JP2009200495A5 - - Google Patents

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Publication number
JP2009200495A5
JP2009200495A5 JP2009037540A JP2009037540A JP2009200495A5 JP 2009200495 A5 JP2009200495 A5 JP 2009200495A5 JP 2009037540 A JP2009037540 A JP 2009037540A JP 2009037540 A JP2009037540 A JP 2009037540A JP 2009200495 A5 JP2009200495 A5 JP 2009200495A5
Authority
JP
Japan
Prior art keywords
segment
sugar water
soluble polymer
polymer
composition contains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009037540A
Other languages
English (en)
Japanese (ja)
Other versions
JP5479755B2 (ja
JP2009200495A (ja
Filing date
Publication date
Priority claimed from US12/071,000 external-priority patent/US9633865B2/en
Application filed filed Critical
Publication of JP2009200495A publication Critical patent/JP2009200495A/ja
Publication of JP2009200495A5 publication Critical patent/JP2009200495A5/ja
Application granted granted Critical
Publication of JP5479755B2 publication Critical patent/JP5479755B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009037540A 2008-02-22 2009-02-20 低汚染研磨組成物 Active JP5479755B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/071,000 US9633865B2 (en) 2008-02-22 2008-02-22 Low-stain polishing composition
US12/071,000 2008-02-22

Publications (3)

Publication Number Publication Date
JP2009200495A JP2009200495A (ja) 2009-09-03
JP2009200495A5 true JP2009200495A5 (enExample) 2012-03-08
JP5479755B2 JP5479755B2 (ja) 2014-04-23

Family

ID=40521509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009037540A Active JP5479755B2 (ja) 2008-02-22 2009-02-20 低汚染研磨組成物

Country Status (6)

Country Link
US (1) US9633865B2 (enExample)
EP (1) EP2093790B1 (enExample)
JP (1) JP5479755B2 (enExample)
KR (1) KR101560647B1 (enExample)
CN (1) CN101525522B (enExample)
TW (1) TWI447188B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102762708B (zh) * 2009-07-06 2015-03-04 布拉斯通产品公司 清洁具有铝组件的传热系统的方法和组合物
SG192220A1 (en) * 2011-02-03 2013-09-30 Nitta Haas Inc Polishing composition and polishing method using the same
US8440097B2 (en) * 2011-03-03 2013-05-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition
US8435896B2 (en) * 2011-03-03 2013-05-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable chemical mechanical polishing composition and methods relating thereto
TWI629347B (zh) * 2012-07-17 2018-07-11 福吉米股份有限公司 使用合金材料硏磨用組成物來研磨合金材料的方法
US20190031919A1 (en) * 2016-01-28 2019-01-31 Fujimi Incorporated Polishing composition
CN107350978A (zh) * 2017-07-26 2017-11-17 天津市职业大学 一种绿色固定磨料抛光片及其制备方法
CN114481286A (zh) * 2021-12-28 2022-05-13 广东省科学院化工研究所 一种用于电解抛光的固体颗粒物
CN114561187B (zh) * 2022-03-07 2022-10-21 山东麦丰新材料科技股份有限公司 一种环保型乳化精磨液及其制备方法
CN116948648A (zh) * 2023-06-30 2023-10-27 浙江奥首材料科技有限公司 一种半导体芯片二氧化硅蚀刻液、制备方法及其应用

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7029373B2 (en) 2001-08-14 2006-04-18 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for metal and associated materials and method of using same
US20030119692A1 (en) * 2001-12-07 2003-06-26 So Joseph K. Copper polishing cleaning solution
GB0216815D0 (en) 2002-07-19 2002-08-28 Aoti Operating Co Inc Detection method and apparatus
US7736405B2 (en) * 2003-05-12 2010-06-15 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for copper and associated materials and method of using same
JP4464111B2 (ja) * 2003-11-13 2010-05-19 旭硝子株式会社 銅配線研磨用組成物、半導体集積回路表面の研磨方法および半導体集積回路用銅配線の作製方法
US7390744B2 (en) * 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US7086935B2 (en) * 2004-11-24 2006-08-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cellulose-containing polishing compositions and methods relating thereto
KR100816651B1 (ko) * 2006-03-31 2008-03-27 테크노세미켐 주식회사 제올라이트를 함유하는 구리 화학 기계적 연마 조성물
CN100491072C (zh) * 2006-06-09 2009-05-27 河北工业大学 Ulsi多层铜布线化学机械抛光中碟形坑的控制方法

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