JP2009188374A5 - - Google Patents

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Publication number
JP2009188374A5
JP2009188374A5 JP2008252604A JP2008252604A JP2009188374A5 JP 2009188374 A5 JP2009188374 A5 JP 2009188374A5 JP 2008252604 A JP2008252604 A JP 2008252604A JP 2008252604 A JP2008252604 A JP 2008252604A JP 2009188374 A5 JP2009188374 A5 JP 2009188374A5
Authority
JP
Japan
Prior art keywords
electronic component
package
package body
mounting terminal
component package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008252604A
Other languages
Japanese (ja)
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JP2009188374A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2008252604A priority Critical patent/JP2009188374A/en
Priority claimed from JP2008252604A external-priority patent/JP2009188374A/en
Priority to US12/348,578 priority patent/US7928635B2/en
Publication of JP2009188374A publication Critical patent/JP2009188374A/en
Publication of JP2009188374A5 publication Critical patent/JP2009188374A5/ja
Withdrawn legal-status Critical Current

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Claims (6)

矩形状のパッケージ本体と、前記パッケージ本体を気密封止する蓋部材と、からなる電子部品用パッケージであって、
前記パッケージ本体の内部に形成された電極パッドと、
前記パッケージ本体の底面の周辺に沿ってそれぞれ形成され、かつ実装面に段差部を有する実装端子と、
前記パッドと前記実装端子とを電気的に接続する複数の接続電極と、
を備えたことを特徴とする電子部品用パッケージ。 An electronic component package comprising a rectangular package body and a lid member for hermetically sealing the package body,
An electrode pad formed inside the package body;
A mounting terminal formed along the periphery of the bottom surface of the package body and having a stepped portion on the mounting surface;
A plurality of connection electrodes for electrically connecting the pad and the mounting terminal;
A package for electronic parts, characterized by comprising: 前記パッケージ本体の前記四隅にキャスタレーションを形成し、該キャスタレーションにそれぞれ前記接続電極を形成したことを特徴とする請求項１に記載の電子部品用パッケージ。   2. The electronic component package according to claim 1, wherein a castellation is formed at each of the four corners of the package body, and the connection electrode is formed on each of the castellations. 前記段差部は、前記実装端子を半田により回路基板に接合したときに、前記実装端子上において前記パッケージ本体の底面の周辺の近くに形成された半田を厚くする形状であることを特徴とする請求項１又は２に記載の電子部品用パッケージ。 The step portion has a shape that thickens solder formed near the bottom surface of the package body on the mounting terminal when the mounting terminal is joined to the circuit board by solder. Item 3. The electronic component package according to Item 1 or 2. 前記パッケージに一対のダミー電極を形成したことを特徴とする請求項１乃至３の何れか一項に記載の電子部品用パッケージ。   The electronic component package according to any one of claims 1 to 3, wherein a pair of dummy electrodes is formed on the package. 前記一対のダミー電極を複数形成したことを特徴とする請求項４に記載の電子部品用パッケージ。   The electronic component package according to claim 4, wherein a plurality of the pair of dummy electrodes are formed. 請求項１乃至５の何れか一項に記載の電子部品用パッケージを備え、前記パッケージ本体の前記電極パッド上に圧電振動片が搭載されたことを特徴とする圧電振動子。   A piezoelectric vibrator comprising the electronic component package according to claim 1, wherein a piezoelectric vibrating piece is mounted on the electrode pad of the package body.
JP2008252604A 2008-01-07 2008-09-30 Package for electronic component, and piezoelectric vibrator Withdrawn JP2009188374A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008252604A JP2009188374A (en) 2008-01-07 2008-09-30 Package for electronic component, and piezoelectric vibrator
US12/348,578 US7928635B2 (en) 2008-01-07 2009-01-05 Package for electronic component and piezoelectric resonator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008000367 2008-01-07
JP2008252604A JP2009188374A (en) 2008-01-07 2008-09-30 Package for electronic component, and piezoelectric vibrator

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012252153A Division JP2013065875A (en) 2008-01-07 2012-11-16 Package for electronic component and electronic device

Publications (2)

Publication Number Publication Date
JP2009188374A JP2009188374A (en) 2009-08-20
JP2009188374A5 true JP2009188374A5 (en) 2011-06-02

Family

ID=41071283

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008252604A Withdrawn JP2009188374A (en) 2008-01-07 2008-09-30 Package for electronic component, and piezoelectric vibrator
JP2012252153A Withdrawn JP2013065875A (en) 2008-01-07 2012-11-16 Package for electronic component and electronic device

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012252153A Withdrawn JP2013065875A (en) 2008-01-07 2012-11-16 Package for electronic component and electronic device

Country Status (1)

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JP (2) JP2009188374A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5148351B2 (en) * 2008-04-23 2013-02-20 日本電波工業株式会社 Surface mount crystal unit
JP2011128140A (en) * 2009-11-19 2011-06-30 Dainippon Printing Co Ltd Sensor device and method of manufacturing the same
CN102696173B (en) * 2010-04-01 2016-03-16 株式会社大真空 The substrate of the electronic parts package of surface installing type and the electronic parts package of surface installing type
CN104335345B (en) 2012-05-30 2018-01-26 京瓷株式会社 Circuit board and electronic installation
JP6314526B2 (en) * 2013-05-10 2018-04-25 株式会社大真空 Piezoelectric vibration device
JP6248539B2 (en) * 2013-10-28 2017-12-20 株式会社大真空 Electronic component package base, electronic component package
JP6176057B2 (en) * 2013-10-28 2017-08-09 株式会社大真空 Electronic component package base, electronic component package

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11261365A (en) * 1998-03-10 1999-09-24 Toyo Commun Equip Co Ltd Package structure for piezoelectric oscillator
JP3685683B2 (en) * 2000-04-19 2005-08-24 日本電波工業株式会社 Crystal oscillator for surface mounting
JP4068367B2 (en) * 2002-03-08 2008-03-26 シチズンホールディングス株式会社 Aggregate substrate for piezoelectric device, piezoelectric device and manufacturing method thereof
JP4067472B2 (en) * 2003-07-29 2008-03-26 京セラキンセキ株式会社 Package for electronic components
JP2005244146A (en) * 2004-01-29 2005-09-08 Kyocera Corp Electronic-component housing package, electronic device, and mounting structure of electronic device
JP4692722B2 (en) * 2004-01-29 2011-06-01 セイコーエプソン株式会社 Electronic component package and electronic component
JP2005244703A (en) * 2004-02-27 2005-09-08 Kyocera Kinseki Corp Base substrate
JP4424591B2 (en) * 2004-03-15 2010-03-03 株式会社住友金属エレクトロデバイス Electronic component storage package
JP2006186667A (en) * 2004-12-27 2006-07-13 Kyocera Kinseki Corp Piezoelectric vibrator
US8279610B2 (en) * 2007-08-23 2012-10-02 Daishinku Corporation Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrate
JP2009100353A (en) * 2007-10-18 2009-05-07 Nippon Dempa Kogyo Co Ltd Quartz crystal device

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