JP5277843B2 - Package body and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package which can improve a connection strength between a package for electronic component and a circuit board and withstand a severe temperature change at a solder connection part. <P>SOLUTION: The package includes a square package body 6 made of stacked ceramic wherein an electronic component 20 can be mounted on its upper surface and a cover member 30 which airtightly seals an opening space on the upper surface of the package body 6 including the electronic component 20. The package body 6 includes a pair of electrode pads 15 which are formed on the bottom of a recess on the upper surface side and connects the electronic component 20 and a pair of mounting terminals 10 and 11 which are formed on both side in the direction of width of the bottom and have a plurality of bumps 10b, 10c, 11b and 11c on the mounting surface. The package includes a plurality of connection electrodes 14 for connecting the pair of electrode pads 15 with a pair of mounting terminals 10 and 11, respectively. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

The present invention relates to an electronic component package and a piezoelectric vibrator, and more particularly to an electronic component package having an improved structure of mounting terminals so as to increase the connection strength with a circuit board, and a piezoelectric vibrator using the same.

Piezoelectric vibrators, especially surface-mounted quartz vibrators, are small in size, easily obtain high-precision and high-stable frequencies, and have little secular change. Is widely used. In recent years, devices have become smaller and lighter, and the demand for further miniaturization of surface-mounted crystal units has been increasing.
As is well known, a surface-mount crystal unit is formed by forming a metal film (excitation electrode) on both main surfaces of a crystal plate using a vacuum deposition method or a sputtering method, and accommodating the metal film in a package body. A lid is hermetically sealed by seam welding or the like at the periphery of the main body.

When a crystal resonator is used for a vehicle-mounted device, the connection strength with the circuit board is particularly important.
The reason for this is that in-vehicle devices are exposed to severe temperature environments from low temperature to high temperature, and the linear expansion coefficient of the piezoelectric vibrator package and the circuit board on which the piezoelectric vibrator is mounted are different. This is because the solder connecting the package and the circuit board is distorted due to the temperature change, and the solder may be fatigued. Further, in recent years, the shape of the surface-mounted crystal resonator has been reduced in size, and the area of the package mounting terminal has been further reduced. Patent Document 1 discloses an example of a surface-mounted crystal resonator in which the connection strength between a mounting terminal (terminal electrode) and a circuit board is reinforced. FIG. 10A is a side sectional view of the surface-mount type crystal resonator, and FIG. 10B is a bottom view. The surface-mounted crystal resonator 70 is bonded to a planar rectangular package body 71 having a recess with an upper opening, a crystal resonator element 75 housed in the package body 71, and an upper opening of the package body 71. And a lid 72. The surface mount type crystal unit 70 is connected to the wiring pattern 91 of the circuit board 90 via the solder 85.

As shown in the bottom view of FIG. 10B, the pair of terminal electrodes 82 and 83 formed along the opposing sides of the bottom surface of the package main body 71 are formed by opposing regions 82a and 83a,
It has the area | regions 82b and 83b in which only one terminal electrode is not formed. These regions are arranged point-symmetrically with respect to the center point of the package body 71. Further, castellations C1 to C4 are formed at four corners of the package body 71, and castellations C1 and C4 are formed.
3 is connected to terminal electrodes 82 and 83, respectively. By configuring the package body 71 as described above, even if the temperature environment changes and a stress is generated in the terminal electrodes 82 and 83 due to a difference in thermal expansion between the package body 71 and the circuit board 90, one terminal electrode is not formed. Corner region 82b,
Since the stresses are released from each other toward 83b, the stress is generated so as to be rotated in a plane at the center point of the package body 71, and the stress is relieved. As a result, it is disclosed that the occurrence of solder cracks and the like can be remarkably suppressed.
Patent Document 2 discloses a package in which four terminal electrodes are formed at the four corners of the back surface of the package, and a small protrusion is formed at the center of each terminal electrode. When a piezoelectric vibrator using this package is mounted on a circuit board, a gap is obtained between the terminal electrode and the circuit board, and a sufficient amount and thickness of solder enters this gap, so that sufficient bonding strength is obtained. Will be disclosed.
JP 2005-108923 A JP 2006-186667 A

