JP6656000B2 - Electronic component module, circuit module, method for manufacturing electronic component module, and method for manufacturing circuit module - Google Patents

Description

  The present invention relates to an electronic component module, a circuit module, a method for manufacturing an electronic component module, and a method for manufacturing a circuit module.

  2. Description of the Related Art A ceramic electronic component such as a multilayer ceramic capacitor and a circuit module in which the ceramic electronic component is mounted on a circuit board are known (see Patent Documents 1 and 2).

  Patent Literature 1 describes a circuit module in which a pair of external electrodes of a multilayer ceramic capacitor is joined to electrodes on a circuit board by soldering. When joining a pair of external electrodes of a multilayer ceramic capacitor to electrodes on a circuit board by soldering, heat is applied to a ceramic body and a circuit board constituting the multilayer ceramic capacitor. In addition, even when the circuit module operates, heat is applied to the ceramic body and the circuit board constituting the multilayer ceramic capacitor. The ceramic body constituting the multilayer ceramic capacitor has a different coefficient of thermal expansion from the circuit board. Stress due to heat during soldering of the multilayer ceramic capacitor to the circuit board and during operation of the circuit module is applied to the ceramic body. Further, in a process of manufacturing a circuit module such as a process of cutting a circuit board, the circuit board may have mechanical stress. The mechanical stress of the circuit board can also be applied to the ceramic body. Due to these stresses, cracks may occur in the ceramic body. This crack may cause the multilayer ceramic capacitor to lose its function.

  Patent Literature 2 describes a ceramic electronic component in which metal terminals are joined to a pair of external electrodes of a multilayer ceramic capacitor. Therefore, the ceramic electronic component described in Patent Document 2 has a complicated structure. The manufacturing cost and manufacturing process of the ceramic electronic component module described in Patent Document 2 increase.

JP-A-8-162357 JP-A-11-40460

  An object of the present invention is to provide an electronic component module and a circuit module having a simple structure that can suppress the occurrence of cracks in a ceramic body of a ceramic electronic component.

  Another object of the present invention is to provide an electronic component module and a circuit module having a simple structure that can suppress the occurrence of cracks in a ceramic body of a ceramic electronic component by reducing the manufacturing cost and the number of manufacturing steps. It is to provide a method of manufacturing with.

An electronic component module according to the present invention includes a ceramic electronic component and a flexible connection member. The ceramic electronic component includes a ceramic body, a first external electrode, and a second external electrode. The ceramic body has a first surface and a second surface different from the first surface. The first external electrode is disposed on the first surface. The second external electrode is disposed on the second surface. The flexible connection member includes a flexible conductive portion. The flexible conductive portion is joined by the first joining member only to the second external electrode of the first external electrode and the second external electrode. The flexible conductive portion has a first portion joined to the second external electrode and a second portion extending from the first portion. The flexible connection member further includes a protrusion formed on the second portion and protruding toward the ceramic electronic component.

  A circuit module according to the present invention includes the above electronic component module and a circuit board. The circuit board has a first terminal and a second terminal. The first external electrode is joined to the first terminal by a second joining member. The second portion of the flexible conductive portion is joined to the second terminal by a third joining member.

A method of manufacturing an electronic component module according to the present invention includes preparing a ceramic electronic component including a ceramic body, a first external electrode, and a second external electrode. The ceramic body has a first surface and a second surface different from the first surface. The first external electrode is disposed on the first surface. The second external electrode is disposed on the second surface. In the method for manufacturing an electronic component module according to the present invention, a flexible connection member including a flexible conductive portion is provided only on a second external electrode of the first external electrode and the second external electrode. The method further comprises joining by: The flexible conductive portion has a first portion joined to the second external electrode and a second portion extending from the first portion. The flexible connection member further includes a protrusion formed on the second portion and protruding toward the ceramic electronic component.

A method for manufacturing a circuit module according to the present invention includes preparing a ceramic electronic component including a ceramic body, a first external electrode, and a second external electrode. The ceramic body has a first surface and a second surface different from the first surface. The first external electrode is disposed on the first surface. The second external electrode is disposed on the second surface. In the method for manufacturing a circuit module according to the present invention, only the second external electrode of the first external electrode and the second external electrode is connected to the flexible connection member including the flexible conductive portion by the first joining member. The method further comprises joining. The flexible conductive portion has a first portion joined to the second external electrode and a second portion extending from the first portion. According to the method for manufacturing a circuit module of the present invention, the first external electrode is bonded to the first terminal of the circuit board by the second bonding member, and the second conductive member is formed by the third bonding member. Joining the portion to the second terminal of the circuit board. The flexible connection member further includes a protrusion formed on the second portion and protruding toward the ceramic electronic component.

  In the electronic component module of the present invention, the flexible connecting member joined to the second external electrode of the ceramic electronic component has flexibility. Therefore, the flexible connection member can reduce the stress applied to the ceramic body of the ceramic electronic component. ADVANTAGE OF THE INVENTION According to the electronic component module of this invention, generation | occurrence | production of a crack in the ceramic body of a ceramic electronic component can be suppressed. Further, the flexible connection member including the flexible conductive portion is bonded only to the second external electrode of the first external electrode and the second external electrode. The flexible connecting member is not present on the first external electrode of the ceramic electronic component. The number of flexible connection members in the electronic component module can be reduced. Therefore, the electronic component module of the present invention has a simple structure.

  In the circuit module of the present invention, the flexible connection member joined to the second external electrode of the ceramic electronic component and the second terminal of the circuit board has flexibility. Therefore, the flexible connection member can reduce the stress applied to the ceramic body of the ceramic electronic component. ADVANTAGE OF THE INVENTION According to the circuit module of this invention, generation | occurrence | production of a crack in the ceramic body of a ceramic electronic component can be suppressed. Further, the flexible connection member does not exist between the first external electrode and the first terminal of the circuit board. The number of flexible connection members in the circuit module can be reduced. Therefore, the circuit module of the present invention has a simple structure.

  In the method for manufacturing an electronic component module according to the present invention, the flexible connection member joined to the second external electrode of the ceramic electronic component has flexibility. Therefore, the flexible connection member can reduce the stress applied to the ceramic body of the ceramic electronic component. ADVANTAGE OF THE INVENTION According to the manufacturing method of the electronic component module of this invention, generation | occurrence | production of a crack in the ceramic body of a ceramic electronic component can be suppressed. Further, in the method for manufacturing an electronic component module according to the present invention, the flexible connection member including the flexible conductive portion is provided only on the second external electrode of the first external electrode and the second external electrode. It is provided with joining by a joining member. The flexible connection member is not on the first external electrode. The number of flexible connection members in the electronic component module can be reduced. The step of joining the flexible connection member to the first external electrode may be omitted. According to the method for manufacturing an electronic component module of the present invention, an electronic component module having a simple structure can be manufactured at a reduced manufacturing cost and a reduced number of manufacturing steps.

  In the method for manufacturing a circuit module according to the present invention, the flexible connection member joined to the second external electrode of the ceramic electronic component has flexibility. Therefore, the flexible connection member can reduce the stress applied to the ceramic body of the ceramic electronic component. ADVANTAGE OF THE INVENTION According to the manufacturing method of the circuit module of this invention, generation | occurrence | production of a crack in the ceramic body of a ceramic electronic component can be suppressed. Further, the flexible connection member does not exist between the first external electrode and the first terminal of the circuit board. The number of flexible connection members in the circuit module can be reduced. The step of joining the flexible connection member to the first external electrode may be omitted. According to the method for manufacturing a circuit module of the present invention, a circuit module having a simple structure can be manufactured with a reduced manufacturing cost and a reduced number of manufacturing steps.

