JP2009181704A - バックライト装置 - Google Patents

バックライト装置 Download PDF

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Publication number
JP2009181704A
JP2009181704A JP2008017348A JP2008017348A JP2009181704A JP 2009181704 A JP2009181704 A JP 2009181704A JP 2008017348 A JP2008017348 A JP 2008017348A JP 2008017348 A JP2008017348 A JP 2008017348A JP 2009181704 A JP2009181704 A JP 2009181704A
Authority
JP
Japan
Prior art keywords
submount
substrate
led
backlight device
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008017348A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009181704A5 (enExample
Inventor
Toshimasa Hayashi
稔真 林
Hideki Kokubu
英樹 國分
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2008017348A priority Critical patent/JP2009181704A/ja
Publication of JP2009181704A publication Critical patent/JP2009181704A/ja
Publication of JP2009181704A5 publication Critical patent/JP2009181704A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2008017348A 2008-01-29 2008-01-29 バックライト装置 Withdrawn JP2009181704A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008017348A JP2009181704A (ja) 2008-01-29 2008-01-29 バックライト装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008017348A JP2009181704A (ja) 2008-01-29 2008-01-29 バックライト装置

Publications (2)

Publication Number Publication Date
JP2009181704A true JP2009181704A (ja) 2009-08-13
JP2009181704A5 JP2009181704A5 (enExample) 2010-04-08

Family

ID=41035529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008017348A Withdrawn JP2009181704A (ja) 2008-01-29 2008-01-29 バックライト装置

Country Status (1)

Country Link
JP (1) JP2009181704A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192407A (ja) * 2013-03-28 2014-10-06 Citizen Electronics Co Ltd 半導体発光装置
JP2017038031A (ja) * 2015-08-14 2017-02-16 シチズン電子株式会社 発光装置及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339542A (ja) * 2005-06-03 2006-12-14 Citizen Electronics Co Ltd チップ型ｌｅｄ
JP2007116125A (ja) * 2005-09-20 2007-05-10 Matsushita Electric Works Ltd 発光装置
JP2007157686A (ja) * 2005-11-11 2007-06-21 Hitachi Displays Ltd 照明装置及びそれを用いた液晶表示装置
JP2007324204A (ja) * 2006-05-30 2007-12-13 Toyoda Gosei Co Ltd 発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339542A (ja) * 2005-06-03 2006-12-14 Citizen Electronics Co Ltd チップ型ｌｅｄ
JP2007116125A (ja) * 2005-09-20 2007-05-10 Matsushita Electric Works Ltd 発光装置
JP2007157686A (ja) * 2005-11-11 2007-06-21 Hitachi Displays Ltd 照明装置及びそれを用いた液晶表示装置
JP2007324204A (ja) * 2006-05-30 2007-12-13 Toyoda Gosei Co Ltd 発光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192407A (ja) * 2013-03-28 2014-10-06 Citizen Electronics Co Ltd 半導体発光装置
JP2017038031A (ja) * 2015-08-14 2017-02-16 シチズン電子株式会社 発光装置及びその製造方法

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