However, in the package main body 71 described in Patent Document 1, the terminal electrodes 82 and 83 are used.
Are electrically connected to the piezoelectric vibration element housed inside the package via one castellation C1 and C3 formed at the corners of the package body, respectively, so that the terminal electrodes 82 and 83 and the castellation C1 and When a crack occurs in the connection portion with C3, there is a problem that the crystal unit may not function.
The technique of Patent Document 2 has a problem in that although the amount of solder between the terminal electrode surface of the package and the land electrode surface of the circuit board increases, the amount of solder at a location where distortion concentrates is not necessarily large.
The present invention has been made to solve the above-described problems. An electronic component package that enhances the connection strength between a package mounting terminal and a land electrode of a circuit board and prevents cracks in a solder joint, and uses the same. It is to provide a piezoelectric vibrator.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

Application Example 1 An electronic component package comprising a rectangular package main body on which an electronic component can be mounted and a lid member that hermetically seals the package main body including the electronic component, and the interior of the package main body A pair of electrode pads, a pair of mounting terminals formed on both sides of the bottom surface of the package body and having a plurality of step portions on the mounting surface, the pair of pads and the pair of mounting terminals An electronic component package comprising a plurality of connection electrodes that are electrically connected to each other.

When the package is configured in this way, the solder on the periphery of the package mounting terminal is thickened,
In addition to increasing the connection strength between the package and the circuit board and dispersing the generated distortion in the solder joints in the edge regions of the plurality of stepped portions, it is possible to prevent cracking of the solder.

Application Example 2 An electronic component package according to Application Example 1 in which castellations are formed at four corners of the package body, and the connection electrodes are formed on the castellations, respectively.

By configuring the package in this way, there is an effect that the connection strength between the package and the circuit board can be increased as well as conduction between the piezoelectric vibration element inside the package and the mounting terminal by castellation.

Application Example 3 In the electronic component package according to Application Example 1 or 2, the step portion has a curved surface on the peripheral edge side of the package body.

When the package is configured in this manner, it is possible to prevent cracking of the solder by dispersing the distortion generated due to the change of the environmental temperature along the curved surface of the solder formed based on the shape of the stepped portion. effective.

Application Example 4 In each of the pair of mounting terminals, the stepped portion has at least two stepped portions, one of the stepped portions is formed near the center of the package body, and the other stepped portion is Application example 1 is formed near the end, and the one stepped portion and the other stepped portion have different heights.
The package for electronic components as described in any one of thru | or 3 is characterized.

When the package is configured in this way, the mounting terminals and the land electrodes of the circuit board are thickened by thickening the solder on the periphery of the mounting terminals excluding the position near the center of the package and the position away from the center of the package where a large strain is applied. In addition to increasing the connection strength of the mounting surface, it is possible to prevent cracks in the solder by dispersing the distortion generated due to changes in the environmental temperature to the edge region of the plurality of stepped portions by the stepped portion provided on the mounting surface. There is an effect that can be done.

Application Example 5 The electronic component package according to Application Example 4 is characterized in that the one stepped portion is higher than the other stepped portion.

By configuring the package in this way, by changing the thickness of the solder at each stepped portion, the distortion generated due to the change in environmental temperature is dispersed in the solder at each stepped portion, thereby preventing cracking of the solder. There is an effect that can be.

[Application Example 6] The electronic component package according to any one of Application Examples 1 to 5, wherein a dummy electrode having a stepped portion is formed on the package body.

When the package is configured in this manner, the connection strength between the package and the circuit board is increased by the dummy electrode, and the distortion caused by the temperature change can be dispersed by the step portion of the dummy electrode. There is an effect that it is obtained.

Application Example 7 A piezoelectric vibrator including the electronic component package according to any one of Application Examples 1 to 6 is characterized.

When the piezoelectric vibrator is configured in this way, when the piezoelectric vibrator is mounted on an electronic device such as a vehicle, the connection strength between the package of the piezoelectric vibrator and the circuit board of the electronic device is large, and distortion caused by a temperature change is reduced. Since dispersion is performed in the edge region of the stepped portion, there is an effect that an electronic device that can withstand a large temperature change, vibration, and shock can be configured.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIGS. 1A and 1B are schematic views showing the structure of the electronic component package according to the first embodiment of the present invention and the structure of a piezoelectric vibrator using the same, and FIG. FIG. 4B is a bottom view. As shown in FIG. 1A, the electronic component package 1 includes a rectangular multilayer ceramic package body 6 on which an electronic component 20 can be mounted on the upper surface side, and an upper surface side of the package body 6 including the electronic component 20. And a lid member 30 that hermetically seals the opening space. As shown in FIG. 1A, the package body 6 is formed on the inner bottom portion of the concave portion on the upper surface side, and a pair of electrode pads 15 that connect the electronic component 20.
As shown in FIG. 4B, a plurality of step portions (on the mounting surface are formed on both sides in the short direction of the bottom surface.
Bump) 10b, 10c, 11b, 11c, and a pair of mounting terminals 10, 11. Furthermore, as shown in FIG. 1A, a pair of electrode pads 15 and a pair of mounting terminals 10,
And a plurality of connection electrodes 14 that are electrically connected to each other.