FIG. 2 is a schematic sectional view of the electronic component module according to Embodiment 1 of the present invention. FIG. 2 is a schematic sectional view of the circuit module according to Embodiment 1 of the present invention. FIG. 4 is a view illustrating a flowchart of the method for manufacturing the electronic component module according to Embodiment 1 of the present invention. FIG. 4 is a diagram illustrating a flowchart of a first example of a method for manufacturing a circuit module according to Embodiment 1 of the present invention. FIG. 5 is a diagram illustrating a flowchart of a second example of the circuit module manufacturing method according to the first embodiment of the present invention. FIG. 9 is a diagram illustrating a flowchart of a fourth example of the circuit module manufacturing method according to the first embodiment of the present invention. FIG. 10 is a diagram illustrating a flowchart of a fifth example of the circuit module manufacturing method according to the first embodiment of the present invention. FIG. 9 is a schematic sectional view of an electronic component module according to Embodiment 2 of the present invention. FIG. 9 is a schematic sectional view of a circuit module according to Embodiment 2 of the present invention. FIG. 13 is a schematic sectional view of an electronic component module according to Embodiment 3 of the present invention. FIG. 9 is a schematic sectional view of a circuit module according to Embodiment 3 of the present invention. FIG. 14 is a schematic sectional view of an electronic component module according to Embodiment 4 of the present invention. FIG. 14 is a schematic sectional view of a circuit module according to Embodiment 4 of the present invention. It is a schematic sectional drawing of the electronic component module concerning Embodiment 5 of this invention. FIG. 14 is a schematic sectional view of a circuit module according to Embodiment 5 of the present invention. FIG. 15 is a schematic sectional view of an electronic component module according to Embodiment 6 of the present invention. FIG. 13 is a schematic sectional view of a circuit module according to Embodiment 6 of the present invention. FIG. 15 is a schematic sectional view of a circuit module according to Embodiment 7 of the present invention. FIG. 15 is a schematic sectional view of a circuit module according to an eighth embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described. Note that the same components are denoted by the same reference numerals, and description thereof will not be repeated.

(Embodiment 1)
Referring to FIG. 1, an electronic component module 1 according to the present embodiment includes a ceramic electronic component 10 and a flexible connection member 20.

  The ceramic electronic component 10 includes a ceramic body 11, a first external electrode 13, and a second external electrode 14. The ceramic electronic component 10 may further include an internal electrode 12 in the ceramic body 11. The ceramic electronic component 10 may be any of a multilayer capacitor, a multilayer inductor, a multilayer varistor, a multilayer piezoelectric element, a multilayer actuator, a multilayer thermistor, a multilayer coil, and a multilayer LC filter. In the present embodiment, ceramic electronic component 10 is a multilayer capacitor.

  The ceramic body 11 has a first surface 11a and a second surface 11b different from the first surface 11a. The second surface 11b may be a surface facing the first surface 11a. The ceramic body 11 may further include a third surface 11c and a fourth surface 11d facing the third surface 11c. Each of the third surface 11c and the fourth surface 11d may connect the first surface 11a and the second surface 11b. The third surface 11c and the fourth surface 11d may be substantially parallel to the direction in which the first internal electrode layer 12a and the second internal electrode layer 12b extend. The third surface 11c and the fourth surface 11d may have a larger area than the first surface 11a and the second surface 11b. The distance between the first surface 11a and the second surface 11b may be larger than the distance between the third surface 11c and the fourth surface 11d. The ceramic body 11 may be formed of barium titanate or the like.

  The first external electrode 13 is arranged on the first surface 11 a of the ceramic body 11. The first external electrode 13 may have a three-layer structure. Specifically, the first external electrode 13 may include a first external electrode layer 13a, a second external electrode layer 13b, and a third external electrode layer 13c. The first external electrode layer 13a is in direct contact with the first surface 11a of the ceramic body 11. The first external electrode layer 13a may be a layer that adheres more strongly to the ceramic body 11 than the second external electrode layer 13b. The first external electrode layer 13a may improve the reliability of electrical connection with the first internal electrode layer 12a of the internal electrodes 12. The first external electrode layer 13a may be made of Ag or an Ag-Pd alloy. The first external electrode layer 13a is formed by applying a conductive paste containing a metal powder made of Ag or an Ag—Pd alloy on the first surface 11a of the ceramic body 11, and sintering the conductive paste. May be formed. The second external electrode layer 13b is disposed on the first external electrode layer 13a. The second external electrode layer 13b may prevent the material of the first external electrode layer 13a from being eaten by the second bonding member 32 (see FIG. 2) such as solder. The second external electrode layer 13b may be made of, for example, nickel (Ni). The second external electrode layer 13b may be formed by a plating method. The third external electrode layer 13c is disposed on the second external electrode layer 13b. The third external electrode layer 13c may have better solderability than the second external electrode layer 13b. The third external electrode layer 13c may be made of Sn, an Sn-Pb alloy, or an Sn-Ag-Cu alloy such as a Sn-3 mass% Ag-0.5 mass% Cu alloy. The third external electrode layer 13c may be formed by a plating method.

  The second external electrode 14 is arranged on the second surface 11 b of the ceramic body 11. The second external electrode 14 may have a three-layer structure. Specifically, the second external electrode 14 may include a fourth external electrode layer 14a, a fifth external electrode layer 14b, and a sixth external electrode layer 14c. The fourth external electrode layer 14a is in direct contact with the second surface 11b of the ceramic body 11. The fourth external electrode layer 14a may be a layer that adheres more firmly to the ceramic body 11 than the fifth external electrode layer 14b. The fourth external electrode layer 14a may improve the reliability of electrical connection with the second internal electrode layer 12b among the internal electrodes 12. The fourth external electrode layer 14a may be made of Ag or an Ag-Pd alloy. A conductive paste containing a metal powder made of Ag or an Ag—Pd alloy or the like is applied on the second surface 11b of the ceramic body 11, and the conductive paste is sintered to form a fourth external electrode layer 14a. May be formed. The fifth external electrode layer 14b is disposed on the fourth external electrode layer 14a. The fifth external electrode layer 14b may prevent the material constituting the fourth external electrode layer 14a from being eaten by the first joint member 31 such as solder. The fifth external electrode layer 14b may be made of nickel (Ni). The fifth external electrode layer 14b may be formed by a plating method. The sixth external electrode layer 14c is disposed on the fifth external electrode layer 14b. The sixth external electrode layer 14c may have better solderability than the fifth external electrode layer 14b. The sixth external electrode layer 14c may be made of Sn or Sn-Pb alloy. The sixth external electrode layer 14c may be formed by a plating method.

  The internal electrode 12 may include a first internal electrode layer 12a and a second internal electrode layer 12b. The first internal electrode layer 12a is electrically connected to the first external electrode 13, but is not electrically connected to the second external electrode 14. The second internal electrode layer 12b is electrically connected to the second external electrode 14, but is not electrically connected to the first external electrode 13. The first internal electrode layer 12a may be composed of a plurality of layers. The second internal electrode layer 12b may be composed of a plurality of layers. The first internal electrode layers 12a and the second internal electrode layers 12b may be alternately stacked with the ceramic body 11 interposed therebetween. The internal electrode 12 may be formed from a metal material such as Pd, an Ag-Pd alloy, and Ni.

  Flexible connection member 20 includes a flexible conductive portion (20). The flexible connection member 20 may be composed of a flexible conductive part (20). The flexible connecting member 20 is electrically and mechanically connected to the second external electrode 14 by the first joining member 31. The flexible conductive portion (20) has a first main surface 20a joined to the second external electrode 14 by the first joining member 31, and a second main surface opposite to the first main surface 20a. 20b. The flexible conductive portion (20) includes a first portion 21 joined to the second external electrode 14 by the first joining member 31, and a second portion 22 extending from the first portion 21. Have. The flexible conductive portion (20) is joined by the first joining member 31 only to the second external electrode 14 of the first external electrode 13 and the second external electrode 14. Specifically, the first main surface 20a of the first portion 21 of the flexible conductive portion (20) is connected to the sixth external electrode layer 14c of the second external electrode 14 by the first bonding member 31. Joined to. There is no first joining member 31 in the second portion 22 of the flexible conductive portion (20). The flexible connection member 20 does not exist on the first external electrode 13. The surface of the first external electrode 13, that is, the surface of the third external electrode layer 13c is exposed.

