JP2009178672A - 基板処理装置及び基板処理方法 - Google Patents

基板処理装置及び基板処理方法 Download PDF

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Publication number
JP2009178672A
JP2009178672A JP2008020735A JP2008020735A JP2009178672A JP 2009178672 A JP2009178672 A JP 2009178672A JP 2008020735 A JP2008020735 A JP 2008020735A JP 2008020735 A JP2008020735 A JP 2008020735A JP 2009178672 A JP2009178672 A JP 2009178672A
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JP
Japan
Prior art keywords
substrate
liquid
processing apparatus
liquid layer
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2008020735A
Other languages
English (en)
Japanese (ja)
Inventor
Akira Son
亮 孫
Mitsuyuki Hakata
満之 羽方
Takuya Zushi
卓哉 厨子
Masaki Shinohara
正樹 篠原
Takashi Higuchi
尚 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP2008020735A priority Critical patent/JP2009178672A/ja
Priority to TW097139749A priority patent/TWI392045B/zh
Priority to CN2008101754246A priority patent/CN101499408B/zh
Priority to KR1020080113300A priority patent/KR100991086B1/ko
Publication of JP2009178672A publication Critical patent/JP2009178672A/ja
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
JP2008020735A 2008-01-31 2008-01-31 基板処理装置及び基板処理方法 Abandoned JP2009178672A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008020735A JP2009178672A (ja) 2008-01-31 2008-01-31 基板処理装置及び基板処理方法
TW097139749A TWI392045B (zh) 2008-01-31 2008-10-16 A substrate processing apparatus and a substrate processing method
CN2008101754246A CN101499408B (zh) 2008-01-31 2008-11-12 基板处理装置以及基板处理方法
KR1020080113300A KR100991086B1 (ko) 2008-01-31 2008-11-14 기판 처리 장치 및 기판 처리 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008020735A JP2009178672A (ja) 2008-01-31 2008-01-31 基板処理装置及び基板処理方法

Publications (1)

Publication Number Publication Date
JP2009178672A true JP2009178672A (ja) 2009-08-13

Family

ID=40946409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008020735A Abandoned JP2009178672A (ja) 2008-01-31 2008-01-31 基板処理装置及び基板処理方法

Country Status (4)

Country Link
JP (1) JP2009178672A (zh)
KR (1) KR100991086B1 (zh)
CN (1) CN101499408B (zh)
TW (1) TWI392045B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150027600A (ko) * 2013-09-04 2015-03-12 엘지디스플레이 주식회사 세정 장치 및 이를 이용한 세정을 포함하는 디스플레이 소자의 제조 방법
JP2018522416A (ja) * 2015-07-08 2018-08-09 デカ テクノロジーズ インコーポレイテッド 材料除去のための半導体デバイス処理方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5183811B2 (ja) * 2010-06-29 2013-04-17 安瀚視特股▲ふん▼有限公司 液晶表示装置用ガラス基板の製造方法
JP5923300B2 (ja) * 2011-12-28 2016-05-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR101344921B1 (ko) * 2012-03-28 2013-12-27 세메스 주식회사 기판처리장치 및 방법
CN104588351A (zh) * 2014-12-02 2015-05-06 深圳市华星光电技术有限公司 基板清洗装置和使用其清洗基板的方法
CN108074835A (zh) * 2016-11-09 2018-05-25 盟立自动化股份有限公司 湿式制程装置
CN114200791B (zh) * 2020-09-17 2023-12-08 株式会社斯库林集团 显影装置及显影方法
CN114733821A (zh) * 2022-03-10 2022-07-12 深圳市卓尔航科技有限公司 一种用于液晶屏玻璃的显影清洗机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001121092A (ja) * 1999-10-29 2001-05-08 Japan Tobacco Inc たばこ裁刻機給送チェンの洗浄装置
JP2001196345A (ja) * 2000-01-13 2001-07-19 Alps Electric Co Ltd 基板ガイド装置ならびにこれを用いた洗浄装置
JP2002329761A (ja) * 2001-04-27 2002-11-15 Tokyo Electron Ltd 搬送装置、洗浄装置及び現像装置
JP2006015276A (ja) * 2004-07-02 2006-01-19 Future Vision:Kk 基板処理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW392226B (en) * 1997-11-05 2000-06-01 Tokyo Electron Ltd Apparatus for processing substrate
KR100677965B1 (ko) * 1999-11-01 2007-02-01 동경 엘렉트론 주식회사 기판처리방법 및 기판처리장치
JP4678665B2 (ja) * 2001-11-15 2011-04-27 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP4244176B2 (ja) * 2002-10-25 2009-03-25 大日本スクリーン製造株式会社 基板処理装置
JP2005191511A (ja) * 2003-12-02 2005-07-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
KR101140770B1 (ko) * 2004-04-28 2012-05-03 가부시키가이샤 에바라 세이사꾸쇼 기판처리유닛 및 기판처리장치와 기판 유지장치 및 기판 유지방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001121092A (ja) * 1999-10-29 2001-05-08 Japan Tobacco Inc たばこ裁刻機給送チェンの洗浄装置
JP2001196345A (ja) * 2000-01-13 2001-07-19 Alps Electric Co Ltd 基板ガイド装置ならびにこれを用いた洗浄装置
JP2002329761A (ja) * 2001-04-27 2002-11-15 Tokyo Electron Ltd 搬送装置、洗浄装置及び現像装置
JP2006015276A (ja) * 2004-07-02 2006-01-19 Future Vision:Kk 基板処理装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150027600A (ko) * 2013-09-04 2015-03-12 엘지디스플레이 주식회사 세정 장치 및 이를 이용한 세정을 포함하는 디스플레이 소자의 제조 방법
KR102089247B1 (ko) * 2013-09-04 2020-03-16 엘지디스플레이 주식회사 세정 장치 및 이를 이용한 세정을 포함하는 디스플레이 소자의 제조 방법
JP2018522416A (ja) * 2015-07-08 2018-08-09 デカ テクノロジーズ インコーポレイテッド 材料除去のための半導体デバイス処理方法
JP2021101487A (ja) * 2015-07-08 2021-07-08 デカ テクノロジーズ ユーエスエー， インコーポレイテッド 材料除去のための半導体デバイス処理方法
JP7104826B2 (ja) 2015-07-08 2022-07-21 デカ テクノロジーズ ユーエスエー， インコーポレイテッド 材料除去のための半導体デバイス処理方法

Also Published As

Publication number Publication date
CN101499408A (zh) 2009-08-05
KR100991086B1 (ko) 2010-10-29
CN101499408B (zh) 2011-01-19
TW200937558A (en) 2009-09-01
KR20090084650A (ko) 2009-08-05
TWI392045B (zh) 2013-04-01

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