The example shown in FIG. 1A is a case where a tuning fork crystal resonator element is used as the electronic component 20, and a pair of lead electrodes (not shown) of the tuning fork crystal resonator element 20 is a pair of electrode pads 15 of the package body 6. Are bonded and fixed using a conductive adhesive. When a metal lid is used as the lid member 30, the lid member 30 is welded to a seal ring formed on the upper peripheral edge of the package body 6 using means such as resistance welding (seam welding), and the package body 6. Is hermetically sealed. Further, as shown in FIG. 1B, castellations C are formed at the four corners of the package body 6.
1, C 2, C 3, C 4 are formed, and the castellations C 1, C 2, C 3, C 4 are connected to the mounting terminals 10, 11, respectively, and function as a connection electrode 14 that conducts the mounting terminals 10, 11 and the electrode pad 15. To do. On the other hand, the castellations C1 to C4 have an effect of strengthening the connection strength between the circuit board and the package 1 by soldering up (fillet) when the package 1 is mounted on the circuit board.
Further, as shown in FIG. 1C, the castellation C ′ may have a configuration in which one is provided at each of the center portions on both sides in the short direction of the bottom surface of the package body 6.

As shown in FIG. 1B, the mounting terminals 10 and 11 provided on the bottom surface of the package body 6 are provided at one location at each of the center portions on both sides in the short direction. And these mounting terminals 10 and 11
First, the mounting terminal bases 10a and 11a are applied to the package main body 6 by using a method such as screen printing, and each of the mounting terminal bases 10a and 11a has a rectangular shape on the surface of the mounting terminal bases 10a and 11a. Large stepped portions (bumps) 10b and 11b and the mounting terminal base 1
Small step portions 10 each having a rectangular shape near the edge of the package body 6 on the surfaces 0a and 11a.
c and 11c are applied by using a method such as screen printing, and are fired at the same time as the package body 6. That is, the mounting terminal 10 (11) is connected to the mounting terminal base 10a (11a),
It consists of two rectangular steps 10b and 10c (11b and 11c). Since the thickness of the stepped portion after firing is about 10 μm to 15 μm by one application of screen printing, the stepped portions (bumps) 10b, 10c, 11b, and 11c having appropriate thicknesses are formed.

FIG. 2 shows mounting terminals 11 when the package 1 is mounted on the land electrode 26 of the circuit board 25.
That is, it is an essential part enlarged side view of the mounting terminal base 11a and the step portions 11b and 11c. FIG.
As can be seen, the thickness of the solder 28 is h2 (the thickness of the solder under the step portions 11b and 11c).
The package mounting terminal 11 is configured such that h1 (thickness of solder under the mounting terminal base 11a) is larger than that in FIG.
When the package is mounted on a circuit board, distortion occurs in the solder joint due to a difference in linear expansion coefficient between the package and the circuit board due to a change in ambient temperature. In order to investigate the relationship between the shape of the package mounting terminals and the distortion generated, the types of package mounting terminals 10 and 11 are as follows:
Four types were selected as shown in the bottom views of FIGS. FIG. 3A shows the mounting terminal 10.
, 11 is a package having a standard area, FIG. 11B is a package having a larger mounting terminal area than FIG. 11A, and FIG. 10C is a step portion (bump) at two locations on the package of FIG. A package provided with 10b and 11b, and FIG. 11D shows a package provided with one castellation C ′ at the center on both sides in the lateral direction. When the packages shown in FIGS. 3A to 3D are mounted on a circuit board via solder, the magnitude of distortion generated in the solder of the bonding material and its region were obtained by simulation. In the case of the package shown in FIGS. 3A, 3B, and 3D, the solder thickness h (shown in FIG. 4A) of the joint is set to 70 μm, and FIG.
When the stepped portions 10b and 11b are provided as described above, the solder thickness h1 (shown in FIG. 4 (b)) at the joint is set to 100 μm. Also, the simulation condition is that the solder freezing point (+ 218 ° C.
) Is the starting point of stress (stress free) and the temperature condition of the temperature cycle (−40 ° C. + 12
5 ° C.), the magnitude of strain applied to the solder and the large strain region were obtained by simulation under the load condition of + 218 ° C. to −40 ° C. where the temperature change was the largest. That means
At the solder freezing point (+ 218 ° C.), no distortion occurs in the package and the circuit board, but distortion occurs when the temperature returns to room temperature, and the distortion is maximum at −40 ° C. Note that temperature fluctuations occur uniformly in the model, and the residual stress of the material constituting the package was not considered.