  The flexible conductive part (20) may be composed of a metal material. The flexible conductive portion (20) may contain 50% by mass or more of an element selected from the group consisting of copper, aluminum, nickel, tin, zinc, silver, and gold. The flexible conductive portion (20) may be composed of Cu, a Cu alloy such as a Cu-Zn alloy or a Cu-Sn alloy, or aluminum or iron surface-treated with Sn or Ni. In order to improve the stability of the electrical connection between the flexible conductive portion (20) and the first joint member 31, the surface of the flexible conductive portion (20) is formed of gold, silver, palladium, or the like. Noble metal layer may be applied.

  The first joining member 31 may be any of lead-containing solder, lead-free solder, conductive adhesive, gold, silver, copper, and nickel. The lead-containing solder may be a Pb-Sn-based solder such as 95% by mass Pb-5% by mass Sn solder, or a Pb-In-based solder. Lead-free solders include Sn-Ag-Cu solder, Sn-Ag-Cu-Sb solder, Sn-Sb solder, Sn-Zn solder such as Sn-3 mass% Ag-0.5 mass% Cu solder. Sn-Bi-based solder such as solder, Sn-In-based solder, or Sn-58 mass% Bi-solder may be used. The conductive adhesive may be an epoxy resin containing fine metal particles made of silver or a silver alloy, or a phenol resin containing fine metal particles made of copper or a copper alloy. The first bonding member 31 made of gold, silver, copper, or nickel may be formed by sintering a paste containing metal nanoparticles made of gold, silver, copper, or nickel at a low temperature of, for example, 300 ° C. or less. .

  The flexible connection member 20 may further include a bent portion 23. The flexible connection member 20 is bent 23 so that at least a portion of the first main surface 20a of the second portion 22 of the flexible conductive portion (20) extends in a direction away from the ceramic electronic component 10. May be bent. The flexible connecting member 20 is arranged such that at least a part of the first main surface 20a of the second portion 22 of the flexible conductive portion (20) faces the fifth main surface 43b of the second terminal 43. May be bent at the bending portion 23. At least a part of the first main surface 20 a of the second portion 22 of the flexible conductive portion (20) may extend in a direction intersecting with the second surface 11 b of the ceramic body 11. At least a part of the first main surface 20a of the second portion 22 of the flexible conductive portion (20) is formed on the third surface 11c of the ceramic body 11, the fourth surface 11d of the ceramic body 11, It may extend substantially parallel to at least one of the first internal electrode layer 12a and the second internal electrode layer 12b. The bent portion 23 may be located in a region on the first portion 21 side of the second portion 22 of the flexible conductive portion (20). The flexible connection member 20 does not have the bent portion 23, and the second portion 22 may extend straight from the first portion 21.

  Referring to FIG. 2, a circuit module 1a according to the present embodiment includes an electronic component module 1 and a circuit board 40. The circuit board 40 has a base material 41, a first terminal 42, a second terminal 43, and wiring (not shown). The circuit board 40 may be a printed wiring board.

  The base material 41 has a third main surface 41a. The third main surface 41a is also the main surface of the circuit board 40. The base material 41 is made of glass fiber reinforced epoxy resin, paper fiber reinforced phenol resin, glass nonwoven fabric reinforced epoxy resin, resin such as BT resin or polyimide resin, metal such as aluminum, aluminum alloy, copper or copper alloy, alumina, or nitride. It may be made of ceramics such as aluminum or silicon nitride. The base material 41 may be a lead frame. The first terminal 42 may be arranged on the third main surface 41a. The second terminal 43 may be arranged on the third main surface 41a. The first terminal 42 has a fourth main surface 42 b on the side opposite to the base 41. The second terminal 43 has a fifth main surface 43b on the side opposite to the base 41. The first terminal 42 and the second terminal 43 may be formed of Cu.

  The first external electrode 13 is joined to the first terminal 42 by the second joining member 32. Specifically, the third external electrode layer 13c of the first external electrode 13 is electrically and mechanically connected to the fourth main surface 42b of the first terminal 42 by the second bonding member 32. You. The flexible connecting member 20 is joined to the second terminal 43 by the third joining member 33. Specifically, the first main surface 20 a of the second portion 22 of the flexible conductive portion (20) is electrically connected to the fifth main surface 43 b of the second terminal 43 by the third joint member 33. And mechanically connected. The second external electrode 14 is electrically connected to the second terminal 43 via the flexible conductive part (20). The flexible conductive portion (20) may be joined to the second external electrode 14 by the first joining member 31 at one end of the first main surface 20a of the flexible conductive portion (20). Good. The flexible conductive portion (20) is connected to the fifth main surface of the second terminal 43 by the third joining member 33 at the other end of the first main surface 20a of the flexible conductive portion (20). 43b.

  The second joint member 32 and the third joint member 33 may be any of lead-containing solder, lead-free solder, conductive adhesive, gold, silver, copper, and nickel. The lead-containing solder may be a Pb-Sn-based solder such as a 95 mass% Pb-5 mass% Sn solder, or a Pb-In-based solder. Lead-free solders include Sn-Ag-Cu solder, Sn-Ag-Cu-Sb solder, Sn-Sb solder, Sn-Zn solder such as Sn-3 mass% Ag-0.5 mass% Cu solder. Sn-Bi-based solder such as solder, Sn-In-based solder, or Sn-58 mass% Bi-solder may be used. The conductive adhesive may be an epoxy resin containing fine metal particles made of silver or a silver alloy, or a phenol resin containing fine metal particles made of copper or a copper alloy. The second bonding member 32 and the third bonding member 33 made of gold, silver, copper or nickel sinter a paste containing metal nanoparticles made of gold, silver, copper or nickel at a low temperature of, for example, 300 ° C. or less. It may be formed by the following. The second joining member 32 and the third joining member 33 may be made of a material different from that of the first joining member 31. The third joining member 33 may be made of the same material as the second joining member 32. The first joining member 31 may have a higher melting point than the third joining member 33. The first joining member 31 may have a lower melting point than the third joining member 33. The first joining member 31 may be separated from the third joining member 33.

  With reference to FIG. 3, a method for manufacturing electronic component module 1 of the present embodiment will be described. The method for manufacturing the electronic component module 1 according to the present embodiment includes a step (S10) of preparing a ceramic electronic component 10 including the ceramic body 11, the first external electrode 13, and the second external electrode 14. . The ceramic body 11 has a first surface 11a and a second surface 11b different from the first surface 11a. The first external electrode 13 is disposed on the first surface 11a. The second external electrode 14 is arranged on the second surface 11b. In the method for manufacturing the electronic component module 1 according to the present embodiment, only the second external electrode 14 of the first external electrode 13 and the second external electrode 14 includes the flexible conductive portion (20). The method further includes a step (S11) of joining the sexual connection member 20 with the first joining member 31. The flexible conductive portion (20) has a first portion 21 joined to the second external electrode 14, and a second portion 22 extending from the first portion 21. The flexible connection member 20 may further include a bent portion 23.

  A method for manufacturing the circuit module 1a according to the present embodiment will be described. In the method for manufacturing the circuit module 1a according to the present embodiment, even if the bonding member having a higher melting point among the first bonding member 31, the second bonding member 32, and the third bonding member 33 hardens more quickly. Good. Therefore, it is possible to prevent the relative positions of the ceramic electronic component 10, the flexible connection member 20, the first terminal 42, and the second terminal 43 from shifting. Mechanical and electrical connection between the ceramic electronic component 10, the flexible connection member 20, the first terminal 42, and the second terminal 43 can be ensured.

  Referring to FIG. 4, a first example of a method of manufacturing circuit module 1a according to the present embodiment includes steps (S10 and S11) of preparing electronic component module 1 manufactured by the same manufacturing method as in FIG. Prepare. Specifically, a first example of a method of manufacturing the circuit module 1a according to the present embodiment includes a ceramic electronic component 10 including a ceramic body 11, a first external electrode 13, and a second external electrode 14. (S10). The ceramic body 11 has a first surface 11a and a second surface 11b different from the first surface 11a. The first external electrode 13 is disposed on the first surface 11a. The second external electrode 14 is arranged on the second surface 11b.

