JP3685683B2 - Crystal oscillator for surface mounting - Google Patents
Crystal oscillator for surface mounting Download PDFInfo
- Publication number
- JP3685683B2 JP3685683B2 JP2000118298A JP2000118298A JP3685683B2 JP 3685683 B2 JP3685683 B2 JP 3685683B2 JP 2000118298 A JP2000118298 A JP 2000118298A JP 2000118298 A JP2000118298 A JP 2000118298A JP 3685683 B2 JP3685683 B2 JP 3685683B2
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- Prior art keywords
- layer
- electrode
- crystal oscillator
- terminal electrode
- container body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は表面実装用の水晶発振器(以下、表面実装発振器とする)産業上の利用分野とし、特に小型化に対応した端子電極を有する水晶発振器に関する。
【0002】
【従来の技術】
(発明の背景)水晶発振器は、周波数及び時間の基準源として通信機器を含む各種の電子機器に広く用いられている。このような中で、表面実装発振器は、特に携帯電話に代表されるように小型な電子機器に使用され、小型化の成否が商品化を決定づける。
【0003】
(従来技術の一例)第3図及び第4図は従来例の一例を説明する表面実装発振器の図で、第3図は断面図、第4図は底面図である。
表面実装発振器は、積層セラミックからなる容器本体1に発振回路を構成する水晶片2、ICチップ3及びコンデンサ4を収容し、カバー5を接合してなる。ICチップ3は容器本体1の底面に、水晶片2は図示しない励振電極から引出電極の延出した一端部両側を段部に固着してなる。そして、容器本体1の4角となる裏面及び側面に表面実装用の端子電極6を形成する。
【0004】
【発明が解決しようとする課題】
(従来技術の問題点)しかしながら、このようなものでは、現行の外形(長さ×幅が5×3.2mm)がさらに小さくなると、表面実装用の端子電極6が小さくなり過ぎて、これが搭載される回路基板との接続強度が危ぶまれる虞があった。特に、表面実装発振器では容器本体1の4角に端子電極6を有するので、幅方向の間隔がさらに狭まると端子電極6間での電気的短絡の虞もあり、端子電極6は小さく維持する必要がある。
【0005】
(発明の目的)本発明は接合強度を維持する表面実装発振器を提供する。
【0006】
【課題を解決するための手段】
本発明は、積層セラミックからなる容器本体内にICチップと水晶片とを収容し、前記容器本体の裏面の4隅には印刷及び焼成によるWからなる下地電極を形成し、前記下地電極上には電界メッキによるN i 及びA u からなる表面層が設けられた端子電極を有する表面実装用の水晶発振器において、前記下地電極は前記裏面から少なくとも一層目と二層目を有し、前記一層目は平坦として前記二層目は縦横に複数の孔を設けてなり、前記端子電極の表面には縦横に凹凸を有する構成とする。
【0007】
【作用】
本発明では、端子電極の表面に縦横の凹凸を設けたので、回路基板に対する接合面積を大きくする。以下、本発明の一実施例を、表面実装発振器を例として説明する。
【0008】
【実施例】
第1図及び第2図は、本発明の一実施例を説明する表面実装発振器の図で、第1図は端子電極を説明する一部断面図、第2図は底面図である。なお、前従来例図と同一部分には同番号を付与してその説明は簡略又は省略する。
表面実装発振器は、前述したように容器本体1の底面にICチップ3を、段部に水晶片2の一端部両側を固着し、カバー5を接合してなる(前第3図参照)。
【0009】
そして、容器本体1の四隅に設けた端子電極6のうち、特に裏面の端子電極(裏面電極とする)6に凹凸を設けた構成とする。これらは、例えば積層セラミックの底壁層1aの裏面に下地電極としてのW(タングステン)を印刷によって形成する際、これを二層6(ab)にして形成する。すなわち、一層目6aは平坦にする。そして、縦横に孔を有するマスクを用いて二層目6bを形成し、焼成によって容器本体1とともに一体的にする。
【0010】
そして、焼成後、端子電極6上に例えばNi(ニッケル)及び必要に応じてNi上にAu(金)を積層する(未図示)。これらのNi及びAuは電解メッキによって形成する。これにより、裏面電極6の表面には、約50μ程度の凹凸が縦横に形成される。
【0011】
このような構成であれば、容器本体1の裏面電極6の表面には凹凸を有するので、表面面積を大きくする。したがって、例えば回路基板に半田等によって搭載する際、半田との接合面積を大きくするので、裏面電極6が小さくなっても接続強度を高めることができる。
【0012】
また、容器本体1が小型になっても裏面電極6を小さく維持できるので、特に幅方向での電気的短絡を防止する。これらのことから、表面実装発振器の小型化をさらに推進できる。
【0013】
【発明の効果】
本発明は、積層セラミックからなる容器本体内にICチップと水晶片とを収容し、前記容器本体の裏面の4隅には印刷及び焼成によるWからなる下地電極を形成し、前記下地電極上には電界メッキによるN i 及びA u からなる表面層が設けられた端子電極を有する表面実装用の水晶発振器において、前記下地電極は前記裏面から少なくとも一層目と二層目を有し、前記一層目は平坦として前記二層目は縦横に複数の孔を設けてなり、前記端子電極の表面には縦横に凹凸を有するので、接合強度を維持した表面実装部品特に表面実装発振器を提供できる。
【図面の簡単な説明】
【図1】 本発明の一実施例を説明する表面実装発振器の図で、特に端子電極を説明する一部断面図である。
【図2】 本発明の一実施例を説明する表面実装発振器の図で、特に端子電極を説明する底面図である。
【図3】 従来例を説明する表面実装発振器の断面図である。
【図4】 従来例を説明する表面実装発振器の底面図である。
【符号の説明】
1 容器本体、2 水晶片、3 ICチップ、4 コンデンサ、5 カバー、6 端子電極.[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a crystal oscillator for surface mounting (hereinafter referred to as a surface mount oscillator) in the industrial application field, and particularly to a crystal oscillator having terminal electrodes corresponding to miniaturization.
