JP2017135275A5 - - Google Patents
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- JP2017135275A5 JP2017135275A5 JP2016014302A JP2016014302A JP2017135275A5 JP 2017135275 A5 JP2017135275 A5 JP 2017135275A5 JP 2016014302 A JP2016014302 A JP 2016014302A JP 2016014302 A JP2016014302 A JP 2016014302A JP 2017135275 A5 JP2017135275 A5 JP 2017135275A5
- Authority
- JP
- Japan
- Prior art keywords
- external electrode
- manufacturing
- circuit module
- bonding member
- flexible conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
Description
本発明の回路モジュールの製造方法は、セラミック素体と、第１の外部電極と、第２の外部電極とを含むセラミック電子部品を準備することを備える。セラミック素体は、第１の面と、第１の面と異なる第２の面とを有する。第１の外部電極は、第１の面上に配置される。第２の外部電極は、第２の面上に配置される。本発明の回路モジュールの製造方法は、第１の外部電極及び第２の外部電極のうち第２の外部電極にのみ、可撓性導電部分を含む可撓性接続部材を第１の接合部材によって接合することをさらに備える。可撓性導電部分は、第２の外部電極に接合される第１の部分と、第１の部分から延在する第２の部分とを有する。本発明の回路モジュールの製造方法は、第２の接合部材によって第１の外部電極を回路基板の第１の端子に接合することと、第３の接合部材によって可撓性導電部分の第２の部分を回路基板の第２の端子に接合することとを備える。 The manufacturing method of the circuit module of this invention comprises preparing the ceramic electronic component containing a ceramic body, a 1st external electrode, and a 2nd external electrode. The ceramic body has a first surface and a second surface different from the first surface . The first external electrode is disposed on the first surface. The second external electrode is disposed on the second surface. In the method for manufacturing a circuit module according to the present invention, a flexible connection member including a flexible conductive portion is formed only on the second external electrode of the first external electrode and the second external electrode by the first bonding member. It further comprises joining. The flexible conductive portion has a first portion joined to the second external electrode and a second portion extending from the first portion. In the method for manufacturing a circuit module according to the present invention, the first external electrode is bonded to the first terminal of the circuit board by the second bonding member, and the second flexible conductive portion is bonded by the third bonding member. Joining the portion to a second terminal of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016014302A JP6656000B2 (en) | 2016-01-28 | 2016-01-28 | Electronic component module, circuit module, method for manufacturing electronic component module, and method for manufacturing circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016014302A JP6656000B2 (en) | 2016-01-28 | 2016-01-28 | Electronic component module, circuit module, method for manufacturing electronic component module, and method for manufacturing circuit module |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017135275A JP2017135275A (en) | 2017-08-03 |
| JP2017135275A5 true JP2017135275A5 (en) | 2018-09-20 |
| JP6656000B2 JP6656000B2 (en) | 2020-03-04 |
Family
ID=59504466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016014302A Active JP6656000B2 (en) | 2016-01-28 | 2016-01-28 | Electronic component module, circuit module, method for manufacturing electronic component module, and method for manufacturing circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6656000B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6895100B2 (en) * | 2018-03-02 | 2021-06-30 | 株式会社村田製作所 | All solid state battery |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0474412U (en) * | 1990-11-07 | 1992-06-30 | ||
| JPH07201650A (en) * | 1993-12-29 | 1995-08-04 | Kinseki Ltd | Surface mounting electronic device |
| JP3206735B2 (en) * | 1998-01-29 | 2001-09-10 | ティーディーケイ株式会社 | Ceramic capacitors |
| JP2000124063A (en) * | 1998-10-19 | 2000-04-28 | Murata Mfg Co Ltd | Ceramic electronic component |
| JP2007220751A (en) * | 2006-02-14 | 2007-08-30 | Tdk Corp | Ceramic capacitor and mounting structure thereof |
| JP2011071220A (en) * | 2009-09-24 | 2011-04-07 | Tdk Corp | Ceramic capacitor with metal terminal, and method of manufacturing the same |
| JP5126266B2 (en) * | 2010-03-24 | 2013-01-23 | Ｔｄｋ株式会社 | Electronic component with metal terminal, mounting method thereof, and manufacturing method thereof |
| JP2012094783A (en) * | 2010-10-28 | 2012-05-17 | Tdk Corp | Electronic component |
| JP2013149675A (en) * | 2012-01-17 | 2013-08-01 | Murata Mfg Co Ltd | Ceramic capacitor |
| JP6229371B2 (en) * | 2013-08-27 | 2017-11-15 | Tdk株式会社 | Ceramic electronic components |
-
2016
- 2016-01-28 JP JP2016014302A patent/JP6656000B2/en active Active
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