  The first example of the method of manufacturing the circuit module 1a according to the present embodiment is that only the second external electrode 14 of the first external electrode 13 and the second external electrode 14 has a flexible conductive portion (20). The step (S11) of joining the flexible connection member 20 including the above by the first joining member 31 is further provided. The flexible conductive portion (20) has a first portion 21 joined to the second external electrode 14, and a second portion 22 extending from the first portion 21. At least one of the second external electrode 14 and the first portion 21 of the flexible conductive portion (20) is brought into contact with the molten solder of the iron tip of the soldering iron so that the second external electrode 14 and the flexible A first joining member 31 may be supplied to at least one of the first portions 21 of the conductive portion (20).

  In the first example of the method of manufacturing the circuit module 1a according to the present embodiment, the second portion 22 of the flexible conductive portion (20) is connected to the second terminal 43 of the circuit board 40 by the third joining member 33. The method further includes a joining step (S12). The flexible connection member 20 may further include a bent portion 23. The molten solder of the iron tip of the soldering iron is brought into contact with at least one of the second terminal 43 and the second part 22 of the flexible conductive part (20), and the second terminal 43 and the flexible conductive part are contacted. The third joining member 33 may be supplied to at least one of the second portions 22 in (20).

  The first example of the method of manufacturing the circuit module 1a according to the present embodiment further includes a step (S13) of joining the first external electrode 13 to the first terminal 42 of the circuit board 40 by the second joining member 32. Prepare. At least one of the first terminal 42 and the first external electrode 13 is brought into contact with the molten solder of the iron tip of the soldering iron, and at least one of the first terminal 42 and the first external electrode 13 is Two joining members 32 may be provided. The third joining member 33 may have a higher melting point than the second joining member 32. In the step (S13) of joining the first external electrode 13 to the first terminal 42 of the circuit board 40 by the second joining member 32, the connection between the flexible connection member 20 and the second terminal 43 of the circuit board 40 is performed. The relative position can be prevented from being shifted. As a result, mechanical and electrical connection between the flexible conductive portion (20) of the flexible connection member 20 and the second terminal 43 of the circuit board 40 can be secured.

  Referring to FIG. 5, in a second example of the method of manufacturing circuit module 1 a of the present embodiment, first external electrode 13 is joined to first terminal 42 of circuit board 40 by second joining member 32. The step (S13) is performed before the step (S12) of joining the second portion 22 of the flexible conductive portion (20) to the second terminal 43 of the circuit board 40 by the third joining member 33. You may. The second joining member 32 may have a higher melting point than the third joining member 33. In the step (S12) of joining the second portion 22 of the flexible conductive portion (20) to the second terminal 43 of the circuit board 40 by the third joining member 33, the first external electrode of the ceramic electronic component 10 is provided. 13 and the first terminal 42 of the circuit board 40 can be prevented from being displaced relative to each other. As a result, mechanical and electrical connection between the first external electrode 13 of the ceramic electronic component 10 and the first terminal 42 of the circuit board 40 can be secured.

  In the third example of the method of manufacturing the circuit module 1a according to the present embodiment, the step (S13) of joining the first external electrode 13 to the first terminal 42 of the circuit board 40 by the second joining member 32 includes: This may be performed together with the step (S12) of joining the second portion 22 of the flexible conductive portion (20) to the second terminal 43 of the circuit board 40 by the third joining member 33.

  In the first to third examples of the method of manufacturing the circuit module 1a according to the present embodiment, the first joint member 31 has a higher melting point than the second joint member 32 and the third joint member 33. Is preferred. Since the first joint member 31 has a higher melting point than the second joint member 32 and the third joint member 33, the second joint 22 of the flexible conductive portion (20) is In the step (S12) of joining the first external electrode 13 to the first terminal 42 of the circuit board 40 with the third joining member 33 (S13). In addition, it is possible to prevent the relative position between the second external electrode 14 of the ceramic electronic component 10 and the flexible connection member 20 from shifting. As a result, mechanical and electrical connection between the second external electrode 14 of the ceramic electronic component 10 and the flexible connection member 20 can be secured.

  Referring to FIGS. 6 and 7, in the fourth to sixth examples of the method of manufacturing the circuit module 1 a of the present embodiment, the third bonding member 33 forms the flexible conductive portion (20). In the step (S12) of joining the second portion 22 to the second terminal 43 of the circuit board 40, only the second external electrode 14 of the first external electrode 13 and the second external electrode 14 is flexible. A step (S11) of joining the flexible connecting member 20 including the conductive portion (20) with the first joining member 31 and connecting the first external electrode 13 with the second joining member 32 to the first terminal of the circuit board 40; It may be performed before the step (S13) of joining to 42.

  With reference to FIG. 6, a fourth example of the method for manufacturing the circuit module 1a according to the present embodiment will be described. In a fourth example of the method for manufacturing the circuit module 1a according to the present embodiment, the step of preparing the ceramic electronic component 10 including the ceramic body 11, the first external electrode 13, and the second external electrode 14 ( S10). In a fourth example of the method of manufacturing the circuit module 1a according to the present embodiment, the second portion 22 of the flexible conductive portion (20) is connected to the second terminal 43 of the circuit board 40 by the third joining member 33. The method further includes a joining step (S12). The flexible connection member 20 may further include a bent portion 23. The fourth example of the method of manufacturing the circuit module 1a of the present embodiment is that only the second external electrode 14 of the first external electrode 13 and the second external electrode 14 has a flexible conductive portion (20). The step (S11) of joining the flexible connection member 20 including the above by the first joining member 31 is further provided. The flexible conductive portion (20) has a first portion 21 joined to the second external electrode 14, and a second portion 22 extending from the first portion 21. The fourth example of the method of manufacturing the circuit module 1a according to the present embodiment further includes a step (S13) of joining the first external electrode 13 to the first terminal 42 of the circuit board 40 by the second joining member 32. Prepare.

  The first joining member 31 may have a higher melting point than the second joining member 32. In the step (S13) of joining the first external electrode 13 to the first terminal 42 of the circuit board 40 by the second joining member 32, the second external electrode 14 of the ceramic electronic component 10 and the flexible connecting member 20 Can be prevented from being shifted from the relative position. As a result, mechanical and electrical connection between the second external electrode 14 of the ceramic electronic component 10 and the flexible connection member 20 can be secured.

  Referring to FIG. 7, in a fifth example of the method of manufacturing circuit module 1 a of the present embodiment, first external electrode 13 is joined to first terminal 42 of circuit board 40 by second joining member 32. The step (S13) is a step (S11) of joining the first portion 21 of the flexible conductive portion (20) of the flexible connection member 20 to the second external electrode 14 by the first joining member 31. May be done before. The second joining member 32 may have a higher melting point than the first joining member 31. In the step (S11) of joining the first portion 21 of the flexible conductive portion (20) of the flexible connection member 20 to the second external electrode 14 by the first joining member 31, the first of the ceramic electronic components 10 The relative position between the first external electrode 13 and the first terminal 42 of the circuit board 40 can be prevented from being shifted. As a result, mechanical and electrical connection between the first external electrode 13 of the ceramic electronic component 10 and the first terminal 42 of the circuit board 40 can be secured.

  In the sixth example of the method of manufacturing the circuit module 1a according to the present embodiment, the step of joining the first external electrode 13 to the first terminal 42 of the circuit board 40 by the second joining member 32 (S13) This may be performed together with the step (S11) of joining the first portion 21 of the flexible conductive portion (20) of the flexible connection member 20 to the second external electrode 14 by the first joining member 31. .

  In the fourth to sixth examples of the method of manufacturing the circuit module 1a according to the present embodiment, the third joint member 33 has a higher melting point than the first joint member 31 and the second joint member 32. Is preferred. Since the third bonding member 33 has a higher melting point than the first bonding member 31 and the second bonding member 32, the second external electrode 14 is connected to the flexible conductive portion (20) of the flexible connecting member 20. ) Of joining the first portion 21 by the first joining member 31 (S11) and joining the first external electrode 13 to the first terminal 42 of the circuit board 40 by the second joining member 32 (S11). In S13), it is possible to prevent the relative position between the flexible connection member 20 and the second terminal 43 of the circuit board 40 from being shifted. As a result, mechanical and electrical connection between the flexible connection member 20 and the second terminal 43 of the circuit board 40 can be secured.