In the figure overwritten on the mounting terminal on the right side of FIG. 3A, the package is mounted on the circuit board,
This shows a large strain region generated when a temperature cycle test of −40 ° C. to + 125 ° C. is applied, and a large strain is generated in the regions indicated by A, B, C, D, and E, particularly the regions indicated by D and E It was found as a result of simulation that this occurs. Needless to say, distortion on the left side of the mounting terminal in FIG. In addition, in the packages of FIGS. 3B to 3D, the region where the large distortion occurs was almost the same as the right side of FIG.
Moreover, the maximum distortion which arises in the castellations C1-C4 of a mounting terminal when the temperature cycle of -40 degreeC- + 125 degreeC was added was calculated | required about the shape of each mounting terminal of FIG. FIG. 3 (e) shows the maximum generated in the caster of the mounting terminal in FIGS. (B) to (d) when the maximum distortion generated in the castellation of the mounting terminal shape shown in FIG. In the figure which showed distortion by relative value, the figure number (a) which shows the shape of a mounting terminal on a horizontal axis
In (d), the vertical axis represents relative solder strain. From FIG. 3 (e), it was found that when the stepped portions 10b, 11b are provided on the mounting terminals 10, 11 as in the package of FIG. 3 (c), the maximum distortion generated in the castellation is minimized.

This is also due to the fact that by providing the stepped portions 10b and 11b in a part of the mounting terminal, the solder interposed between the circuit board and the bottom surface of the mounting terminal becomes thick, and the distortion is alleviated. Further, the relationship between the thickness of the solder and the connection strength is disclosed in Japanese Patent Laid-Open No. 5-308179, and the connection strength has a maximum value with respect to the solder thickness and has an appropriate thickness. Based on the results of the above simulation, the mounting terminal shape is designed to increase the solder thickness at the area where the distortion is large, that is, the position farthest from the center of the package and the peripheral edge of the mounting terminal excluding the part near the center of the package To do. Further, as shown in the distribution diagram of distortion on the right side mounting terminal in FIG. 3A, since strain concentrates on the boundary portion of the mounting terminal, a plurality of step portions 10b on the mounting terminal bases 10a and 11a.
10c, 11b, and 11c were provided, and various packages having mounting terminals that disperse the strain at the edge portion of the stepped portion were manufactured. And the crack rate (ratio of the crack length with respect to the solder full length in a certain cross section) was investigated. As a result, it was found that when the mounting electrode of the package shown in FIG. 1 was adopted, the cross-sectional solder crack rate was low, that is, the generation of cracks could be further reduced.

FIG. 4A is an enlarged side view of a main part of a conventional electronic component package 1 ′ mounted on a circuit board 25. The land electrode 26 of the circuit board 25 and the mounting terminal 11a of the package 1 ′ are shown in FIG.
Between the two, a solder layer having a thickness h is interposed. As a result of the simulation, it was found from the above simulation that when the environmental temperature changes, the distortion of the region indicated by P at the end of the package 1 ′ is maximized. FIG. 4B is an enlarged side view of the main part of the electronic component package 1 according to the present invention mounted on the circuit board 25. When the environmental temperature changes, a region indicated by P at the end of the package 1 and a stepped portion. As a result of simulation, it has been found that the distortion is maximized in the regions indicated by Q1 and Q2 at the boundaries of 11b and 11c. By providing the plurality of step portions 11b and 11c in this way, it becomes possible to disperse the distortion caused by the difference in the linear expansion coefficient between the package 1 and the circuit board in each of the regions P, Q1, and Q2. It is possible to prevent solder deterioration due to repeated changes in environmental temperature, that is, solder cracking.