[0002]
[Prior art]
BACKGROUND OF THE INVENTION Crystal oscillators are widely used in various electronic devices including communication devices as a frequency and time reference source. Under such circumstances, surface-mounted oscillators are used for small electronic devices such as mobile phones, and the success or failure of miniaturization determines the commercialization.
[0003]
(Example of Prior Art) FIGS. 3 and 4 are views of a surface-mount oscillator for explaining an example of a conventional example. FIG. 3 is a sectional view and FIG. 4 is a bottom view.
The surface-mount oscillator includes a container body 1 made of a multilayer ceramic, housing a
[0004]
[Problems to be solved by the invention]
(Problem of the prior art) However, in such a case, when the current outer shape (length × width is 5 × 3.2 mm) is further reduced, the terminal electrode 6 for surface mounting becomes too small and is mounted. The connection strength with the circuit board may be jeopardized. In particular, since the surface mount oscillator has the terminal electrodes 6 at the four corners of the container body 1, there is a risk of an electrical short circuit between the terminal electrodes 6 when the interval in the width direction is further narrowed, and the terminal electrodes 6 need to be kept small. There is.
[0005]
SUMMARY OF THE INVENTION The present invention provides a surface mount oscillator that maintains bonding strength.
[0006]
[Means for Solving the Problems]
In the present invention , an IC chip and a crystal piece are accommodated in a container body made of a multilayer ceramic , and a base electrode made of W is formed by printing and baking at the four corners of the back surface of the container main body, and on the base electrode in the crystal oscillator for surface mounting with a terminal electrode surface layer consisting of N i and a u by electrolytic plating is provided, wherein the base electrode has at least a first layer and a second layer from said back surface, said first layer Is flat and the second layer is provided with a plurality of holes vertically and horizontally, and the surface of the terminal electrode has irregularities vertically and horizontally .
[0007]
[Action]
In the present invention, since the vertical and horizontal irregularities are provided on the surface of the terminal electrode, the bonding area to the circuit board is increased. Hereinafter, an embodiment of the present invention will be described using a surface mount oscillator as an example.
[0008]
【Example】
1 and 2 are views of a surface-mount oscillator for explaining an embodiment of the present invention. FIG. 1 is a partial sectional view for explaining a terminal electrode, and FIG. 2 is a bottom view. In addition, the same number is attached | subjected to the part same as a prior art example figure, and the description is simplified or abbreviate | omitted.