  The effects of the electronic component module 1, the circuit module 1a, the method of manufacturing the electronic component module 1 and the method of manufacturing the circuit module 1a according to the present embodiment will be described.

  The electronic component module 1 of the present embodiment includes a ceramic electronic component 10 and a flexible connection member 20. The ceramic electronic component 10 includes a ceramic body 11, a first external electrode 13, and a second external electrode 14. The ceramic body 11 has a first surface 11a and a second surface 11b different from the first surface 11a. The first external electrode 13 is disposed on the first surface 11a. The second external electrode 14 is arranged on the second surface 11b. Flexible connection member 20 includes a flexible conductive portion (20). The flexible conductive portion (20) is joined by the first joining member 31 only to the second external electrode 14 of the first external electrode 13 and the second external electrode 14. The flexible conductive portion (20) has a first portion 21 joined to the second external electrode 14, and a second portion 22 extending from the first portion 21.

  In the electronic component module 1 of the present embodiment, the flexible connection member 20 joined to the second external electrode 14 of the ceramic electronic component 10 has flexibility. Therefore, the flexible connection member 20 can reduce the stress applied to the ceramic body 11 of the ceramic electronic component 10. The stress relieved by the flexible connecting member 20 includes thermal stress applied to the ceramic body 11 when the ceramic electronic component 10 is soldered to the circuit board 40 and heat applied to the ceramic body 11 when the ceramic electronic component 10 operates. The stress and the mechanical stress applied to the ceramic body 11 due to the mechanical stress of the circuit board can be exemplified. According to the electronic component module 1 of the present embodiment, the occurrence of cracks in the ceramic body 11 of the ceramic electronic component 10 can be suppressed. In addition, the flexible connection member 20 including the flexible conductive portion (20) is connected to only the second external electrode 14 of the first external electrode 13 and the second external electrode 14 by the first bonding member 31. Joined. The flexible connection member 20 does not exist on the first external electrode 13 of the ceramic electronic component 10. The number of flexible connection members 20 in the electronic component module 1 can be reduced. Therefore, electronic component module 1 of the present embodiment has a simple structure.

  In the electronic component module 1 of the present embodiment, the flexible connection member 20 may have the bent portion 23. Since the flexible connection member 20 including the flexible conductive portion (20) is bent at the bent portion 23, the rigidity of the flexible connection member 20 at the bent portion 23 decreases. Therefore, the bent flexible connection member 20 can further reduce the stress applied to the ceramic body 11. The bent flexible connection member 20 can further suppress the occurrence of cracks in the ceramic body 11. Further, since the flexible connection member 20 has the bent portion 23, at least a part of the first main surface 20a of the second portion 22 of the flexible conductive portion (20) is It may face the fifth main surface 43b of the terminal 43. Therefore, the flexible conductive portion (20) can be firmly joined to the second terminal 43 of the circuit board 40 with a large area.

  The circuit module 1a according to the present embodiment includes the electronic component module 1 and a circuit board 40. The circuit board 40 has a first terminal 42 and a second terminal 43. The first external electrode 13 is joined to the first terminal 42 by the second joining member 32. The second portion 22 of the flexible conductive portion (20) is joined to the second terminal 43 by a third joining member 33.

  In the circuit module 1a of the present embodiment, the flexible connection member 20 joined to the second external electrode 14 of the ceramic electronic component 10 and the second terminal 43 of the circuit board 40 has flexibility. Therefore, the flexible connection member 20 can reduce the stress applied to the ceramic body 11 of the ceramic electronic component 10. The stress relieved by the flexible connecting member 20 includes thermal stress applied to the ceramic body 11 when the ceramic electronic component 10 is soldered to the circuit board 40 and heat applied to the ceramic body 11 when the ceramic electronic component 10 operates. The stress and the mechanical stress applied to the ceramic body 11 due to the mechanical stress of the circuit board can be exemplified. According to the circuit module 1a of the present embodiment, the occurrence of cracks in the ceramic body 11 of the ceramic electronic component 10 can be suppressed. Further, the flexible connection member 20 including the flexible conductive portion (20) does not exist between the first external electrode 13 and the first terminal 42 of the circuit board 40. The number of flexible connection members 20 in the circuit module 1a can be reduced. Therefore, the circuit module 1a according to the present embodiment has a simple structure.

  In the circuit module 1a of the present embodiment, the flexible connection member 20 may have the bent portion 23. Since the flexible connection member 20 including the flexible conductive portion (20) is bent at the bent portion 23, the rigidity of the flexible connection member 20 at the bent portion 23 decreases. Therefore, the bent flexible connection member 20 can further reduce the stress applied to the ceramic body 11. The bent flexible connection member 20 can further suppress the occurrence of cracks in the ceramic body 11. Further, since the flexible connecting member 20 including the flexible conductive portion (20) is bent at the bent portion 23, the first main surface 20a of the second portion 22 of the flexible conductive portion (20) is provided. May face the fifth main surface 43b of the second terminal 43. Therefore, the flexible conductive portion (20) can be firmly joined to the second terminal 43 of the circuit board 40 with a large area.

  In the circuit module 1a of the present embodiment, the first joining member 31 may be separated from the third joining member 33. Since the first joining member 31 is separated from the third joining member 33, the first joining member 31 does not mix with the third joining member 33. For this reason, in the present embodiment, the fact that the first joint member 31 and the third joint member 33 are mixed with each other and the thermal and mechanical properties of the first joint member 31 and the third joint member 33 are changed. Of the circuit module 1a can be prevented. Further, since the first joint member 31 is separated from the third joint member 33, all of the first main surface 20a of the flexible conductive portion (20) is connected to the first joint member 31 and the third joint member 31. It is not covered by the member 33. Loss of flexibility of the flexible connection member 20 due to the entire first main surface 20a of the flexible conductive portion (20) being covered by the first bonding member 31 and the third bonding member 33. Can be prevented by the circuit module 1a of the present embodiment. Therefore, the occurrence of cracks in the ceramic body 11 of the ceramic electronic component 10 can be further suppressed.

  In the circuit module 1a of the present embodiment, the first joint member 31, the second joint member 32, and the third joint member 33 are made of lead-containing solder, lead-free solder, conductive adhesive, gold, silver, and copper. And nickel. Lead-free solders such as Sn-Ag-Cu solder, Sn-Ag-Cu-Sb solder or Sn-Sb solder are better than lead-containing solders such as Pb-Sn solder or Pb-In solder. , Hard to creep deformation. When lead-free solder that is unlikely to creep is used as the second joint member 32 and the third joint member 33, the stress applied to the ceramic body 11 by the second joint member 32 and the third joint member 33 Is difficult to mitigate. On the other hand, in the circuit module 1a of the present embodiment, the flexible connection member 20 has flexibility. Therefore, even if lead-free solder that is unlikely to be creep-deformed is used as the second joint member 32 and the third joint member 33, the flexible connection member 20 reduces the stress applied to the ceramic body 11 by reducing the stress applied thereto. The occurrence of cracks in the ceramic body 11 can be suppressed.

  The method for manufacturing the electronic component module 1 of the present embodiment includes preparing a ceramic electronic component 10 including a ceramic body 11, a first external electrode 13, and a second external electrode 14. The ceramic body 11 has a first surface 11a and a second surface 11b different from the first surface 11a. The first external electrode 13 is disposed on the first surface 11a. The second external electrode 14 is arranged on the second surface 11b. In the method for manufacturing the electronic component module 1 according to the present embodiment, only the second external electrode 14 of the first external electrode 13 and the second external electrode 14 includes the flexible conductive portion (20). It further comprises joining the male connection member 20 with the first joining member 31. The flexible conductive portion (20) has a first portion 21 joined to the second external electrode 14, and a second portion 22 extending from the first portion 21.

