JP2009200267A - Solar cell - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a back junction solar cell which can have a collecting electrode layer formed with a fine line width while suppressing damage to a semiconductor layer and a semiconductor substrate. <P>SOLUTION: The solar cell 10 includes a pair of second semiconductor layers 14 disposed adjacently to both sides of a first semiconductor layer 12, an insulating layer 16 formed from one second semiconductor layer 14 to extend over the first semiconductor layer 12, and an insulating layer 16 formed from the other semiconductor layer 14 to extend over the first semiconductor layer 12. A transparent electrode layer 18 and the collecting electrode layer 20 are parted from each other by a pair of separation grooves 30 formed on the insulating film 16 in a first direction. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a back junction solar cell including an n-type semiconductor layer and a p-type semiconductor layer formed on the back surface of a semiconductor substrate.

  Solar cells are expected as a new energy source because they can directly convert clean and infinitely supplied sunlight into electricity.

  Conventionally, a so-called back junction type solar cell including an n-type semiconductor layer and a p-type semiconductor layer formed on the back surface of a semiconductor substrate has been proposed (see Patent Document 1).

Each of the n-type semiconductor layer and the p-type semiconductor layer is alternately formed in a line along a predetermined direction. A transparent electrode layer and a collecting electrode layer are sequentially formed on the n-type semiconductor layer and the p-type semiconductor layer. The collecting electrode layer is formed by disposing a conductive material on the transparent electrode layer using a printing method.
JP-A-2005-101240

  Here, in order to suppress recombination of photogenerated carriers inside the semiconductor substrate, it is preferable to narrow the line width between the n-type semiconductor layer and the p-type semiconductor layer. Thereby, the collection efficiency of photogenerated carriers can be improved.

  However, since the collecting electrode layer is generally formed using a printing method, a coating method, or the like, there is a limit to forming the collecting electrode layer with a fine line width. Therefore, even if the line width of each semiconductor layer is narrowed, it is difficult to form a collecting electrode layer on each semiconductor layer.

  Therefore, a method of processing the transparent electrode layer and the collecting electrode layer using a mechanical processing method such as laser processing after sequentially forming the transparent electrode layer and the collecting electrode layer so as to cover each semiconductor layer is conceivable. According to such a method, the collecting electrode layer can be formed with a fine line width as compared with the case where a printing method or a coating method is used.

  However, in such a method, the semiconductor layer and the semiconductor substrate are damaged by the laser beam, so that the output of the solar cell may be reduced.

  The present invention has been made in view of the above situation, and provides a back junction solar cell capable of forming a collecting electrode layer with a fine line width while suppressing damage to the semiconductor layer and the semiconductor substrate. With the goal.

  A solar cell according to one feature of the present invention includes a semiconductor substrate having a light receiving surface and a back surface provided on the opposite side of the light receiving surface, a first semiconductor layer formed along a predetermined direction on the back surface, A pair of second semiconductor layers formed along a predetermined direction on the back surface and disposed on both sides of the first semiconductor layer, and the first semiconductor from above one of the pair of second semiconductor layers. A first insulating layer formed over the layer, a second insulating layer formed over the first semiconductor layer from the other second semiconductor layer of the pair of second semiconductor layers, and the first semiconductor A transparent electrode layer covering the layer and the second semiconductor layer, and a collecting electrode layer formed on the transparent electrode layer, the first semiconductor layer has one conductivity type, and each of the pair of second semiconductor layers includes: The transparent electrode layer and the collecting electrode layer are on the first insulating layer and the second conductive layer. And gist to be separated by a pair of separation grooves formed along a predetermined direction on the edge layer.

  According to the solar cell of one aspect of the present invention, the pair of separation grooves is formed on the first and second insulating layers, and each of the first and second insulating layers is formed on the second semiconductor layer. It is formed over the first semiconductor layer. Therefore, even when the separation groove is formed using a mechanical processing method such as laser processing, the collecting electrode layer can be formed with a fine line width while suppressing damage to each semiconductor layer. it can.

  In one feature of the present invention, an i-type amorphous silicon layer is interposed between the back surface and the first semiconductor layer, and an i-type non-layer is interposed between the back surface and each of the pair of second semiconductor layers. A crystalline silicon layer may be interposed.

  In one feature of the present invention, the semiconductor substrate has one conductivity type, and the distance between the pair of separation grooves in the direction orthogonal to the predetermined direction is larger than the contact width between the first semiconductor layer and the back surface. It can be large.

    ADVANTAGE OF THE INVENTION According to this invention, the back junction type solar cell which can form a collection electrode layer with a fine line | wire width can be provided, suppressing the damage which a semiconductor layer and a semiconductor substrate receive.

    Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic and ratios of dimensions and the like are different from actual ones. Accordingly, specific dimensions and the like should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

(Configuration of solar cell)
The configuration of the solar cell 10 according to the embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view of the back surface side of the solar cell 10 according to the present embodiment. 2 is a cross-sectional view taken along line AA in FIG. FIG. 1 schematically shows the number and size of the p-side electrode layer 20a and the n-side electrode layer 20b.

  As shown in FIGS. 1 and 2, the solar cell 10 includes a semiconductor substrate 11, a first semiconductor layer 12, a second semiconductor layer 14, an insulating layer 16, a transparent electrode layer 18, and a collecting electrode layer 20.

  The semiconductor substrate 11 has a light receiving surface that receives sunlight and a back surface provided on the opposite side of the light receiving surface. The semiconductor substrate 11 generates photogenerated carriers by receiving light on the light receiving surface. The photogenerated carrier refers to holes and electrons generated when light is absorbed by the semiconductor substrate 11.

  The semiconductor substrate 11 may be composed of a general semiconductor material including a crystalline semiconductor material such as single crystal Si or polycrystalline Si having n-type or p-type conductivity, or a compound semiconductor material such as GaAs or InP. it can. In the present embodiment, the semiconductor substrate 11 will be described as an n-type single crystal silicon substrate. Note that minute irregularities may be formed on the light receiving surface and the back surface of the semiconductor substrate 11.

  The first semiconductor layer 12 is formed in a line shape along the first direction on the back surface of the semiconductor substrate 11. The first semiconductor layer 12 according to this embodiment includes an i-type amorphous silicon layer and a p-type amorphous silicon layer that are sequentially stacked from the back side of the semiconductor substrate 11. According to such a configuration (so-called HIT structure), the pn junction characteristics can be improved.

  The second semiconductor layer 14 is formed in a line shape along the first direction on the back surface of the semiconductor substrate 11. As shown in FIG. 2, the first semiconductor layers 12 and the second semiconductor layers 14 are alternately arranged along the second direction. Accordingly, a pair of second semiconductor layers 14 are disposed on both sides of the first semiconductor layer 12. Further, both end portions in the second direction of the second semiconductor layer 14 are disposed on the first semiconductor layer 12.

  The second semiconductor layer 14 according to this embodiment includes an i-type amorphous silicon layer and an n-type amorphous silicon layer that are sequentially stacked from the back side of the semiconductor substrate 11. According to such a configuration (so-called BSF structure), recombination of photogenerated carriers on the back surface of the semiconductor substrate 11 can be suppressed.

  Here, as shown in FIG. 2, the contact width α between the first semiconductor layer 12 and the semiconductor substrate 11 is larger than the contact width β between the second semiconductor layer 14 and the semiconductor substrate 11 in the second direction. The contact width α is, for example, about 350 μm, and the contact width β is, for example, about 200 μm.

  The insulating layer 16 is formed from the second semiconductor layer 14 to the first semiconductor layer 12. Specifically, the insulating layer 16 covers the second direction end of the first semiconductor layer 12 and the second direction end of the second semiconductor layer 14. As the insulating layer 16, aluminum nitride, silicon nitride, silicon oxide, or the like can be used.

  The transparent electrode layer 18 covers the first semiconductor layer 12 and the second semiconductor layer 14 and is formed over the pair of insulating layers 16. The transparent electrode layer 18 is formed of a light-transmitting conductive material. As the transparent electrode layer 18, ITO (indium tin oxide), tin oxide, zinc oxide, or the like can be used.

  The collecting electrode layer 20 is formed on the transparent electrode layer 18. The collecting electrode layer 20 can be formed using a resin-type conductive paste using a resin material as a binder and using conductive particles such as silver particles as a filler, silver by sputtering, or the like.

  Here, the transparent electrode layer 18 and the collecting electrode layer 20 are separated by the separation groove 30 formed along the first direction on the insulating layer 16. The separation groove 30 is formed by removing the transparent electrode layer 18 and the collection electrode layer 20 along the first direction by laser light irradiation. As a result, the collecting electrode layer 20 is separated into a p-side electrode layer 20 a disposed on the first semiconductor layer 12 and an n-side electrode layer 20 b disposed on the second semiconductor layer 14. Therefore, the p-side electrode layer 20a and the n-side electrode layer 20b are electrically separated by the separation groove 30. The p-side electrode layer 20a is a collecting electrode that collects holes. The n-side electrode layer 20b is a collecting electrode that collects electrons.

  Further, as shown in FIG. 2, in the second direction, the width γ of the p-side electrode layer 20a is substantially equal to the width δ of the n-side electrode layer 20b. Accordingly, the separation grooves 30 are arranged in parallel at substantially equal intervals along the second direction.

