물 및 에칭 잔류물을 선택적으로 제거하기 위한 조성물 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4642221A (en) * | 1983-07-05 | 1987-02-10 | Atlantic Richfield Company | Method and composition for inhibiting corrosion in aqueous heat transfer systems |
| JPH0982668A (ja) * | 1995-09-20 | 1997-03-28 | Sony Corp | 研磨用スラリー及びこの研磨用スラリーを用いる研磨方法 |
| JP2000160139A (ja) * | 1998-12-01 | 2000-06-13 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
| US6238592B1 (en) * | 1999-03-10 | 2001-05-29 | 3M Innovative Properties Company | Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
| JP3941284B2 (ja) * | 1999-04-13 | 2007-07-04 | 株式会社日立製作所 | 研磨方法 |
| US6234875B1 (en) * | 1999-06-09 | 2001-05-22 | 3M Innovative Properties Company | Method of modifying a surface |
| JP4391715B2 (ja) * | 1999-08-13 | 2009-12-24 | キャボット マイクロエレクトロニクス コーポレイション | 化学機械的研磨系 |
| US7041599B1 (en) * | 1999-12-21 | 2006-05-09 | Applied Materials Inc. | High through-put Cu CMP with significantly reduced erosion and dishing |
| US20020025762A1 (en) * | 2000-02-16 | 2002-02-28 | Qiuliang Luo | Biocides for polishing slurries |
| US6451697B1 (en) * | 2000-04-06 | 2002-09-17 | Applied Materials, Inc. | Method for abrasive-free metal CMP in passivation domain |
| US6409781B1 (en) * | 2000-05-01 | 2002-06-25 | Advanced Technology Materials, Inc. | Polishing slurries for copper and associated materials |
| US20020068454A1 (en) * | 2000-12-01 | 2002-06-06 | Applied Materials, Inc. | Method and composition for the removal of residual materials during substrate planarization |
| US6632259B2 (en) * | 2001-05-18 | 2003-10-14 | Rodel Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| US6692546B2 (en) * | 2001-08-14 | 2004-02-17 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| US7029373B2 (en) * | 2001-08-14 | 2006-04-18 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| US6805812B2 (en) * | 2001-10-11 | 2004-10-19 | Cabot Microelectronics Corporation | Phosphono compound-containing polishing composition and method of using same |
| US20030119692A1 (en) * | 2001-12-07 | 2003-06-26 | So Joseph K. | Copper polishing cleaning solution |
| US20040077295A1 (en) * | 2002-08-05 | 2004-04-22 | Hellring Stuart D. | Process for reducing dishing and erosion during chemical mechanical planarization |
| JP2005142516A (ja) * | 2003-06-11 | 2005-06-02 | Toshiro Doi | 化学機械研磨用スラリー組成物及び化学機械研磨方法 |
| JP4464111B2 (ja) * | 2003-11-13 | 2010-05-19 | 旭硝子株式会社 | 銅配線研磨用組成物、半導体集積回路表面の研磨方法および半導体集積回路用銅配線の作製方法 |
| US7384871B2 (en) * | 2004-07-01 | 2008-06-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| US7086935B2 (en) * | 2004-11-24 | 2006-08-08 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cellulose-containing polishing compositions and methods relating thereto |
| US7435356B2 (en) * | 2004-11-24 | 2008-10-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Abrasive-free chemical mechanical polishing compositions and methods relating thereto |
| WO2007019342A2 (en) * | 2005-08-05 | 2007-02-15 | Advanced Technology Materials, Inc. | High throughput chemical mechanical polishing composition for metal film planarization |
-
2008
- 2008-02-22 US US12/072,015 patent/US20090215266A1/en not_active Abandoned
-
2009
- 2009-01-22 TW TW098102429A patent/TWI487760B/zh not_active IP Right Cessation
- 2009-02-09 EP EP09152376A patent/EP2093789A3/en not_active Withdrawn
- 2009-02-20 JP JP2009037541A patent/JP5514449B2/ja active Active
- 2009-02-20 CN CN2009100047488A patent/CN101515546B/zh not_active Expired - Fee Related
- 2009-02-20 KR KR1020090014260A patent/KR101560648B1/ko not_active Expired - Fee Related
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