  In the method for manufacturing electronic component module 1 of the present embodiment, flexible connection member 20 joined to second external electrode 14 of ceramic electronic component 10 has flexibility. Therefore, the flexible connection member 20 can reduce the stress applied to the ceramic body 11 of the ceramic electronic component 10. According to the method of manufacturing electronic component module 1 of the present embodiment, cracks can be suppressed from occurring in ceramic body 11 of ceramic electronic component 10. Further, in the method for manufacturing electronic component module 1 of the present embodiment, only second external electrode 14 of first external electrode 13 and second external electrode 14 includes flexible conductive portion (20). The method includes joining the flexible connection member 20 with the first joining member 31. The flexible connection member 20 does not exist on the first external electrode 13. The number of flexible connection members 20 in the electronic component module 1 can be reduced. The step of joining the flexible connection member 20 to the first external electrode 13 can be omitted. According to the method of manufacturing electronic component module 1 of the present embodiment, electronic component module 1 having a simple structure can be manufactured with reduced manufacturing costs and reduced manufacturing steps.

  In the method for manufacturing electronic component module 1 of the present embodiment, flexible connection member 20 may have bent portion 23. Since the flexible connection member 20 including the flexible conductive portion (20) is bent at the bent portion 23, the rigidity of the flexible connection member 20 at the bent portion 23 decreases. Therefore, the bent flexible connection member 20 can further reduce the stress applied to the ceramic body 11. The bent flexible connection member 20 can further suppress the occurrence of cracks in the ceramic body 11. Further, since the flexible connection member 20 has the bent portion 23, at least a part of the first main surface 20a of the second portion 22 of the flexible conductive portion (20) is It may face the fifth main surface 43b of the terminal 43. Therefore, the flexible conductive portion (20) can be firmly joined to the second terminal 43 of the circuit board 40 with a large area.

  The method for manufacturing the circuit module 1a according to the present embodiment includes preparing a ceramic electronic component 10 including the ceramic body 11, the first external electrode 13, and the second external electrode 14. The ceramic body 11 has a first surface 11a and a second surface 11b different from the first surface 11a. The first external electrode 13 is disposed on the first surface 11a. The second external electrode 14 is arranged on the second surface 11b. In the method for manufacturing the circuit module 1a according to the present embodiment, only the second external electrode 14 of the first external electrode 13 and the second external electrode 14 includes the flexible conductive portion (20). The method further includes joining the connecting member 20 with the first joining member 31. The flexible conductive portion (20) has a first portion 21 joined to the second external electrode 14, and a second portion 22 extending from the first portion 21. In the method of manufacturing the circuit module 1 a according to the present embodiment, the first external electrode 13 is bonded to the first terminal 42 of the circuit board 40 by the second bonding member 32 and the third bonding member 33 Bonding the second portion 22 of the flexible conductive portion (20) to the second terminal 43 of the circuit board 40.

  In the method of manufacturing the circuit module 1a according to the present embodiment, the flexible connection member 20 joined to the second external electrode 14 of the ceramic electronic component 10 and the second terminal 43 of the circuit board 40 has flexibility. Have. Therefore, the flexible connection member 20 can reduce the stress applied to the ceramic body 11 of the ceramic electronic component 10. According to the method of manufacturing the circuit module 1a of the present embodiment, the occurrence of cracks in the ceramic body 11 of the ceramic electronic component 10 can be suppressed. Further, the flexible connection member 20 does not exist between the first external electrode 13 and the first terminal 42 of the circuit board 40. The number of flexible connection members 20 in the circuit module 1a can be reduced. The step of joining the flexible connection member 20 to the first external electrode 13 can be omitted. According to the method of manufacturing the circuit module 1a of the present embodiment, the circuit module 1a having a simple structure can be manufactured at a reduced manufacturing cost and a reduced number of manufacturing steps.

  In the method for manufacturing the circuit module 1a according to the present embodiment, the flexible connection member 20 may have the bent portion 23. Since the flexible connection member 20 including the flexible conductive portion (20) is bent at the bent portion 23, the rigidity of the flexible connection member 20 at the bent portion 23 decreases. Therefore, the bent flexible connection member 20 can further reduce the stress applied to the ceramic body 11. The bent flexible connection member 20 can further suppress the occurrence of cracks in the ceramic body 11. Further, since the flexible connection member 20 has the bent portion 23, at least a part of the first main surface 20a of the second portion 22 of the flexible conductive portion (20) is It may face the fifth main surface 43b of the terminal 43. Therefore, the flexible conductive portion (20) can be firmly joined to the second terminal 43 of the circuit board 40 with a large area.

(Embodiment 2)
The electronic component module 2 according to the second embodiment will be described with reference to FIG. The circuit module 2a according to the second embodiment will be described with reference to FIG. The electronic component module 2 and the circuit module 2a of the present embodiment basically have the same configuration as the electronic component module 1 and the circuit module 1a of the first embodiment, but differ mainly in the following points.

  In the electronic component module 2 and the circuit module 2a of the present embodiment, the flexible connection member 20 is provided on the first main surface 20a of the second portion 22 of the flexible conductive portion (20) by a ceramic electronic component. It may further include a protrusion 24 protruding toward the 10 side. The first joining member 31 may be separated from the third joining member 33 by the protrusion 24. The convex portion 24 can block the first joining member 31 and prevent the first joining member 31 from mixing with the third joining member 33. The protrusion 24 may have conductivity or may have insulation. The protrusion 24 may be made of a resin such as an epoxy resin or a solder resist. The protrusion 24 may have flexibility.

  The effects of the electronic component module 2 and the circuit module 2a according to the present embodiment will be described. The electronic component module 2 and the circuit module 2a of the present embodiment have the following effects in addition to the effects of the electronic component module 1 and the circuit module 1a of the first embodiment.

  In the electronic component module 2 and the circuit module 2 a of the present embodiment, the protrusion 24 separates the third bonding member 33 from the first bonding member 31. For this reason, the convex portions 24 prevent the first bonding member 31 from mixing with the third bonding member 33 and change the thermal and mechanical properties of the first bonding member 31 and the third bonding member 33. The protrusion 24 can be reliably prevented. Further, the entirety of the first main surface 20a of the flexible conductive portion (20) is covered by the first joint member 31 and the third joint member 33, so that the flexibility of the flexible connection member 20 is lost. The protrusion 24 can be prevented from being performed. For this reason, the protrusions 24 can reliably suppress the occurrence of cracks in the ceramic body 11 of the ceramic electronic component 10.

(Embodiment 3)
Third Embodiment An electronic component module 3 according to a third embodiment will be described with reference to FIG. With reference to FIG. 11, a circuit module 3a according to the third embodiment will be described. The electronic component module 3 and the circuit module 3a of the present embodiment basically have the same configuration as the electronic component module 1 and the circuit module 1a of the first embodiment, but differ mainly in the following points.

  In the present embodiment, the flexible connection member 50 includes a flexible conductive portion 51 and a flexible resin portion 52 laminated on the flexible conductive portion 51. Therefore, the flexible connection member 50 according to the present embodiment has the same mechanical strength as the flexible connection member 20 according to the first embodiment, but has a higher mechanical strength than the flexible connection member 20 according to the first embodiment. It has greater flexibility. Flexible conductive portion 51 in the present embodiment may be thinner than flexible conductive portion (20) in the first embodiment. The flexible resin portion 52 may have greater flexibility than the flexible conductive portion 51. The flexible resin portion 52 may be made of any one of epoxy resin, polyurethane resin, polyimide resin, phenol resin, polyethylene terephthalate resin and silicone rubber.

  The flexible conductive portion 51 includes a first main surface 51a joined to the second external electrode 14 by the first joining member 31, a second main surface 52b opposite to the first main surface 51a, and Having. The flexible conductive portion 51 of the present embodiment includes a first portion 53 joined to the second external electrode 14 by the first joining member 31, and a second portion extending from the first portion 53. 54. The first main surface 51a of the first portion 53 of the flexible conductive portion 51 is joined to the sixth external electrode layer 14c of the second external electrode 14 by the first joining member 31. The first portion 53 in the present embodiment has the same configuration as the first portion 21 of the first embodiment, and has the same function. The second portion 54 according to the present embodiment has a configuration similar to that of the second portion 22 of the first embodiment and has a similar function. The flexible connection member 50 may further have a bent portion 55. The bent portion 55 in the present embodiment has the same configuration as the bent portion 23 of the first embodiment, and has the same function.