As described above, the surface-mounted oscillator is formed by bonding the IC chip 3 to the bottom surface of the container body 1, fixing one end of the
[0009]
Of the terminal electrodes 6 provided at the four corners of the container body 1, in particular, the terminal electrode 6 (referred to as the back electrode) on the back surface is provided with irregularities. For example, when W (tungsten) as a base electrode is formed on the back surface of the
[0010]
Then, after firing, for example, Ni (nickel) is laminated on the terminal electrode 6 and Au (gold) is laminated on Ni as necessary (not shown). These Ni and Au are formed by electrolytic plating. As a result, irregularities of about 50 μ are formed vertically and horizontally on the surface of the back electrode 6.
[0011]
With such a configuration, since the surface of the back electrode 6 of the container body 1 has irregularities, the surface area is increased. Therefore, for example, when mounting on a circuit board with solder or the like, the bonding area with the solder is increased, so that the connection strength can be increased even if the back electrode 6 is reduced.
[0012]
Moreover, since the back surface electrode 6 can be kept small even if the container main body 1 is reduced in size, an electrical short circuit in the width direction is particularly prevented. For these reasons, it is possible to further promote downsizing of the surface mount oscillator.
[0013]
【The invention's effect】
In the present invention , an IC chip and a crystal piece are accommodated in a container body made of a multilayer ceramic , and a base electrode made of W is formed by printing and baking at the four corners of the back surface of the container main body, and on the base electrode in the crystal oscillator for surface mounting with a terminal electrode surface layer consisting of N i and a u by electrolytic plating is provided, wherein the base electrode has at least a first layer and a second layer from said back surface, said first layer Is flat and the second layer is provided with a plurality of holes in the vertical and horizontal directions, and the surface of the terminal electrode has irregularities in the vertical and horizontal directions, so that it is possible to provide a surface-mounted component, particularly a surface-mounted oscillator, that maintains the bonding strength.
[Brief description of the drawings]
FIG. 1 is a diagram of a surface-mount oscillator for explaining an embodiment of the present invention, particularly a partial cross-sectional view for explaining a terminal electrode.
FIG. 2 is a view of a surface-mount oscillator for explaining an embodiment of the present invention, particularly a bottom view for explaining a terminal electrode.
FIG. 3 is a cross-sectional view of a surface mount oscillator for explaining a conventional example.
FIG. 4 is a bottom view of a surface-mount oscillator for explaining a conventional example.
[Explanation of symbols]
1 container body, 2 crystal piece, 3 IC chip, 4 capacitor, 5 cover, 6 terminal electrode.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000118298A JP3685683B2 (en) | 2000-04-19 | 2000-04-19 | Crystal oscillator for surface mounting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000118298A JP3685683B2 (en) | 2000-04-19 | 2000-04-19 | Crystal oscillator for surface mounting |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001308490A JP2001308490A (en) | 2001-11-02 |
JP3685683B2 true JP3685683B2 (en) | 2005-08-24 |
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JP2000118298A Expired - Fee Related JP3685683B2 (en) | 2000-04-19 | 2000-04-19 | Crystal oscillator for surface mounting |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006186667A (en) * | 2004-12-27 | 2006-07-13 | Kyocera Kinseki Corp | Piezoelectric vibrator |
JP4777745B2 (en) * | 2005-11-01 | 2011-09-21 | セイコーインスツル株式会社 | Piezoelectric vibrator, oscillator including the same, radio clock, and electronic device |
JP2009100353A (en) | 2007-10-18 | 2009-05-07 | Nippon Dempa Kogyo Co Ltd | Quartz crystal device |
US7928635B2 (en) | 2008-01-07 | 2011-04-19 | Epson Toyocom Corporation | Package for electronic component and piezoelectric resonator |
JP2009188374A (en) * | 2008-01-07 | 2009-08-20 | Epson Toyocom Corp | Package for electronic component, and piezoelectric vibrator |
JP5277843B2 (en) * | 2008-01-07 | 2013-08-28 | セイコーエプソン株式会社 | Package body and electronic device |
JP5224522B2 (en) * | 2008-10-31 | 2013-07-03 | 京セラクリスタルデバイス株式会社 | Piezoelectric vibrator and manufacturing method thereof |
JP6133854B2 (en) * | 2012-05-30 | 2017-05-24 | 京セラ株式会社 | Wiring board and electronic device |
-
2000
- 2000-04-19 JP JP2000118298A patent/JP3685683B2/en not_active Expired - Fee Related
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JP2001308490A (en) | 2001-11-02 |
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