JP2009188147A5 - - Google Patents

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Publication number
JP2009188147A5
JP2009188147A5 JP2008025927A JP2008025927A JP2009188147A5 JP 2009188147 A5 JP2009188147 A5 JP 2009188147A5 JP 2008025927 A JP2008025927 A JP 2008025927A JP 2008025927 A JP2008025927 A JP 2008025927A JP 2009188147 A5 JP2009188147 A5 JP 2009188147A5
Authority
JP
Japan
Prior art keywords
sealing
mold
sealing resin
circuit device
circuit element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008025927A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009188147A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008025927A priority Critical patent/JP2009188147A/ja
Priority claimed from JP2008025927A external-priority patent/JP2009188147A/ja
Publication of JP2009188147A publication Critical patent/JP2009188147A/ja
Publication of JP2009188147A5 publication Critical patent/JP2009188147A5/ja
Pending legal-status Critical Current

Links

JP2008025927A 2008-02-06 2008-02-06 回路装置の製造方法 Pending JP2009188147A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008025927A JP2009188147A (ja) 2008-02-06 2008-02-06 回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008025927A JP2009188147A (ja) 2008-02-06 2008-02-06 回路装置の製造方法

Publications (2)

Publication Number Publication Date
JP2009188147A JP2009188147A (ja) 2009-08-20
JP2009188147A5 true JP2009188147A5 (ko) 2011-05-26

Family

ID=41071113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008025927A Pending JP2009188147A (ja) 2008-02-06 2008-02-06 回路装置の製造方法

Country Status (1)

Country Link
JP (1) JP2009188147A (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011114136A (ja) * 2009-11-26 2011-06-09 Sanyo Electric Co Ltd 半導体装置及びその製造方法
WO2016006650A1 (ja) * 2014-07-10 2016-01-14 大日本印刷株式会社 リードフレームの多面付け体、樹脂付きリードフレームの多面付け体、半導体装置の多面付け体、樹脂付きリードフレームの多面付け体の製造方法、それに使用される射出成形用金型、成形装置
JP6525835B2 (ja) * 2015-09-24 2019-06-05 Ｔｏｗａ株式会社 電子部品の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3601985B2 (ja) * 1998-10-30 2004-12-15 富士通株式会社 半導体パッケージの製造方法
JP2000025074A (ja) * 1998-07-14 2000-01-25 Aoi Denshi Kk モールド装置、モールド方法、モールドされた半導体装置の切断方法及び半導体装置の作製方法
JP2002164364A (ja) * 2000-11-29 2002-06-07 Apic Yamada Corp 半導体装置の製造方法
JP2002261107A (ja) * 2001-03-05 2002-09-13 Hitachi Ltd 半導体装置の製造方法
JP4202632B2 (ja) * 2001-09-28 2008-12-24 株式会社東芝 一括封止型半導体パッケージの樹脂封止構造およびその製造装置
TW200423316A (en) * 2003-02-19 2004-11-01 Hitachi Chemical Co Ltd Adhesive film for semiconductor, adhesive film attached on metal plate, wiring circuit and semiconductor device with the same, and the manufacturing method for semiconductor device
JP2004319900A (ja) * 2003-04-18 2004-11-11 Towa Corp 樹脂封止用型及び樹脂封止用型の仕様決定方法

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