  The effects of the electronic component module 3 and the circuit module 3a according to the present embodiment will be described. The electronic component module 3 and the circuit module 3a according to the present embodiment have the following effects in addition to the effects of the electronic component module 1 and the circuit module 1a according to the first embodiment.

  The flexible connection member 50 includes a flexible resin portion 52 laminated on the flexible conductive portion 51. The flexible connection member 50 according to the present embodiment has greater flexibility than the flexible connection member 20 according to the first embodiment. Therefore, the bent flexible connection member 50 can further reduce the stress applied to the ceramic body 11 of the ceramic electronic component 10. The flexible connection member 50 can further suppress the occurrence of cracks in the ceramic body 11 of the ceramic electronic component 10.

(Embodiment 4)
An electronic component module 4 according to the fourth embodiment will be described with reference to FIG. The circuit module 4a according to the fourth embodiment will be described with reference to FIG. The electronic component module 4 and the circuit module 4a according to the present embodiment basically have the same configuration as the electronic component module 3 and the circuit module 3a according to the third embodiment, but differ mainly in the following points.

  The electronic component module 4 and the circuit module 4a according to the present embodiment are the same as the electronic component module 3 and the circuit module 3a according to the third embodiment, and further include the protrusion 24 according to the second embodiment. Specifically, in the electronic component module 4 and the circuit module 4 a of the present embodiment, the flexible connection member 50 is provided on the first main surface 51 a of the second portion 54 of the flexible conductive portion 51. A projection 24 protruding toward the ceramic electronic component 10 may be further included. The electronic component module 4 and the circuit module 4a of the present embodiment have the effects of the electronic component module 2 and the circuit module 2a of the second embodiment and the effects of the electronic component module 3 and the circuit module 3a of the third embodiment. .

(Embodiment 5)
An electronic component module 5 according to the fifth embodiment will be described with reference to FIG. The circuit module 5a according to the fifth embodiment will be described with reference to FIG. The electronic component module 5 and the circuit module 5a of the present embodiment basically have the same configuration as the electronic component module 1 and the circuit module 1a of the first embodiment, but differ mainly in the following points.

  In the electronic component module 5 and the circuit module 5a of the present embodiment, the flexible connection member 20 is folded so that the first main surface 20a is located outside the second main surface 20b. The flexible connection member 20 has a plurality of bent portions 23. The second portion 22 of the flexible conductive portion (20) includes a portion extending in a direction away from the ceramic electronic component 10 and a portion extending away from the first portion 21 on the opposite side of the ceramic electronic component 10 to the ceramic body 11. And a portion extending in the direction toward the ceramic electronic component 10 may be included. A bent portion 23 may be disposed between a portion extending in a direction away from the ceramic electronic component 10 and the first portion 21. Between a portion extending away from the ceramic electronic component 10 and a portion extending along the second surface 11b of the ceramic body 11 away from the first portion 21 on the opposite side to the ceramic electronic component 10 In addition, a bent portion 23 may be arranged. Between a portion extending along the second surface 11b of the ceramic body 11 away from the first portion 21 on the opposite side of the ceramic electronic component 10 and a portion extending in a direction toward the ceramic electronic component 10 In addition, a bent portion 23 may be arranged. The first portion 21 is apart from a portion of the second portion 22 extending in a direction toward the ceramic electronic component 10.

  In the circuit module 5 a of the present embodiment, at least a part of the first main surface 20 a of the second portion 22 of the flexible conductive portion (20) faces the fifth main surface 43 b of the second terminal 43. May be. Specifically, the first main surface 20a of the flexible conductive portion (20) in the portion extending in the direction toward the ceramic electronic component 10 faces the fifth main surface 43b of the second terminal 43. Is also good. The first main surface 20a of the second portion 22 of the flexible conductive portion (20) is joined to the fifth main surface 43b of the second terminal 43 by a third joining member 33. The flexible conductive portion (20) is joined to the second external electrode 14 by the first joining member 31 at one end of the first main surface 20a of the flexible conductive portion (20). . The flexible conductive portion (20) may be joined to the second terminal 43 by a third joining member 33 at the other end of the first main surface 20a of the flexible conductive portion (20). . The portion extending in the direction toward the ceramic electronic component 10 may include the other end of the first main surface 20a of the flexible conductive portion (20) joined to the second terminal 43. One end of the first main surface 20a of the flexible conductive portion (20) is separated from the other end of the first main surface 20a of the flexible conductive portion (20).

  The effects of the electronic component module 5 and the circuit module 5a according to the present embodiment will be described. The electronic component module 5 and the circuit module 5a of the present embodiment have the following effects in addition to the effects of the electronic component module 1 and the circuit module 1a of the first embodiment.

  In the electronic component module 5 and the circuit module 5a according to the present embodiment, the flexible connection member 20 is folded so that the first main surface 20a is disposed outside the second main surface 20b. The flexible connection member 20 according to the present embodiment is longer than the flexible connection member 20 according to the first embodiment. The longer the flexible connection member 20, the more the flexible connection member 20 can bend. Therefore, the flexible connection member 20 of the present embodiment can further reduce the stress applied to the ceramic body 11 of the ceramic electronic component 10. The electronic component module 5 and the circuit module 5a according to the present embodiment can further suppress the occurrence of cracks in the ceramic body 11 of the ceramic electronic component 10.

  In the electronic component module 5 and the circuit module 5a according to the present embodiment, the flexible connection member 20 is folded so that the first main surface 20a is disposed outside the second main surface 20b. Therefore, it is possible to reliably prevent the thermal and mechanical properties of the first joint member 31 and the third joint member 33 from changing due to the first joint member 31 being mixed with the third joint member 33. .

(Embodiment 6)
An electronic component module 6 according to the sixth embodiment will be described with reference to FIG. The circuit module 6a according to the sixth embodiment will be described with reference to FIG. The electronic component module 6 and the circuit module 6a according to the present embodiment basically have the same configuration as the electronic component module 5 and the circuit module 5a according to the fifth embodiment, but differ mainly in the following points. Like the flexible connection member 50 of the third embodiment, the flexible connection member 50 of the present embodiment includes a flexible conductive portion 51 and a flexible resin laminated on the flexible conductive portion 51. And a portion 52.

  The electronic component module 6 and the circuit module 6a of the present embodiment have the effects of the electronic component module 5 and the circuit module 5a of the fifth embodiment and the effects of the electronic component module 3 and the circuit module 3a of the third embodiment. . For example, the flexible connection member 50 of the present embodiment is folded so that the first main surface 20a is disposed outside the second main surface 20b. The flexible connection member 50 according to the present embodiment is longer than the flexible connection member 20 according to the first embodiment. Further, the flexible connection member 50 according to the present embodiment includes a flexible resin portion 52 laminated on the flexible conductive portion 51. Therefore, the flexible connection member 50 according to the present embodiment has greater flexibility than the flexible connection member 20 according to the first embodiment. The flexible connection member 50 according to the present embodiment can further reduce the stress applied to the ceramic body 11 of the ceramic electronic component 10. The electronic component module 6 and the circuit module 6a of the present embodiment can further suppress the occurrence of cracks in the ceramic body 11 of the ceramic electronic component 10.

(Embodiment 7)
The circuit module 7a according to the seventh embodiment will be described with reference to FIG. The circuit module 7a of the present embodiment basically has the same configuration as the circuit module 1a of the first embodiment, but differs mainly in the following points.

  In the circuit module 7a of the present embodiment, the first external electrode 13, the second external electrode 14, and the first terminal 42 are the same as the third main surface of the circuit board 40 on which the first terminal 42 is arranged. It is arranged along the direction crossing 41a. Specifically, the first external electrode 13, the second external electrode 14, and the first terminal 42 are in a direction perpendicular to the third main surface 41 a of the circuit board 40 on which the first terminal 42 is disposed. May be arranged along.