The first feature of the present invention is the positional relationship between the mounting terminal bases 10a and 11a of the mounting terminals 10 and 11 and the step portions (bumps) 10b, 10c, 11b and 11c. The mounting terminal 11 will be described as an example. As shown in the bottom view of FIG. 1B, the right end in the drawing of the mounting terminal base 11a and the right end of the larger rectangular step portion 11b are substantially aligned. In the middle / up / down direction (short side direction), the stepped portion 11b is positioned substantially at the center of the terminal base 11a. The smaller rectangular step portion 11c is disposed closer to the end of the package body 6 with a space from the step portion 11b. That is, the step portions 11b and 11c are the mounting terminals excluding the position farthest from the center of the electronic component package 1 and the center of the package when the mounting terminal 11 is joined to the land electrode on the circuit board side by soldering. The shape is such that the solder with the peripheral edge of 11 becomes thicker. The first feature is to increase the thickness of the solder in the region where the distortion is greatly applied.
The second feature of the present invention is that by providing a plurality of step portions 10b, 10c, 11b, and 11c, distortion that acts more strongly in the longitudinal direction than in the package short direction is reduced.
, 11b and 11c can be dispersed at the edge portions, and cracking of the solder can be prevented.

When the package according to the present invention shown in FIG. 1 is mounted on a mounting board, that is, when the mounting terminal of the package is joined to the land electrode of the mounting board via solder, the conduction resistance between the land electrode and the mounting terminal is − Depending on the number of temperature cycles (heat cycles) from 40 ° C to + 125 ° C,
Experimented with how it changed. FIG. 5A shows a measurement pattern 40 on a substrate on which a package is mounted. 41a and 41b are land electrodes, 42a and 42b are wiring conductors, 43a and 4b.
3b is a terminal electrode for conducting resistance measurement. FIG. 5B is a plan view of the substrate 45 actually used for the conduction resistance measurement in which a plurality of measurement patterns 40 are arranged in a lattice pattern.
The package used in the conduction resistance experiment includes a package having a stepped mounting terminal shown in FIG. 1 and a package having a general mounting terminal shown in FIGS. 3A to 3D for comparison. Was used. Since it is for measuring the conduction resistance of the solder that joins the mounting terminal and the land electrode, the electrode pads inside the package body, for example, the two electrode pads 15 in FIG. It was. Measurement points are 500 times before heat cycle, 1000 times
, 1500 times, 2000 times, 2500 times, 3000 times, and the conduction resistance after 3000 heat cycle tests were measured.

FIG. 6 is a line graph showing the conduction resistance after each heat cycle test. Line A
B and C are diagrams showing the relationship between the number of heat cycles and the conduction resistance of the package having the mounting terminals shown in FIGS. 3A, 3D, and 1C, respectively.
From FIG. 6, it was found that the package having the stepped mounting terminal according to the present invention shows a good result even in the heat cycle test of the conduction resistance.

FIG. 7 is a bottom view showing the configuration of the package 2 of the second embodiment. The difference from the embodiment of FIG. 1 is the configuration of the step portions 10d and 11d. Mounting terminal 10 of package 2 is mounting terminal base 1
0a and a plurality of circular stepped portions 10d. Similarly, the mounting terminal 11 is mounted on the mounting terminal base 1.
1a and a plurality of circular step portions 11d. In the embodiment shown in FIG. 7, there are five step portions 10d and 11d, and two step portions 10d and 11d are located closer to the center of the package 2, respectively.
d is an example in which three step portions 10d and 11d are arranged near the end of the package 2, respectively. By arranging the stepped portions 10d and 11d in this manner, the solder farthest from the center of the package 2 and the peripheral edge of the mounting terminal excluding the portion near the center of the package becomes thick, and the package 2 and the circuit board In addition to increasing the connection strength, it is possible to disperse the strain acting more strongly in the longitudinal direction than in the package short direction at the edge portions of the stepped portions 10d and 11d, thereby preventing cracks in the solder. .