  Further, the width γ of the p-side electrode layer 20a is smaller than the contact width α. The width δ of the n-side electrode layer 20b is larger than the contact width β.

(Method for manufacturing solar cell)
Next, a method for manufacturing the solar cell 10 will be described with reference to FIGS.

  First, a shadow mask is put on the back surface of the n-type single crystal silicon substrate (semiconductor substrate 11). Subsequently, using the CVD method, as shown in FIG. 3, an i-type amorphous silicon layer and a p-type amorphous silicon layer (first semiconductor layer 12) are sequentially stacked. The i-type amorphous silicon layer has a thickness that does not substantially contribute to power generation, for example, a thickness of several to 250 inches. The layer thickness of the p-type amorphous silicon layer is, for example, about 10 nm.

  Next, a shadow mask is put on the back surface of the n-type single crystal silicon substrate. Subsequently, using the CVD method, as shown in FIG. 4, an i-type amorphous silicon layer and an n-type amorphous silicon layer (second semiconductor layer 14) are sequentially stacked. The i-type amorphous silicon layer has a thickness that does not substantially contribute to power generation, for example, a thickness of several to 250 inches. The layer thickness of the n-type amorphous silicon layer is, for example, about 20 nm.

  Next, using a sputtering method, a coating method, or the like, as shown in FIG. 5, nitriding is performed so as to cover the second direction end portion of the first semiconductor layer 12 and the second direction end portion of the second semiconductor layer 14. An aluminum layer (insulating layer 16) is formed.

  Next, as shown in FIG. 6, an ITO layer (transparent electrode layer 18) is uniformly formed so as to cover the first semiconductor layer 12, the second semiconductor layer 14, and the insulating layer 16 by using a sputtering method.

  Next, a silver paste (collecting electrode layer 20) is disposed on the transparent electrode layer 18 by using a printing method or a coating method, as shown in FIG.

  Next, the position where the insulating layer 16 is formed is irradiated with laser light and scanned along the first direction. Thereby, as shown in FIG. 8, the collection electrode layer 20 and the transparent electrode layer 18 are removed, and the separation groove 30 is formed. For example, when an ArF excimer laser (wavelength: 193 nm, energy: 6.4 eV) is used, the laser light is absorbed by aluminum nitride (forbidden band width: 6.2 eV).

(Function and effect)
The solar cell 10 according to this embodiment is formed so as to straddle a pair of second semiconductor layers 14 disposed on both sides of the first semiconductor layer 12 and from one second semiconductor layer 14 to the first semiconductor layer 12. And the insulating layer 16 formed over the second semiconductor layer 14 to the first semiconductor layer 12. The transparent electrode layer 18 and the collection electrode layer 20 are separated by a pair of separation grooves 30 formed along the first direction on the insulating layer 16.

  As described above, the separation groove 30 is formed on the insulating layer 16, and the insulating layer 16 is formed so as to extend from the second semiconductor layer 14 to the first semiconductor layer 12. Therefore, even when the separation groove 30 is formed using a mechanical processing method such as laser processing, the collecting electrode layer 20 is suppressed while preventing the first semiconductor layer 12 and the second semiconductor layer 14 from being damaged. The (p-side electrode layer 20a and n-side electrode layer 20b) can be finely formed.

  Further, since the insulating layer 16 is formed from the second semiconductor layer 14 to the first semiconductor layer 12, the separation groove 30 can be formed at an arbitrary position on the insulating layer 16. Therefore, in the second direction, the width γ of the p-side electrode layer 20a and the width δ of the n-side electrode layer 20b are arbitrarily set regardless of the width α of the first semiconductor layer 12 and the width β of the second semiconductor layer 14. be able to.

  Specifically, the width γ of the p-side electrode layer 20a is made smaller than the contact width α between the first semiconductor layer 12 and the semiconductor substrate 11, and the width δ of the n-side electrode layer 20b is made to be the same as that of the second semiconductor layer 14. The contact width β with the semiconductor substrate 11 can be made larger. Thus, even when trying to efficiently collect holes (minority carriers) generated inside the semiconductor substrate 11 in the first semiconductor layer 12 by making the contact width β smaller than the contact width α, The width γ of the p-side electrode layer 20a and the width δ of the n-side electrode layer 20b can be formed substantially equal. As a result, the electrical resistances of the p-side electrode layer 20a and the n-side electrode layer 20b can be made substantially equal.

  Further, in the solar cell 10 according to the present embodiment, the transparent electrode layer 18 and the collecting electrode layer 20 are simultaneously processed by using a mechanical processing method such as laser light. Therefore, since the manufacturing process can be simplified, the manufacturing cost of the solar cell 10 can be reduced.

