JP2009181704A - バックライト装置 - Google Patents
バックライト装置 Download PDFInfo
- Publication number
- JP2009181704A JP2009181704A JP2008017348A JP2008017348A JP2009181704A JP 2009181704 A JP2009181704 A JP 2009181704A JP 2008017348 A JP2008017348 A JP 2008017348A JP 2008017348 A JP2008017348 A JP 2008017348A JP 2009181704 A JP2009181704 A JP 2009181704A
- Authority
- JP
- Japan
- Prior art keywords
- submount
- led
- substrate
- backlight device
- led chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 239000003566 sealing material Substances 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000012423 maintenance Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 21
- 239000011347 resin Substances 0.000 description 21
- 238000007789 sealing Methods 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008017348A JP2009181704A (ja) | 2008-01-29 | 2008-01-29 | バックライト装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008017348A JP2009181704A (ja) | 2008-01-29 | 2008-01-29 | バックライト装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009181704A true JP2009181704A (ja) | 2009-08-13 |
JP2009181704A5 JP2009181704A5 (enrdf_load_stackoverflow) | 2010-04-08 |
Family
ID=41035529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008017348A Withdrawn JP2009181704A (ja) | 2008-01-29 | 2008-01-29 | バックライト装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2009181704A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014192407A (ja) * | 2013-03-28 | 2014-10-06 | Citizen Electronics Co Ltd | 半導体発光装置 |
JP2017038031A (ja) * | 2015-08-14 | 2017-02-16 | シチズン電子株式会社 | 発光装置及びその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339542A (ja) * | 2005-06-03 | 2006-12-14 | Citizen Electronics Co Ltd | チップ型led |
JP2007116125A (ja) * | 2005-09-20 | 2007-05-10 | Matsushita Electric Works Ltd | 発光装置 |
JP2007157686A (ja) * | 2005-11-11 | 2007-06-21 | Hitachi Displays Ltd | 照明装置及びそれを用いた液晶表示装置 |
JP2007324204A (ja) * | 2006-05-30 | 2007-12-13 | Toyoda Gosei Co Ltd | 発光装置 |
-
2008
- 2008-01-29 JP JP2008017348A patent/JP2009181704A/ja not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339542A (ja) * | 2005-06-03 | 2006-12-14 | Citizen Electronics Co Ltd | チップ型led |
JP2007116125A (ja) * | 2005-09-20 | 2007-05-10 | Matsushita Electric Works Ltd | 発光装置 |
JP2007157686A (ja) * | 2005-11-11 | 2007-06-21 | Hitachi Displays Ltd | 照明装置及びそれを用いた液晶表示装置 |
JP2007324204A (ja) * | 2006-05-30 | 2007-12-13 | Toyoda Gosei Co Ltd | 発光装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014192407A (ja) * | 2013-03-28 | 2014-10-06 | Citizen Electronics Co Ltd | 半導体発光装置 |
JP2017038031A (ja) * | 2015-08-14 | 2017-02-16 | シチズン電子株式会社 | 発光装置及びその製造方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100219 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100329 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110722 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110802 |
|
A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20110913 |