  The effect of the circuit module 7a of the present embodiment will be described. The circuit module 7a of the present embodiment has the following effects in addition to the effects of the circuit module 1a of the first embodiment. In the circuit module 7a of the present embodiment, the first external electrode 13, the second external electrode 14, and the first terminal 42 are the same as the third main surface of the circuit board 40 on which the first terminal 42 is arranged. It is arranged along the direction crossing 41a. The distance between the first surface 11a and the second surface 11b of the ceramic body 11 is larger than the distance between the third surface 11c and the fourth surface 11d of the ceramic body 11. The circuit according to the present embodiment is different from a circuit module in which the first external electrode 13, the second external electrode 14, and the first terminal 42 are respectively arranged in parallel with the third main surface 41 a of the circuit board 40. Module 7a comprises a longer flexible connection member 20. The longer the flexible connection member 20, the more the flexible connection member 20 can bend. Therefore, the flexible connection member 20 of the present embodiment can further reduce the stress applied to the ceramic body 11 of the ceramic electronic component 10. The circuit module 7a according to the present embodiment can further suppress the occurrence of cracks in the ceramic body 11 of the ceramic electronic component 10.

(Embodiment 8)
The circuit module 8a according to the eighth embodiment will be described with reference to FIG. The circuit module 8a of the present embodiment basically has the same configuration as the circuit module 7a of the seventh embodiment, but differs mainly in the following points. Like the flexible connection member 50 of the third embodiment, the flexible connection member 50 of the present embodiment includes a flexible conductive portion 51 and a flexible resin laminated on the flexible conductive portion 51. And a portion 52.

  The circuit module 8a of the present embodiment has the effects of the circuit module 7a of the seventh embodiment and the effects of the circuit module 3a of the third embodiment. For example, in the circuit module 8a of the present embodiment, the first external electrode 13, the second external electrode 14, and the first terminal 42 are connected to the third terminal of the circuit board 40 on which the first terminal 42 is arranged. They are arranged along a direction crossing the main surface 41a. The circuit according to the present embodiment is different from a circuit module in which the first external electrode 13, the second external electrode 14, and the first terminal 42 are respectively arranged in parallel with the third main surface 41 a of the circuit board 40. Module 8a includes a longer flexible connection member 50. Further, flexible connection member 50 in the present embodiment includes a flexible resin portion 52 laminated on flexible conductive portion 51. Therefore, the flexible connection member 50 according to the present embodiment has greater flexibility than the flexible connection member 20 according to the first embodiment. Since the flexible connecting member 50 in the present embodiment is long and has great flexibility, the flexible connecting member 50 further reduces the stress applied to the ceramic body 11 of the ceramic electronic component 10. Can be. The circuit module 8a of the present embodiment can further suppress the occurrence of cracks in the ceramic body 11 of the ceramic electronic component 10.

  The embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. As long as there is no contradiction, at least two of the first to eighth embodiments disclosed this time may be combined. For example, the protrusion 24 of the second embodiment may be arranged on the flexible connection member 20 of the seventh embodiment. The protrusion 24 of the fourth embodiment may be arranged on the flexible connection member 50 of the eighth embodiment. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  1, 2, 3, 4, 5, 6 electronic component module, 1a, 2a, 3a, 4a, 5a, 6a, 7a, 8a circuit module, 10 ceramic electronic component, 11 ceramic body, 11a first surface, 11b 2nd surface, 11c 3rd surface, 11d 4th surface, 12 internal electrodes, 12a 1st internal electrode layer, 12b 2nd internal electrode layer, 13 1st external electrode, 13a 1st external electrode Layer, 13b second external electrode layer, 13c third external electrode layer, 14 second external electrode, 14a fourth external electrode layer, 14b fifth external electrode layer, 14c sixth external electrode layer, 20 , 50 flexible connecting member, 20a, 51a first main surface, 20b, 51b second main surface, 21, 53 first portion, 22, 54 second portion, 23, 55 bent portion, 24 convex Part, 31 first joining member, 3 2nd joining member, 33 3rd joining member, 40 circuit board, 41 base material, 41a 3rd principal surface, 42 first terminal, 42b 4th principal surface, 43 2nd terminal, 43b 5th Main surface, 51 flexible conductive portion, 52 flexible resin portion.

Claims (16)

A ceramic body having a first surface, a second surface different from the first surface, a first external electrode on the first surface, and a second external electrode on the second surface A ceramic electronic component including an electrode;
A flexible connection member including a flexible conductive portion,
The flexible conductive portion is bonded only to the second external electrode of the first external electrode and the second external electrode by a first bonding member,
The flexible conductive portions possess a first portion joined to the second outer electrode, and a second portion extending from said first portion,
The electronic component module , wherein the flexible connection member further includes a protrusion formed on the second portion and protruding toward the ceramic electronic component .   The electronic component module according to claim 1, wherein the flexible connection member has a bent portion. The flexible conductive portion has a first main surface joined to the second external electrode by the first joining member, and a second main surface opposite to the first main surface. And
3. The electronic component module according to claim 1, wherein the flexible connection member is folded so that the first main surface is disposed outside the second main surface. 4.   The electronic component module according to claim 1, wherein the flexible conductive portion is made of a metal material.   5. The flexible conductive portion according to claim 1, wherein the flexible conductive portion contains at least 50% by mass of an element selected from the group consisting of copper, aluminum, nickel, tin, zinc, silver, and gold. Electronic component module.   The electronic component module according to any one of claims 1 to 5, wherein the flexible connection member further includes a flexible resin portion laminated on the flexible conductive portion.   The electronic component module according to claim 6, wherein the flexible resin portion is made of any one of an epoxy resin, a polyurethane resin, a polyimide resin, a phenol resin, a polyethylene terephthalate resin, and a silicone rubber. An electronic component module according to any one of claims 1 to 7,
A circuit board having a first terminal and a second terminal;
The first external electrode is joined to the first terminal by a second joining member,
The circuit module, wherein the second portion of the flexible conductive portion is joined to the second terminal by a third joining member. The circuit module according to claim 8 , wherein the first joining member is separated from the third joining member. Before SL first joint member by the convex portion is separated from said third joint members, the circuit module according to claim 9. The said 1st joining member, the said 2nd joining member, and the said 3rd joining member are any one of a lead containing solder, a lead-free solder, a conductive adhesive, gold, silver, copper, and nickel. The circuit module according to any one of claims 8 to 10 . The said 1st external electrode, the said 2nd external electrode, and the said 1st terminal are arrange | positioned along the direction which cross | intersects the main surface of the said circuit board in which the said 1st terminal is arrange | positioned. The circuit module according to any one of claims 8 to 11 . A ceramic body having a first surface, a second surface different from the first surface, a first external electrode on the first surface, and a second external electrode on the second surface Preparing a ceramic electronic component including an electrode;
Bonding a flexible connection member including a flexible conductive portion with a first bonding member only to the second external electrode of the first external electrode and the second external electrode,
The flexible conductive portions possess a first portion joined to the second outer electrode, and a second portion extending from said first portion,
The method of manufacturing an electronic component module, wherein the flexible connection member further includes a protrusion formed on the second portion and protruding toward the ceramic electronic component . The method for manufacturing an electronic component module according to claim 13 , wherein the flexible connection member has a bent portion. A ceramic body having a first surface, a second surface different from the first surface, a first external electrode on the first surface, and a second external electrode on the second surface Preparing a ceramic electronic component including an electrode;
Bonding a flexible connection member including a flexible conductive portion with a first bonding member only to the second external electrode of the first external electrode and the second external electrode, The flexible conductive portion has a first portion joined to the second external electrode, and a second portion extending from the first portion,
Joining the first external electrode to a first terminal of the circuit board by a second joining member;
Joining the second portion of the flexible conductive portion to a second terminal of the circuit board by a third joining member ,
The method of manufacturing a circuit module, wherein the flexible connection member further includes a projection formed on the second portion and protruding toward the ceramic electronic component . The method according to claim 15 , wherein the flexible connection member has a bent portion.

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