  In the solar cell 10 according to this embodiment, each of the first semiconductor layer 12 and the second semiconductor layer 14 includes an i-type amorphous silicon layer formed on the semiconductor substrate 11. Therefore, even if one of the first semiconductor layer 12 and the second semiconductor layer 14 is in contact with the other, since the i-type amorphous silicon layer is interposed therebetween, the occurrence of a short-circuit current can be suppressed. . As a result, even when both are formed with a fine line width, since it is not necessary to physically separate them, overcrowding control in the manufacturing process can be suppressed.

(Other embodiments)
Although the present invention has been described according to the above-described embodiments, it should not be understood that the descriptions and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  For example, in the above embodiment, the first semiconductor layer 12 and the second semiconductor layer 14 are brought into contact with each other. However, as shown in FIG. 9, the first semiconductor layer 12 and the second semiconductor layer 14 are in the second direction. It may be physically separated. In this case, the insulating layer 16 is filled in a gap (groove) between the first semiconductor layer 12 and the second semiconductor layer 14.

  In the above embodiment, the collecting electrode layer 20 is printed or applied with a uniform thickness. However, as shown in FIG. 10, the thickness of the portion of the collecting electrode layer 20 that is irradiated with laser light is reduced. It may be printed or applied.

  Moreover, in the said embodiment, while connecting the 1st direction edge part of the p side electrode layer 20a as shown in FIG. 1, the 1st direction edge part of the n side electrode layer 20b was connected, but FIG. As shown, these may not be linked.

  In the above embodiment, an n-type single crystal silicon substrate is used as the semiconductor substrate 11, but the conductivity type of the semiconductor substrate 11 may be p-type. Further, a general semiconductor material other than single crystal silicon may be used as the semiconductor substrate 11.

  Moreover, in the said embodiment, although the separation groove 30 was formed by irradiating a laser beam, you may form the separation groove 30 by the well-known method in which a fine process is possible.

  The number and size of the first semiconductor layer 12 (p-side electrode layer 20a) and the second semiconductor layer 14 (n-side electrode layer 20b) can be changed as appropriate.

It is a top view of the back surface side of the solar cell 10 which concerns on embodiment of this invention. It is sectional drawing in the AA of FIG. It is a figure for demonstrating the manufacturing method of the solar cell 10 which concerns on embodiment of this invention (the 1). It is a figure for demonstrating the manufacturing method of the solar cell 10 which concerns on embodiment of this invention (the 2). It is a figure for demonstrating the manufacturing method of the solar cell 10 which concerns on embodiment of this invention (the 3). It is a figure for demonstrating the manufacturing method of the solar cell 10 which concerns on embodiment of this invention (the 4). It is a figure for demonstrating the manufacturing method of the solar cell 10 which concerns on embodiment of this invention (the 5). It is a figure for demonstrating the manufacturing method of the solar cell 10 which concerns on embodiment of this invention (the 6). It is sectional drawing which shows an example of the solar cell 10 which concerns on embodiment of this invention. It is a figure for demonstrating an example of the manufacturing method of the solar cell 10 which concerns on embodiment of this invention. It is a top view which shows an example of the solar cell 10 which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Solar cell 11 ... Semiconductor substrate 12 ... 1st semiconductor layer 14 ... 2nd semiconductor layer 16 ... Insulating layer 18 ... Transparent electrode layer 20 ... Collection electrode layer 20a ... P side electrode layer 20b ... N side electrode layer 30 ... Separation groove

Claims (3)

A semiconductor substrate having a light receiving surface and a back surface provided on the opposite side of the light receiving surface;
A first semiconductor layer formed along a predetermined direction on the back surface;
A pair of second semiconductor layers formed along the predetermined direction on the back surface and disposed on both sides of the first semiconductor layer;
A first insulating layer formed from one second semiconductor layer to the first semiconductor layer of the pair of second semiconductor layers;
A second insulating layer formed from the other second semiconductor layer to the first semiconductor layer of the pair of second semiconductor layers;
A transparent electrode layer covering the first semiconductor layer and the second semiconductor layer;
A collecting electrode layer formed on the transparent electrode layer,
The first semiconductor layer has one conductivity type,
Each of the pair of second semiconductor layers has another conductivity type,
The transparent electrode layer and the collecting electrode layer are separated by a pair of separation grooves formed along the predetermined direction on the first insulating layer and the second insulating layer. . An i-type amorphous silicon layer is interposed between the back surface and the first semiconductor layer,
The solar cell according to claim 1, wherein an i-type amorphous silicon layer is interposed between the back surface and each of the pair of second semiconductor layers. The semiconductor substrate has the one conductivity type,
3. The solar cell according to claim 1, wherein an interval between the pair of separation grooves is larger than a contact width between the first semiconductor layer and the back surface in a direction orthogonal to the predetermined direction.

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