FIG. 8 is a bottom view showing the configuration of the package 3 of the third embodiment, and the package 1 shown in FIG.
Is different from the two dummy electrodes 12, 13 near the end in the short side direction at the center in the long side direction.
Is provided. As shown in FIG. 8, the dummy electrodes 12 and 13 include dummy electrode bases 12a and 13a and rectangular step portions 12b and 13b, respectively. By providing the dummy electrodes 12 and 13 to which the step portions 12b and 13b are added, the connection strength between the package 3 and the circuit board is increased, and distortion caused when the environmental temperature changes is reduced by the step portions 12b and 12b.
A package can be constructed that is dispersed at the boundary of 13b and prevents cracking of the solder.

FIG. 9 is a bottom view showing the configuration of the package 4 of the fourth embodiment, which is different from the package 2 of the second embodiment shown in FIG. 7 in the center portion in the long side direction and closer to the end portion in the short side direction. Two dummy electrodes 16 and 17 are provided. As shown in FIG. 7, the dummy electrodes 16 and 17 include dummy electrode bases 16a and 17a and circular step portions 16b and 17b, respectively. By providing the dummy electrodes 16 and 17 to which the step portions 16b and 17b are added, the connection strength between the package 4 and the circuit board is increased, and the distortion generated when the environmental temperature changes is distributed in the edge regions of the step portions 16b and 17b. Thus, a package for preventing cracking of the solder can be configured.

A package having a convex portion on the terminal electrode is disclosed in Patent Document 2, but the configuration of the mounting terminal of the package according to the present invention is greatly strained, excluding a region far from the center of the package and a portion near the center of the package. The difference is that the mounting terminal structure increases the thickness of the solder in the peripheral region of the mounting terminal and the strain is distributed to the edge region of each stepped portion.
In the first embodiment shown in FIG. 1, an example in which a tuning fork type crystal vibrating element is mounted on the electrode pad 15 formed in the concave portion of the package 1 is shown, but the second to fourth shown in FIGS. A piezoelectric vibration element may be mounted in the recesses of the packages 2, 3, and 4 of the embodiment to constitute a surface-mount type piezoelectric vibrator.

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic which shows the structure of the package of 1st Example based on this invention, (a) is sectional drawing, (b) is a bottom view, (c) is a bottom view. The principal part enlarged side view at the time of mounting the package of a circuit board. (A)-(d) is a bottom view of a package, (e) is a figure which shows the relationship between the shape of a mounting terminal, and relative solder distortion. (A) is the cross section explaining the area | region where the distortion of the conventional package is applied, (b) is the area | region where the distortion of the package of this invention is applied. (A) is a top view of the pattern for conductive resistance measurement, (b) is a top view of the pattern for measurement distribute | arranged on the board | substrate. The figure which shows the relationship between the heat cycle frequency and conduction resistance. The bottom view of the package of 2nd Example. The bottom view of the package of 3rd Example. The bottom view of the package of 4th Example. (A) is sectional drawing and (b) is a bottom view of the conventional package.

Explanation of symbols

1, 2, 3, 4 ... package, 6 ... package body, 10, 11 ... mounting terminal, 10a,
11a: Mounting terminal base, 10b, 10c, 10d, 11b, 11c, 11d, 12b,
13b, 16b, 17b ... stepped portion (bump), 12, 13, 16, 17 ... dummy electrode, 1
2a, 13a, 16a, 17a ... dummy electrode base, 14 ... connection electrode, 15 ... electrode pad, 20 ... electronic component, 25 ... circuit board, 26 ... land electrode, 28 ... solder, 30 ... lid member, C
', C1, C2, C3, C4 ... castellation, A, B, C, D, E ... large distortion region, 40 ... measurement pattern, 41a, 41b ... land electrode, 42a, 42b ... wiring conductor, 43a, 43b Terminal electrode for measurement, 45 ... Board

Claims (4)

A package body on which electronic components are mounted,
The mounting surface of the package body includes a mounting terminal for surface mounting disposed between a center point of the mounting surface and an outer peripheral edge of the package body,
In the mounting terminal, a first bump and a second bump are arranged in this order from the outer peripheral edge side toward the center point side,
A package body, wherein the second bump has a larger area in plan view than the first bump.   The direction perpendicular to the direction in which the first bump and the second bump are arranged is defined as the width direction, and the width direction of the first bump is larger than the width direction of the second bump. The package body according to claim 1, wherein the package body is small. Wherein the first bump and the second bump, the package body of claim 1 or 2, characterized in that different heights. An electronic device comprising: the package body according to any one of claims 1 to 3 ; and an electronic component mounted on the package body.

Images