JP2009200495A5 - - Google Patents
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- Publication number
- JP2009200495A5 JP2009200495A5 JP2009037540A JP2009037540A JP2009200495A5 JP 2009200495 A5 JP2009200495 A5 JP 2009200495A5 JP 2009037540 A JP2009037540 A JP 2009037540A JP 2009037540 A JP2009037540 A JP 2009037540A JP 2009200495 A5 JP2009200495 A5 JP 2009200495A5
- Authority
- JP
- Japan
- Prior art keywords
- segment
- sugar water
- soluble polymer
- polymer
- composition contains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920003169 water-soluble polymer Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/071,000 US9633865B2 (en) | 2008-02-22 | 2008-02-22 | Low-stain polishing composition |
| US12/071,000 | 2008-02-22 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009200495A JP2009200495A (ja) | 2009-09-03 |
| JP2009200495A5 true JP2009200495A5 (enExample) | 2012-03-08 |
| JP5479755B2 JP5479755B2 (ja) | 2014-04-23 |
Family
ID=40521509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009037540A Active JP5479755B2 (ja) | 2008-02-22 | 2009-02-20 | 低汚染研磨組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9633865B2 (enExample) |
| EP (1) | EP2093790B1 (enExample) |
| JP (1) | JP5479755B2 (enExample) |
| KR (1) | KR101560647B1 (enExample) |
| CN (1) | CN101525522B (enExample) |
| TW (1) | TWI447188B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012532245A (ja) * | 2009-07-06 | 2012-12-13 | プレストーン プロダクツ コーポレイション | アルミニウム構成部分を有する伝熱系の洗浄のための方法および組成 |
| KR101907229B1 (ko) * | 2011-02-03 | 2018-10-11 | 니타 하스 인코포레이티드 | 연마용 조성물 및 그것을 이용한 연마 방법 |
| US8440097B2 (en) * | 2011-03-03 | 2013-05-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition |
| US8435896B2 (en) * | 2011-03-03 | 2013-05-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable chemical mechanical polishing composition and methods relating thereto |
| US20150166862A1 (en) * | 2012-07-17 | 2015-06-18 | Fujimi Incorporated | Composition for polishing alloy material and method for producing alloy material using same |
| WO2017130749A1 (ja) * | 2016-01-28 | 2017-08-03 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| CN107350978A (zh) * | 2017-07-26 | 2017-11-17 | 天津市职业大学 | 一种绿色固定磨料抛光片及其制备方法 |
| CN114481286A (zh) * | 2021-12-28 | 2022-05-13 | 广东省科学院化工研究所 | 一种用于电解抛光的固体颗粒物 |
| CN114561187B (zh) * | 2022-03-07 | 2022-10-21 | 山东麦丰新材料科技股份有限公司 | 一种环保型乳化精磨液及其制备方法 |
| CN116948648A (zh) * | 2023-06-30 | 2023-10-27 | 浙江奥首材料科技有限公司 | 一种半导体芯片二氧化硅蚀刻液、制备方法及其应用 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7029373B2 (en) | 2001-08-14 | 2006-04-18 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| US20030119692A1 (en) | 2001-12-07 | 2003-06-26 | So Joseph K. | Copper polishing cleaning solution |
| GB0216815D0 (en) | 2002-07-19 | 2002-08-28 | Aoti Operating Co Inc | Detection method and apparatus |
| US7736405B2 (en) * | 2003-05-12 | 2010-06-15 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for copper and associated materials and method of using same |
| JP4464111B2 (ja) * | 2003-11-13 | 2010-05-19 | 旭硝子株式会社 | 銅配線研磨用組成物、半導体集積回路表面の研磨方法および半導体集積回路用銅配線の作製方法 |
| US7390744B2 (en) * | 2004-01-29 | 2008-06-24 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US7086935B2 (en) * | 2004-11-24 | 2006-08-08 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cellulose-containing polishing compositions and methods relating thereto |
| KR100816651B1 (ko) * | 2006-03-31 | 2008-03-27 | 테크노세미켐 주식회사 | 제올라이트를 함유하는 구리 화학 기계적 연마 조성물 |
| CN100491072C (zh) * | 2006-06-09 | 2009-05-27 | 河北工业大学 | Ulsi多层铜布线化学机械抛光中碟形坑的控制方法 |
-
2008
- 2008-02-22 US US12/071,000 patent/US9633865B2/en active Active
-
2009
- 2009-01-22 TW TW098102432A patent/TWI447188B/zh active
- 2009-02-09 EP EP09152377.9A patent/EP2093790B1/en not_active Ceased
- 2009-02-20 KR KR1020090014258A patent/KR101560647B1/ko active Active
- 2009-02-20 JP JP2009037540A patent/JP5479755B2/ja active Active
- 2009-02-20 CN CN2009100047473A patent/CN101525522B/zh active Active
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